WO2011126702A3 - Encapsulated curing agents - Google Patents
Encapsulated curing agents Download PDFInfo
- Publication number
- WO2011126702A3 WO2011126702A3 PCT/US2011/028938 US2011028938W WO2011126702A3 WO 2011126702 A3 WO2011126702 A3 WO 2011126702A3 US 2011028938 W US2011028938 W US 2011028938W WO 2011126702 A3 WO2011126702 A3 WO 2011126702A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- curing agent
- composition
- temperature
- encapsulated
- curing agents
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
- C08J3/241—Preventing premature crosslinking by physical separation of components, e.g. encapsulation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J13/00—Colloid chemistry, e.g. the production of colloidal materials or their solutions, not otherwise provided for; Making microcapsules or microballoons
- B01J13/02—Making microcapsules or microballoons
- B01J13/04—Making microcapsules or microballoons by physical processes, e.g. drying, spraying
- B01J13/043—Drying and spraying
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J13/00—Colloid chemistry, e.g. the production of colloidal materials or their solutions, not otherwise provided for; Making microcapsules or microballoons
- B01J13/02—Making microcapsules or microballoons
- B01J13/06—Making microcapsules or microballoons by phase separation
- B01J13/12—Making microcapsules or microballoons by phase separation removing solvent from the wall-forming material solution
- B01J13/125—Making microcapsules or microballoons by phase separation removing solvent from the wall-forming material solution by evaporation of the solvent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J13/00—Colloid chemistry, e.g. the production of colloidal materials or their solutions, not otherwise provided for; Making microcapsules or microballoons
- B01J13/02—Making microcapsules or microballoons
- B01J13/06—Making microcapsules or microballoons by phase separation
- B01J13/14—Polymerisation; cross-linking
- B01J13/16—Interfacial polymerisation
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Dispersion Chemistry (AREA)
- Analytical Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Paints Or Removers (AREA)
- Sealing Material Composition (AREA)
- Manufacturing Of Micro-Capsules (AREA)
Abstract
An encapsulated curing agent, for use in a chemical composition to be cured, such as, an adhesive or encapsulant, comprises a polymeric coating forming a shell around a curing agent core. The curing agent is capable of exhibiting a morphology change and expanding upon the application of heat at a temperature below the degradation temperature of the polymeric coating material, and below the curing temperature of the encapsulant or adhesive composition in which the encapsulated curing agent is to be used. This allows the curing agent to escape from the encapsulation coating and into the composition to be cured before the cure temperature of the composition is reached.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US31898710P | 2010-03-30 | 2010-03-30 | |
US61/318,987 | 2010-03-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2011126702A2 WO2011126702A2 (en) | 2011-10-13 |
WO2011126702A3 true WO2011126702A3 (en) | 2012-01-12 |
Family
ID=44763466
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2011/028938 WO2011126702A2 (en) | 2010-03-30 | 2011-03-18 | Encapsulated curing agents |
Country Status (2)
Country | Link |
---|---|
TW (1) | TW201139631A (en) |
WO (1) | WO2011126702A2 (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9683129B2 (en) | 2014-12-04 | 2017-06-20 | Prc-Desoto International, Inc. | Polythioether sealants with extended working time |
CN109362226B (en) | 2015-05-15 | 2021-08-20 | 陶氏环球技术有限责任公司 | Material delivery system for a laminator |
EP3115348A1 (en) * | 2015-07-07 | 2017-01-11 | BAE Systems PLC | Cast explosive composition |
CA2991169C (en) | 2015-07-07 | 2023-03-28 | Bae Systems Plc | Pbx composition |
ES2760908T3 (en) * | 2015-07-07 | 2020-05-18 | Bae Systems Plc | Molten explosive composition |
EP3448923B1 (en) | 2016-04-25 | 2021-03-17 | 3M Innovative Properties Company | Composite particles for curing epoxy resin compositions and curable and cured epoxy resin compositions prepared using the particles |
WO2018111637A1 (en) | 2016-12-13 | 2018-06-21 | 3M Innovative Properties Company | Epoxy stabilization using acid-coated nitrogen-containing catalysts, particles, and methods |
CN113613775A (en) | 2019-03-28 | 2021-11-05 | 3M创新有限公司 | Epoxide microcapsules with pickering emulsifiers |
US20220195247A1 (en) | 2019-03-28 | 2022-06-23 | 3M Innovative Properties Company | Structural bonding tape with epoxide microcapsules |
CN109957377A (en) * | 2019-04-28 | 2019-07-02 | 祝亚琴 | A kind of closure dispersing agent |
CN111808268A (en) * | 2020-07-23 | 2020-10-23 | 苏州科技大学 | Epoxy resin latent curing agent and preparation method thereof |
WO2022123498A1 (en) | 2020-12-10 | 2022-06-16 | 3M Innovative Properties Company | Crosslinked polymer particles and related compositions and processes |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3505428A (en) * | 1966-01-03 | 1970-04-07 | Inmont Corp | Curable normally stable compositions containing cross linking agent in capsule form |
US4808639A (en) * | 1986-07-16 | 1989-02-28 | Production Previews, Inc. | Liquid curable adhesive composition comprising a polyester resin and a microencapsulated peroxide curing agent |
US5589523A (en) * | 1994-03-15 | 1996-12-31 | Toray Industries, Inc. | Microcapsule-type curing agent, method for producing the same, thermosetting resin composition, prepreg and fiber reinforced composite material |
US6113728A (en) * | 1989-03-09 | 2000-09-05 | Hitachi Chemical Company, Ltd. | Process for connecting circuits and adhesive film used therefor |
US20050107494A1 (en) * | 2002-02-18 | 2005-05-19 | Takayuki Matsushima | Latent hardener, process for producing the same, and adhesive containing latent hardener |
EP1557438A1 (en) * | 2002-10-25 | 2005-07-27 | Asahi Kasei Chemicals Corporation | Capsule type hardener and composition |
WO2010122995A1 (en) * | 2009-04-24 | 2010-10-28 | 旭化成イーマテリアルズ株式会社 | Imidazole compound-containing microcapsulated composition, curable composition using same, and masterbatch type curing agent |
-
2011
- 2011-03-18 WO PCT/US2011/028938 patent/WO2011126702A2/en active Application Filing
- 2011-03-22 TW TW100109762A patent/TW201139631A/en unknown
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3505428A (en) * | 1966-01-03 | 1970-04-07 | Inmont Corp | Curable normally stable compositions containing cross linking agent in capsule form |
US4808639A (en) * | 1986-07-16 | 1989-02-28 | Production Previews, Inc. | Liquid curable adhesive composition comprising a polyester resin and a microencapsulated peroxide curing agent |
US6113728A (en) * | 1989-03-09 | 2000-09-05 | Hitachi Chemical Company, Ltd. | Process for connecting circuits and adhesive film used therefor |
US5589523A (en) * | 1994-03-15 | 1996-12-31 | Toray Industries, Inc. | Microcapsule-type curing agent, method for producing the same, thermosetting resin composition, prepreg and fiber reinforced composite material |
US20050107494A1 (en) * | 2002-02-18 | 2005-05-19 | Takayuki Matsushima | Latent hardener, process for producing the same, and adhesive containing latent hardener |
EP1557438A1 (en) * | 2002-10-25 | 2005-07-27 | Asahi Kasei Chemicals Corporation | Capsule type hardener and composition |
WO2010122995A1 (en) * | 2009-04-24 | 2010-10-28 | 旭化成イーマテリアルズ株式会社 | Imidazole compound-containing microcapsulated composition, curable composition using same, and masterbatch type curing agent |
Also Published As
Publication number | Publication date |
---|---|
WO2011126702A2 (en) | 2011-10-13 |
TW201139631A (en) | 2011-11-16 |
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