CN105500137A - Grinding apparatus - Google Patents
Grinding apparatus Download PDFInfo
- Publication number
- CN105500137A CN105500137A CN201510651931.2A CN201510651931A CN105500137A CN 105500137 A CN105500137 A CN 105500137A CN 201510651931 A CN201510651931 A CN 201510651931A CN 105500137 A CN105500137 A CN 105500137A
- Authority
- CN
- China
- Prior art keywords
- grinding
- grinding stone
- stone
- plate workpiece
- unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
- B24B49/165—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load for grinding tyres
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Immunology (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Analytical Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Pathology (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Biochemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Quality & Reliability (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
Abstract
The invention provides a grinding apparatus. Damages such as gaps on a grinding stone can be determined, and the state of the surface to be ground of a plate-shaped workpiece can be uniformly maintained. The grinding apparatus (1) is provided with a chuck table (3), a grinding unit (4), and a measuring unit (5). The chuck table (3) holds the plate-shaped workpiece (W). The grinding unit (4) is provided with a grinding wheel (4f) in a rotatable manner, and the grinding wheel (4f) is provided with a grinding stone (4d) used for grinding the plate-shaped workpiece in an annular manner. The measuring unit (5) measures the side surface (4e) of the grinding stone. The measuring unit is provided with a light emitting part (51), an image sensor (52), a calculating part (56) and a judging part (57). The light emitting part (51) irradiates the side surface of the grinding stone with measuring light (B1). The image sensor (52) receives reflected light (B2) which is formed in a way that the measuring light irradiated by the light emitting part is reflected by the side surface of the grinding stone. The calculating part (56) calculates the distance between the light emitting part and the side surface of the grinding stone according to the detection position where the image sensor detects the reflected light. The judging part (57) judges the damage of the grinding stone according to the change of the distance calculated by the calculating part.
Description
Technical field
The present invention relates to grinding attachment plate workpiece being carried out to grinding, the grinding stone arranged in the form of a ring particularly can be made to rotate and plate workpiece be carried out to the grinding attachment of grinding.
Background technology
Conventionally, there is known make the plate workpieces such as wafer be thinned to the grinding attachment (such as with reference to patent document 1) of specific thickness.Grinding attachment described in patent document 1 is arranged on arranging the Grinding wheel having arranged multiple grinding stone in the form of a ring on rotary body.In this grinding attachment, when making plate workpiece be thinned to final thickness, by the rotation of rotary body, Grinding wheel is rotated, while make the grinding stone arranged in the form of a ring be connected to plate workpiece to carry out grinding.
In grinding in the past, use grinding stone that the granularity of abrasive particle is about #340 to carry out corase grind to cut, then, the grinding stone that the granularity of abrasive particle is about #2000 is used to carry out fine ginding, and in recent years, the grinding stone also using the granularity of abrasive particle to be #7000, #8000 carries out grinding (such as with reference to patent document 1 and 2).
Patent document 1: Japanese Patent No. 4734041 publication
Patent document 2: Japanese Unexamined Patent Publication 2010-280041 publication
But as mentioned above, when when the granularity of abrasive particle is comparatively large, abrasive particle is thinner, grinding stone is often formed by the bonding agent of softness.Therefore, in the grinding of plate workpiece, there is the problem that grinding stone easily produces breach.
Further, in this grinding, on the upper surface (being ground face) of plate workpiece, need to make the grinding trace caused due to grinding become even, but when utilizing the grinding stone creating breach to carry out grinding, grinding trace can become uneven.Therefore, when plate workpiece is wafer, the problem that the quality that also there is each device formed segmentation plate workpiece impacts.
And then, supposing when using optical detecting means to detect the breach of grinding stone, requiring that reducing the impact becoming the grinding fluid of atomize also maintains accuracy of detection well.
Summary of the invention
The present invention completes in view of the above circumstances, its object is to, and provides the breakages such as a kind of breach that can judge in grinding stone, and can maintain the grinding attachment of the state in the face that is ground of plate workpiece equably.
Grinding attachment of the present invention has: chuck table, and it keeps plate workpiece; Grinding unit, it assembles in the mode that can rotate and has arranged the Grinding wheel of grinding stone in the form of a ring, and the plate workpiece that this grinding stone is used for chuck table keeps carries out grinding; And determination unit, it measures the side surface of grinding stone, and it is characterized in that, determination unit has: illuminating part, and its side surface to grinding stone irradiates and measures light; Imageing sensor, the reverberation that its reception is reflected at the side surface of grinding stone from the mensuration light that illuminating part irradiates and obtained; Operational part, what it detected reverberation according to imageing sensor detects the distance that the side surface of computing from illuminating part to grinding stone is carried out in position; And judging part, the change of its distance calculated according to operational part judges the breakage of grinding stone.
In the structure shown here, operational part computing is used to play the distance of the side surface of the grinding stone of rotation from illuminating part.Grinding stone exist breach etc. damaged time, this distance to change in this elongated mode in local, damage location place, so, the breakage of grinding stone can be judged according to this change by judging part.Therefore, utilize the judged result of judging part, just can avoid proceeding grinding by the grinding stone of breakage.Thereby, it is possible to suppress, in be ground formation damage (scratch) or the formation on face of plate workpiece, there is the grinding form of speckle (inequality).Its result, can make the state being ground the grinding trace that face is formed become even, and then the quality of plate workpiece can be made to become stable.And, because illuminating part and imageing sensor carry out light projector and light relative to the side surface of grinding stone, so, the surface of illuminating part and imageing sensor can be arranged along vertical, make the grinding fluid adhered to owing to spraying to this surface easily flow and fall, thus the adhesion amount of grinding fluid can be reduced.And then, can be easy to adopt in illuminating part and the structure arranging air curtain etc. between imageing sensor and the side surface of grinding stone, in this situation, the attachment of grinding fluid can be reduced more well and make estimating precision become stable.
According to the present invention, the breakages such as the breach on grinding stone can be judged, and the state in the face that is ground of plate workpiece can be maintained equably.
Accompanying drawing explanation
Fig. 1 is the stereogram of an example of the grinding attachment that embodiment is shown.
Fig. 2 is the key diagram of the mensuration main points that the determination unit that above-mentioned grinding attachment has is shown.
Fig. 3 is the curve map of the measurement result that said determination unit is shown.
Fig. 4 is the stereogram of the grinding attachment that variation is shown.
Label declaration
1: grinding attachment, 3: chuck table, 4: grinding unit, 4d: grinding stone, 4e: side surface, 4f: Grinding wheel, 5: determination unit, 51: illuminating part, 52: imageing sensor, 56: operational part, 57: judging part, B1: measure light, B2: reverberation, W: plate workpiece.
Detailed description of the invention
Below, with reference to accompanying drawing, embodiments of the present invention are described in detail.Fig. 1 is the stereogram of an example of the grinding attachment that embodiment is shown.
As shown in Figure 1, grinding attachment 1 is configured to, and by making, chuck table 3 is relative with grinding unit 4 to be rotated, thus carries out grinding to the plate workpiece W that chuck table 3 keeps.Determination unit 5 is provided with in the right side area of chuck table 3.
As the machined object in grinding attachment 1 and plate workpiece W, the substrate that can adopt silicon wafer or be made up of the difficult-to-grind material of hard.This plate workpiece W is such as by having the sapphire of hard of Vickers hardness more than 2000, carborundum (SiC), aluminium titanium carbon (AlTiC) or aluminium oxide ceramics (Al
2o
3) etc. material form.
Grinding attachment 1 has the pedestal 2 of roughly rectangular shape.The column 22 at the rectangular-shaped opening portion 21 extended in the X-axis direction and the rear being vertically installed in opening portion 21 is configured with at the upper surface of pedestal 2.Opening portion 21 is covered by the stage support platform 24 of supporting chuck table 3 and undulatory dust cover 25.Column 22 has rectangular shape, and is provided with grinding unit 4 at its front surface.
Stage support platform 24 has roughly square shape, and it supports chuck table 3.Further, stage support platform 24 is connected with not shown driving mechanism, and the driving force by supplying from this driving mechanism, slide along X-direction in opening portion 21 mobile.Thus, the delivering to slide between the grinding position opposed with grinding unit 4 and plate workpiece W of position and move of the plate workpiece W of chuck table 3 before supply processing the plate workpiece W after reclaiming processing.
Dust cover 25 prevents the grindstone dust etc. produced when the grinding of plate workpiece W from entering in pedestal 2.On the front surface that dust cover 25 is arranged on stage support platform 24 and rear surface, and be configured to stretch according to its shift position.
Chuck table 3 has disc-shape, and is configured to by not shown chuck rotary unit and can is that axle rotates with disc centre.The holding surface 3a of absorption maintenance plate workpiece W is provided with at the upper surface of chuck table 3.Holding surface 3a is such as made up of porous ceramic film material, and porous ceramic film material is connected with attraction source (not shown).
In grinding unit 4, be provided with wheel installed part 4b in the lower end of the main shaft 4a of cylindrical shape, and at the lower surface of wheel installed part 4b, Grinding wheel 4f be installed.Grinding wheel 4f is configured to configure multiple grinding stone 4d in the form of a ring at the lower surface of wheel pedestal 4c.Grinding stone 4d is such as made up of Ceramic bond grinding stone.Along with the driving of main shaft 4a, around Z axis High Rotation Speed, its lower surface becomes grinding face and contacts to carry out grinding with plate workpiece W grinding stone 4d.In addition, main shaft 4a is fixed on the output shaft as the CD-ROM drive motor 8 of rotary unit.Therefore, Grinding wheel 4f is rotated by main shaft 4a by the driving of CD-ROM drive motor 8.
Grinding unit 4 is configured to the grinding and feeding unit 44 be arranged on column 22 and drives and can be upper mobile at above-below direction (Z-direction), and can make grinding unit 4 and chuck table 3 connect near and far from.Grinding and feeding unit 44 has Z axis platform 44a, and the support 44b installed by the front-surface side at Z axis workbench 44a and carry grinding unit 4.Rearward outstanding nut portions (not shown) is provided with at the back side of Z axis workbench 44a.The nut portions of the ball-screw 44c that the front surface of column 22 is arranged and Z axis workbench 44a screws togather.Further, the servo motor 44d linked with an end of ball-screw 44c is driven in rotation, and thus, grinding unit 4 is upper mobile at above-below direction (Z-direction).
Then, on the basis of Fig. 1, with reference to Fig. 2, determination unit 5 is described.Fig. 2 is the key diagram of the mensuration main points that determination unit is shown.
Determination unit 5 has illuminating part 51 and imageing sensor 52, and these illuminating parts 51 and imageing sensor 52 are loaded in framework 53.The pillar 54 that framework 53 is uprightly arranged by the upper surface from pedestal 2 and being configured in and the height and position of Grinding wheel 4f equal extent (not shown in Fig. 2).Illuminating part 51 and imageing sensor 52 are configured to separate predetermined distance in side (Y direction) and the side surface 4e of grinding stone 4d.The surface of illuminating part 51 and imageing sensor 52 is along vertical arranging.
Illuminating part 51 irradiates as the mensuration light B1 of laser to the side surface 4e of the grinding stone 4d being positioned at side (left).The mensuration light B1 irradiated from illuminating part 51 is become reverberation B2 at the side surface 4e of grinding stone 4d by reflecting, and this reverberation B2 is received by imageing sensor 52.Imageing sensor 52 has CCD, and exports the signal corresponding with the position of the reverberation B2 that CCD receives.
Determination unit 5 is configured to comprise operational part 56 and judging part 57 (in Fig. 2, both sides are all not shown).The position that detects of the reverberation B2 that imageing sensor 52 detects is imported into operational part 56 as signal.Operational part 56 according to inputted signal come computing from illuminating part 51 distance to the side surface 4e of grinding stone 4d.The change of the distance that judging part 57 calculates according to operational part 56, judges that grinding stone 4d is with or without breakage.In addition, operational part 56 and judging part 57 are configured to be included in and carry out in the blanket control part (not shown) controlled to each several part of grinding attachment 1, and this control part is configured to comprise the processor and the storage medium such as ROM (ReadOnlyMemory: read-only storage), RAM (RandomAccessMemory: random access memory) that perform various process.
Control part such as according to pre-entering and the control information stored, controls the driving timing, rotating speed etc. of chuck rotary unit (not shown) of chuck table 3 and the driving of each several part of grinding attachment 1.As concrete example, there is damaged judgement in the side surface 4e of the grinding stone 4d made according to judging part 57, controls the driving of servo motor 44d, makes grinding unit rise and stop the grinding of plate workpiece W.Further, with or without breakage on the side surface 4e of the grinding stone 4d judged according to judging part 57, the process in the replacing period at display unit (not shown) upper display Grinding wheel 4f etc. is controlled.
Then, the method for grinding of the grinding attachment 1 using present embodiment is described.First, after utilizing the holding surface 3a attracting holding plate workpiece W of chuck table 3, drive stage support platform 24, chuck table 3 is moved in the X-axis direction, the position of plate workpiece W is defined in the grinding position place opposed with grinding stone 4d.
Before and after this, the position of the upper surface position of plate workpiece W and the upper surface (holding surface 3a) of chuck table 3 is determined by detecting unit (not shown), and according to the thickness of the plate workpiece W calculated by measurement result or by the thickness of plate workpiece W that detects at the upper surface of plate workpiece W and the optical path length of lower surface reflection and the final thickness etc. of prespecified plate workpiece W, obtain the grinding and feeding amount of grinding and feeding unit 44.Then, make chuck table 3 and Grinding wheel 4f continuous rotation, and grinding stone 4d is ground feeding with the grinding and feeding amount obtained in lower direction simultaneously, thus plate workpiece W is ground to final thickness.While grinding fluid is sprayed in the face that is ground of grinding stone 4d and plate workpiece W, this grinding is being carried out from nozzle (not shown).
In the grinding of plate workpiece W, measured the side surface 4e of the grinding stone 4d on the Grinding wheel 4f rotated by determination unit 5.In this mensuration, irradiate from the illuminating part 51 of determination unit 5 and measure light B1.So because Grinding wheel 4f rotates, the position on the side surface 4e of grinding stone 4d that mensuration light B1 injects can change in a rotational direction.The reverberation B2 that the side surface 4e of grinding stone 4d reflects is received by imageing sensor 52, and passes through the distance between the side surface 4e of operational part 56 real-time operation grinding stone 4d and illuminating part 51.According to this operation result, in judging part 57, carry out waveform processing (with reference to Fig. 3), and carry out judgement grinding stone 4d and have unabroken process.Below this process is described.
Fig. 3 is the curve map of the measurement result of determination unit 5.In figure 3, the longitudinal axis represents the distance between the side surface 4e of grinding stone 4d and illuminating part 51, and transverse axis represents the time in grinding.As shown in Figure 3, every the stipulated time, the distance between the side surface 4e of grinding stone 4d and illuminating part 51 all can be elongated, and this expression is set up in parallel multiple grinding stone 4d in the form of a ring and there is gap between adjacent grinding stone 4d.Therefore, in figure 3, representing the width of grinding stone 4d apart from the part shown in the symbol D between elongated 2 parts, the breakage of grinding stone 4d is judged in the portion.
When all not having damaged in multiple grinding stone 4d, in all parts in figure 3 shown in symbol D, the distance between the side surface 4e of grinding stone 4d and illuminating part 51 is all constant.Here, when grinding stone 4d creates the breakages such as breach, only creating the part of this breach, the distance between the side surface 4e of grinding stone 4d and illuminating part 51 is elongated, uses operational part 56 to calculate this distance.According to this operation result, in judging part 57, as shown in the symbol C of Fig. 3, only for the part creating breach, be different from other parts and carry out making the waveform processing elongated apart from local, thus being judged as existing damaged at the side surface 4e of grinding stone 4d.According to this judgement, the work of control part (not shown) to grinding unit 4 grade controls and interrupts grinding, and makes display unit and notifying device (all not shown) carry out work, passes on above-mentioned exception to operator.
As mentioned above, grinding attachment 1 according to the present embodiment, even if the abrasive particle of grinding stone 4d is formed by the bonding agent of jewelry, expensive clothing and other valuables, creates the breakages such as breach due to grinding on grinding stone 4d, and judging part 57 also can be used to judge this breakage.Thereby, it is possible to avoid using damaged grinding stone 4d to proceed grinding, can suppress bad in the processing being ground formation damage or tool brindled grinding form on face of plate workpiece W.Its result, can maintain the state being ground the grinding trace that face is formed of plate workpiece W equably, and then can realize the stabilisation of device quality, the raising of Product Precision.
Further, because illuminating part 51 and imageing sensor 52 are positioned at the side of grinding stone 4d, so, can, to arrange illuminating part 51 and imageing sensor 52 away from the mode of grinding stone 4d, the grinding fluid of Sprayable thus can be suppressed to be attached to their surface.And, can be easy to adopt the design arranging air curtain, water seal etc. between illuminating part 51 and the side surface 4e of imageing sensor 52 and grinding stone 4d, the attachment of grinding fluid can be suppressed more well.
And then, because the surface of illuminating part 51 and imageing sensor 52 is along vertical setting, so even if the grinding fluid attachment of Sprayable is over their surface, this grinding fluid also can flow and fall, thus can reduce the adhesion amount of grinding fluid.Thereby, it is possible to make the estimating precision of determination unit 5 become stable.
In addition, the invention is not restricted to above-mentioned embodiment, can various change be carried out implement.In the above-described embodiment, in accompanying drawing, illustrated size, shape, direction etc. are all not limited thereto, and suitably can change in the scope playing effect of the present invention.In addition, not departing from the scope of the object of the invention, can carry out suitably changing implementing.
Such as, also can add to above-mentioned embodiment the casing (not shown) surrounding framework 53.Casing has the shutter door opened when illuminating part 51 and imageing sensor 52 measure the side surface 4e of grinding stone 4b, cuts off grinding fluid, thus also can protect illuminating part 51 and imageing sensor 52 by closing shutter door.
Further, the structure that arranges of the illuminating part 51 in determination unit 5 and imageing sensor 52 is not limited to above-mentioned embodiment, such as, also can arrange supporting construction on column 22 or support 44b.As concrete example, the structure shown in Fig. 4 can be enumerated.Fig. 4 is the stereogram of the grinding attachment that variation is shown.In the above-described embodiment, framework 53 is uprightly set from pedestal 2 by pillar 54, but also can, as shown in the variation of Fig. 4, via bracket 44e, pillar 54 is connected with support 44b, and support 44b and framework 53 are linked.In this situation, even if make grinding unit 4 move by grinding and feeding unit 44, the side surface 4e of grinding stone 4d also can be measured when keeping constant by framework 53 with the relative position of grinding stone 4d.Therefore, as long as the attachment of grinding fluid can be suppressed, just side surface 4e can be measured.
Utilizability in industry
As mentioned above, the present invention is useful in the grinding attachment by being arranged on grinding grinding stone on the Grinding wheel of rotation plate workpiece being carried out to grinding.
Claims (1)
1. a grinding attachment, it has: chuck table, and it keeps plate workpiece; Grinding unit, it is installed in the mode that can rotate and has arranged the Grinding wheel of grinding stone in the form of a ring, and this grinding stone is used for carrying out grinding to the plate workpiece that this chuck table keeps; And determination unit, it measures the side surface of this grinding stone, it is characterized in that,
This determination unit has: illuminating part, and its side surface to this grinding stone irradiates and measures light; Imageing sensor, it receives this mensuration light of irradiating from this illuminating part by the reverberation after the reflection of the side surface of grinding stone; Operational part, its according to this imageing sensor detect this reverberation detect position come computing from this illuminating part the distance to the side surface of this grinding stone; And judging part, the change of its this distance calculated according to this operational part judges the breakage of this grinding stone.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-210208 | 2014-10-14 | ||
| JP2014210208A JP2016078147A (en) | 2014-10-14 | 2014-10-14 | Grinding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105500137A true CN105500137A (en) | 2016-04-20 |
Family
ID=55708635
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510651931.2A Pending CN105500137A (en) | 2014-10-14 | 2015-10-10 | Grinding apparatus |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2016078147A (en) |
| KR (1) | KR20160043898A (en) |
| CN (1) | CN105500137A (en) |
| TW (1) | TW201620675A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108015673A (en) * | 2016-11-01 | 2018-05-11 | 株式会社迪思科 | Grinding attachment |
| US20180200865A1 (en) * | 2017-01-16 | 2018-07-19 | Disco Corporation | Method of detecting clogging of chuck table and processing apparatus |
| CN108296935A (en) * | 2017-01-11 | 2018-07-20 | 株式会社迪思科 | Chuck table and grinding attachment |
| CN109249304A (en) * | 2018-09-21 | 2019-01-22 | 西安理工大学 | A kind of plane lapping precision sizing equipment and control method |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6860416B2 (en) * | 2017-05-18 | 2021-04-14 | 株式会社ディスコ | Processing equipment |
| JP6953075B2 (en) * | 2017-08-09 | 2021-10-27 | 株式会社ディスコ | Cutting equipment and wafer processing method |
| KR102593254B1 (en) * | 2023-02-27 | 2023-10-25 | 주식회사 베셀 | Semiconductor manufacturing apparatus and semiconductor fabricating method using the same |
| CN118294458B (en) * | 2024-06-05 | 2024-08-16 | 河北双羊砂轮制造有限公司 | Laser detection device for grinding wheel |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11300612A (en) * | 1998-04-22 | 1999-11-02 | Asahi Glass Co Ltd | Method and device for grinding platelike body |
| CN1815694A (en) * | 2005-02-01 | 2006-08-09 | 矽品精密工业股份有限公司 | Semiconductor processing process |
| CN101670533A (en) * | 2009-09-25 | 2010-03-17 | 南京信息工程大学 | Cutting-tool wear state evaluating method based on image analysis of workpiece machining surface |
| JP2012148387A (en) * | 2011-01-21 | 2012-08-09 | Disco Corp | Machining device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05220733A (en) * | 1992-02-17 | 1993-08-31 | Yokogawa Electric Corp | Dicing abnormality sensing device |
-
2014
- 2014-10-14 JP JP2014210208A patent/JP2016078147A/en active Pending
-
2015
- 2015-09-01 TW TW104128798A patent/TW201620675A/en unknown
- 2015-09-23 KR KR1020150134804A patent/KR20160043898A/en unknown
- 2015-10-10 CN CN201510651931.2A patent/CN105500137A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11300612A (en) * | 1998-04-22 | 1999-11-02 | Asahi Glass Co Ltd | Method and device for grinding platelike body |
| CN1815694A (en) * | 2005-02-01 | 2006-08-09 | 矽品精密工业股份有限公司 | Semiconductor processing process |
| CN101670533A (en) * | 2009-09-25 | 2010-03-17 | 南京信息工程大学 | Cutting-tool wear state evaluating method based on image analysis of workpiece machining surface |
| JP2012148387A (en) * | 2011-01-21 | 2012-08-09 | Disco Corp | Machining device |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108015673A (en) * | 2016-11-01 | 2018-05-11 | 株式会社迪思科 | Grinding attachment |
| CN108015673B (en) * | 2016-11-01 | 2021-06-04 | 株式会社迪思科 | Grinding device |
| CN108296935A (en) * | 2017-01-11 | 2018-07-20 | 株式会社迪思科 | Chuck table and grinding attachment |
| US20180200865A1 (en) * | 2017-01-16 | 2018-07-19 | Disco Corporation | Method of detecting clogging of chuck table and processing apparatus |
| US10500696B2 (en) * | 2017-01-16 | 2019-12-10 | Disco Corporation | Method of detecting clogging of chuck table and processing apparatus |
| CN109249304A (en) * | 2018-09-21 | 2019-01-22 | 西安理工大学 | A kind of plane lapping precision sizing equipment and control method |
| CN109249304B (en) * | 2018-09-21 | 2019-09-27 | 西安理工大学 | A kind of plane lapping precision sizing equipment and control method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2016078147A (en) | 2016-05-16 |
| TW201620675A (en) | 2016-06-16 |
| KR20160043898A (en) | 2016-04-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105500137A (en) | Grinding apparatus | |
| TWI674948B (en) | Grinding device | |
| JP6377433B2 (en) | Grinding method | |
| JP6732382B2 (en) | Processing device and method of processing workpiece | |
| JP2006021264A (en) | Grinding apparatus | |
| JP2012135853A (en) | Grinding device | |
| JP2018062052A (en) | Cutting method and cutting device | |
| JP2015116637A (en) | Grinding method | |
| JP2015036170A (en) | Grinding device | |
| JP2017056523A (en) | Grinding device | |
| JP6226722B2 (en) | Height position detection method | |
| KR20160033041A (en) | Method for grinding workpiece | |
| JP6598668B2 (en) | Grinding equipment | |
| JP5731806B2 (en) | Grinding equipment | |
| CN101733850A (en) | Cutting device | |
| JP6251614B2 (en) | Workpiece grinding method | |
| JP2013222822A (en) | Dividing method | |
| JP5654365B2 (en) | Grinding equipment | |
| JP6262593B2 (en) | Grinding equipment | |
| TWI726134B (en) | Grinding device | |
| TW202302478A (en) | Installation for producing at least one useful part from a glass pane | |
| JP2012152859A (en) | Grinding device | |
| KR102570199B1 (en) | Wafer evaluation method | |
| JP2010186776A (en) | Method of grinding wafer | |
| JP6244206B2 (en) | Grinding equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160420 |