CN101733850A - Cutting device - Google Patents
Cutting device Download PDFInfo
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- CN101733850A CN101733850A CN200910220848A CN200910220848A CN101733850A CN 101733850 A CN101733850 A CN 101733850A CN 200910220848 A CN200910220848 A CN 200910220848A CN 200910220848 A CN200910220848 A CN 200910220848A CN 101733850 A CN101733850 A CN 101733850A
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- cutting
- cutting tip
- light
- topping machanism
- opposite directions
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- 238000005520 cutting process Methods 0.000 title claims abstract description 170
- 239000007788 liquid Substances 0.000 claims abstract description 79
- 239000002173 cutting fluid Substances 0.000 claims abstract description 50
- 239000012530 fluid Substances 0.000 claims abstract description 8
- 230000009429 distress Effects 0.000 claims description 34
- 238000012360 testing method Methods 0.000 claims description 27
- 239000002699 waste material Substances 0.000 claims description 6
- 238000002347 injection Methods 0.000 claims description 5
- 239000007924 injection Substances 0.000 claims description 5
- 238000012423 maintenance Methods 0.000 claims description 5
- 238000011144 upstream manufacturing Methods 0.000 claims description 5
- 238000005507 spraying Methods 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 abstract description 51
- 230000003287 optical effect Effects 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 46
- 238000001514 detection method Methods 0.000 description 37
- 238000004140 cleaning Methods 0.000 description 10
- 239000007921 spray Substances 0.000 description 10
- 230000007547 defect Effects 0.000 description 8
- 230000002950 deficient Effects 0.000 description 8
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 206010028896 Needle track marks Diseases 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
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- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Dicing (AREA)
Abstract
The present invention provides a cutting device which is capable of accurately detecting damaged condition of a cutting blade in cutting when a optical method is used for detecting a damaged condition of the cutting blade. The cutting device (1) has a cutting blade (41) for cutting a semiconductor chip (W) through rotating and a platform (13) for holding the semiconductor chip (W). A cutting can be performed by making the curring blade (41) and the platform (13) move relatively at the same time of providing a cutting fluid to the cutting blade (41). The cutting device also has a damaged condition detecting part (57) which has a light-emitting component (62) and a light accepting component (63) that are opposed with each other and isolated by the edge of the cutting blade (41) for detecting the damaged condition of the cutting blade (41) according to the light accepting quantity of the light accepting component (63), and a cutting fluid supplying part (56) for supplying fluid in the opposing room between the light-emitting component (62) and the light accepting component (63) for assisting the detecting and fulfilling the opposing room by the detecting assistance liquid.
Description
Technical field
The present invention relates to topping machanism, particularly utilize cutting tip to cut the topping machanism of semiconductor wafer along cutting off preset lines.
Background technology
In production process of semiconductor device, on the surface of the semiconductor wafer of circular plate shape roughly, form cancellate spacing track (street, predetermined cut-off rule), in the zone that spacing track marks off, form circuit such as IC, LSI.Then, utilize cutting (Dicing) device semiconductor wafer to be cut, be divided into each semiconductor chip along spacing track as topping machanism.The semiconductor chip that is partitioned into by this way is widely used in electric equipments such as mobile phone and computers after encapsulating.
In the past, as the method for utilizing this cutter sweep to come dividing semiconductor wafer, known had a method (for example with reference to patent documentation 1) of washing the cutting swarf that produces because of cutting by cutting fluid.This cutter sweep sprays cutting fluid from a plurality of jet blowers to the processing part and the cutting tip of semiconductor wafer when the discoideus cutting tip that is made of diamond abrasive grain is rotated at a high speed.Then, cutter sweep has been cut under a certain amount of state of semiconductor wafer at cutting tip, cuts feeding along spacing track, cuts semiconductor wafer thus.
[patent documentation 1] Japanese kokai publication hei 11-8211 communique
In addition, in cutter sweep,, considered to be provided with the structure of distress condition detecting sensor for the distress condition of cutting tip in confirming to cut.About this distress condition detecting sensor, light-emitting component and photo detector with between dispose in opposite directions across the mode of the knife-edge of cutting tip, the knife-edge that the light beam that penetrates from light-emitting component is cut blade partly blocks and is received by photo detector, detects the distress condition of cutting tip according to the light income of photo detector.
But, because when cutting, be to spray cutting fluid to the processing part and the cutting tip of semiconductor wafer from a plurality of jet blowers, therefore, cutting fluid that is involved in because of cutting tip rotation and the drop that splashes are fed in the space in opposite directions between light-emitting component and the photo detector, cause light generation scattering owing to the transmissivity of these drops etc. and air and refractive index are different, cause the light income instability of photo detector thus.Therefore, existence can't accurately detect the problem of the distress condition of cutting tip in the cutting.
Summary of the invention
The present invention finishes just in view of the above problems, and it is a kind of when utilizing optical mode to detect the distress condition of cutting tip that its purpose is to provide, and can accurately detect the topping machanism of the distress condition of the cutting tip in the cutting.
Topping machanism of the present invention has the workpiece maintaining part of coming the cutting tip and the described workpiece of maintenance of cutting workpiece by rotation, when described cutting tip provides cutting fluid, described cutting tip and described workpiece maintaining part are relatively moved cut described workpiece, it is characterized in that, this topping machanism also has: the distress condition test section, it has light-emitting component and photo detector, and detect the distress condition of described cutting tip according to the light income of described photo detector, wherein, described light-emitting component and photo detector with between dispose in opposite directions across the mode of the knife-edge of described cutting tip; And the liquid supply unit, its feed fluid of space in opposite directions between described light-emitting component and described photo detector makes liquid be full of described space in opposite directions.
According to this structure, utilize light income under the state that the space in opposite directions between light-emitting component and the photo detector is full of by liquid to detect the distress condition of cutting tip in the cutting, therefore, even the drop of the cutting fluid that is involved in the cutting fluid in the rotation of cutting tip and splashes is fed in the space in opposite directions between light-emitting component and the photo detector, can prevent that also these indrawn cutting fluids and the drop that splashes from causing transmissivity and refractive index in the space in opposite directions between light-emitting component and the photo detector that the situation that part changes takes place.Therefore, the light income instability of the photo detector that causes by interference can be suppressed, the distress condition of cutting tip in the cutting can be detected exactly.
In addition, the invention is characterized in, in above-mentioned topping machanism, described liquid supply unit near described space in opposite directions, from the upstream side of the direction of rotation of described cutting tip by spraying to described space in opposite directions feed fluid.
According to this structure, owing to be near the space in opposite directions between light-emitting component and the photo detector, upstream side feed fluid from the direction of rotation of cutting tip, therefore, shortened from ejecting liquid to the distance that supplies in the space in opposite directions, the liquid that ejects is near space in opposite directions, thus, can by the rotation of cutting tip with efficient liquid supply in opposite directions in the space, can making in opposite directions, the space remains the state that is full of liquid.
In addition, the invention is characterized in that in above-mentioned topping machanism, this topping machanism has the blade cover that covers described cutting tip, put at described blade and be provided with discharge portion that the waste liquid that this discharge portion splashes cutting is discharged to the outside of described blade cover.
According to this structure, because the waste liquid that splashes of cutting is discharged to the outside of blade cover, therefore, in the inboard of blade cover, the internal circulating load of waste liquid reduces, and can suppress waste liquid and be fed in the space in opposite directions between light-emitting component and the photo detector.Thus, can improve the accuracy of detection of the distress condition of cutting tip in the cutting.
In addition, the invention is characterized in, in above-mentioned topping machanism, described liquid supply unit is arranged on the upstream of the direction of rotation of described cutting tip with respect to described space in opposite directions, and is arranged on the downstream of the direction of rotation of described cutting tip with respect to described discharge portion.
According to this structure, utilize discharge portion and suppressed waste liquid to be fed to space in opposite directions between light-emitting component and the photo detector, therefore, can be by the rotation of cutting tip from the liquid supply unit to the liquid of space supplying clean in opposite directions.
In addition, the invention is characterized in that in above-mentioned topping machanism, described liquid supply unit comes feed fluid from the upside of the periphery of described cutting tip by injection.
According to this structure, from the upside atomizing of liquids of the periphery of described cutting tip, therefore, liquid is involved in cutting tip and splashes upward, and then is fed in the space in opposite directions between light-emitting component and the photo detector.Thus, the liquid fallback of gravitate reduces, can with efficient liquid supply in opposite directions in the space.
In addition, the invention is characterized in that in above-mentioned topping machanism, the liquid of supply is cutting fluid.
According to this structure, the source that provides of the liquid of the supply of space in opposite directions between light-emitting component and photo detector can be consistent with the supply source of cutting fluid, can simplify the apparatus structure of topping machanism.In addition, be fed in the space in opposite directions that is full of liquid with the drop that splashes even if be involved in the cutting fluid of cutting tip, but, therefore, can improve the accuracy of detection of the distress condition of cutting tip because transmissivity is consistent with refractive index.
According to the present invention, when utilizing optical mode to detect the distress condition of cutting tip, can accurately detect the distress condition of the cutting tip in the cutting.
Description of drawings
Fig. 1 is the figure that the embodiment of topping machanism of the present invention is shown, and is the stereogram that is supported on the semiconductor wafer on the ring frame.
Fig. 2 is the figure that the embodiment of topping machanism of the present invention is shown, and is the stereoscopic figure of topping machanism.
Fig. 3 is the figure that the embodiment of topping machanism of the present invention is shown, and is the stereogram of cutting unit.
Fig. 4 is the figure that the embodiment of topping machanism of the present invention is shown, and is the stereoscopic figure of blade unit.
Fig. 5 is the figure that the embodiment of topping machanism of the present invention is shown, and is the side schematic view of blade unit (a), (b) is the A-A generalized section of the blade unit in (a).
Fig. 6 is the figure that the embodiment of topping machanism of the present invention is shown, and is to be illustrated in not use the curve map that carries out the result of defects detection under the situation that detects auxiliary liquid.
Fig. 7 is the figure that the embodiment of topping machanism of the present invention is shown, and is that expression has used the auxiliary liquid of detection to carry out the result's of defects detection curve map.
Fig. 8 is the figure that the embodiment of topping machanism of the present invention is shown, and is the figure at expression mensuration position on the cutting tip when carrying out the defects detection of cutting tip.
Fig. 9 is the figure that the embodiment of topping machanism of the present invention is shown, and is to be illustrated in not use the curve map that damages the result of detection under the situation that detects auxiliary liquid fully.
Figure 10 is the figure that the embodiment of topping machanism of the present invention is shown, and is that expression has used the auxiliary liquid of detection to damage the result's of detection curve map fully.
Label declaration
1, topping machanism; 2, casing; 3, cutting unit; 13, Ka Tai (workpiece maintaining part); 14, blade unit; 17, card table transferring mechanism; 19, blade unit travel mechanism; 41, cutting tip; 43, blade cover; 45, opposed jet blower 46, the place ahead jet blower; 47, forefront jet blower; 48, top jet blower (liquid supply unit) 56, cutting fluid supply unit (liquid supply unit); 57, distress condition test section; 61, support portion; 62, light-emitting component; 63, photo detector; 64, discharge portion; W, semiconductor wafer (workpiece).
The specific embodiment
Below, with reference to accompanying drawing embodiments of the present invention are elaborated.At first, before the topping machanism to embodiments of the present invention described, simple declaration was as the semiconductor wafer of cutting object.Fig. 1 is the stereogram that is supported on the semiconductor wafer on the ring frame.
As shown in Figure 1, semiconductor wafer W forms roughly discoideus, and its surface is aligned to the cancellate preset lines of cutting apart and is divided into a plurality of zones, is formed with devices 71 such as IC, LSI in the zone that these mark off.In addition, semiconductor wafer W is supported on the ring frame 73 via adhesive tape (tape) 72, and under the state in being contained in not shown magazine (cassette), is admitted to and is sent from topping machanism 1.
In addition, in the present embodiment, as workpiece, with semiconductor wafers such as silicon wafers is that example describes, but be not limited to this structure, can also be attached to DAF on the semiconductor wafer W (DieAttach Film: the chip attachment film) encapsulation, pottery, glass, sapphire and substrate, the various electric component of silicon system and the various rapidoprints that require the micron order precision of bonding parts, semiconductor product such as, as workpiece.
Next, the topping machanism of embodiments of the present invention is described with reference to Fig. 2.Fig. 2 is the stereoscopic figure of the topping machanism of embodiments of the present invention.Fig. 3 is the stereogram of cutting unit of the topping machanism of embodiments of the present invention.
As shown in Figure 2, topping machanism 1 has rectangular-shaped casing 2, contains cutting unit 3 (with reference to Fig. 3) in the inside of casing 2.Cutting unit 3 has semiconductor wafer W is taken into card platform 13 in the casing 2, in Fig. 2, shows that card platform 13 moves to the outside and the state waited in the place ahead of casing 2.The place ahead at casing 2, be adjacent to the card platform 13 of the outside that moves to casing 2, be provided with and send into unloading part 4 and cleaning unit 5, wherein, send into unloading part 4 and be used to send into and be sent from the magazine of accommodating semiconductor wafer W, the semiconductor wafer W that 5 pairs of cuttings of cleaning unit finish is cleaned.
The front face 2a of casing 2 is provided with push-pull arm 6, upper arm 7 and underarm 8, wherein, push-pull arm 6 is sent into the handing-over of the semiconductor wafer W between unloading part 4 and the card platform 13, and upper arm 7 and underarm 8 block the handing-over of the semiconductor wafer W between platform 13 and the cleaning unit 5.In addition, be provided with pair of guide rails 15 above card platform 13, pair of guide rails 15 constitutes can be separated from one another or close.And a side 2b of casing 2 is provided with the motor 9 of touch panel formula, and this motor 9 is used to set various processing conditions, for example is used for the cutting speed of control of topping machanism 1 and cutting fluid quantity delivered etc.
Send into unloading part 4 and have the mounting plate 11 that is used for the mounting magazine, mounting plate 11 can carry out lifting.Send into unloading part 4 and have lifting placing plate 11 under the state of magazine in mounting, regulate thus semiconductor wafer W on short transverse the release location and push the position.
On the upper surface of cleaning unit 5, be formed with circular peristome 5a, have the maintenance platform 12 that keeps the semiconductor wafer W that cutting finishes in the central authorities of peristome 5a.Keep platform 12 between the inside of the peristome 5a of the upper surface of cleaning unit 5 and cleaning unit 5, to carry out lifting.When keeping platform 12 to be positioned at peristome 5a, the semiconductor wafer W that cutting is finished remains on the maintenance platform 12, when keeping platform 12 to drop to the inside of cleaning unit 5, the semiconductor wafer W that cutting finishes is cleaned.
Push-pull arm 6 constitutes, under the state of sending into after unloading part 4 has carried out the adjusting of magazine height, from magazine, release semiconductor wafer W and with its mounting on pair of guide rails 15, in addition, the semiconductor wafer W that is positioned on the pair of guide rails 15 is pushed in the magazine.About pair of guide rails 15, when mounting has semiconductor wafer W, support semiconductor wafer W close to each otherly, and, semiconductor wafer W is positioned, and when mounting semiconductor wafer W not, be separated from one another into mounting surface across card platform 13 with respect to card platform 13.Upper arm 7 is picked up the semiconductor wafer W that is positioned on the pair of guide rails 15, between the pair of guide rails 15 after separate, semiconductor wafer W is placed on the card platform 13, in addition, picks up the semiconductor wafer W that cutting finishes it is placed on the maintenance platform 12.Underarm 8 constitutes, and picks up to clean the semiconductor wafer W finish and place it on the pair of guide rails 15.
As shown in Figure 3, cutting unit 3 constitutes, and a pair of blade unit 14 with cutting tip 41 is relatively moved with the card platform 13 that is keeping semiconductor wafer W cut semiconductor wafer W.Cutting unit 3 has pedestal 16, and pedestal 16 is provided with the card table transferring mechanism 17 that card platform 13 is moved along X-direction.In addition, on the pedestal 16 of cutting unit 3, be provided with across card table transferring mechanism 17, the upright pair of column sections 18 that is provided with, be provided with blade unit travel mechanism 19 on the top of this a pair of column sections 18, this blade unit travel mechanism 19 moves blade unit 14 above card platform 13.
Card table transferring mechanism 17 has: the brace table 21 that extends on X-direction; The pair of guide rails 22 that is configured on the brace table 21 and is parallel to each other; And be slidably disposed on motor-driven X-axis workbench 23 on the pair of guide rails 22.In addition, card platform 13 is fixed on the top of X-axis workbench 23.Card platform 13 has the anchor clamps 24 that driven by pneumatic actuator on four direction, utilize these four anchor clamps 24 to come clamping ring frame 73, and semiconductor wafer W is remained state behind the location.
Blade unit travel mechanism 19 has: the brace table 25 that extends on Y direction; Be configured in the pair of guide rails that is parallel to each other 26 of the front of brace table 25; Be slidably disposed on the motor-driven a pair of Y-axis workbench 27 on the pair of guide rails 26.In addition, blade unit travel mechanism 19 has: the pair of guide rails that is parallel to each other 28 that is configured in each Y-axis workbench 27 front respectively; Be configured in each slidably to the motor-driven Z axle workbench 29 on the guide rail 28.On each Z axle workbench 29, extend respectively and be provided with blade unit 14.
In addition, the rear side at X-axis workbench 23, each Y-axis workbench 27 and each Z axle workbench 29 is formed with not shown nut portions respectively, and these nut portions and ball- screw 31,32 screw (Z axle workbench use ball-screw illustrate).And, on the both ends of the ball-screw 32 of the ball-screw 31 of X-axis workbench 23 usefulness, Y-axis workbench 27 usefulness, ball-screw that Z axle workbench is used, be connected with a pair of drive motors 34,35,36 respectively, drive motors rotated the driving ball-screw by these.
Details aftermentioned, blade unit 14 have the axle 42 that is connected with cutting tip 41, and the driving by axle 42 comes high speed rotary cutting blade 41.Then, by moving of Y-axis workbench 27, make cutting tip 41 the position alignment semiconductor wafer W cut apart preset lines, by the penetraction depth of regulating that moves of Z axle workbench 29 to semiconductor wafer W.Afterwards, by moving of X-axis workbench 23, under remaining on state on the card platform 13, semiconductor wafer W cuts feeding.By repeating above action, semiconductor wafer W is cut apart along the cancellate preset lines of cutting apart.
Next, be elaborated with reference to Fig. 4 and Fig. 5 blade unit.Fig. 4 is the stereoscopic figure of the blade unit of embodiments of the present invention.Fig. 5 is the schematic diagram of the blade unit of embodiments of the present invention, is the side schematic view of blade unit (a), (b) is the A-A generalized section of the blade unit in (a).In addition, in Fig. 4 and Fig. 5, for convenience of explanation, only illustrate the peripheral part of cutting tip.
As shown in Figure 4 and Figure 5, blade unit 14 has: along the cutting tip 41 of arrow R direction rotation; Axle 42 (with reference to the Fig. 3) that are connected with cutting tip 41; The blade that periphery outside the processing part of cutting tip 41 is covered overlaps 43.Cutting tip 41 for example has discoideus cutting grinding tool, and this cutting grinding tool utilizes the binding material be combined into by abrasive particles such as diamonds, and cutting tip 41 is installed on the leading section of axle 42.In addition,, be not limited to this shape, for example also can form ring-type though that the cutting tip of present embodiment forms is discoideus.
A pair of opposed jet blower 45 is connected with cutting fluid supply unit 56 via connecting portion 51 respectively, to the cutting tip injection cutting fluid of semiconductor wafer W, carries out the cooling and the cleaning of cutting tip.The place ahead jet blower 46 is connected with cutting fluid supply unit 56 via connecting portion 52, and in the past direction cutting tip 41 sprays cutting fluids, and cutting fluid is rolled on the cutting tip 41 and carries out the cooling and the cleaning of cutting tip.
Forefront jet blower 47 is connected with cutting fluid supply unit 56 via connecting portion 53, with the line parallel that is cutting and be adjacent to, sprays cutting fluid to the adjacent line that has cut off, carries out the cleaning of adjacent line.Top jet blower 48 is connected with cutting fluid supply unit 56 via connecting portion 54, sprays to distress condition test section 57 described later and detects auxiliary liquid, distress condition test section 57 is cleaned, and improve accuracy of detection.In addition, detecting auxiliary liquid is the liquid identical with cutting fluid.
Distress condition test section 57 has: across the top of cutting tip 41 and opposed a pair of support portion 61; Be arranged on the light-emitting component 62 in a pair of support portion 61; And be arranged on photo detector 63 on another.In addition, light-emitting component 62 and photo detector 63 are arranged on the inner surface of a pair of support portion 61, and the knife-edge that the light beam that penetrates from light-emitting component 62 is cut blade 41 partly blocks and received by photo detector 63.That is, distress condition test section 57 detects the damage fully of cutting tip 41 or has distress conditions such as defective according to the increase of the quantities received of photo detector 63.
And, distress condition test section 57 from above jet blower 48 eject under the state that detects auxiliary liquid and confirm distress condition.At this moment, be full of the auxiliary liquid of the detection of ejecting from top jet blower 48 in the space in opposite directions between light-emitting component 62 and the photo detector 63, the light beam that penetrates from light-emitting component 62 passes and detects auxiliary liquid and received by photo detector 63.
Therefore, the drop and the indrawn cutting fluid of the cutting fluid that splashes by the cutting tip of cutting tip 41, even be fed in the space in opposite directions between light-emitting component 62 and the photo detector 63, it is constant that the transmissivity in the space in opposite directions between light-emitting component 62 and the photo detector 63 and refractive index also can keep, and these are different with situation about receiving in air.That is, can suppress and be rolled into the turbulent flow that the cutting fluid in this space causes by the drop of the cutting fluid in the space in opposite directions that is sent to unevenly between light-emitting component 62 and the photo detector 63.
In this case, top jet blower 48 is positioned near the of distress condition test section 57 and is partial to the cutting direction rear of cutting tip 41 slightly, the auxiliary liquid of the detection of ejecting is near the space in opposite directions between light-emitting component 62 and the photo detector 63, therefore, can will detect auxiliary liquid by the rotation of cutting tip 41 and supply to more efficiently in opposite directions in the space, can making in opposite directions, the space remains the state that detects auxiliary liquid that is full of.
In addition, top jet blower 48 also sprays the auxiliary liquid of detection from the upside of cutting tip 41 peripheries, therefore, the auxiliary liquid of the detection of ejecting is involved in cutting tip 41 and splashes upward, and then is fed in the space in opposite directions between light-emitting component 62 and the photo detector 63.Thus, the whereabouts of gravitate amount reduces, in the space in opposite directions that can supply to efficiently.And, owing to be to provide continuously in the space in opposite directions between light-emitting component 62 and photo detector 63 to detect to assist liquid, therefore, can prevent on the receiving plane of dirt attached to the exit facet of light-emitting component 62 and photo detector 63.
In addition, the auxiliary liquid of detection that ejects from top jet blower 48 is the liquid identical with the cutting fluid that ejects from other jet blowers, therefore, the supply source of cutting fluid can be made as same supply source.In addition, the auxiliary liquid of detection that ejects from top jet blower 48 also can be the liquid different with the cutting fluid that ejects from other jet blowers.In this case, the auxiliary liquid of detection that ejects from top jet blower 48 can be to have the transmissivity identical with the cutting fluid that ejects from other jet blowers and the liquid of refractive index, also can be the liquid with transmissivity higher than the cutting fluid that ejects from other jet blowers.
On blade cover 43, the cutting direction rear that is positioned at cutting tip 41 and with respect to above jet blower 48 be positioned at the position at the direction of rotation rear of cutting tip 41, be provided with discharge portion 64, the dirty cutting fluid of utilizing discharge portion 64 that cutting is splash is discharged to the outside of blade cover 43.Discharge portion 64 connects the position that dirty cutting fluid entered easily that the cutting because of cutting tip 41 splashes, and in this connects partly, the plate that tilts in the mode that uprises towards the direct of travel rear is installed.
That is, be discharged from dirty cutting fluid that portion 64 is taken into and splash, and then be discharged in the not shown drain pan towards the top of direct of travel rear side.Thus, in the inboard of blade cover 43, the internal circulating load of dirty cutting fluid reduces, and can suppress dirty cutting fluid and be fed in the space in opposite directions between light-emitting component 62 and the photo detector 63.Thus, the auxiliary liquid of new detection is fed in the space in opposite directions between light-emitting component 62 and the photo detector 63, and the arrival amount that is in the dirty cutting fluid that comprises cutting swarf etc. of turbulent condition reduces, so has improved the accuracy of detection of distress condition test section 57.
Then, the light income of the photo detector 63 of distress condition test section 57 is imported in the not shown control part, calculates the light rate that is subjected to according to light income in control part.In addition, about being subjected to the light rate in the present embodiment, receive at photo detector 63 under the situation of all light beams that penetrate from light-emitting component 62, to be subjected to the light rate to be made as 100%, according to the influence of knife-edge that is subjected to cutting tip 41 and interference etc. and the actual amount that is received by photo detector 63 is calculated the light rate that is subjected to.Here, for clear and definite effect of the present invention, having implemented up, jet blower sprays the detection test of the distress condition of cutting tip 41 under the state that detects auxiliary liquid and is not spraying the detection test of the distress condition of cutting tip 41 under the state that detects auxiliary liquid.
Below, the test result of detection test of the distress condition of cutting tip 41 is described.The defects detection test of cutting tip 41 at first, is described with reference to Fig. 6 and Fig. 7.In test, on blade unit Z1 and blade unit Z2, be separately installed with the cutting tip 41 of defective with a place 4 (μ m) angular travel.In addition, for the cutting tip 41 without the physical presence defective cuts, the front end of cutting tip 41 is navigated on the position with the surface distance of semiconductor wafer W hundreds of (μ m), speed with 20 (mm/s) is carried out relative feeding to card platform 13 with cutting tip 41, measures by the simulation processing action.The rotating speed of cutting tip 41 and the flow of each jet blower are undertaken by following condition.
The condition of ■ blade unit Z1 side
Rotating speed of flail: 45000 (rpm)
The total emitted dose of a pair of opposed jet blower: 1.4 (l/min)
The emitted dose of the place ahead jet blower: 1.0 (l/min)
The emitted dose of forefront jet blower: 1.0 (l/min)
The condition of ■ blade unit Z2 side
Rotating speed of flail: 50000 (rpm)
The total emitted dose of a pair of opposed jet blower: 1.4 (l/min)
The emitted dose of the place ahead jet blower: 1.0 (l/min)
The emitted dose of forefront jet blower: 1.0 (l/min)
Fig. 6 is illustrated in not use the curve map that carries out the result of defects detection under the situation that detects auxiliary liquid.Fig. 7 is that expression has used the auxiliary liquid of detection to carry out the result's of defects detection curve map.The emitted dose that detects auxiliary liquid is 0.5 (l/min).About locating, as shown in Figure 8,, 1000 positions have approximately been measured along the neighboring of cutting tip 41.
Here, ask for the summation that is subjected to the light rate of carrying out repeated detection respectively and obtaining, divided by measuring number of times, the value that obtains on average is subjected to the light rate as first then respectively locating.And first summation that on average is subjected to the light rate of asking for that all locate then divided by the quantity that locates, on average is subjected to the light rate with the value that obtains as second.About being subjected to the light rate, when photo detector 63 is received all from light beam that light-emitting component 62 penetrates be subjected to the light rate be made as 100% be subjected to the light rate.Transverse axis is represented locating of cutting tip 41.The longitudinal axis represents that first on average is subjected to the light rate.Solid line Z1 represents to be installed in the testing result of the cutting tip 41 on the blade unit Z1.Solid line Z2 represents to be installed in the testing result of the cutting tip 41 on the blade unit Z2.
According to Fig. 6 and Fig. 7 as can be known, in the testing result of Z2, locating between 100～150, first on average is subjected to the light rate to become big, and in the testing result of Z1, is measuring between the position 800～900, and first on average is subjected to the light rate to become big, therefore is identified as defective respectively.Fig. 6 and Fig. 7 are compared, exist among Fig. 6 defective the position first on average be subjected to the light rate on average to be subjected to the light rate approximately high by 4% than second, exist among Fig. 7 defective the position first on average be subjected to the light rate on average to be subjected to the light rate about high by 7% than second.
This be because, in Fig. 7, the detected auxiliary liquid in space in opposite directions between light-emitting component 62 and the photo detector 63 is full of, therefore, even the drop of the cutting fluid that is involved in the cutting fluid in the rotation of cutting tip 41 and splashes is fed in the space in opposite directions between light-emitting component 62 and the photo detector 63, the drop of the cutting fluid that also can prevent these indrawn cutting fluids and splash causes transmissivity and the refractive index in the space in opposite directions between light-emitting component 62 and the photo detector 63 that the situation that part changes takes place, and can suppress the light income instability of the photo detector 63 that caused by interference.
Usually, when existing first on average to be subjected to the light rate high, defective is regarded as in this position to surpassing second when on average being subjected to the position of light rate setting (for example 4%).
Hence one can see that, compares with existing topping machanism, and topping machanism 1 of the present invention can detect littler defective accurately.
Next, illustrate that with reference to Fig. 9 and Figure 10 the damage fully of cutting tip 41 detects test.In test, on blade unit Z1 and blade unit Z2, flawless cutting tip 41 has been installed respectively.In addition, similarly measure with the defects detection test by simulation processing.Light-emitting component 62 and photo detector 63 are set at and are subjected to the light rate is on 10% the position.The rotating speed of cutting tip 41 is identical with the defects detection test with the flow rate condition of each jet blower.
Fig. 9 is illustrated in not use the curve map that damages the result of detection under the situation that detects auxiliary liquid fully.Figure 10 is that expression has used the auxiliary liquid of detection to damage the result's of detection curve map fully.The emitted dose that detects auxiliary liquid is 0.5 (l/min).
Here, ask for the summation of in the time that cutting tip 41 rotates a circle, measuring that is subjected to the light rate, divided by measuring number of times, the value that obtains on average is subjected to the light rate as the 3rd then.Transverse axis is represented the elapsed time, to the curve map right side expression effluxion that advances.The longitudinal axis represents to be subjected to the light rate.Solid line Z1 represents to be installed in the testing result of the cutting tip 41 on the blade unit Z1.Solid line Z2 is illustrated in the testing result of the cutting tip 41 on the blade unit Z2.
Fig. 9 and Figure 10 are compared, in Fig. 9, roughly taken place than large deviation between 10%～40% by the light rate, and in Figure 10, be subjected to the light rate that deviation is roughly taking place between 10%～20%.
This be because, in Figure 10, the detected auxiliary liquid in space in opposite directions between light-emitting component 62 and the photo detector 63 is full of, therefore, even the drop of the cutting fluid that is involved in the cutting fluid in the rotation of cutting tip 41 and splashes is fed in the space in opposite directions between light-emitting component 62 and the photo detector 63, the drop of the cutting fluid that also can prevent these indrawn cutting fluids and splash causes transmissivity and the refractive index in the space in opposite directions between light-emitting component 62 and the photo detector 63 that the situation that part changes takes place, and can suppress the light income instability of the photo detector 63 that caused by interference.
Usually, when the 3rd on average is subjected to the light rate to surpass predetermined value (for example 70%), regards as cutting tip and damage fully.
Hence one can see that, compares with existing topping machanism, and topping machanism 1 of the present invention has reduced cutting tip 41 do not taken place fully to damage thinks the possibility that cutting tip 41 damages fully by mistake, can detect more accurately.Though cutting tip 41 is worn along with the carrying out of processing, and,,, also can identify complete distress condition exactly even the cutting tip 41 of wearing and tearing had taken place according to the present invention owing to wearing and tearing cause being subjected to the light rate to increase.
In addition, in the above-described embodiment, top jet blower 48 is formed near the space in opposite directions between light-emitting component 62 and the photo detector 63, but is not limited to this structure.For example, the also flow of the auxiliary liquid of detection that can eject according to the rotating speed of cutting tip 41 and from top jet blower 48 is formed on top jet blower 48 on the position away from this space.
In addition, in the above-described embodiment, constitute, the auxiliary liquid of the detection of ejecting from top jet blower 48 is involved in cutting tip 41 and upwards splashes, and then by the space in opposite directions between light-emitting component 62 and the photo detector 63, but be not limited to this structure, also can directly the auxiliary liquid of detection be ejected in the space in opposite directions between light-emitting component 62 and the photo detector 63.
In addition, in the above-described embodiment, top jet blower 48 sprays the injection direction of the auxiliary liquid of detection and the direction of rotation of cutting tip 41 roughly is crossed as the right angle, but be not limited to this structure, also can constitute, spray the injection direction and the roughly consistent direction of the direction of rotation of cutting tip 41 that detects auxiliary liquid from top jet blower 48, spray.Thus, can be more efficiently supply in the space in opposite directions between light-emitting component 62 and the photo detector 63 detecting auxiliary liquid.
In addition, in the above-described embodiment, constitute, thereby spraying the detected auxiliary liquid in the space in opposite directions that makes between light-emitting component 62 and the photo detector 63 by top jet blower 48 is full of, but be not limited to this structure, so long as get final product with detecting the structure of assisting liquid to be full of the space in opposite directions between light-emitting component 62 and the photo detector 63.For example also can constitute, under the part of the knife-edge of cutting tip 41 is immersed in state in the liquid, in the middle of light-emitting component 62 and photo detector 63 be configured in and on the position in opposite directions across the part of this knife-edge.
In addition, in the above-described embodiment, discharge portion 64 forms the plate that is equipped with to tilt in the mode that uprises towards the direct of travel rear, but, also can constitute, plate is not set, but, on blade cover 43, peristome or incomplete portion is set in the mode that the dirty cutting fluid that does not hinder cutting to splash is discharged to processing direct of travel rear.
In addition, in disclosed embodiment, all the elements all are exemplary, thereby are not subjected to the restriction of present embodiment.It is illustrated that scope of the present invention is not only above-mentioned embodiment, and as described in claims, scope of the present invention is represented the implication that is equal to claims and comprised all changes in the scope.
[utilizability on the industry]
As mentioned above, the present invention is aspect the distress condition of utilizing optical mode detection cutting tip, have the effect that can accurately detect the distress condition of the cutting tip in the cutting, to cut the topping machanism of semiconductor wafer particularly useful along cutting off preset lines for utilizing cutting tip.
Claims (6)
1. topping machanism, this topping machanism has the workpiece maintaining part of coming the cutting tip and the described workpiece of maintenance of cutting workpiece by rotation, when described cutting tip provides cutting fluid, described cutting tip and described workpiece maintaining part are relatively moved cut described workpiece, it is characterized in that this topping machanism also has:
The distress condition test section, it has light-emitting component and photo detector, and detect the distress condition of described cutting tip according to the light income of described photo detector, wherein, described light-emitting component and photo detector with between dispose in opposite directions across the mode of the knife-edge of described cutting tip; And
The liquid supply unit, its feed fluid of space in opposite directions between described light-emitting component and described photo detector makes liquid be full of described space in opposite directions.
2. topping machanism according to claim 1 is characterized in that,
Described liquid supply unit near described space in opposite directions, from the upstream side of the direction of rotation of described cutting tip by spraying to described space in opposite directions feed fluid.
3. topping machanism according to claim 1 and 2 is characterized in that,
This topping machanism has the blade cover that covers described cutting tip,
Put at described blade and to be provided with discharge portion, the waste liquid that this discharge portion splashes cutting is discharged to the outside of described blade cover.
4. topping machanism according to claim 3 is characterized in that,
Described liquid supply unit is arranged on the upstream of the direction of rotation of described cutting tip with respect to described space in opposite directions, and is arranged on the downstream of the direction of rotation of described cutting tip with respect to described discharge portion.
5. according to each described topping machanism in the claim 1 to 4, it is characterized in that,
Described liquid supply unit comes feed fluid from the upside of the periphery of described cutting tip by injection.
6. according to each described topping machanism in the claim 1 to 5, it is characterized in that,
The liquid that described liquid supply unit is supplied with is cutting fluid.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008285342A JP2010114251A (en) | 2008-11-06 | 2008-11-06 | Cutting device |
| JP2008-285342 | 2008-11-06 |
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| Publication Number | Publication Date |
|---|---|
| CN101733850A true CN101733850A (en) | 2010-06-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910220848A Pending CN101733850A (en) | 2008-11-06 | 2009-11-06 | Cutting device |
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| CN (1) | CN101733850A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103921357A (en) * | 2013-01-15 | 2014-07-16 | 株式会社迪思科 | Cutting device |
| CN105082378A (en) * | 2014-05-06 | 2015-11-25 | 黄海沔 | Intelligent jewel cutting machine |
| CN109342146A (en) * | 2018-11-30 | 2019-02-15 | 河海大学 | A kind of prismatical joint rock mass sample chemical cleavage device with angle |
| CN109501015A (en) * | 2017-09-14 | 2019-03-22 | 株式会社迪思科 | Cutting apparatus |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7458807B2 (en) * | 2020-02-07 | 2024-04-01 | 株式会社ディスコ | cutting equipment |
| JP2022084051A (en) * | 2020-11-26 | 2022-06-07 | Ｔｏｗａ株式会社 | Blade cover, cutting device, and method for manufacturing cut product |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4185713B2 (en) * | 2002-06-21 | 2008-11-26 | 株式会社ディスコ | Blade cover |
| JP4704816B2 (en) * | 2005-06-29 | 2011-06-22 | 株式会社ディスコ | Cutting equipment |
| JP2008149388A (en) * | 2006-12-14 | 2008-07-03 | Disco Abrasive Syst Ltd | Cutting apparatus |
| JP2008262983A (en) * | 2007-04-10 | 2008-10-30 | Disco Abrasive Syst Ltd | Dicing method |
-
2008
- 2008-11-06 JP JP2008285342A patent/JP2010114251A/en active Pending
-
2009
- 2009-11-06 CN CN200910220848A patent/CN101733850A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103921357A (en) * | 2013-01-15 | 2014-07-16 | 株式会社迪思科 | Cutting device |
| CN105082378A (en) * | 2014-05-06 | 2015-11-25 | 黄海沔 | Intelligent jewel cutting machine |
| CN109501015A (en) * | 2017-09-14 | 2019-03-22 | 株式会社迪思科 | Cutting apparatus |
| CN109342146A (en) * | 2018-11-30 | 2019-02-15 | 河海大学 | A kind of prismatical joint rock mass sample chemical cleavage device with angle |
| CN109342146B (en) * | 2018-11-30 | 2021-03-02 | 河海大学 | Chemical cutting device for columnar jointed rock mass sample with inclination angle |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2010114251A (en) | 2010-05-20 |
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