CN105489560A - Huskless filled and protected circuit element and manufacturing technology thereof - Google Patents
Huskless filled and protected circuit element and manufacturing technology thereof Download PDFInfo
- Publication number
- CN105489560A CN105489560A CN201510847390.0A CN201510847390A CN105489560A CN 105489560 A CN105489560 A CN 105489560A CN 201510847390 A CN201510847390 A CN 201510847390A CN 105489560 A CN105489560 A CN 105489560A
- Authority
- CN
- China
- Prior art keywords
- circuit element
- filler
- shell
- protection type
- type circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/54—Providing fillings in containers, e.g. gas fillings
Abstract
The invention discloses a huskless filled and protected circuit element and a manufacturing technology thereof. The huskless filled and protected circuit element is formed by welding an electronic element and a lead with a solder and then carrying out encapsulation molding with a filler, wherein the filler is formed by evenly mixing a high-temperature insulating material of quick lime, cement or ceramic powder with a binder at the ratio of 2.5-4.5 g/ml. The filler disclosed by the invention is high in strength and high-temperature resistant; filling and curing can be carried out at a room temperature; bad factors of bubbles and the like caused by coating of coating powder at a high temperature in a traditional technology are avoided; meanwhile, the procedure can be simplified by the filler; the production and manufacturing time is saved; and the reliability and the yield of a product are improved.
Description
Technical field
The present invention relates to circuit element technical field, particularly relate to one and fill protection type circuit element without shell and make technique.
Background technology
Traditional circuit element, the application powder that product uses carries out application in the painting shove charge of high temperature, and because the time is long and the problem of technique, after causing application, product surface has the problem such as bubble and product electrical property failure.Tradition coating process complexity is various, and not easily management and control yields is low, and the huge area occupied of coating equipment is large and can produce dust and high temperature pollutes, and affects workshop air environment.
Summary of the invention
The object of the invention is to provide a kind of for the deficiencies in the prior art fill protection type circuit element without shell and make technique; this intensity of packing of filling protection type circuit element without shell is large, high temperature resistant; filling solidification just can be carried out in normal temperature situation; avoid application powder at high temperature application in traditional handicraft and can produce the undesirable elements such as bubble; with using this filler that operation can be simplified, save reliability and yield that the manufacturing time improves product.
For achieving the above object, the present invention is achieved through the following technical solutions.
One is filled protection type circuit element without shell and is made technique; include electronic component to carry out carrying out encapsulated moulding by filler after solder welds with lead-in wire, described filler is that the high-temperature insulation material of quick lime, cement or ceramic powders and adhesive carry out Homogeneous phase mixing according to the ratio of 2.5 ~ 4.5g/ml.
Wherein, described mixture is that the high-temperature insulation material of quick lime, cement or ceramic powders and adhesive carry out Homogeneous phase mixing according to the ratio of 3.5g/ml.
Wherein, described electronic component is temperature alloy silk, gas discharge tube, piezo-resistance or Transient Suppression Diode semiconductor chip.
Wherein, described lead-in wire is insert molded after being welded by solder with electronic component in mould and then loads filler and carry out filling and encapsulate.
Wherein, described lead-in wire is the copper of metal conductive materials, copper steel, iron or iron nickel conducting metal or alloy material and surface can through tin, silver, nickel or gold surface process.
Wherein, described lead-in wire is linear, U-shaped, V-arrangement or L shape.
Beneficial effect of the present invention is: one of the present invention is filled protection type circuit element without shell and made technique, include electronic component to carry out carrying out encapsulated moulding by filler after solder welds with lead-in wire, described filler is quick lime, the high-temperature insulation material of cement or ceramic powders and adhesive carry out Homogeneous phase mixing according to the ratio of 2.5 ~ 4.5g/ml, intensity of packing of the present invention is large, high temperature resistant, filling solidification just can be carried out in normal temperature situation, avoid application powder at high temperature application in traditional handicraft and can produce the undesirable elements such as bubble, operation can be simplified with using this filler, save reliability and yield that the manufacturing time improves product.
Accompanying drawing explanation
Utilize accompanying drawing to be further detailed the present invention below, but the embodiment in accompanying drawing does not form any limitation of the invention.
Fig. 1 is structural representation of the present invention;
Fig. 2 is cutaway view of the present invention;
Fig. 3 is the structural representation of the embodiment of the present invention two;
Fig. 4 is the structural representation of the embodiment of the present invention three.
Embodiment
Below in conjunction with concrete execution mode, the present invention will be described.
As Figure 1-4; one is filled protection type circuit element without shell and is made technique; include electronic component 41 to carry out carrying out encapsulated moulding by filler 2 after solder 5 welds with lead-in wire, described filler 2 is that the high-temperature insulation material of quick lime, cement or ceramic powders and adhesive carry out Homogeneous phase mixing according to the ratio of 2.5 ~ 4.5g/ml.
Further, when described filler is mixed by high-temperature insulation material and binding agent, the setting time of the mixed packing of different mixing proportion, intensity, toughness are different, preferred as the present invention, described mixture 2 is that the high-temperature insulation material of quick lime, cement or ceramic powders and adhesive carry out Homogeneous phase mixing according to the ratio of 3.5g/ml.
Preferred as the present invention, described electronic component 4 is temperature alloy silk, gas discharge tube, piezo-resistance or Transient Suppression Diode semiconductor chip.
Further, described lead-in wire 1 is insert molded in mould after being welded by solder 5 with electronic component 4 and then loads filler 2 and carry out filling and encapsulate.
Preferred as the present invention, described lead-in wire 1 is the copper of metal conductive materials, copper steel, iron or iron nickel conducting metal or alloy material and surface can through tin, silver, nickel or gold surface process.
Preferred as the present invention, described lead-in wire 1 is linear, U-shaped, V-arrangement or L shape.
Need further explain, embodiments of the invention have following:
Embodiment one:
As shown in Figure 1-2, when described electronic component 4 is voltage dependent resistor chip, after described lead-in wire 1 welds with electronic component 4, be placed to fixed position in pattern, load filler 2 and make electronic component 4 be filled thing 2 completely to wrap up.
Embodiment two:
As shown in Figure 3, when described electronic component 4 is the product of Transient Suppression Diode chip bipod, the electrode integrative-structure formed by lead-in wire 1, solder 5, electronic component 4, solder 5, the electrode integrative-structure that lead-in wire 1 is formed, puts into shaping mould and uses filler 2 to load solidification to make after welding.
Embodiment three:
As shown in Figure 4, when described electronic component is the product of Transient Suppression Diode chip tripod, form electrode integrative-structure by lead-in wire 1, solder 5, electronic component 4, solder 5, the electrode integrative-structure that lead-in wire 1 is formed, solder 5, electronic component 4, solder 5, the electrode integrative-structure that lead-in wire 1 is formed, puts into shaping mould and uses filler 2 to load solidification to make after welding.
Embodiments of the invention one, two, three with make partly to lead group circuit element electric property all better than traditional handicraft, use the filler in this example to avoid application powder at high temperature application in traditional handicraft and can produce the undesirable elements such as bubble, operation can be simplified with using this filler, save reliability and yield that the manufacturing time improves product, wherein implement two with embodiment three distinguish with, the mode that both connect in circuit is different, embodiment two is two pins, and embodiment three is three pins.
Above content is only preferred embodiment of the present invention, and for those of ordinary skill in the art, according to thought of the present invention, all will change in specific embodiments and applications, this description should not be construed as limitation of the present invention.
Claims (6)
1. fill protection type circuit element and make technique without shell for one kind; it is characterized in that: include electronic component (4) and carry out carrying out encapsulated moulding by filler (2) after solder (5) welds with lead-in wire (1), described filler (2) is quick lime, the high-temperature insulation material of cement or ceramic powders and adhesive carry out Homogeneous phase mixing according to the ratio of 2.5 ~ 4.5g/ml.
2. fill protection type circuit element and make technique according to claim 1 one kind without shell, it is characterized in that: described mixture (2) is quick lime, the high-temperature insulation material of cement or ceramic powders and adhesive carry out Homogeneous phase mixing according to the ratio of 3.5g/ml.
3. fill protection type circuit element and make technique according to claim 1 one kind without shell, it is characterized in that: described electronic component (4) is temperature alloy silk, gas discharge tube, piezo-resistance or Transient Suppression Diode semiconductor chip.
4. fill protection type circuit element and make technique according to claim 1 one kind without shell, it is characterized in that: described lead-in wire (1) is insert molded in mould after being welded by solder (5) with electronic component (4) then to be loaded filler (2) and carry out filling and encapsulate.
5. fill protection type circuit element and make technique according to claim 1 one kind without shell, it is characterized in that: the copper that described lead-in wire (1) is metal conductive materials, copper steel, iron or iron nickel conducting metal or alloy material surface can through tin, silver, nickel or gold surface process.
6. fill protection type circuit element and make technique according to claim 6 one kind without shell, it is characterized in that: described lead-in wire (1) is linear, U-shaped, V-arrangement or L shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510847390.0A CN105489560A (en) | 2015-11-30 | 2015-11-30 | Huskless filled and protected circuit element and manufacturing technology thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510847390.0A CN105489560A (en) | 2015-11-30 | 2015-11-30 | Huskless filled and protected circuit element and manufacturing technology thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105489560A true CN105489560A (en) | 2016-04-13 |
Family
ID=55676458
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510847390.0A Pending CN105489560A (en) | 2015-11-30 | 2015-11-30 | Huskless filled and protected circuit element and manufacturing technology thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105489560A (en) |
Citations (9)
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|---|---|---|---|---|
| CN2720645Y (en) * | 2004-07-29 | 2005-08-24 | 亿光电子工业股份有限公司 | Anti-electrostatic package structure for light-emitting diode |
| CN101042952A (en) * | 2007-04-27 | 2007-09-26 | 甘立刚 | Varistor with novel short-circuit protection device |
| CN101842333A (en) * | 2007-10-29 | 2010-09-22 | 京瓷株式会社 | Process for producing conductor built-in ceramic |
| CN102024900A (en) * | 2010-10-29 | 2011-04-20 | 济南大学 | Piezoelectric sensor, beam type concrete sensor, and preparation methods and application thereof |
| CN202523702U (en) * | 2011-12-27 | 2012-11-07 | 百圳君耀电子（深圳）有限公司 | Semiconductor component packaging structure |
| CN104374808A (en) * | 2014-11-10 | 2015-02-25 | 常州市双成工具有限公司 | Diesel engine smoke intensity sensor |
| WO2015067441A1 (en) * | 2013-11-07 | 2015-05-14 | Heraeus Deutschland GmbH & Co. KG | Semiconductor module with an encasing cement mass that covers a semiconductor component |
| CN104835606A (en) * | 2015-04-03 | 2015-08-12 | 兴勤（常州）电子有限公司 | Electronic component multilayer alloy electrode and production method thereof |
| CN204732398U (en) * | 2015-04-21 | 2015-10-28 | 广东百圳君耀电子有限公司 | Lead-in wire electrode structure, framework and electronic device |
-
2015
- 2015-11-30 CN CN201510847390.0A patent/CN105489560A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2720645Y (en) * | 2004-07-29 | 2005-08-24 | 亿光电子工业股份有限公司 | Anti-electrostatic package structure for light-emitting diode |
| CN101042952A (en) * | 2007-04-27 | 2007-09-26 | 甘立刚 | Varistor with novel short-circuit protection device |
| CN101842333A (en) * | 2007-10-29 | 2010-09-22 | 京瓷株式会社 | Process for producing conductor built-in ceramic |
| CN102024900A (en) * | 2010-10-29 | 2011-04-20 | 济南大学 | Piezoelectric sensor, beam type concrete sensor, and preparation methods and application thereof |
| CN202523702U (en) * | 2011-12-27 | 2012-11-07 | 百圳君耀电子（深圳）有限公司 | Semiconductor component packaging structure |
| WO2015067441A1 (en) * | 2013-11-07 | 2015-05-14 | Heraeus Deutschland GmbH & Co. KG | Semiconductor module with an encasing cement mass that covers a semiconductor component |
| CN104374808A (en) * | 2014-11-10 | 2015-02-25 | 常州市双成工具有限公司 | Diesel engine smoke intensity sensor |
| CN104835606A (en) * | 2015-04-03 | 2015-08-12 | 兴勤（常州）电子有限公司 | Electronic component multilayer alloy electrode and production method thereof |
| CN204732398U (en) * | 2015-04-21 | 2015-10-28 | 广东百圳君耀电子有限公司 | Lead-in wire electrode structure, framework and electronic device |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB03 | Change of inventor or designer information |
Inventor after: Zhou Yunfu Inventor after: Zhou Quan Inventor after: Zhang Guang Inventor after: Li Yanhua Inventor after: Wang Zujiang Inventor before: Zhou Yunfu Inventor before: Zhou Quan |
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| COR | Change of bibliographic data | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160413 |
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| RJ01 | Rejection of invention patent application after publication |