CN204732398U - Lead-in wire electrode structure, framework and electronic device - Google Patents
Lead-in wire electrode structure, framework and electronic device Download PDFInfo
- Publication number
- CN204732398U CN204732398U CN201520245082.6U CN201520245082U CN204732398U CN 204732398 U CN204732398 U CN 204732398U CN 201520245082 U CN201520245082 U CN 201520245082U CN 204732398 U CN204732398 U CN 204732398U
- Authority
- CN
- China
- Prior art keywords
- lead
- wire
- chip
- electrode structure
- wire electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The utility model discloses a kind of lead-in wire electrode structure, framework and electronic device, relate to electronic component technology field.Described lead-in wire electrode structure comprises lead-in wire and electrode, and described lead-in wire and electrode are formed in one.Described lead-in wire electrode structure saves bonding wire operation, there is not the rosin joint of traditional handicraft, bonding wire efficiency be low, equipment is unstable, bonding wire to problems such as damage of product, improve product reliability and quality; Adopt frame-type, can automated production be carried out, enhance productivity, homogeneity of product etc.; By using the integrally formed structure of lead-in wire electrode, can assemble each smooth attractive in appearance, take the less circuit element of pcb board.
Description
Technical field
The utility model relates to electronic component technology field, particularly relates to a kind of electrode structure that goes between, comprises the framework of this lead-in wire electrode structure and comprises the electronic device of this lead-in wire electrode structure.
Background technology
Traditional circuit element, lead-in wire and electrode be two parts, by solder bond together, however there is rosin joint in traditional solder taul technique, bonding wire is insecure, bonding wire efficiency is low, bonding wire to damage of product, performance index instability etc. problems.The progress of science and technology, chip, circuit board integrated level are more and more higher, various circuit element manufacture, towards more and more saving spatial development, therefore produces the region taking pcb board (printed circuit board (PCB)) less, and the more stable circuit element of electrical property is especially important.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of lead-in wire electrode structure, framework and electronic device, there is not conventional circuit elements bonding wire problem in described lead-in wire electrode structure, and in the equal electrically situation of conventional circuit elements, the region taking pcb board is less, electrically more stable.
For solving the problems of the technologies described above, technical solution adopted in the utility model is: a kind of lead-in wire electrode structure, is characterized in that: described lead-in wire electrode structure comprises lead-in wire and electrode, and described lead-in wire and electrode are formed in one.
Further technical scheme is: the front and back sides of described electrode is solder side, the side, upper and lower, left and right of electrode is lead-in wire installation surface, one end of lead-in wire is arranged in a lead-in wire installation surface, the other end of lead-in wire is free end, and the central axis of lead-in wire is parallel with the solder side of electrode and be between former and later two solders side; Described electrode shape is square, polygon, circle or oval, and lead-in wire is radial mode, L-type or J type.
The invention also discloses a kind of lead-in wire electrode structure framework, it is characterized in that: described framework comprises lead-in wire electrode structure described in several and metallic interconnect, the free end of the electrode on described lead-in wire electrode structure is arranged on metallic interconnect, and between lead-in wire electrode structure, interval is arranged.
The invention also discloses a kind of electronic device, it is characterized in that: comprise the lead-in wire electrode structure described in two, be provided with a chip between two lead-in wire electrode structures, the lead-in wire electrode structure of arranged on left and right sides is welded on the left and right solder side of chip respectively by solder.
Further technical scheme is: described chip is that semiconductor chip, discharge tube, metal oxide are pressure-sensitive, carborundum or macromolecule/ceramic material.
The invention also discloses a kind of electronic device, it is characterized in that: comprise the lead-in wire electrode structure described in two, a chip is provided with between two lead-in wire electrode structures, be provided with between the lead-in wire electrode structure in left side and chip and between the lead-in wire electrode structure on right side and chip without going between electrode, without lead-in wire electrode by solder and lead-in wire electrode structure and chips welding.
Further technical scheme is: described chip is that semiconductor chip, discharge tube, metal oxide are pressure-sensitive, carborundum or macromolecule/ceramic material.
The invention also discloses a kind of electronic device, it is characterized in that: comprise the lead-in wire electrode structure described in two, two chips are provided with between two lead-in wire electrode structures, be provided with between the lead-in wire electrode structure in left side and the chip in left side, between the chip in left side and the chip on right side and between the chip on right side and the lead-in wire electrode structure on right side without go between electrode, without the welding electronic elements of electrode by solder and the left and right sides that go between.
Further technical scheme is: described chip is that semiconductor chip, discharge tube, metal oxide are pressure-sensitive, carborundum or macromolecule/ceramic material.
The invention also discloses a kind of electronic device, it is characterized in that: comprise the lead-in wire electrode structure described in three, be provided with a chip between two adjacent lead-in wire electrode structures, the lead-in wire electrode structure of chip both sides is by solder and chips welding.
The beneficial effect adopting technique scheme to produce is: described lead-in wire electrode structure saves bonding wire operation, there is not the rosin joint of traditional handicraft, bonding wire efficiency be low, equipment is unstable, bonding wire to problems such as damage of product, improve product reliability and quality; Adopt frame-type, can automated production be carried out, enhance productivity, homogeneity of product etc.; By using the integrally formed structure of lead-in wire electrode, can assemble each smooth attractive in appearance, take the less circuit element of pcb board.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of electrode structure of going between described in the utility model;
Fig. 2 is the schematic diagram of electrode structure framework of going between in the utility model;
Fig. 3-4 is structural representations of the embodiment one of electronic device;
Fig. 5 is the structural representation of the embodiment two of electronic device;
Fig. 6 is the structural representation of the embodiment three of electronic device;
Fig. 7 is the structural representation of the embodiment four of electronic device;
Wherein: 1, electrode structure 11, lead-in wire 12, electrode 2, solder 3, chip 4, nothing lead-in wire electrode 5, metallic interconnect.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, be clearly and completely described the technical scheme in the utility model embodiment, obviously, described embodiment is only a part of embodiment of the present utility model, instead of whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all belong to the scope of the utility model protection.
Set forth a lot of detail in the following description so that fully understand the utility model, but the utility model can also adopt other to be different from alternate manner described here to implement, those skilled in the art can when doing similar popularization without prejudice to when the utility model intension, and therefore the utility model is by the restriction of following public specific embodiment.
As shown in Figure 1: the utility model discloses a kind of lead-in wire electrode structure, described lead-in wire electrode structure 1 comprises lead-in wire 11 and electrode 12, and described lead-in wire 11 and electrode 12 are formed in one, and is an entirety.The front and back sides of described electrode 12 is solder side, the side, upper and lower, left and right of electrode 12 is lead-in wire installation surface, one end of lead-in wire 11 is arranged in a lead-in wire installation surface, the other end of lead-in wire 11 is free end, and the central axis of lead-in wire 11 is parallel with the solder side of electrode 12 and be between former and later two solders side.Described electrode 12 shape is square, polygon, circle or oval, and lead-in wire 11 is radial mode, L-type or J type.
As shown in Figure 2, the utility model also comprises a kind of lead-in wire electrode structure framework, and described framework comprises several foregoing lead-in wire electrode structure 1 and metallic interconnects 5.The free end of the electrode 12 on described lead-in wire electrode structure 1 is arranged on metallic interconnect 5, and between lead-in wire electrode structure 1, interval is arranged.Multiple lead-in wire electrode is joined integrally, and to be designed to framework integrally formed, being generate to make lead-in wire electrode structure realize automation, enhancing productivity.
Embodiment one
As shown in Figure 3-4, the utility model discloses a kind of electronic device, comprise two foregoing lead-in wire electrode structures 1, be provided with a chip 3 between two lead-in wire electrode structures 1, described chip 3 can be that semiconductor chip, discharge tube, metal oxide are pressure-sensitive, carborundum or macromolecule/ceramic material.The lead-in wire electrode structure 1 of arranged on left and right sides is welded on the left and right solder side of chip respectively by solder 2.The electronic device performance of this kind of structure and efficiency are better than traditional structure, and each smooth attractive in appearance, takies pcb board area little.
Embodiment two
As shown in Figure 5, the utility model discloses a kind of electronic device, comprise foregoing two lead-in wire electrode structures 1, be provided with a chip 3 between two lead-in wire electrode structures 1, described chip 3 can be that semiconductor chip, discharge tube, metal oxide are pressure-sensitive, carborundum or macromolecule/ceramic material.Being provided with between the lead-in wire electrode structure 1 in left side and chip 3 and between the lead-in wire electrode structure 1 on right side and chip 3 without going between electrode 4, being welded with lead-in wire electrode structure 1 and chip 3 by solder without lead-in wire electrode 4.The electronic device performance of this kind of structure and efficiency are better than traditional structure, and each smooth attractive in appearance, takies pcb board area little.
Embodiment three
As shown in Figure 6, the utility model discloses a kind of electronic device, comprise two foregoing lead-in wire electrode structures, be provided with two chips 3 between two lead-in wire electrode structures 1, described chip 3 can be that semiconductor chip, discharge tube, metal oxide are pressure-sensitive, carborundum or macromolecule/ceramic material.Be provided with between the lead-in wire electrode structure 1 in left side and the chip 3 in left side, between the chip 3 in left side and the chip 3 on right side and between the chip 3 on right side and the lead-in wire electrode structure 1 on right side without go between electrode 4, without the welding electronic elements of electrode 4 by solder and the left and right sides that go between.The electronic device performance of this kind of structure and efficiency are better than traditional structure, and each smooth attractive in appearance, takies pcb board area little.
Embodiment four
As shown in Figure 7, the utility model discloses a kind of electronic device, comprise three foregoing lead-in wire electrode structures 1, be provided with a chip 3 between adjacent two lead-in wire electrode structures 1, described chip 3 can be that semiconductor chip, discharge tube, metal oxide are pressure-sensitive, carborundum or macromolecule/ceramic material.The lead-in wire electrode structure 1 of chip 3 both sides is welded with chip 3 by solder 2.
The device performance that embodiment one is made with lead-in wire electrode structure is better than traditional structure a little, and take pcb board area little, each smooth attractive in appearance.Embodiment two is from embodiment one, add thin nothing lead-in wire metal electrode, and using the buffer strip as lead-in wire electrode structure and chip chamber, after increasing buffering nothing lead-in wire metal electrode, the product property indices made is better on the basis of embodiment one product.Embodiment three is the numbers adding chip from embodiment two, to meet different voltage specifications or technical performance index, as can be seen from embodiment three, the quantity of chip according to different voltage specifications or technical performance index, suitably can increase and decrease according to embodiment one or embodiment two.Embodiment four is electronic devices that lead-in wire electrode structure takies three little pins of pcb board area, and can find out from embodiment four, it can be many pin circuitry components and parts.
Described lead-in wire electrode structure saves bonding wire operation, there is not the rosin joint of traditional handicraft, bonding wire efficiency be low, equipment is unstable, bonding wire to problems such as damage of product, improve product reliability and quality; Adopt frame-type, can automated production be carried out, enhance productivity, homogeneity of product etc.; By using the integrally formed structure of lead-in wire electrode, can assemble each smooth attractive in appearance, take the less circuit element of pcb board.
Claims (9)
1. go between an electrode structure, and it is characterized in that: described lead-in wire electrode structure (1) comprises lead-in wire (11) and electrode (12), described lead-in wire (11) and electrode (12) are formed in one; The front and back sides of described electrode (12) is solder side, the side, upper and lower, left and right of electrode (12) is lead-in wire installation surface, one end of lead-in wire (11) is arranged in a lead-in wire installation surface, the other end of lead-in wire (11) is free end, and the central axis of lead-in wire (11) is parallel with the solder side of electrode (12) and be between former and later two solders side; Described electrode (12) shape is square, polygon, circle or oval, and lead-in wire (11) is radial mode, L-type or J type.
2. a lead-in wire electrode structure framework, it is characterized in that: described framework comprises several go between as claimed in claim 1 electrode structure (1) and metallic interconnects (5), the free end of the electrode (12) on described lead-in wire electrode structure (1) is arranged on metallic interconnect (5), and between lead-in wire electrode structure (1), interval is arranged.
3. an electronic device, it is characterized in that: comprise two lead-in wire electrode structures (1) according to claim 1, be provided with a chip (3) between two lead-in wires electrode structure (1), the lead-in wire electrode structure (1) of arranged on left and right sides is welded on the left and right solder side of chip respectively by solder (2).
4. electronic device according to claim 3, is characterized in that: described chip (3) is semiconductor chip, discharge tube, metal oxide are pressure-sensitive, carborundum or macromolecule/ceramic material.
5. an electronic device, it is characterized in that: comprise two lead-in wire electrode structures (1) according to claim 1, a chip (3) is provided with between two lead-in wires electrode structure (1), being provided with without going between electrode (4) between the lead-in wire electrode structure (1) in left side and chip (3) and between the lead-in wire electrode structure (1) on right side and chip (3), being welded with lead-in wire electrode structure (1) and chip (3) by solder without lead-in wire electrode (4).
6. electronic device according to claim 5, is characterized in that: described chip (3) is semiconductor chip, discharge tube, metal oxide are pressure-sensitive, carborundum or macromolecule/ceramic material.
7. an electronic device, it is characterized in that: comprise two lead-in wire electrode structures according to claim 1, two chips (3) are provided with between two lead-in wires electrode structure (1), be provided with nothing between lead-in wire electrode structure (1) and the chip (3) in left side in left side, between the chip (3) in left side with the chip (3) on right side and between the chip (3) on right side with the lead-in wire electrode structure (1) on right side to go between electrode (4), nothing goes between the welding electronic elements of electrode (4) by solder and the left and right sides.
8. electronic device according to claim 7, is characterized in that: described chip (3) is semiconductor chip, discharge tube, metal oxide are pressure-sensitive, carborundum or macromolecule/ceramic material.
9. an electronic device, it is characterized in that: comprise three lead-in wire electrode structures (1) according to claim 1, be provided with a chip (3) between two adjacent lead-in wires electrode structure (1), the lead-in wire electrode structure (1) of chip (3) both sides is welded with chip (3) by solder (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520245082.6U CN204732398U (en) | 2015-04-21 | 2015-04-21 | Lead-in wire electrode structure, framework and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520245082.6U CN204732398U (en) | 2015-04-21 | 2015-04-21 | Lead-in wire electrode structure, framework and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204732398U true CN204732398U (en) | 2015-10-28 |
Family
ID=54390731
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520245082.6U Active CN204732398U (en) | 2015-04-21 | 2015-04-21 | Lead-in wire electrode structure, framework and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204732398U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105489560A (en) * | 2015-11-30 | 2016-04-13 | 广东百圳君耀电子有限公司 | Huskless filled and protected circuit element and manufacturing technology thereof |
-
2015
- 2015-04-21 CN CN201520245082.6U patent/CN204732398U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105489560A (en) * | 2015-11-30 | 2016-04-13 | 广东百圳君耀电子有限公司 | Huskless filled and protected circuit element and manufacturing technology thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204732398U (en) | Lead-in wire electrode structure, framework and electronic device | |
| CN104617073A (en) | Diode device for small signals | |
| CN102800765A (en) | Light emitting diode (LED) packaging structure and packaging process for same | |
| CN204088316U (en) | The 360 degree of luminescences of formal dress flip-chip can arbitrarily around LED silk | |
| CN107708297A (en) | A kind of electroplate lead wire design based on pad | |
| CN203799821U (en) | Coil magnetic core assembly | |
| CN203967124U (en) | A kind of LED lamp of flip-chip packaged multifaceted light-emitting | |
| CN103367040B (en) | A kind of leading foot structure being convenient to the relay of whole machine installation | |
| CN207637785U (en) | Novel high-frequency microwave high power limiter welding assembly structure | |
| CN203136328U (en) | Mounting structure of flexible circuit board pin | |
| CN202662615U (en) | Axial diode | |
| CN212033019U (en) | Light-emitting device of vertical integrated control chip | |
| CN204014275U (en) | For the pad syndeton of link block plate and motherboard | |
| CN205004327U (en) | 62mmIGBT module | |
| CN109166846A (en) | A kind of novel LED display device and manufacture craft | |
| CN203596366U (en) | LED module structure easy to process | |
| CN103325712A (en) | IGBT module packaging welding auxiliary device and system | |
| CN204084484U (en) | Gas-cooker pulse igniter | |
| CN206480625U (en) | A kind of RGBLED structures | |
| CN208479081U (en) | A kind of corrugation pallet gantry using the connection projection welding of tooth form multipole point T-type | |
| CN207624684U (en) | Prevent the semiconductor lead frame of rosin joint | |
| CN103107274B (en) | A kind of LED integrating packaging module adopting transition electrode to realize | |
| CN204441276U (en) | For the diode component of small-signal | |
| CN204088297U (en) | Heavy-duty diode device | |
| CN108364920A (en) | Flip-chip assembly, flip chip packaging structure and preparation method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |