CN105489528A - Washing device - Google Patents
Washing device Download PDFInfo
- Publication number
- CN105489528A CN105489528A CN201510627118.1A CN201510627118A CN105489528A CN 105489528 A CN105489528 A CN 105489528A CN 201510627118 A CN201510627118 A CN 201510627118A CN 105489528 A CN105489528 A CN 105489528A
- Authority
- CN
- China
- Prior art keywords
- chip
- hopper
- shell
- carrying
- cleaning device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
The invention provides a washing device capable of fully washing each chip-size packages (CSP) into which a CSP substrate (packaging substrate) or semiconductor wafer is divided or a chip of a semiconductor chip and the like. The washing device for washing the chip has: a chip container which is formed by meshes of the size limiting passing of the chip; a water storage tank used for soaking the chip container; an ultrasonic generation unit which applies ultrasonic vibration to washing water stored in the water storage tank; a drainage unit which discharges the washing water stored in the water storage tank; and a drying unit which transports air to the chip contained in the water storage tank and thus dries the chip.
Description
Technical field
The present invention relates to the cleaning device for cleaning chip semiconductor wafer etc. being divided into each semiconductor chip etc.
Background technology
In semiconductor device manufacturing process, multiple regions of the arrangement in clathrate on the surface being the roughly semiconductor wafer of circular plate shape form the circuit of IC, LSI etc., and cut off along the segmentation preset lines of regulation each region being formed with this circuit, thus produce each semiconductor chip.As above divided semiconductor chip is packed and be widely used in the electric equipment of mobile phone or personal computer etc.
The electric equipment of mobile phone and personal computer etc. requires to realize lightweight and miniaturization further, and about the encapsulation of semiconductor chip, it is also proposed the encapsulation technology of the realized miniaturization being referred to as chip size packages (CSP).As one of CSP technology, the encapsulation technology being referred to as QuadFlatNon-leadPackage (QFN) is actual to be used.This encapsulation technology being referred to as QFN is being formed with the splicing ear of multiple splicing ear corresponding to semiconductor chip and is being formed with semiconductor chips multiple in rectangular arranging on the battery lead plate of the copper coin of the segmentation preset lines divided on each semiconductor chip etc. in clathrate, and the resin portion formed by casting resin from the rear side of semiconductor chip makes battery lead plate and semiconductor chip form as one, thus form csp substrate (base plate for packaging).By cutting off this base plate for packaging along segmentation preset lines, thus be divided into by the chip size packages (CSP) of each encapsulation.
By cutting off above-mentioned base plate for packaging along segmentation preset lines, thus be divided into and had by the segmenting device of chip size packages (CSP) of each encapsulation: holding station, it is that clathrate is formed with the escape that the cutting edge of cutting tool is kept out of the way in the region corresponding with segmentation preset lines, and is respectively equipped with suction hole in the multiple regions marked off by escape; Cutting unit, it has and cuts off the base plate for packaging that is attracted to maintain in this holding station to be divided into the cutting tool of each chip along segmentation preset lines; Cleaning unit, it is for cleaning the multiple chip size packages (CSP) separated separately by this cutting unit; And accommodating mechanism, it will be arranged on pallet by the multiple chip size packages (CSP) after the cleaning of this cleaning unit and receive (such as with reference to patent documentation 1).
Patent documentation 1 Japanese Unexamined Patent Publication 2013-65603 publication
And, in the segmenting device described in above-mentioned patent documentation 1, although have for cleaning by the cleaning unit of each multiple chip size packages (CSP) separated, but there is the problem that this fully cannot clean chip.
Summary of the invention
The present invention completes in view of the foregoing, its main technical task be to provide one fully to clean cleaning device that csp substrate (base plate for packaging) or semiconductor wafer are split into the chip of each chip size packages (CSP) or semiconductor chip etc.
In order to solve above-mentioned major technique problem, the invention provides a kind of cleaning device cleaning chip, it is characterized in that having: chip collector, it is made up of the mesh of the size passed through of limited chip; Hopper, it is for soaking this chip collector; Ultrasonic wave generating unit, it gives ultrasonic vibration to the rinse water be stored in this hopper; Drainage cell, it discharges the rinse water be stored in this hopper; And drying unit, it makes it dry to the chip conveying air be accommodated in this hopper.
Cleaning device has receives above-mentioned hopper in bottom and the shell on top with space, this shell has the carrying-in/carrying-out opening for moving into and take out of chip collector in upper portion side wall, and be provided with air outlet to received chip collector opening and exhaust outlet at roof, also there is the shutter door for this carrying-in/carrying-out opening of opening and closing, and be connected with the air delivery duct of drying unit at air outlet.
The effect of invention
Cleaning device of the present invention has: chip collector, and it is made up of the mesh of the size passed through of limited chip; Hopper, it is for soaking this chip collector; Ultrasonic wave generating unit, it gives ultrasonic vibration to the rinse water be stored in this hopper; Drainage cell, it discharges the rinse water be stored in hopper; And drying unit, it makes it dry to the chip conveying air be accommodated in hopper, therefore the chip collector being accommodated with chip is soaked in hopper, and make ultrasonic wave generating unit carry out action and give ultrasonic vibration to the rinse water be stored in hopper, therefore, it is possible to fully clean chip.And, about by the chip cleaned, after discharged rinse water by drainage cell, make drying unit carry out action, thus made its blow out air it dry, therefore, it is possible to transported immediately to subsequent processing.
Accompanying drawing explanation
The stereogram of the cleaning device that Fig. 1 is consisted of the present invention.
Fig. 2 is the exploded perspective view that the cleaning device shown in pie graph 1 obtains main structural components.
Fig. 3 is the profile of the cleaning device shown in Fig. 1.
Fig. 4 is the stereogram that the chip collector adduction of the cleaning device represented shown in pie graph 1 contains the state of chip.
Fig. 5 is the key diagram of the matting by the cleaning device enforcement shown in Fig. 1.
Fig. 6 is the key diagram of the drying process by the cleaning device enforcement shown in Fig. 1.
Label declaration
2: shell, 232: shutter door, 3: hopper, 332: rinse water supply pipe, 4: chip collector, 40: mesh container main body, 5: drying unit, 6: ultrasonic wave generating unit, 61: ultrasonic vibration element, 62: alternating current applying unit, 7: drainage cell.
Embodiment
Below, the preferred implementation of the cleaning device formed by the present invention is further described with reference to accompanying drawing.
Fig. 1 illustrates the stereogram of the cleaning device consisted of the present invention, and Fig. 2 illustrates the exploded perspective view of the main structural components of the cleaning device shown in pie graph 1, and Fig. 3 illustrates the profile of the cleaning device shown in Fig. 1.
Cleaning device in illustrated execution mode has rectangular-shaped shell 2, the hopper 3 be accommodated in this shell 2, chip collector 4, the drying unit 5 be soaked in this hopper 3.
As shown in figures 1 and 3, shell 2 is configured to comprise: each other at rectangular-shaped diapire 21 and the roof 22 of upper and lower arranging spaced apart; Connect sidewall 23a and 23b of the dual-side of this diapire 21 and roof 22 respectively; And connect end wall 24a and 24b on limit, two ends of diapire 21 and roof 22 respectively, as shown in Figure 1, diapire 21 is placed on and supports on base station 8.On the top of the sidewall 23a of formation shell 2, as shown in Figure 1, be provided with the carrying-in/carrying-out opening 231 for moving into and take out of chip collector 4, and the open-close lid 232 for this carrying-in/carrying-out opening 231 of opening and closing is installed by not shown linkage.In addition, on the roof 22 forming shell 2, be provided with to the air outlet 221 (with reference to Fig. 3) of chip collector 4 opening be incorporated in shell 2 and the exhaust outlet 222 at shell 2 opening.In addition, as shown in Figure 1, the end wall 24a forming shell 2 is equipped with rinse water ingress pipe 241.This rinse water ingress pipe 241 is connected with not shown rinse water feed unit.
As shown in Figure 2, above-mentioned hopper 3 is configured to comprise rectangular-shaped base plate 31, erect side plate 32a and 32b of setting respectively and erect end plate 33a and 33b of setting from the limit, two ends of base plate 31 respectively from the dual-side of this base plate 31, and open above it.In the upper end of end plate 33a and 33b of formation hopper 3, be provided with and keep out of the way groove 331 and 331 when moving into and take out of chip collector 4 for what keep out of the way for the hand of operator.In addition, be equipped with rinse water supply pipe 332 on the top of an end wall 33a, and be equipped with tapping pipe 333 on the top of another end wall 33b.On the base plate 31 forming hopper 3, as shown in Figure 3, the ultrasonic vibration element 61 forming ultrasonic wave generating unit 6 is equipped.This ultrasonic vibration element 61 is configured to the high-frequency current being applied such as 20kHz by alternating current applying unit 62.In addition, the base plate 31 forming hopper 3 is provided with discharge outlet 311, this discharge outlet 311 is connected with the drainage pipe 71 of the drainage cell 7 getting rid of the rinse water be stored in hopper 3.This drainage pipe 71 is equipped with electromagnetic opening and closing valve 72.Hopper 3 as constructed as above is configured on the diapire 21 of formation shell 2, and is formed with space between itself and roof 22.In addition, if hopper 3 is configured on the diapire 21 of formation shell 2, then as shown in Figure 3, be disposed in the rinse water supply pipe 332 on an end wall 33a by connecting hose 242 connection and be disposed in the rinse water ingress pipe 241 formed on an end wall 24a of above-mentioned shell 2.In addition, be disposed in the tapping pipe 333 on another end wall 33b by connecting hose 244 connection and be disposed in the tapping pipe 243 formed on another end wall 24b of shell 2.
Said chip collector 4 has the open rectangular-shaped mesh container main body 40 in top, and upper edge be provided with foreign side outstanding by support lugn 41a, 41b and 42a, 42b.As shown in Figure 4, mesh container main body 40 is made up of web plate, and this web plate is made up of the mesh passed through of the chip 10 of size limited chip sized package (CSP) etc.From the thickness being set to be less than side plate 32a and 32b of above-mentioned hopper 3 by the width of support lugn 41a, 41b that the long side direction upper edge of mesh container main body 40 is outstanding outward, and the size of keeping out of the way groove 331 and 331 be formed at end plate 33a and 33b can be reached from the outstanding outward thickness being set to be less than end plate 33a and 33b of above-mentioned hopper 3 by the width of support lugn 42a, 42b of the short side direction upper edge of mesh container main body 40.This width be formed as the thickness of end plate 33a and 33b being greater than hopper 3 by support lugn 42a, 42b as keeping this by support lugn 42a, 42b and transporting the handle part of chip collector 4 and play function.
Above-mentioned drying unit 5 has the drying machine main body 50 comprising forced draft fan etc. and the air delivery duct 51 be connected with this drying machine main body 50.As shown in Figure 3, with regard to drying unit 5 as constructed as above, air delivery duct 51 is embedded in the air outlet 221 formed at the roof 22 of above-mentioned shell 2.
Cleaning device in illustrated execution mode is as above formed, and below illustrates that it acts on.
When cleaning the chip of chip size packages (CSP) etc., as shown in Figure 4, in chip collector 4, receive the chip 10 separated by each.Then, open the open-close lid 232 be installed on shell 2 shown in Fig. 1, make carrying-in/carrying-out opening 231 opening, hold on received as mentioned above by the chip collector 4 of each chip 10 separated by support lugn 42a, 42b, and it to be moved in shell 2 from carrying-in/carrying-out opening 231.Then, as shown in Figure 5, the mesh container main body 40 of chip collector 4 is inserted in hopper 3, and is positioned over formation end plate 33a, 33b of hopper 3 and the upper surface of side plate 32a, 32b by by support lugn 42a, 42b with by support lugn 41a, 41b.
As mentioned above, at the chip collector 4 by having received the chip 10 separated by each by support lugn 42a, 42b with when being positioned over by support lugn 41a, 41b the upper surface forming end plate 33a, 33b and side plate 32a, the 32b being disposed in hopper 3 in shell 2, as shown in Figure 5, make not shown rinse water feed unit carry out action, and supply rinse water 30 by rinse water supply pipe 332 pairs of hoppers 3.In addition, when the water level of rinse water 30 arrives tapping pipe 333, can be sluiced by tapping pipe 333.Then, make the alternating current applying unit 62 of formation ultrasonic wave generating unit 6 carry out action, ultrasonic vibration element 61 is applied to the high-frequency current of such as 20kHz.Its result, gives ultrasonic vibration to the rinse water 30 in hopper 3, and the chip 10 be accommodated in the mesh container main body 40 of chip collector 4 is carried out Ultrasonic Cleaning (matting).In addition, the time of giving ultrasonic vibration to the rinse water 30 in hopper 3 can be a few minutes.
After implementing matting as mentioned above, stop the action of not shown rinse water feed unit, and stop the action of the alternating current applying unit 62 forming ultrasonic wave generating unit 6.Then, as shown in Figure 6, open the electromagnetic opening and closing valve 72 forming drainage cell 7, thus discharge the rinse water 30 in hopper 3.Then, drying unit 5 is made to carry out action, by the air delivery duct 51 chimeric with the air outlet 221 on the roof 22 being formed at shell 2, to being implemented matting as mentioned above and the chip 10 be incorporated in the mesh container main body 40 of chip collector 4 sprays air (be preferably hot blast).Its result, the chip 10 after cleaning obtains drying (drying process).As above after implementing drying process, stop the action of drying machine 5, the open-close lid 232 of opening installation on shell 2, the chip collector 4 obtaining dry chip 10 after being accommodated with cleaning is taken out of from carrying-in/carrying-out opening 231 and transports to subsequent processing.
As mentioned above, in the cleaning device of illustrated execution mode, the mesh container main body 40 of the chip collector 4 being accommodated with chip 10 is soaked in hopper 3, and make ultrasonic wave generating unit 6 carry out action to give ultrasonic vibration to the rinse water be stored in hopper 3, therefore, it is possible to fully clean chip 10.And, after having discharged rinse water by drainage cell 7, make drying unit 5 carry out action, make the chip after cleaning 10 dry, therefore, it is possible to transported immediately to subsequent processing.
Claims (2)
1. a cleaning device, it cleans chip,
The feature of this cleaning device is to have:
Chip collector, it is made up of mesh, passing through of the size limited chip of this mesh; Hopper, it is for soaking this chip collector; Ultrasonic wave generating unit, it gives ultrasonic vibration to the rinse water be stored in this hopper; Drainage cell, it discharges the rinse water be stored in this hopper; And drying unit, it makes it dry to the chip conveying air be accommodated in this hopper.
2. cleaning device according to claim 1, wherein,
This cleaning device has shell, and this shell is received this hopper in bottom and had space on top,
This shell has carrying-in/carrying-out opening in upper portion side wall, and this carrying-in/carrying-out opening is used for moving into and take out of chip collector, and this shell is provided with air outlet to received chip collector opening and exhaust outlet at roof,
This shell has the shutter door of this carrying-in/carrying-out opening being carried out to opening and closing, and is connected with the air delivery duct of drying unit at air outlet.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014206145A JP2016073934A (en) | 2014-10-07 | 2014-10-07 | Cleaning device |
| JP2014-206145 | 2014-10-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105489528A true CN105489528A (en) | 2016-04-13 |
Family
ID=55676431
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510627118.1A Pending CN105489528A (en) | 2014-10-07 | 2015-09-28 | Washing device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2016073934A (en) |
| CN (1) | CN105489528A (en) |
| TW (1) | TW201620628A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107424896A (en) * | 2016-05-23 | 2017-12-01 | Sti 有限公司 | Chamber clean system |
| CN112135935A (en) * | 2018-05-08 | 2020-12-25 | 青岛海尔洗衣机有限公司 | Ultrasonic cleaning device |
| CN112427392A (en) * | 2020-12-08 | 2021-03-02 | 江西舜源电子科技有限公司 | Be used for abluent basket of flowers of silicon chip to rock device |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106076995A (en) * | 2016-06-14 | 2016-11-09 | 成都中牧生物药业有限公司 | It is easy to the cleaning method of thorough cleaning agents bottle |
| CN106077000A (en) * | 2016-06-14 | 2016-11-09 | 成都中牧生物药业有限公司 | Based on the reagent bottle clean method improving cleaning effect |
| JP7049298B2 (en) * | 2019-09-27 | 2022-04-06 | 株式会社桜川ポンプ製作所 | Cleaning device for the object to be cleaned and method for cleaning the object to be cleaned using the device |
| CN112427401B (en) * | 2020-12-01 | 2022-03-15 | 莱芜成威电子材料有限公司 | Ultrasonic automatic cleaner convenient to operate |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0889916A (en) * | 1994-09-27 | 1996-04-09 | S N D:Kk | Simplified ultrasonic washer |
| JP2002045802A (en) * | 2000-08-08 | 2002-02-12 | Tdk Corp | Chip type electronic component separating, washing and drying device |
| CN1445825A (en) * | 2002-03-14 | 2003-10-01 | 旺宏电子股份有限公司 | Device for cleaning single type chips |
| CN200981070Y (en) * | 2006-11-10 | 2007-11-28 | 吴永清 | Chip cleaning machine |
-
2014
- 2014-10-07 JP JP2014206145A patent/JP2016073934A/en active Pending
-
2015
- 2015-08-31 TW TW104128613A patent/TW201620628A/en unknown
- 2015-09-28 CN CN201510627118.1A patent/CN105489528A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0889916A (en) * | 1994-09-27 | 1996-04-09 | S N D:Kk | Simplified ultrasonic washer |
| JP2002045802A (en) * | 2000-08-08 | 2002-02-12 | Tdk Corp | Chip type electronic component separating, washing and drying device |
| CN1445825A (en) * | 2002-03-14 | 2003-10-01 | 旺宏电子股份有限公司 | Device for cleaning single type chips |
| CN200981070Y (en) * | 2006-11-10 | 2007-11-28 | 吴永清 | Chip cleaning machine |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107424896A (en) * | 2016-05-23 | 2017-12-01 | Sti 有限公司 | Chamber clean system |
| CN107424896B (en) * | 2016-05-23 | 2019-12-10 | Sti 有限公司 | Chamber cleaning system |
| CN112135935A (en) * | 2018-05-08 | 2020-12-25 | 青岛海尔洗衣机有限公司 | Ultrasonic cleaning device |
| CN112427392A (en) * | 2020-12-08 | 2021-03-02 | 江西舜源电子科技有限公司 | Be used for abluent basket of flowers of silicon chip to rock device |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201620628A (en) | 2016-06-16 |
| JP2016073934A (en) | 2016-05-12 |
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| PB01 | Publication | ||
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160413 |
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| WD01 | Invention patent application deemed withdrawn after publication |