CN105482554B - Electrically conductive ink - Google Patents
Electrically conductive ink Download PDFInfo
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- CN105482554B CN105482554B CN201410522980.1A CN201410522980A CN105482554B CN 105482554 B CN105482554 B CN 105482554B CN 201410522980 A CN201410522980 A CN 201410522980A CN 105482554 B CN105482554 B CN 105482554B
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- electrically conductive
- substrate
- conductive ink
- solvent
- ink
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Abstract
The embodiment of the present invention provides a kind of electrically conductive ink.The electrically conductive ink includes main body ink and substrate solvent.Main body ink accounts for the 60 to 95wt% of electrically conductive ink, and substrate solvent accounts for the 5 to 40wt% of electrically conductive ink.Main body ink further includes multiple conductive particles and bulk solvent, and conductive particle accounts for the 70 to 80wt% of main body ink, and bulk solvent accounts for the 20 to 30wt% of main body ink.In addition, substrate solvent is the solvent for dissolving substrate surface.
Description
Technical field
The present invention relates to a kind of electrically conductive inks, and in particular to a kind of for forming the conductive oil of conductive layer in substrate surface
Ink.
Background technique
It is commonly in the side that the method for line layer is formed on substrate including the use of spraying, dispensing either screen painting at present
Conductive material is formed on substrate by method, later using the method for sintering to form line layer on substrate.
During sintering, if the temperature used too it is low may result in line layer substrate surface adhesive force not
It is good, and have the situation of disengaging, cause wiring board electric conductivity and reliability decrease.However, having if the temperature of sintering is too high
It may result in line layer and substrate deformation, and then influence the quality of wiring board.
Summary of the invention
The embodiment of the present invention provides a kind of electrically conductive ink, this electrically conductive ink can promote conductive layer in the attachment of substrate surface
Power.
The embodiment of the present invention provides a kind of electrically conductive ink, including main body ink and substrate solvent.Main body ink accounts for conductive oil
The 60 to 95wt% of ink, and substrate solvent accounts for the 5 to 40wt% of electrically conductive ink.Main body ink further include multiple conductive particles and
Bulk solvent, conductive particle accounts for the 70 to 80wt% of main body ink, and bulk solvent accounts for the 20 to 30wt% of main body ink.Separately
Outside, substrate solvent is the solvent for dissolving substrate surface.
In conclusion the present invention provides a kind of electrically conductive ink, to form a conductive layer in substrate surface, electrically conductive ink packet
Including main body ink and substrate solvent, substrate solvent enables main body ink to be embedded in substrate surface dissolving substrate surface,
Conductive layer is able to ascend after sintering in the adhesive force of substrate surface.
Be further understood that feature and technology contents of the invention to be enabled, please refer to below in connection with it is of the invention specifically
It is bright, but these explanations are intended merely to illustrate the present invention, rather than make any limitation to interest field of the invention.
Specific embodiment
The present invention provides a kind of electrically conductive ink, and to form conductive layer in substrate surface, this electrically conductive ink includes bulk oil
Ink, substrate solvent and higher boiling ink.Main body ink accounts for the 60 to 95wt% of electrically conductive ink, and substrate solvent accounts for the 5 of electrically conductive ink
To 40wt%, higher boiling ink then accounts for the 5 to 30wt% of electrically conductive ink.In addition, main body ink further includes conductive particle and main body
Solvent, conductive particle accounts for the 70 to 80wt% of main body ink, and bulk solvent then accounts for the 20 to 30wt% of main body ink.
In the present embodiment, conductive particle is Argent grain, and so invention is not limited thereto, in other embodiments, conductive
Particle can be for example copper particle either other conductive materials.In addition, bulk solvent is selected from by polyalcohol and polyol ethers institute
At least one of group of composition, substrate solvent are selected from the group as composed by hydro carbons, esters, phenols, amides and ketone
At least one of.High boiling solvent is the solvent that boiling point is greater than 180 DEG C, can be selected from the group as composed by polyalcohol and polyol ethers
At least one of group.It should be noted that in the present embodiment, bulk solvent and high boiling solvent select property similar at
Point, at the chance analyzed when being used with reducing.
In actual use, user can first mix electrically conductive ink according to aforementioned proportion, and according to actual track
Design, in a manner of screen painting, dispensing or spraying, is formed in substrate surface for electrically conductive ink.And then it is coated with leading
The substrate of electric ink is sent into oven and is sintered, and after the completion of sintering, conductive layer be will form in substrate surface, to prepare circuit base
Plate.It should be noted that in the present embodiment, the material of substrate may include substantially aliphatic hydrocarbon polymer resin, polyamide, polyester
Or polyacrylate.
Specifically, since the material of substrate is largely high molecular polymer, when electrically conductive ink is formed in substrate surface
When, the substrate solvent in electrically conductive ink can dissolve substrate surface so that between the macromolecular chain of substrate surface, free volume,
Away from increase, therefore the main body ink in electrically conductive ink is easier insertion substrate surface.After oversintering, conductive layer is in substrate table
Therefore the adhesive force in face can increase.
In addition to this, the high boiling solvent in electrically conductive ink is mainly the evaporation rate to reduce substrate solvent.At this
In embodiment, substrate solvent selects the lower ingredient of boiling point, so that electrically conductive ink can permeate and be diffused into substrate surface.So
And low-boiling electrically conductive ink evaporation rate is very fast, and in actual use, if the time of applying conductive ink is longer, conductive oil
After the completion of ink may solidify before coating is completed, and then the uniformity for influencing electrically conductive ink coating is either sintered, lead
Electric layer is in the adhesive force of substrate.
In addition, the embodiment of the present invention is that electrically conductive ink is formed in substrate table in the way of printing, dispensing or spraying etc.
Face.In general, the output device of printing, dispensing or spraying, e.g. spray head are open smaller, electrically conductive ink may also can
Because of the too fast volatilization of bulk solvent and substrate solvent, and solidifies and be blocked in the output device of printing, dispensing or spraying, shadow
Ring the efficiency of coating.For this purpose, addition high boiling solvent can reduce the evaporation rate of substrate solvent, and then reduces electrically conductive ink and exist
During coating, the chance that solidifies or block.
It is noted that the amount of addition is controlled since high boiling solvent less easily volatilizees, such as
The content for being high boiling solvent can be less than substrate solvent, and electrically conductive ink is difficult to cured situation when reducing sintering.In fact, high
Boiling point solvent selective according to actual needs can make an addition in electrically conductive ink, in other embodiments, can not also add
High boiling solvent.And when electrically conductive ink does not add high boiling solvent, the preferred proportion of substrate solvent is to account for electrically conductive ink
8 to 25wt%.
It should be noted that being about 10 by the coating duration that electrically conductive ink is coated on substrate surface in the present embodiment
Minute.The temperature of sintering is about between 80 to 250 DEG C, and preferably sintering temperature is between 100 to 200 DEG C.In addition, preferably
Sintering temperature be 1 hour.
In addition, corresponding substrate solvent can be used for different substrate materials, to realize preferable solute effect.
For example, when the material of the substrate is substantially aliphatic hydrocarbon polymer resin, substrate solvent is selected from by aromatic hydrocarbon, halogenated hydrocarbons
And at least one of group composed by esters.When the material of substrate is polyamide, substrate solvent is selected from by phenols and acyl
At least one of group composed by amine.When the material of substrate be polyester when, substrate solvent be selected from by phenols, halogenated hydrocarbons and
At least one of group composed by amides.In addition, substrate solvent is choosing when the material of the substrate is polyacrylate
At least one of group composed by free aromatic hydrocarbon, ketone, esters and halogenated hydrocarbons.Substrate material and corresponding substrate solvent
Table 1 listed below:
Table 1
| Substrate material | Substrate solvent |
| Substantially aliphatic hydrocarbon polymer resin | Aromatic hydrocarbon, halogenated hydrocarbons, esters |
| Polyamide | Phenols, amides |
| Polyester | Phenols, halogenated hydrocarbons, amides |
| Polyacrylate | Aromatic hydrocarbon, ketone, esters, halogenated hydrocarbons |
Next, being configured to electrically conductive ink using above-mentioned substrate solvent, main body ink and high boiling solvent for introducing, and apply
Cloth is on substrate, to introduce the composition ratio and experiment flow of various embodiments of the present invention.
Embodiment 1
In the electrically conductive ink of embodiment 1, conductive particle selects Argent grain, and bulk solvent selects propylene glycol monomethyl ether, substrate
Solvent selects dimethylbenzene, and high boiling solvent selects diethylene glycol dimethyl ether.In addition, Argent grain accounts for the 75wt% of main body ink, account for
The 66wt% of electrically conductive ink.Substrate solvent accounts for the 15wt% of electrically conductive ink, and high boiling solvent then accounts for electrically conductive ink
10wt%.
By mentioned component be uniformly mixed be prepared into electrically conductive ink after, can using print in the way of, electrically conductive ink be coated with
On the polycarbonate substrate containing 50wt% glass fibre.Coating duration is about 10 minutes, and sintering time is 1 hour, sintering
Temperature is 120 DEG C.After the completion of sintering, electrically conductive ink can form conductive layer in substrate surface, to prepare circuit substrate.
Embodiment 2
In the electrically conductive ink of embodiment 2, conductive particle selects Argent grain, and bulk solvent selects propylene glycol monomethyl ether, substrate
Solvent selects dimethylformamide, and high boiling solvent selects ethylene glycol.In addition, Argent grain accounts for the 75wt% of main body ink, account for
The 66wt% of electrically conductive ink.Substrate solvent accounts for the 13wt% of electrically conductive ink, and high boiling solvent then accounts for electrically conductive ink
12wt%.
By mentioned component be uniformly mixed be prepared into electrically conductive ink after, can using print in the way of, electrically conductive ink be coated with
On polyamide substrate.Coating duration is about 10 minutes, and sintering time is 1 hour, and sintering temperature is 190 DEG C.It has been sintered
Cheng Hou, electrically conductive ink can form conductive layer in substrate surface, to prepare circuit substrate.
Embodiment 3
In the electrically conductive ink of embodiment 3, conductive particle selects Argent grain, and bulk solvent selects propylene glycol monomethyl ether, substrate
Solvent selects hexone, and high boiling solvent selects ethylene glycol.In addition, Argent grain accounts for the 75wt% of main body ink,
Account for the 66wt% of electrically conductive ink.Substrate solvent accounts for the 17wt% of electrically conductive ink, and high boiling solvent then accounts for electrically conductive ink
13wt%.
By mentioned component be uniformly mixed be prepared into electrically conductive ink after, can using print in the way of, electrically conductive ink be coated with
On polymethyl methacrylate base material.Coating duration is about 10 minutes, and sintering time is 1 hour, and sintering temperature is 120 DEG C.
After the completion of sintering, electrically conductive ink can form conductive layer in substrate surface, to prepare circuit substrate.
Comparative example 1
In the electrically conductive ink of comparative example 1, conductive particle selects nano-Ag particles, and nano-Ag particles can be by polyvinyl pyrrole
Alkanone resin is coated, and to avoid nano silver reunion, and solvent selects propylene glycol monomethyl ether.In addition, nano-Ag particles account for conduction
The 20 to 40wt% of ink, polyvinyl pyrrolidone resin content is the 1 to 5% of nano silver, solvent account for the 60 of electrically conductive ink to
80wt%.
By mentioned component be uniformly mixed be prepared into electrically conductive ink after, can using print in the way of, electrically conductive ink be coated with
On polycarbonate substrate.Coating duration is about 10 minutes, and sintering time is 1 hour, and sintering temperature is 200 DEG C.It needs to illustrate
, the sintering temperature of comparative example must just be able to achieve preferable adhesive force up to 200 DEG C.After the completion of sintering, electrically conductive ink can be in base
Material surface forms conductive layer, to prepare circuit substrate.It should be noted that each ingredient is with ratio included by comparative example 1
For the conducting ink formulation that general industry is common.
And circuit substrate prepared by above-described embodiment 1 to 3 and comparative example 1 will carry out temperature shock, temperature and humidity circulation
And the test of adhesive force, to carry out reliability test to the conductive layer on substrate.It should be noted that the embodiment of the present invention institute into
Capable reliability test is according to standard " ink reliability test specification " (Reliability test spec for ink
Trace), tested.Next, the test mode that temperature shock, temperature and humidity circulation and adhesive force will be introduced.
The step of temperature shock test (Temp Shock Test), includes, and above-described embodiment 1 to 3 and comparative example 1 is made
The standby circuit substrate come out is first set in 85 DEG C of insulating box 2 hours, then circuit substrate is shifted to 2 in -40 DEG C of insulating box
Hour.The time replaced every time is less than or equal to 3 minutes, and is repeated 5 times, time about 20 hours altogether when always surveying.After the completion of test,
Whether the surface of observation circuit substrate has defect, color change, removing, deformation or the situation of rupture to generate.
The step of temperature and humidity loop test (Damp Heat Test), includes, firstly, by above-described embodiment 1 to 3 and comparison
The prepared circuit substrate come out of example 1 is placed in the climatic chamber that temperature is 25 DEG C, humidity is 93%.Later, by constant temperature
The temperature of constant humidity cabinet rises to 55 DEG C in 3 hours, and maintains 55 DEG C of totally 9 hours.Then, by the temperature of climatic chamber
25 DEG C are dropped in 2 hours, and maintains 25 DEG C of totally 16 hours, to complete the circulation of 16 hour.
The circulation of 16 hours carries out 14 circulations in total, wherein can drop humidity when proceeding to the 9th circulation
To 50%, and observe whether circuitry testing substrate surface has defect, color change, removing, deformation or the situation of rupture to generate.It
Afterwards, then by humidity it adjusts to 93%, to carry out remaining 5 circulations.
In addition, the embodiment of the present invention can also carry out temperature to the circuit substrate come out prepared by embodiment 1 to 3 and comparative example 1
Degree impact and the test (Temperature Shock+Adhesion Test) of attaching power and temperature and humidity circulation and attaching power test
(Damp Heat+Adhesion Test).In the test of temperature shock and attaching power, the electricity of embodiment 1 to 3 and comparative example 1
Base board can first carry out above-mentioned temperature shock test.The circuit substrate for having carried out temperature test is placed 2 hours again later, then into
The cutting of hundred lattice of row, and observe whether cut edge has defect, removing or the situation of rupture to generate.
Above-mentioned temperature shock and the test for attaching power are using five grades, to define cut edge defect, removing or break
The situation split." 0 " grade represents that cut edge is completely smooth, and the situation that do not remove.Grade " 1 " represents the intersection in cutting
Place has the conductive layer of flakelet to remove, and the part for removing defect accounts for the 5% of cutting region.Grade " 2 " represent conductive layer along
At cut edge, or in the infall of cutting have the situation of removing, and the part for removing defect account for the 5% of cutting region to
15%.Grade " 3 " represents conductive layer along the removing for having part or full wafer at cut edge, and other blocks of cutting region
There is the removing of part, the part for removing defect accounts for the 15% to 35% of cutting region.Grade " 4 " represents conductive layer along cutting edge
There is large stretch of removing at edge, and other blocks of cutting region also have large stretch of removing, the part for removing defect accounts for cutting region
35% to 65%.The part that grade " 5 " then represents conductive layer removing defect accounts for 65% more than cutting region.
And recycle and attach in temperature and humidity in power test, the circuit substrate of embodiment 1 to 3 and comparative example 1 can be carried out first
State temperature and humidity loop test.The circuit substrate for having carried out temperature and humidity loop test is placed 2 hours again later, then carries out hundred lattice and cuts
It cuts, and observes whether cut edge has defect, removing or the situation of rupture to generate.It recycles and attaches in example test in temperature and humidity,
Be also it is identical as above-mentioned temperature shock and the attaching test of power, classified using five grades, exhaustive division mode is herein not
It repeats more.And the circuit substrate of embodiment 1 to 3 and comparative example 1, after above-mentioned reliability test, test result is listed in the table below
In 2:
Table 2
From the content of table 2 it is found that the circuit substrate of 1-3 of the embodiment of the present invention is followed in temperature shock test either temperature and humidity
Before and after ring test, in appearance all without significant change.That is, the electrically-conductive backing plate surface of embodiment 1-3, there is no obvious
The situations such as defect, color change, removing, deformation or rupture.However the circuit substrate of comparative example 1 is whether surveyed in temperature shock
Before and after examination either temperature and humidity loop test, conductive layer has the phenomenon that removing or gauffer.
In addition, the circuit substrate of 1-3 of the embodiment of the present invention is in temperature shock and attaches power test either temperature and humidity circulation
And after attaching power test, circuit substrate cut edge is relatively smooth, and the situation almost without conductive layer removing occurs, conductive layer
The part for removing defect is less than the 5% of cutting region.However, comparative example 1 is either warm and humid in temperature shock and attaching power test
After degree circulation and attaching power test, at circuit board cut edge and other blocks of cutting region all have large stretch of conductive layer stripping
From the area for removing defect is greater than the 65% of cutting region.From the result of above-mentioned reliability test it is found that compared to comparative example 1,
The conductive layer of 1-3 of the embodiment of the present invention has preferable reliability test result.That is, utilizing electrically conductive ink of the invention
Prepared conductive layer has preferable adhesive force and reliability for circuit substrate.
In conclusion the present invention provides a kind of electrically conductive ink, to form a conductive layer in substrate surface, electrically conductive ink packet
Main body ink, substrate solvent and high boiling solvent are included, substrate solvent enables main body ink to be embedded in dissolve substrate surface
Substrate surface is able to ascend conductive layer in the adhesive force of substrate surface after sintering.In addition, high boiling solvent can reduce substrate
The evaporation rate of solvent promotes the quality that electrically conductive ink is coated on substrate surface.
The above description is only an embodiment of the present invention, the scope of patent protection being not intended to limit the invention.Any
Field technical staff, without departing from the spirit and scope of the invention, the equivalence replacement of made variation and retouching, is still this hair
In bright scope of patent protection.
Claims (11)
1. a kind of electrically conductive ink, to form conductive layer in a substrate surface, which is characterized in that the electrically conductive ink includes:
One main body ink, accounts for the 60 to 90wt% of the electrically conductive ink, and the main body ink includes:
Multiple conductive particles account for the 70 to 80wt% of the main body ink；And
One bulk solvent accounts for the 20 to 30wt% of the main body ink；
One substrate solvent accounts for the 5 to 35wt% of the electrically conductive ink, and the substrate solvent is the molten of the dissolution substrate surface
Agent；And
One high boiling solvent accounts for the 5 to 30wt% of the electrically conductive ink, and the content of the high boiling solvent is less than the substrate
The content of solvent, the boiling point of the high boiling solvent is between 180 to 220 DEG C.
2. electrically conductive ink as described in claim 1, wherein the bulk solvent is selected from by polyalcohol and polyol ethers institute group
At at least one of group, and the high boiling solvent be in the group as composed by polyalcohol and polyol ethers at least
It is a kind of.
3. electrically conductive ink as described in claim 1, wherein the substrate solvent is selected from by hydro carbons, esters, phenols, amides
And at least one of group composed by ketone.
4. electrically conductive ink as described in claim 1, wherein the substrate solvent accounts for the 10 to 20wt% of the electrically conductive ink.
5. electrically conductive ink as described in claim 1, wherein the substrate solvent accounts for the 8 to 25wt% of the electrically conductive ink.
6. electrically conductive ink as described in claim 1, wherein the high boiling solvent accounts for the 10 to 20wt% of the electrically conductive ink.
7. electrically conductive ink as claimed in claim 3, wherein the material of the substrate includes: substantially aliphatic hydrocarbon polymer resin, gathers
Amide, polyester or polyacrylate.
8. electrically conductive ink as claimed in claim 7, wherein when the material of the substrate is substantially aliphatic hydrocarbon polymer resin, institute
Stating substrate solvent is selected from least one of group as composed by aromatic hydrocarbon, halogenated hydrocarbons and esters.
9. electrically conductive ink as claimed in claim 7, wherein the substrate solvent is when the material of the substrate is polyamide
Selected from least one of group as composed by phenols and amides.
10. electrically conductive ink as claimed in claim 7, wherein the substrate solvent is when the material of the substrate is polyester
Selected from least one of group as composed by phenols, halogenated hydrocarbons and amides.
11. electrically conductive ink as claimed in claim 7, wherein when the material of the substrate is polyacrylate, the substrate
Solvent is selected from least one of group as composed by aromatic hydrocarbon, ketone, esters and halogenated hydrocarbons.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410522980.1A CN105482554B (en) | 2014-09-30 | 2014-09-30 | Electrically conductive ink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410522980.1A CN105482554B (en) | 2014-09-30 | 2014-09-30 | Electrically conductive ink |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105482554A CN105482554A (en) | 2016-04-13 |
| CN105482554B true CN105482554B (en) | 2018-12-28 |
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ID=55669840
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410522980.1A Expired - Fee Related CN105482554B (en) | 2014-09-30 | 2014-09-30 | Electrically conductive ink |
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| Country | Link |
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| CN (1) | CN105482554B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20200140359A (en) * | 2018-05-08 | 2020-12-15 | 아그파-게바에르트 엔.브이. | Conductive ink |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102719137A (en) * | 2012-05-31 | 2012-10-10 | 杭州浙大海维特化工科技有限公司 | Special jet ink for PVC (polyvinyl chloride) cable |
| CN103952034A (en) * | 2014-05-19 | 2014-07-30 | 北京印刷学院 | Resin-free nano-silver electrically conductive printing ink as well as preparation method and applications thereof |
-
2014
- 2014-09-30 CN CN201410522980.1A patent/CN105482554B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102719137A (en) * | 2012-05-31 | 2012-10-10 | 杭州浙大海维特化工科技有限公司 | Special jet ink for PVC (polyvinyl chloride) cable |
| CN103952034A (en) * | 2014-05-19 | 2014-07-30 | 北京印刷学院 | Resin-free nano-silver electrically conductive printing ink as well as preparation method and applications thereof |
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| CN105482554A (en) | 2016-04-13 |
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