CN104559714A - Special three-proofing insulating paint for electronic components and electronic circuit boards - Google Patents

Special three-proofing insulating paint for electronic components and electronic circuit boards Download PDF

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Publication number
CN104559714A
CN104559714A CN201410735266.0A CN201410735266A CN104559714A CN 104559714 A CN104559714 A CN 104559714A CN 201410735266 A CN201410735266 A CN 201410735266A CN 104559714 A CN104559714 A CN 104559714A
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component
acrylic resin
resin liquid
special
electronic circuit
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CN201410735266.0A
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CN104559714B (en
Inventor
单勇革
赵治平
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Taiyuan Aero Instruments Co Ltd
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Taiyuan Aero Instruments Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
    • C09D175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/14—Methyl esters, e.g. methyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/62—Polymers of compounds having carbon-to-carbon double bonds
    • C08G18/6216—Polymers of alpha-beta ethylenically unsaturated carboxylic acids or of derivatives thereof
    • C08G18/622—Polymers of esters of alpha-beta ethylenically unsaturated carboxylic acids
    • C08G18/6225—Polymers of esters of acrylic or methacrylic acid
    • C08G18/6229—Polymers of hydroxy groups containing esters of acrylic or methacrylic acid with aliphatic polyalcohols

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Paints Or Removers (AREA)

Abstract

The invention belongs to the technical field of paint for circuit boards. In order to solve the problems that the existing insulating paint is difficult in construction and storage and the coating corner easily drops, wrinkles and cracks and is frequently doped and thus the products are reworked and a huge hidden danger is caused to the products and that the electrical property is relatively poor and a high-energy consumption process is needed for curing and long-time baking is required and the like, the invention provides a special three-proofing insulating paint for electronic components and electronic circuit boards. The three-proofing insulating paint consists of a component 1 prepared from a mixed acrylic resin liquid, an initiator, a mixed solvent, an organic silicon insulating aid, an organic silicon leveling agent, an organic silicon antifoaming agent and an organic bismuth crosslinking curing accelerator according to a certain proportion and a component 2 of aliphatic isocyanate. The mixed acrylic resin liquid and the aliphatic isocyanate conduct a condensation polymerization reaction and are crosslinked and cured into a film which provides the insulating and protection functions. The prepared circuit board is stable in quality while the electrical property and protection property are both improved. The problem of high energy consumption for baking and curing of the insulating paint is solved.

Description

A kind of electronic devices and components and the special three anti-insulation compound of electronic circuit board
Technical field
The invention belongs to electronic circuit board technical field of coatings, be specifically related to a kind of electronic devices and components and the special three anti-insulation compound of electronic circuit board.
Background technology
For a long time, China's electronic circuit board, electronic devices and components are as indicating meter, sensor, pick-up, in the products such as air data computer, the insullac S31-11 of a large amount of use, this coating is the product before 20 years, its coat-thickness must reach more than 2mm and just really have NBC protective performance, i.e. salt spray resistance, wet-hot aging performance, fungus resistance energy, by temperature before completion of cure, humidity, construction technology, material prescription, the aspect impacts such as starting material are very large, stable performance but not easily grasp, difficulty of construction is large, not easily storage and coating corner easily come off, wrinkling, cracking, doping, cause repeatedly occurring that product is done over again, very large hidden danger is brought to product.And have that electrical property is poor always, paint solidification must high temperature and toasting for a long time, in order to ensure the insulating property of insullac, must adopt this highly energy-consuming technique.The external advanced insulating coating materials such as Russia, if у р 231 is former Soviet Union product, heat resistance, insulating property, workability are all more advanced, but do not domesticize always.
Summary of the invention
The present invention in order to solve existing insullac S31-11 difficulty of construction greatly, not easily storage and coating corner easily come off, wrinkling, cracking, doping, cause product to be done over again, bring very large hidden danger to product; And exist always electrical property poor, need to adopt highly energy-consuming technique to be cured and the problems such as long-time baking, provide a kind of electronic devices and components and the special three anti-insulation compound of electronic circuit board.
The present invention is realized by following technical scheme: a kind of electronic devices and components and the special three anti-insulation compound of electronic circuit board, be that the component 1 of 1:1 and component 2 form by mass ratio, described component 1 is that 97-99 part mixes acrylic resin liquid, 1-5 part initiator, 90-150 part mixed solvent, 0.2-0.4 part organic silicon insulation auxiliary agent, 0.2-0.4 part organosilicon flow agent, 0.3-0.5 part silicone antifoam agent, 0.5-1.5 part organo-bismuth crosslinking curing promotor form by weight part; Described component 2 is aliphatic isocyanates.
Described organosilicon flow agent is organic silicon modified by polyether, as 300,301,306 of BYK company, and the material that other compositions are known to the skilled person.
Described mixing acrylic resin liquid be by weight part be 40-50 part methyl methacrylate, 15-25 part butyl methacrylate, 0.5-1 part vinylformic acid, 10-20 part butyl acrylate, 20-30 part Hydroxyethyl acrylate, 10-15 part organo-siloxane made by solution polymerization mode in organic solvent; Described mixed solvent is xylene solvent.
In proportion mixed solvent, initiator and methyl methacrylate, butyl methacrylate, vinylformic acid, butyl acrylate, Hydroxyethyl acrylate, organo-siloxane being placed in temperature of reaction is that the acrylic resin polymerization reaction kettle of 140 DEG C ~ 150 DEG C carries out polyreaction, by the resin liquid strainer of reaction product by below 15u, products therefrom is mixing acrylic resin liquid, fineness < 15 μm; The preparation method of described component 1 is: in mixing acrylic resin liquid, add organic silicon insulation auxiliary agent, organosilicon flow agent, silicone antifoam agent and organo-bismuth crosslinking curing promotor in proportion, then in paint mixing cylinder, the solids content of adjustment mixing acrylic resin liquid is 45 ± 1%, transformation efficiency >=95%, is component 1 after the metre filter of 20 μm; Component 2 is filtered rear for subsequent use; The component 1 obtained after filtration and component 2 are mixed described electronic devices and components and the special three anti-insulation compound of electronic circuit board of system.
Paint film reaction mechanism of the present invention is shown in Fig. 1, and electronic devices and components of the present invention and the special three anti-insulation compound of electronic circuit board, compared with S31-11 urethane drying insulated paint, have following beneficial effect:
1, be reduced to 4 hours by original 6 hours time of drying, dry 60 DEG C ~ 70 DEG C conditions after surface drying and can proceed to next procedure in 4 hours, in 1000 wiring boards, power consumption is reduced to 8000 degree from 18000 degree, brownout 10000 degree;
2, operating procedure is simple, is sprayed become spraying for twice one time from S31-11;
3, sticking power is promoted to 1 grade by 2 grades, improves the bonding force of coating and wiring board;
4, volume resistance is from 10 of normality 14it is 10 that Ω cm raises 15from 10 after Ω cm, immersion 12it is 10 that Ω cm raises 13Ω cm;
5, paint film electric breakdown strength raises as raising as 50kV/mm from 35 kV/mm after 80kV/mm, immersion from 70 kV/mm of normality, improves the insulating property of paint film;
6, the special three anti-insulation compound of electronic circuit board have passed NBC protective performance test: fungus resistance 30 days, salt fog resistance (35 DEG C) 7 days, humidity resistance (30 DEG C ~ 60 DEG C, 95%RH) 10 days.
Compared with Muscovite yp231 coating, the volume resistance of normality of the present invention and disruptive strength are 10 15Ω cm and more than Kv/mm, is all better than 7.8 × 10 of yp231 coating 14Ω cm, 52Kv/mm.
The present invention adopts modified acrylic polyurethane type coating to replace original S31-11 urethane drying insulated paint; the aliphatic polymeric isocyanate of mixing acrylate resin liquid and isocyanato group containing is utilized to carry out polycondensation; crosslinking curing film forming, provides insulation and the protection function of protection electronic circuit class.XX type cockpit display, XX type cockpit display instrument are applied, examine after tested and pass through, meet the requirement that quality product detects.Apply coating of the present invention and adopt the electronic circuit board prepared by low-temperature curing technique, show through investigation, electronic circuit board steady quality, electrical property and barrier propterty are improved.Wiring board electrical property is not only made to be improved, if its volume resistance is from 10 of normality 14it is 10 that Ω cm raises 15from 10 after Ω cm, immersion 12it is 10 that Ω cm raises 13Ω cm, paint film electric breakdown strength raises as raising as 50kV/mm from 35 kV/mm after 80kV/mm, immersion from 70 kV/mm of normality, sticking power is 1 grade from 2 grades of risings, and be reduced to coating 1 time for 2 times from coating, baking-curing reduces by 80 DEG C from 90 DEG C, solves a difficult problem for long-standing problem electronic industry wiring board insulation compound baking-curing highly energy-consuming.
Accompanying drawing explanation
Fig. 1 is the paint film reaction mechanism figure of the special three anti-insulation compound of electronic devices and components of the present invention and electronic circuit board.
Embodiment
Embodiment 1: a kind of electronic devices and components and the special three anti-insulation compound of electronic circuit board, be that the component 1 of 1:1 and component 2 form by mass ratio, described component 1 is that 97 parts of mixing acrylic resin liquid, 1 part of initiator, 90 parts of mixed solvents, 0.2 part of organic silicon insulation auxiliary agent, 0.4 part of organosilicon flow agent, 0.3 part of silicone antifoam agent, 1.5 parts of organo-bismuth crosslinking curing promotor form by weight part; Described component 2 is aliphatic isocyanates.Described organosilicon flow agent is organic silicon modified by polyether, as 300,301,306 of BYK company, and the material that other compositions are known to the skilled person.
Described mixing acrylic resin liquid be by weight part be 40 parts of methyl methacrylates, 15 parts of butyl methacrylate, 0.5 part of vinylformic acid, 10 parts of butyl acrylates, 20 parts of Hydroxyethyl acrylates, 10 parts of organo-siloxanes are made by solution polymerization mode in organic solvent; Described mixed solvent is xylene solvent.
The preparation method of described mixing acrylic resin liquid is: be carry out polyreaction in the acrylic resin polymerization reaction kettle of 140 DEG C ~ 150 DEG C by mixed solvent, initiator and methyl methacrylate, butyl methacrylate, vinylformic acid, butyl acrylate, Hydroxyethyl acrylate, organo-siloxane temperature of reaction in proportion, by the resin liquid strainer of reaction product by below 15u, products therefrom is mixing acrylic resin liquid, fineness < 15 μm; The preparation method of described component 1 is: in mixing acrylic resin liquid, add organic silicon insulation auxiliary agent, organosilicon flow agent, silicone antifoam agent and organo-bismuth crosslinking curing promotor in proportion, then in paint mixing cylinder, the solids content of adjustment mixing acrylic resin liquid is 45 ± 1%, transformation efficiency >=95%, is component 1 after the metre filter of 20 μm; Component 2 is filtered rear for subsequent use; The component 1 obtained after filtration and component 2 are mixed described electronic devices and components and the special three anti-insulation compound of electronic circuit board of system.
Electronic devices and components prepared by the present embodiment and the special three anti-insulation compound of electronic circuit board are after tested, time of drying was reduced to 4 hours by original 6 hours, dry 60 DEG C ~ 70 DEG C conditions after surface drying and can proceed to next procedure in 4 hours, in 1000 wiring boards, power consumption is reduced to 8000 degree from 18000 degree, brownout 10000 degree; Spray one time; Sticking power is promoted to 1 grade by 2 grades, improves the bonding force of coating and wiring board; The volume resistance of coating described in embodiment 2 is all not less than after volume resistance normality and immersion; The disruptive strength of coating described in embodiment 2 is all not less than after paint film electric breakdown strength normality and immersion; The special three anti-insulation compound of electronic circuit board have passed NBC protective performance test: fungus resistance 30 days, salt fog resistance (35 DEG C) 7 days, humidity resistance (30 DEG C ~ 60 DEG C, 95%RH) 11 days.
Embodiment 2: a kind of electronic devices and components and the special three anti-insulation compound of electronic circuit board, be that the component 1 of 1:1 and component 2 form by mass ratio, described component 1 is that 98 parts of mixing acrylic resin liquid, 3 parts of initiators, 120 parts of mixed solvents, 0.3 part of organic silicon insulation auxiliary agent, 0.2 part of organosilicon flow agent, 0.5 part of silicone antifoam agent, 0.5 part of organo-bismuth crosslinking curing promotor form by weight part; Described component 2 is aliphatic isocyanates.
Described mixing acrylic resin liquid by weight part be 45 parts of methyl methacrylates, 20 parts of butyl methacrylate, 0.8 part of vinylformic acid, 20 parts of butyl acrylates, 26 parts of Hydroxyethyl acrylates, 13 parts of organo-siloxanes form.Preparation method is with preparation method described in embodiment 1.
Embodiment 3: a kind of electronic devices and components and the special three anti-insulation compound of electronic circuit board, be that the component 1 of 1:1 and component 2 form by mass ratio, described component 1 is that 99 parts of mixing acrylic resin liquid, 5 parts of initiators, 150 parts of mixed solvents, 0.4 part of organic silicon insulation auxiliary agent, 0.3 part of organosilicon flow agent, 0.4 part of silicone antifoam agent, 1.0 parts of organo-bismuth crosslinking curing promotor form by weight part; Described component 2 is aliphatic isocyanates.
Described mixing acrylic resin liquid by weight part be 50 parts of methyl methacrylates, 25 parts of butyl methacrylate, 1 part of vinylformic acid, 15 parts of butyl acrylates, 30 parts of Hydroxyethyl acrylates, 15 parts of organo-siloxanes form.Preparation method is with preparation method described in embodiment 1.
Electronic devices and components prepared by the present embodiment and the special three anti-insulation compound of electronic circuit board are after tested, time of drying was reduced to 4 hours by original 6 hours, dry 60 DEG C ~ 70 DEG C conditions after surface drying and can proceed to next procedure in 4 hours, in 1000 wiring boards, power consumption is reduced to 8000 degree from 18000 degree, brownout 10000 degree; Spray one time; Sticking power is promoted to 1 grade by 2 grades, improves the bonding force of coating and wiring board; The volume resistance of coating described in embodiment 2 is all not less than after volume resistance normality and immersion; The disruptive strength of coating described in embodiment 2 is all not less than after paint film electric breakdown strength normality and immersion; The special three anti-insulation compound of electronic circuit board have passed NBC protective performance test: fungus resistance 31 days, salt fog resistance (35 DEG C) 8 days, humidity resistance (30 DEG C ~ 60 DEG C, 95%RH) 10 days.
Experimental example: the electronic devices and components prepared by embodiment 2 and the special three anti-insulation compound of electronic circuit board compare with the performance test of existing S31-11 urethane drying insulated paint, S31-11 urethane drying insulated paint the performance test results is in table 1, described in embodiment 2, coating property test result is in table 2, utilizes the equipment such as infrared spectra, thermo-cracking instrument, nucleus magnetic resonance to carry out analytical results in table 3 to yp231 coating.
Table 1
Table 2
Table 3

Claims (3)

1. electronic devices and components and the special three anti-insulation compound of electronic circuit board, it is characterized in that: be that the component 1 of 1:1 and component 2 form by mass ratio, described component 1 is that 97-99 part mixes acrylic resin liquid, 1-5 part initiator, 90-150 part mixed solvent, 0.2-0.4 part organic silicon insulation auxiliary agent, 0.2-0.4 part organosilicon flow agent, 0.3-0.5 part silicone antifoam agent, 0.5-1.5 part organo-bismuth crosslinking curing promotor form by weight part; Described component 2 is aliphatic isocyanates.
2. a kind of electronic devices and components according to claim 1 and the special three anti-insulation compound of electronic circuit board, is characterized in that: described mixing acrylic resin liquid be by weight part be 40-50 part methyl methacrylate, 15-25 part butyl methacrylate, 0.5-1 part vinylformic acid, 10-20 part butyl acrylate, 20-30 part Hydroxyethyl acrylate, 10-15 part organo-siloxane made by solution polymerization mode in organic solvent; Described mixed solvent is xylene solvent.
3. a kind of electronic devices and components according to claim 1 and 2 and the special three anti-insulation compound of electronic circuit board, it is characterized in that: the preparation method of described mixing acrylic resin liquid is: in proportion by mixed solvent, initiator and methyl methacrylate, butyl methacrylate, vinylformic acid, butyl acrylate, Hydroxyethyl acrylate, it is that the acrylic resin polymerization reaction kettle of 140 DEG C ~ 150 DEG C carries out polyreaction that organo-siloxane is placed in temperature of reaction, by the resin liquid strainer of reaction product by below 15u, products therefrom is mixing acrylic resin liquid, fineness < 15 μm, the preparation method of described component 1 is: in mixing acrylic resin liquid, add organic silicon insulation auxiliary agent, organosilicon flow agent, silicone antifoam agent and organo-bismuth crosslinking curing promotor in proportion, then in paint mixing cylinder, the solids content of adjustment mixing acrylic resin liquid is 45 ± 1%, transformation efficiency >=95%, is component 1 after the metre filter of 20 μm, component 2 is filtered rear for subsequent use, the component 1 obtained after filtration and component 2 are mixed described electronic devices and components and the special three anti-insulation compound of electronic circuit board of system.
CN201410735266.0A 2014-12-08 2014-12-08 Special three-proofing insulating paint for electronic components and electronic circuit boards Active CN104559714B (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106189792A (en) * 2016-08-30 2016-12-07 乐凯特科技铜陵有限公司 The wiring board coating agent that a kind of electrical insulating property is excellent
CN107849386A (en) * 2015-07-15 2018-03-27 株式会社村田制作所 Composition for forming coating and electronic unit
CN110229597A (en) * 2019-03-21 2019-09-13 天津灯塔涂料工业发展有限公司 Polyurethane three proofings varnish and preparation method thereof and resin liquid and preparation method thereof
CN110330874A (en) * 2019-03-21 2019-10-15 天津灯塔涂料工业发展有限公司 Polyurethane three proofings priming paint and preparation method thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1429870A (en) * 2003-01-30 2003-07-16 安泰科技股份有限公司 Insulating protective couting material for soft-magnetic product and its preparation method
WO2004003086A1 (en) * 2002-06-27 2004-01-08 Ppg Industries Ohio, Inc. Electrodepositable dielectric coating compositions to coat a substrate and methods to form dielectric coating
CN103031046A (en) * 2011-09-29 2013-04-10 上海正欧实业有限公司 Novel organosilicone acrylic acid bi-component polyurethane coating and preparation method thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004003086A1 (en) * 2002-06-27 2004-01-08 Ppg Industries Ohio, Inc. Electrodepositable dielectric coating compositions to coat a substrate and methods to form dielectric coating
CN1429870A (en) * 2003-01-30 2003-07-16 安泰科技股份有限公司 Insulating protective couting material for soft-magnetic product and its preparation method
CN103031046A (en) * 2011-09-29 2013-04-10 上海正欧实业有限公司 Novel organosilicone acrylic acid bi-component polyurethane coating and preparation method thereof

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107849386A (en) * 2015-07-15 2018-03-27 株式会社村田制作所 Composition for forming coating and electronic unit
CN107849386B (en) * 2015-07-15 2020-04-17 株式会社村田制作所 Composition for forming coating film and electronic component
CN106189792A (en) * 2016-08-30 2016-12-07 乐凯特科技铜陵有限公司 The wiring board coating agent that a kind of electrical insulating property is excellent
CN110229597A (en) * 2019-03-21 2019-09-13 天津灯塔涂料工业发展有限公司 Polyurethane three proofings varnish and preparation method thereof and resin liquid and preparation method thereof
CN110330874A (en) * 2019-03-21 2019-10-15 天津灯塔涂料工业发展有限公司 Polyurethane three proofings priming paint and preparation method thereof

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