CN104559714B - Special three-proofing insulating paint for electronic components and electronic circuit boards - Google Patents

Special three-proofing insulating paint for electronic components and electronic circuit boards Download PDF

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Publication number
CN104559714B
CN104559714B CN201410735266.0A CN201410735266A CN104559714B CN 104559714 B CN104559714 B CN 104559714B CN 201410735266 A CN201410735266 A CN 201410735266A CN 104559714 B CN104559714 B CN 104559714B
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component
resin liquid
acrylic resin
special
organic silicon
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CN104559714A (en
Inventor
单勇革
赵治平
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Taiyuan Aero Instruments Co Ltd
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Taiyuan Aero Instruments Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
    • C09D175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/14—Methyl esters, e.g. methyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/62—Polymers of compounds having carbon-to-carbon double bonds
    • C08G18/6216—Polymers of alpha-beta ethylenically unsaturated carboxylic acids or of derivatives thereof
    • C08G18/622—Polymers of esters of alpha-beta ethylenically unsaturated carboxylic acids
    • C08G18/6225—Polymers of esters of acrylic or methacrylic acid
    • C08G18/6229—Polymers of hydroxy groups containing esters of acrylic or methacrylic acid with aliphatic polyalcohols

Abstract

The invention belongs to the technical field of paint for circuit boards. In order to solve the problems that the existing insulating paint is difficult in construction and storage and the coating corner easily drops, wrinkles and cracks and is frequently doped and thus the products are reworked and a huge hidden danger is caused to the products and that the electrical property is relatively poor and a high-energy consumption process is needed for curing and long-time baking is required and the like, the invention provides a special three-proofing insulating paint for electronic components and electronic circuit boards. The three-proofing insulating paint consists of a component 1 prepared from a mixed acrylic resin liquid, an initiator, a mixed solvent, an organic silicon insulating aid, an organic silicon leveling agent, an organic silicon antifoaming agent and an organic bismuth crosslinking curing accelerator according to a certain proportion and a component 2 of aliphatic isocyanate. The mixed acrylic resin liquid and the aliphatic isocyanate conduct a condensation polymerization reaction and are crosslinked and cured into a film which provides the insulating and protection functions. The prepared circuit board is stable in quality while the electrical property and protection property are both improved. The problem of high energy consumption for baking and curing of the insulating paint is solved.

Description

A kind of electronic devices and components and the special three anti-coatings of electronic circuit board
Technical field
The invention belongs to electronic circuit board technical field of coatings is and in particular to a kind of electronic devices and components and electronic circuit board Special three anti-coatings.
Background technology
For a long time, China's electronic circuit board, electronic devices and components such as display, sensor, pick-up, atmosphere data calculates In the products such as machine, a large amount of insulated paint S31-11 using, this coating is the product before 20 years, and its coating layer thickness must reach 2mm Below just really there is NBC protective performance, i.e. salt spray resistance, wet-hot aging performance, fungus resistance energy, before completion of cure be subject to temperature, The impact of the aspects such as humidity, construction technology, material prescription, raw material is very big, and stable performance but be difficult is grasped, difficulty of construction is big, no Easily storage and coating corner easily come off, wrinkling, cracking, doping, lead to product repeatedly occurs do over again, bring to product very hidden greatly Suffer from.And have that electrical property is poor always, paint solidification must high temperature and long-time toast, in order to ensure the insulating properties of insulated paint Can be it is necessary to adopt this highly energy-consuming technique.The advanced insulating coating material abroad such as Russia, such as у р 231 are former Soviet Union product, Heat resistance, insulating properties, workability are all more advanced, but do not domesticize always.
Content of the invention
The present invention in order to solve that existing insulated paint S31-11 difficulty of construction is big, be difficult storage and coating corner easily come off, Wrinkling, cracking, doping, lead to product to be done over again, bring very big hidden danger to product；And exist always electrical property poor, need adopt The problems such as solidified with highly energy-consuming technique and toasted for a long time, there is provided a kind of electronic devices and components and electronic circuit board special three Anti- coatings.
The present invention is realized by following technical scheme：A kind of electronic devices and components and the special three anti-insulation of electronic circuit board apply Material, is 1 by mass ratio:1 component 1 and component 2 form, and described component 1 is to mix acrylic resin by weight portion for 97-99 part Liquid, 1-5 part initiator, 90-150 part mixed solvent, 0.2-0.4 part organic silicon insulation auxiliary agent, 0.2-0.4 part organosilicon levelling Agent, 0.3-0.5 part organic silicon defoamer, 0.5-1.5 part organo-bismuth crosslinking curing accelerator composition；Described component 2 is aliphatic Isocyanates.
Described organosilicon levelling agent is organic silicon modified by polyether, such as 300,301, the 306 of BYK company, and other compositions are this Material known to skilled person.
Described mixing acrylic resin liquid be by weight portion be 40-50 part methyl methacrylate, 15-25 part metering system Acid butyl ester, 0.5-1 part acrylic acid, 10-20 part butyl acrylate, 20-30 part hydroxy-ethyl acrylate, 10-15 part organosiloxane Made by polymerisation in solution mode in organic solvent；Described mixed solvent is xylene solvent.
In proportion by mixed solvent, initiator and methyl methacrylate, butyl methacrylate, acrylic acid, propylene Acid butyl ester, hydroxy-ethyl acrylate, organosiloxane are placed in the acrylic resin polymerization reaction kettle that reaction temperature is 140 DEG C ~ 150 DEG C In carry out polymerisation, by product by the resin liquid filter of below 15u, products therefrom is mixing acrylic resin Liquid, 15 μm of fineness ＜；The preparation method of described component 1 is：It is proportionally added into organic silicon insulation in mixing acrylic resin liquid Auxiliary agent, organosilicon levelling agent, organic silicon defoamer and organo-bismuth crosslinking curing accelerator, then adjust mixing third in paint mixing cylinder The solids content of olefin(e) acid resin liquid is 45 ± 1%, conversion ratio >=95%, and 20 μm of filter is component 1 after filtering；Component 2 mistake Standby after filter；The component 1 that obtains and component 2 mixes the described electronic devices and components of system and electronic circuit board special three is prevented after filtering Coatings.
Paint film reaction mechanism of the present invention is shown in Fig. 1, electronic devices and components of the present invention and the special three anti-insulation of electronic circuit board Coating, compared with S31-11 polyurethane drying insulated paint, has the advantages that：
1st, drying time was reduced to 4 hours by original 6 hours, dried 4 hours in 60 DEG C～70 DEG C conditions after surface drying Next procedure can be proceeded to, in terms of 1000 wiring boards, power consumption is reduced to 8000 degree from 18000 degree, using electricity wisely 10000 Degree；
2nd, operating procedure is simple, is changed into for twice spraying one time from S31-11 spraying；
3rd, adhesive force is promoted to 1 grade by 2 grades, improves the adhesion of coating and wiring board；
4th, volume resistance is from the 10 of normality14Ω cm rises a height of 1015From 10 after Ω cm, immersion12Ω cm rises a height of 1013Ω·cm；
5th, paint film electric breakdown strength is a height of from 35 kV/mm liters after 70 kV/mm of normality rise a height of 80kV/mm, soak 50kV/mm, improves the insulating properties of paint film；
6th, the special three anti-coatings of electronic circuit board have passed through NBC protective performance test：Fungus resistance 30 days, salt fog resistance （35℃）7 days, humidity resistance（30 DEG C～60 DEG C, 95%RH）10 days.
Compared with Muscovite yp231 coating, the volume resistance of normality of the present invention and breakdown strength are 1015Ω cm and More than Kv/mm, is superior to the 7.8 × 10 of yp231 coating14Ω·cm、52Kv/mm.
The present invention adopts modified acrylic polyurethane type coating to replace originally using S31-11 polyurethane drying insulated paint, utilizes Mixing acrylate resin liquid carries out polycondensation reaction, crosslinking curing film forming with the aliphatic polymeric isocyanate of isocyanato group containing, carries For protecting insulation and the safeguard function of electronic circuit class.XX type cockpit display, XX type cockpit display instrument are applied, Examine after tested and pass through, meet the requirement of product quality detection.Coat coating of the present invention and adopt low-temperature setting technique Prepared electronic circuit board, shows through investigation, electronic circuit board steady quality, electrical property and barrier propterty are improved.No Wiring board electrical property is only made to be improved, such as its volume resistance is from the 10 of normality14Ω cm rises a height of 1015Ω cm, immersion Afterwards from 1012Ω cm rises a height of 1013Ω cm, paint film electric breakdown strength rises a height of 80kV/mm, leaching from 70 kV/mm of normality Rise a height of 50kV/mm from 35 kV/mm after water, adhesive force rises a height of 1 grade from 2 grades, and be reduced to coating 1 time for 2 times from coating, Baking-curing reduces by 80 DEG C from 90 DEG C, solves the difficulty of long-standing problem electronics industry wiring board coatings baking-curing highly energy-consuming Topic.
Brief description
Fig. 1 is electronic devices and components of the present invention and the paint film reaction mechanism of the special three anti-coatings of electronic circuit board Figure.
Specific embodiment
Embodiment 1：A kind of electronic devices and components and the special three anti-coatings of electronic circuit board, are 1 by mass ratio:1 group Point 1 and component 2 form, described component 1 is to be that 97 parts of mixing acrylic resin liquid, 1 part of initiator, 90 parts of mixing are molten by weight portion Agent, 0.2 part of organic silicon insulation auxiliary agent, 0.4 part of organosilicon levelling agent, 0.3 part of organic silicon defoamer, 1.5 parts of organo-bismuths are crosslinked solid Change accelerator composition；Described component 2 is aliphatic isocyanates.Described organosilicon levelling agent is organic silicon modified by polyether, such as BYK The 300 of company, 301,306, the material that other compositions are known to the skilled person.
Described mixing acrylic resin liquid be by weight portion be 40 parts of methyl methacrylates, 15 parts of methacrylic acid fourths Ester, 0.5 part of acrylic acid, 10 parts of butyl acrylates, 20 parts of hydroxy-ethyl acrylates, 10 parts of organosiloxanes pass through in organic solvent Polymerisation in solution mode is made；Described mixed solvent is xylene solvent.
Described mixing acrylic resin liquid preparation method be：In proportion by mixed solvent, initiator and metering system Sour methyl esters, butyl methacrylate, acrylic acid, butyl acrylate, hydroxy-ethyl acrylate, organosiloxane reaction temperature are 140 DEG C ~ 150 DEG C of acrylic resin polymerization reaction kettle in carry out polymerisation, product is passed through the resin liquid mistake of below 15u Filter, products therefrom is mixing acrylic resin liquid, 15 μm of fineness ＜；The preparation method of described component 1 is：In mixing acrylic acid It is proportionally added into organic silicon insulation auxiliary agent, organosilicon levelling agent, organic silicon defoamer and organo-bismuth crosslinking curing in resin liquid to promote Enter agent, then the solids content of adjustment mixing acrylic resin liquid is 45 ± 1% in paint mixing cylinder, conversion ratio >=95%, 20 μm Filter is component 1 after filtering；Component 2 is standby after filtering；After filtering, the component 1 obtaining and component 2 mix described in system Electronic devices and components and the special three anti-coatings of electronic circuit board.
Electronic devices and components prepared by the present embodiment and the special three anti-coatings of electronic circuit board after tested, drying time It was reduced to 4 hours by original 6 hours, dry 4 hours in 60 DEG C～70 DEG C conditions after surface drying and can proceed to next procedure, with 1000 wiring board meters, power consumption is reduced to 8000 degree from 18000 degree, 10000 degree of using electricity wisely；Spraying one time；Adhesive force is by 2 Level is promoted to 1 grade, improves the adhesion of coating and wiring board；All it is not less than embodiment 2 after volume resistance normality and immersion The volume resistance of described coating；All it is not less than puncturing of coating described in embodiment 2 after paint film electric breakdown strength normality and immersion Intensity；The special three anti-coatings of electronic circuit board have passed through NBC protective performance test：Fungus resistance 30 days, salt fog resistance（35 ℃）7 days, humidity resistance（30 DEG C～60 DEG C, 95%RH）11 days.
Embodiment 2：A kind of electronic devices and components and the special three anti-coatings of electronic circuit board, are 1 by mass ratio:1 group Point 1 and component 2 form, described component 1 be by weight portion be 98 parts of mixing acrylic resin liquid, 3 parts of initiators, 120 parts of mixing Solvent, 0.3 part of organic silicon insulation auxiliary agent, 0.2 part of organosilicon levelling agent, 0.5 part of organic silicon defoamer, 0.5 part of organo-bismuth crosslinking Curing accelerator forms；Described component 2 is aliphatic isocyanates.
Described mixing acrylic resin liquid be by weight portion be 45 parts of methyl methacrylates, 20 parts of methacrylic acid fourths Ester, 0.8 part of acrylic acid, 20 parts of butyl acrylates, 26 parts of hydroxy-ethyl acrylates, 13 parts of organosiloxane compositions.Preparation method is same Preparation method described in embodiment 1.
Embodiment 3：A kind of electronic devices and components and the special three anti-coatings of electronic circuit board, are 1 by mass ratio:1 group Point 1 and component 2 form, described component 1 be by weight portion be 99 parts of mixing acrylic resin liquid, 5 parts of initiators, 150 parts of mixing Solvent, 0.4 part of organic silicon insulation auxiliary agent, 0.3 part of organosilicon levelling agent, 0.4 part of organic silicon defoamer, 1.0 parts of organo-bismuth crosslinkings Curing accelerator forms；Described component 2 is aliphatic isocyanates.
Described mixing acrylic resin liquid be by weight portion be 50 parts of methyl methacrylates, 25 parts of methacrylic acid fourths Ester, 1 part of acrylic acid, 15 parts of butyl acrylates, 30 parts of hydroxy-ethyl acrylates, 15 parts of organosiloxane compositions.Preparation method is with real Apply preparation method described in example 1.
Electronic devices and components prepared by the present embodiment and the special three anti-coatings of electronic circuit board after tested, drying time It was reduced to 4 hours by original 6 hours, dry 4 hours in 60 DEG C～70 DEG C conditions after surface drying and can proceed to next procedure, with 1000 wiring board meters, power consumption is reduced to 8000 degree from 18000 degree, 10000 degree of using electricity wisely；Spraying one time；Adhesive force is by 2 Level is promoted to 1 grade, improves the adhesion of coating and wiring board；All it is not less than embodiment 2 after volume resistance normality and immersion The volume resistance of described coating；All it is not less than puncturing of coating described in embodiment 2 after paint film electric breakdown strength normality and immersion Intensity；The special three anti-coatings of electronic circuit board have passed through NBC protective performance test：Fungus resistance 31 days, salt fog resistance（35 ℃）8 days, humidity resistance（30 DEG C～60 DEG C, 95%RH）10 days.
Experimental example：Electronic devices and components prepared by embodiment 2 and the special three anti-coatings of electronic circuit board with existing S31-11 polyurethane drying insulated paint performance test is compared, and S31-11 polyurethane drying insulated paint the performance test results are shown in Table 1, in fact Apply coating property test result described in example 2 and be shown in Table 2, using equipment such as infrared spectrum, thermal cracking instrument, nuclear magnetic resonance, yp231 is applied Material is analyzed the results are shown in Table 3.
Table 1
Table 2
Table 3

Claims (2)

1. a kind of electronic devices and components and the special three anti-coatings of electronic circuit board it is characterised in that：It is 1 by mass ratio:1 group Point 1 and component 2 form, described component 1 is exhausted for 97-99 part mixing acrylic resin liquid, 0.2-0.4 part organosilicon by weight portion Edge auxiliary agent, 0.2-0.4 part organosilicon levelling agent, 0.3-0.5 part organic silicon defoamer, 0.5-1.5 part organo-bismuth crosslinking curing promote Enter agent composition；Described component 2 is aliphatic isocyanates；Described mixing acrylic resin liquid is to be caused for 1-5 part by weight portion Agent, 90-150 part mixed solvent, 40-50 part methyl methacrylate, 15-25 part butyl methacrylate, 0.5-1 part propylene Acid, 10-20 part butyl acrylate, 20-30 part hydroxy-ethyl acrylate, 10-15 part organosiloxane pass through molten in organic solvent Liquid polymerization methodses are made；Described mixed solvent is xylene solvent.
2. a kind of electronic devices and components according to claim 1 and the special three anti-coatings of electronic circuit board, its feature exists In：Described mixing acrylic resin liquid preparation method be：In proportion by mixed solvent, initiator and methyl methacrylate It is 140 that ester, butyl methacrylate, acrylic acid, butyl acrylate, hydroxy-ethyl acrylate, organosiloxane are placed in reaction temperature DEG C ~ 150 DEG C of acrylic resin polymerization reaction kettle in carry out polymerisation, product is passed through less than 15 μm of resin liquid mistake Filter, products therefrom is mixing acrylic resin liquid, 15 μm of fineness ＜；The preparation method of described component 1 is：In mixing acrylic acid It is proportionally added into organic silicon insulation auxiliary agent, organosilicon levelling agent, organic silicon defoamer and organo-bismuth crosslinking curing in resin liquid to promote Enter agent, then the solids content of adjustment mixing acrylic resin liquid is 45 ± 1% in paint mixing cylinder, conversion ratio >=95%, 20 μm Filter is component 1 after filtering；Component 2 is standby after filtering；Described in after filtering, the component 1 that obtain and component 2 are mixed to prepare Electronic devices and components and the special three anti-coatings of electronic circuit board.
CN201410735266.0A 2014-12-08 2014-12-08 Special three-proofing insulating paint for electronic components and electronic circuit boards Active CN104559714B (en)

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Publication number Priority date Publication date Assignee Title
JP6555349B2 (en) * 2015-07-15 2019-08-07 株式会社村田製作所 Electronic components
CN106189792A (en) * 2016-08-30 2016-12-07 乐凯特科技铜陵有限公司 The wiring board coating agent that a kind of electrical insulating property is excellent
CN110330874A (en) * 2019-03-21 2019-10-15 天津灯塔涂料工业发展有限公司 Polyurethane three proofings priming paint and preparation method thereof
CN110229597A (en) * 2019-03-21 2019-09-13 天津灯塔涂料工业发展有限公司 Polyurethane three proofings varnish and preparation method thereof and resin liquid and preparation method thereof

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CN1429870A (en) * 2003-01-30 2003-07-16 安泰科技股份有限公司 Insulating protective couting material for soft-magnetic product and its preparation method
CN103031046A (en) * 2011-09-29 2013-04-10 上海正欧实业有限公司 Novel organosilicone acrylic acid bi-component polyurethane coating and preparation method thereof

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US6713587B2 (en) * 2001-03-08 2004-03-30 Ppg Industries Ohio, Inc. Electrodepositable dielectric coating compositions and methods related thereto

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CN1429870A (en) * 2003-01-30 2003-07-16 安泰科技股份有限公司 Insulating protective couting material for soft-magnetic product and its preparation method
CN103031046A (en) * 2011-09-29 2013-04-10 上海正欧实业有限公司 Novel organosilicone acrylic acid bi-component polyurethane coating and preparation method thereof

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