CN105482554A - Conductive printing ink - Google Patents
Conductive printing ink Download PDFInfo
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- CN105482554A CN105482554A CN201410522980.1A CN201410522980A CN105482554A CN 105482554 A CN105482554 A CN 105482554A CN 201410522980 A CN201410522980 A CN 201410522980A CN 105482554 A CN105482554 A CN 105482554A
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- electrically conductive
- solvent
- conductive ink
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- ink
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Abstract
The embodiment of the invention provides a conductive printing ink. The conductive printing ink comprises main body printing ink and a substrate solvent. The main body printing ink accounts for 60-95% of the conductive printing ink by weight. The substrate solvent accounts for 5-40% of the conductive printing ink by weight. The main body printing ink also comprises a plurality of conductive particles and a main body solvent. The conductive particles account for 70-80% of the main body printing ink by weight. The main body solvent accounts for 20-30% of the main body printing ink by weight. The substrate solvent is a solvent used for dissolving the surface of a substrate.
Description
Technical field
The present invention relates to a kind of electrically conductive ink, and in particular to a kind of electrically conductive ink for forming conductive layer at substrate surface.
Background technology
The common method forming line layer on base material comprises and utilizes spraying, some glue or the method for screen painting at present, is formed at by electro-conductive material on base material, afterwards again through the method for oversintering to form line layer on base material.
In the process of sintering, if the too low line layer that may cause of temperature used is not good at the sticking power of substrate surface, and there is the situation of disengaging to occur, cause wiring board electroconductibility and reliability decrease.But, if the temperature of sintering is too high, then likely can causes line layer and substrate deformation, and then affect the quality of wiring board.
Summary of the invention
The embodiment of the present invention provides a kind of electrically conductive ink, and this electrically conductive ink can promote the sticking power of conductive layer at substrate surface.
The embodiment of the present invention provides a kind of electrically conductive ink, comprises main body ink and base material solvent.Main body ink accounts for 60 to the 95wt% of electrically conductive ink, and base material solvent accounts for 5 to the 40wt% of electrically conductive ink.Main body ink also comprises multiple conductive particle and bulk solvent, and conductive particle accounts for 70 to the 80wt% of main body ink, and bulk solvent accounts for 20 to the 30wt% of main body ink.In addition, base material solvent is the solvent dissolving substrate surface.
In sum, the invention provides a kind of electrically conductive ink, in order to form a conductive layer in substrate surface, electrically conductive ink comprises main body ink and base material solvent, base material solvent is in order to dissolve substrate surface, make main body ink to embed substrate surface, conductive layer can be promoted after sintering in the sticking power of substrate surface.
Further understand feature of the present invention and technology contents for enable, refer to following detailed description for the present invention, but these explanations are only used to the present invention is described, but not any restriction is done to interest field of the present invention.
Embodiment
The invention provides a kind of electrically conductive ink, in order to form conductive layer at substrate surface, this electrically conductive ink comprises main body ink, base material solvent and high boiling point ink.Main body ink accounts for 60 to the 95wt% of electrically conductive ink, and base material solvent accounts for 5 to the 40wt% of electrically conductive ink, and high boiling point ink then accounts for 5 to the 30wt% of electrically conductive ink.In addition, main body ink also comprises conductive particle and bulk solvent, and conductive particle accounts for 70 to the 80wt% of main body ink, and bulk solvent then accounts for 20 to the 30wt% of main body ink.
In the present embodiment, conductive particle is Argent grain, and right the present invention is not as limit, and in other embodiments, conductive particle can be such as copper particle or other conductive material.In addition, bulk solvent is selected from least one in the group that is made up of polyvalent alcohol and polyol ethers, and base material solvent is selected from least one in the group that is made up of hydro carbons, ester class, phenols, amides and ketone.High boiling solvent is the solvent that boiling point is greater than 180 DEG C, at least one in the group that optional free multicomponent alcohol and polyol ethers form.It should be noted that, in the present embodiment, the composition that bulk solvent and high boiling solvent select character close, the chance becoming to analyze during to reduce use.
In actual use, electrically conductive ink can first mix according to aforementioned proportion by user, and according to actual track design, with screen painting, some glue or the mode of spraying, electrically conductive ink is formed at substrate surface.Afterwards, then sintered by the base material feeding baking box being coated with electrically conductive ink, after having sintered, conductive layer can be formed at substrate surface, to prepare circuit substrate.It should be noted that, in the present embodiment, the material of base material can comprise aliphatic hydrocarbon fluoropolymer resin, polymeric amide, polyester or polyacrylic ester.
Specifically, because the material major part of base material is high molecular polymer, when electrically conductive ink is formed at substrate surface, base material solvent in electrically conductive ink can dissolve substrate surface, between the macromolecular chain making substrate surface, free volume, spacing increase, and therefore the main body ink in electrically conductive ink more easily embed substrate surface.When after oversintering, therefore conductive layer can raise at the sticking power of substrate surface.
In addition, the high boiling solvent in electrically conductive ink is mainly in order to reduce the evaporation rate of base material solvent.In the present embodiment, the composition that base material solvent selects boiling point lower, can permeate to make electrically conductive ink and be diffused into substrate surface.But lower boiling electrically conductive ink evaporation rate is very fast, in actual use, if the time of applying conductive ink is longer, namely electrically conductive ink may solidify before coating completes, so affect electrically conductive ink coating uniformity coefficient or after sintering completes, conductive layer is in the sticking power of base material.
In addition, the embodiment of the present invention utilizes printing, mode such as some glue or spraying etc., and electrically conductive ink is formed at substrate surface.Generally speaking, printing, some glue or the take-off equipment of spraying are such as shower nozzles, opening is less, electrically conductive ink also may volatilizing because of bulk solvent and base material solvent too soon, and solidification is blocked in printing, some glue or the take-off equipment of spraying, the efficiency that impact is coated with.For this reason, add the evaporation rate that high boiling solvent can reduce base material solvent, and then reduce electrically conductive ink in the process of coating, the chance of solidification or blocking.
It is worth mentioning that, because high boiling solvent is comparatively not easy volatilization, the amount of therefore adding needs to control, such as, be that the content of high boiling solvent can be less than base material solvent, and during to reduce sintering, electrically conductive ink is difficult to the situation of solidifying.In fact, high boiling solvent can optionally make an addition in electrically conductive ink according to the actual requirements, in other embodiments, also can not add high boiling solvent.And when not adding high boiling solvent at electrically conductive ink, the preferred proportion of base material solvent is 8 to the 25wt% accounting for electrically conductive ink.
It should be noted that, in the present embodiment, coating duration electrically conductive ink being coated on substrate surface is approximately 10 minutes.The temperature of sintering greatly between 80 to 250 DEG C, and between preferably sintering temperature is 100 to 200 DEG C.In addition, preferably sintering temperature is 1 hour.
In addition, corresponding base material solvent can be used for different base material materials, realize good solute effect.For example, when the material of described base material is aliphatic hydrocarbon fluoropolymer resin, base material solvent is selected from least one in the group that is made up of aromatic hydrocarbon, halohydrocarbon and ester class.When the material of base material is polymeric amide, base material solvent is selected from least one in the group that is made up of phenols and amides.When the material of base material is polyester, base material solvent is selected from least one in the group that is made up of phenols, halohydrocarbon and amides.In addition, when the material of described base material is polyacrylic ester, base material solvent is selected from least one in the group that is made up of aromatic hydrocarbon, ketone, ester class and halohydrocarbon.Base material material is listed in following table 1 with corresponding base material solvent:
Table 1
| Base material material | Base material solvent |
| Aliphatic hydrocarbon fluoropolymer resin | Aromatic hydrocarbon, halohydrocarbon, ester class |
| Polymeric amide | Phenols, amides |
| Polyester | Phenols, halohydrocarbon, amides |
| Polyacrylic ester | Aromatic hydrocarbon, ketone, ester class, halohydrocarbon |
next, introduction utilized above-mentioned base material solvent, main body ink and high boiling solvent to be configured to electrically conductive ink, and be coated on base material, to introduce proportion of composing and the experiment flow of the multiple embodiment of the present invention.
embodiment 1
In the electrically conductive ink of embodiment 1, conductive particle selects Argent grain, and bulk solvent selects propylene glycol monomethyl ether, and dimethylbenzene selected by base material solvent, and high boiling solvent selects diethylene glycol dimethyl ether.In addition, Argent grain accounts for the 75wt% of main body ink, accounts for the 66wt% of electrically conductive ink.Base material solvent accounts for the 15wt% of electrically conductive ink, and high boiling solvent is then the 10wt% accounting for electrically conductive ink.
After mentioned component is mixed being prepared into electrically conductive ink, the mode of printing can be utilized, electrically conductive ink is coated on the polycarbonate substrate containing 50wt% glass fibre.Coating duration is about 10 minutes, and sintering time is 1 hour, and sintering temperature is 120 DEG C.After having sintered, electrically conductive ink can form conductive layer at substrate surface, to prepare circuit substrate.
embodiment 2
In the electrically conductive ink of embodiment 2, conductive particle selects Argent grain, and bulk solvent selects propylene glycol monomethyl ether, and dimethyl formamide selected by base material solvent, and high boiling solvent selects ethylene glycol.In addition, Argent grain accounts for the 75wt% of main body ink, accounts for the 66wt% of electrically conductive ink.Base material solvent accounts for the 13wt% of electrically conductive ink, and high boiling solvent is then the 12wt% accounting for electrically conductive ink.
After mentioned component is mixed being prepared into electrically conductive ink, the mode of printing can be utilized, electrically conductive ink is coated on polyamide resin base material.Coating duration is about 10 minutes, and sintering time is 1 hour, and sintering temperature is 190 DEG C.After having sintered, electrically conductive ink can form conductive layer at substrate surface, to prepare circuit substrate.
embodiment 3
In the electrically conductive ink of embodiment 3, conductive particle selects Argent grain, and bulk solvent selects propylene glycol monomethyl ether, and hexone selected by base material solvent, and high boiling solvent selects ethylene glycol.In addition, Argent grain accounts for the 75wt% of main body ink, accounts for the 66wt% of electrically conductive ink.Base material solvent accounts for the 17wt% of electrically conductive ink, and high boiling solvent is then the 13wt% accounting for electrically conductive ink.
After mentioned component is mixed being prepared into electrically conductive ink, the mode of printing can be utilized, electrically conductive ink is coated on polymethyl methacrylate base material.Coating duration is about 10 minutes, and sintering time is 1 hour, and sintering temperature is 120 DEG C.After having sintered, electrically conductive ink can form conductive layer at substrate surface, to prepare circuit substrate.
comparative example 1
In the electrically conductive ink of comparative example 1, conductive particle selects nano-Ag particles, and nano-Ag particles can be undertaken coated by polyvinyl pyrrolidone resin, and to avoid nanometer silver to reunite, and propylene glycol monomethyl ether selected by solvent.In addition, nano-Ag particles accounts for 20 to the 40wt% of electrically conductive ink, and polyvinyl pyrrolidone resin content is 1 to 5% of nanometer silver, and solvent accounts for 60 to the 80wt% of electrically conductive ink.
After mentioned component is mixed being prepared into electrically conductive ink, the mode of printing can be utilized, electrically conductive ink is coated on polycarbonate substrate.Coating duration is about 10 minutes, and sintering time is 1 hour, and sintering temperature is 200 DEG C.It should be noted that, the sintering temperature of comparative example must reach 200 DEG C, could realize preferably sticking power.After having sintered, electrically conductive ink can form conductive layer at substrate surface, to prepare circuit substrate.It should be noted that, each composition included by comparative example 1 is the common conducting ink formulation of general industry with ratio.
And above-described embodiment 1 to 3 and the circuit substrate prepared by comparative example 1 will carry out the test of temperature shock, humiture circulation and sticking power, to carry out reliability test to the conductive layer on base material.It should be noted that, the reliability test that the embodiment of the present invention is carried out, according to standard " ink reliability tentative specification " (Reliabilitytestspecforinktrace), test.Next, temperature shock, humiture circulation and the test mode of sticking power will be introduced.
The step of temperature shock test (TempShockTest) comprises, and circuit substrate out prepared by above-described embodiment 1 to 3 and comparative example 1 to be first arranged in the thermostat container of 85 DEG C 2 hours, then to be changed by circuit substrate to the thermostat container of-40 DEG C 2 hours.The time of each replacing is less than or equal to 3 minutes, and repeats 5 times, about 20 hours altogether time during total survey.After test completes, observe the surface of circuit substrate and whether have defect, colour-change, stripping, be out of shape or the situation of breaking produces.
The step of humiture loop test (DampHeatTest) comprises, and first, circuit substrate out prepared by above-described embodiment 1 to 3 and comparative example 1 is placed on temperature is 25 DEG C, humidity is in the climatic chamber of 93%.Afterwards, the temperature of climatic chamber was risen to 55 DEG C in 3 hours, and maintain 55 DEG C 9 totally hours.Then, the temperature of climatic chamber was dropped to 25 DEG C in 2 hours, and maintain 25 DEG C 16 totally hours, to complete the circulation of 16 hours.
14 circulations are carried out in the circulation of described 16 hours altogether, wherein proceeding to the 9th circulation time, humidity can be down to 50%, and whether observation test circuit substrate surface has defect, colour-change, stripping, to be out of shape or the situation of breaking produces.Afterwards, then humidity is adjusted to 93%, to carry out 5 circulations be left.
In addition, the embodiment of the present invention also can be carried out test (TemperatureShock+AdhesionTest) and the humiture circulation of temperature shock and the power of attaching to circuit substrate out prepared by embodiment 1 to 3 and comparative example 1 and attach Force meansurement (DampHeat+AdhesionTest).Temperature shock and attach power test in, the circuit substrate of embodiment 1 to 3 and comparative example 1 first can carry out said temperature Impact Test.Again the circuit substrate having carried out temperature test is placed 2 hours afterwards, then carry out hundred lattice cuttings, and the situation of observing cut edge and whether have defect, peeling off or breaking produces.
Said temperature impacts and the test of the power of attaching utilizes five grades, the situation defining cut edge defect, peel off or break.It is completely level and smooth that " 0 " grade represents cut edge, and do not have the situation of stripping.Grade " 1 " representative, at the infall of cutting, have the conductive layer of small thin slices to peel off, and the part peeling off defect accounts for 5% of cutting zone.Grade " 2 " represents conductive layer along cut edge place, or has the situation of stripping at the infall of cutting, and the part peeling off defect accounts for 5% to 15% of cutting zone.Grade " 3 " represents conductive layer has part or full wafer stripping along cut edge place, and other blocks of cutting zone also have the stripping of part, and the part peeling off defect accounts for 15% to 35% of cutting zone.Grade " 4 " represents conductive layer large stretch of stripping along cut edge place, and other blocks of cutting zone also have large stretch of stripping, and the part peeling off defect accounts for 35% to 65% of cutting zone.Grade " 5 " then represents conductive layer and peels off the part of defect and account for and exceed 65% of cutting zone.
And in humiture circulation and attaching Force meansurement, the circuit substrate of embodiment 1 to 3 and comparative example 1 can first carry out above-mentioned humiture loop test.Again the circuit substrate having carried out humiture loop test is placed 2 hours afterwards, then carry out hundred lattice cuttings, and the situation of observing cut edge and whether have defect, peeling off or breaking produces.Humiture circulation and attach example test in, be also impact with said temperature and the test of the power of attaching identical, utilize five grades to classify, exhaustive division mode does not repeat at this.And the circuit substrate of embodiment 1 to 3 and comparative example 1 is after above-mentioned reliability test, test result is listed in the table below in 2:
Table 2
From the content of table 2, the circuit substrate of embodiment of the present invention 1-3, before and after temperature shock test or humiture loop test, does not all change in appearance significantly.That is, the electrically-conductive backing plate of embodiment 1-3 surface, not obvious defect, colour-change, stripping, is out of shape or the situation such as to break.No matter but the circuit substrate of comparative example 1 is before and after temperature shock test or humiture loop test, conductive layer has the phenomenon of stripping or gauffer to occur.
In addition, the circuit substrate of embodiment of the present invention 1-3 is in temperature shock and attach Force meansurement or humiture circulation and after attaching Force meansurement, circuit substrate cut edge is quite level and smooth, and the situation almost not having conductive layer to peel off occurs, and the part that conductive layer peels off defect is less than 5% of cutting zone.But comparative example 1 is at temperature shock and attaching Force meansurement or humiture circulates and after attaching Force meansurement, other blocks of circuit card cut edge place and cutting zone all have large stretch of conductive layer to peel off, and the area of stripping defect is greater than 65% of cutting zone.From the result of above-mentioned reliability test, compared to comparative example 1, the conductive layer of embodiment of the present invention 1-3 has preferably reliability test result.That is, utilize the conductive layer prepared by electrically conductive ink of the present invention, for circuit substrate, there is preferably sticking power and reliability.
In sum, the invention provides a kind of electrically conductive ink, in order to form a conductive layer in substrate surface, electrically conductive ink comprises main body ink, base material solvent and high boiling solvent, base material solvent is in order to dissolve substrate surface, make main body ink to embed substrate surface, conductive layer can be promoted after sintering in the sticking power of substrate surface.In addition, high boiling solvent can reduce the evaporation rate of base material solvent, promotes the quality that substrate surface coated by electrically conductive ink.
The foregoing is only embodiments of the invention, it is also not used to limit scope of patent protection of the present invention.Any those skilled in the art, not departing from spirit of the present invention and scope, the equivalence of the variation done and retouching is replaced, and is still in scope of patent protection of the present invention.
Claims (12)
1. an electrically conductive ink, in order to form conductive layer at a substrate surface, it is characterized in that, described electrically conductive ink comprises:
One main body ink, account for 60 to the 95wt% of described electrically conductive ink, and described main body ink comprises:
Multiple conductive particle, accounts for 70 to the 80wt% of described main body ink; And
One bulk solvent, accounts for 20 to the 30wt% of described main body ink; And
One base material solvent, accounts for 5 to the 40wt% of described electrically conductive ink, and described base material solvent is the solvent dissolving described substrate surface.
2. electrically conductive ink as claimed in claim 1, further comprise: a high boiling solvent, wherein said high boiling solvent accounts for 5 to the 40wt% of described electrically conductive ink, and the boiling point of described high boiling solvent is between 180 to 220 DEG C, and described main body ink accounts for 60 to the 90wt% of described electrically conductive ink.
3. electrically conductive ink as claimed in claim 2, wherein said bulk solvent is selected from least one in the group that is made up of polyvalent alcohol and polyol ethers, and described high boiling solvent is selected from least one in the group that is made up of polyvalent alcohol and polyol ethers.
4. electrically conductive ink as claimed in claim 1, wherein said base material solvent is selected from least one in the group that is made up of hydro carbons, ester class, phenols, amides and ketone.
5. electrically conductive ink as claimed in claim 1, wherein said base material solvent accounts for 10 to the 20wt% of described electrically conductive ink.
6. electrically conductive ink as claimed in claim 1, wherein said base material solvent accounts for 8 to the 25wt% of described electrically conductive ink.
7. electrically conductive ink as claimed in claim 2, wherein said high boiling solvent accounts for 10 to the 20wt% of described electrically conductive ink.
8. electrically conductive ink as claimed in claim 4, the material of wherein said base material comprises: aliphatic hydrocarbon fluoropolymer resin, polymeric amide, polyester or polyacrylic ester.
9. electrically conductive ink as claimed in claim 8, wherein when the material of described base material is aliphatic hydrocarbon fluoropolymer resin, described base material solvent is selected from least one in the group that is made up of aromatic hydrocarbon, halohydrocarbon and ester class.
10. electrically conductive ink as claimed in claim 8, wherein when the material of described base material is polymeric amide, described base material solvent is selected from least one in the group that is made up of phenols and amides.
11. electrically conductive inks as claimed in claim 8, wherein when the material of described base material is polyester, described base material solvent is selected from least one in the group that is made up of phenols, halohydrocarbon and amides.
12. electrically conductive inks as claimed in claim 8, wherein when the material of described base material is polyacrylic ester, described base material solvent is selected from least one in the group that is made up of aromatic hydrocarbon, ketone, ester class and halohydrocarbon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410522980.1A CN105482554B (en) | 2014-09-30 | 2014-09-30 | Electrically conductive ink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410522980.1A CN105482554B (en) | 2014-09-30 | 2014-09-30 | Electrically conductive ink |
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| Publication Number | Publication Date |
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| CN105482554A true CN105482554A (en) | 2016-04-13 |
| CN105482554B CN105482554B (en) | 2018-12-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410522980.1A Expired - Fee Related CN105482554B (en) | 2014-09-30 | 2014-09-30 | Electrically conductive ink |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021521314A (en) * | 2018-05-08 | 2021-08-26 | アグフア−ゲヴエルト，ナームローゼ・フエンノートシヤツプ | Conductive ink |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102719137A (en) * | 2012-05-31 | 2012-10-10 | 杭州浙大海维特化工科技有限公司 | Special jet ink for PVC (polyvinyl chloride) cable |
| CN103952034A (en) * | 2014-05-19 | 2014-07-30 | 北京印刷学院 | Resin-free nano-silver electrically conductive printing ink as well as preparation method and applications thereof |
-
2014
- 2014-09-30 CN CN201410522980.1A patent/CN105482554B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102719137A (en) * | 2012-05-31 | 2012-10-10 | 杭州浙大海维特化工科技有限公司 | Special jet ink for PVC (polyvinyl chloride) cable |
| CN103952034A (en) * | 2014-05-19 | 2014-07-30 | 北京印刷学院 | Resin-free nano-silver electrically conductive printing ink as well as preparation method and applications thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021521314A (en) * | 2018-05-08 | 2021-08-26 | アグフア−ゲヴエルト，ナームローゼ・フエンノートシヤツプ | Conductive ink |
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| CN105482554B (en) | 2018-12-28 |
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Address after: 510000 Guangdong city of Guangzhou Province Economic and Technological Development Zone East Road No. 59 Grand View Co-patentee after: Lite-On Technology Corporation Patentee after: Star Precision Technology (Guangzhou) Co., Ltd. Address before: 510000 Guangdong city of Guangzhou Province Economic and Technological Development Zone East Road No. 59 Grand View Co-patentee before: Lite-On Technology Corporation Patentee before: GUANGZHOU GUANGBAO MOBILE ELECTRONICS PARTS CO., LTD. |
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Granted publication date: 20181228 Termination date: 20200930 |