CN105470176A - 半导体成膜设备、衬底自动定位卡紧结构及卡紧方法 - Google Patents
半导体成膜设备、衬底自动定位卡紧结构及卡紧方法 Download PDFInfo
- Publication number
- CN105470176A CN105470176A CN201511028800.5A CN201511028800A CN105470176A CN 105470176 A CN105470176 A CN 105470176A CN 201511028800 A CN201511028800 A CN 201511028800A CN 105470176 A CN105470176 A CN 105470176A
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- 239000000758 substrate Substances 0.000 title claims abstract description 101
- 239000004065 semiconductor Substances 0.000 title claims abstract description 37
- 238000000034 method Methods 0.000 title claims abstract description 25
- 230000008569 process Effects 0.000 claims abstract description 13
- 230000001154 acute effect Effects 0.000 claims abstract description 12
- 230000000149 penetrating effect Effects 0.000 claims abstract description 5
- 230000005484 gravity Effects 0.000 claims description 24
- 230000009471 action Effects 0.000 claims description 17
- 230000007246 mechanism Effects 0.000 claims description 3
- 239000010408 film Substances 0.000 description 24
- 238000010586 diagram Methods 0.000 description 6
- 239000012495 reaction gas Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 239000007921 spray Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201511028800.5A CN105470176B (zh) | 2015-12-31 | 2015-12-31 | 半导体成膜设备、衬底自动定位卡紧结构及卡紧方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201511028800.5A CN105470176B (zh) | 2015-12-31 | 2015-12-31 | 半导体成膜设备、衬底自动定位卡紧结构及卡紧方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105470176A true CN105470176A (zh) | 2016-04-06 |
CN105470176B CN105470176B (zh) | 2018-08-10 |
Family
ID=55607745
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201511028800.5A Active CN105470176B (zh) | 2015-12-31 | 2015-12-31 | 半导体成膜设备、衬底自动定位卡紧结构及卡紧方法 |
Country Status (1)
Country | Link |
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CN (1) | CN105470176B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108346607A (zh) * | 2017-01-25 | 2018-07-31 | 上海新昇半导体科技有限公司 | 竖直插入式阻挡脚及伯努利吸盘 |
CN111029236A (zh) * | 2018-10-09 | 2020-04-17 | 北京北方华创微电子装备有限公司 | 支撑装置及反应腔室 |
TWI821919B (zh) * | 2021-12-16 | 2023-11-11 | 大陸商江蘇天芯微半導體設備有限公司 | 一種反射板組、燈組模組、襯底處理設備及反射板組的調節方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003048158A (ja) * | 2001-07-31 | 2003-02-18 | Applied Materials Inc | 機械化学的研磨装置の基板支持部材および機械化学的研磨装置 |
US20040060513A1 (en) * | 2000-12-15 | 2004-04-01 | Yasuhiko Kojima | Processing method and processing apparatus |
JP2005057086A (ja) * | 2003-08-05 | 2005-03-03 | Komatsu Electronic Metals Co Ltd | 半導体ウェーハのローディング装置およびローディング方 |
CN101492810A (zh) * | 2008-01-25 | 2009-07-29 | 中芯国际集成电路制造(上海)有限公司 | 晶片支撑组件 |
CN104576495A (zh) * | 2015-01-08 | 2015-04-29 | 北京七星华创电子股份有限公司 | 一种晶片夹持装置 |
CN205452245U (zh) * | 2015-12-31 | 2016-08-10 | 北京七星华创电子股份有限公司 | 半导体成膜设备、衬底自动定位卡紧结构 |
-
2015
- 2015-12-31 CN CN201511028800.5A patent/CN105470176B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040060513A1 (en) * | 2000-12-15 | 2004-04-01 | Yasuhiko Kojima | Processing method and processing apparatus |
JP2003048158A (ja) * | 2001-07-31 | 2003-02-18 | Applied Materials Inc | 機械化学的研磨装置の基板支持部材および機械化学的研磨装置 |
JP2005057086A (ja) * | 2003-08-05 | 2005-03-03 | Komatsu Electronic Metals Co Ltd | 半導体ウェーハのローディング装置およびローディング方 |
CN101492810A (zh) * | 2008-01-25 | 2009-07-29 | 中芯国际集成电路制造(上海)有限公司 | 晶片支撑组件 |
CN104576495A (zh) * | 2015-01-08 | 2015-04-29 | 北京七星华创电子股份有限公司 | 一种晶片夹持装置 |
CN205452245U (zh) * | 2015-12-31 | 2016-08-10 | 北京七星华创电子股份有限公司 | 半导体成膜设备、衬底自动定位卡紧结构 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108346607A (zh) * | 2017-01-25 | 2018-07-31 | 上海新昇半导体科技有限公司 | 竖直插入式阻挡脚及伯努利吸盘 |
CN108346607B (zh) * | 2017-01-25 | 2020-11-03 | 上海新昇半导体科技有限公司 | 竖直插入式阻挡脚及伯努利吸盘 |
CN111029236A (zh) * | 2018-10-09 | 2020-04-17 | 北京北方华创微电子装备有限公司 | 支撑装置及反应腔室 |
TWI821919B (zh) * | 2021-12-16 | 2023-11-11 | 大陸商江蘇天芯微半導體設備有限公司 | 一種反射板組、燈組模組、襯底處理設備及反射板組的調節方法 |
Also Published As
Publication number | Publication date |
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CN105470176B (zh) | 2018-08-10 |
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Address after: 100015 No. 1 East Jiuxianqiao Road, Beijing, Chaoyang District Applicant after: North China Science and technology group Limited by Share Ltd. Address before: 100016 Jiuxianqiao East Road, Beijing, No. 1, No. Applicant before: BEIJING SEVENSTAR ELECTRONIC Co.,Ltd. |
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TA01 | Transfer of patent application right |
Effective date of registration: 20180104 Address after: 100176 No. 8, Wenchang Avenue, Daxing District economic and Technological Development Zone, Beijing Applicant after: BEIJING NAURA MICROELECTRONICS EQUIPMENT Co.,Ltd. Address before: 100015 No. 1 East Jiuxianqiao Road, Beijing, Chaoyang District Applicant before: North China Science and technology group Limited by Share Ltd. |
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