CN111656506A - 用于处理各种尺寸基板的设备 - Google Patents
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Abstract
本公开提供了处理不同尺寸的基板的方法和设备的实施例。在一些实施例中,用于处理不同尺寸的基板的设备包括:具有配置成支持具有第一尺寸的基板的第一组接触垫和配置成支持具有小于第一尺寸的第二尺寸的基板的第二组接触垫的一对终端受动器。
Description
技术领域
本公开的实施例总体上涉及基板处理设备,并且更具体地涉及用于处理不同尺寸的基板的方法和设备。
背景技术
在半导体制造工业中,对基板(诸如半导体晶片之类)的精确和仔细处理是基板处理的关键方面。自动化(诸如通过具有设计为用于处理晶片的终端受动器的基板处理机器人)被用来执行复杂的不可触摸任务以及减少或隔离任何外部污染。此类基板处理机器人将基板(诸如晶片之类的)从一个位置传送到另一个位置,将基板从系统内的一个站到另一站拾起和放下等。通常,基板处理机器人被设计并构建成处理一种类型的基板尺寸,这取决于例如系统能力与配置。作为示例,一些系统可以配置成处理200mm晶片或300mm晶片等。
随着技术以及更紧凑、更小的具有高计算能力的电子设备的进步,工业已经将其焦点从200mm晶片移至300mm晶片。因为300mm晶片的加工在市场上变得更占优势,所以对具有300mm加工能力的工具的需求增加,导致工具制造商设计并构建更多300mm工具,缓慢地逐步淘汰200mm工具。
然而,尽管过渡到300mm基板加工,许多芯片制造商仍具有在它们各自库存中的大量的200mm基板。发明人认为,期望处理200mm基板的此类芯片制造商和其他人,可能不希望购买可能很快被淘汰的200mm工具。
因此,发明人已提供了改进的方法和设备,所述方法和设备使得基板处理机器人能够处理不同尺寸的基板,诸如200mm和300mm晶片。
发明内容
本文提供了用于处理不同尺寸的基板的方法与设备的实施例。在一些实施例中,用于处理不同尺寸的基板的设备包括:一对终端受动器,其具有配置成支持具有第一尺寸的基板的第一组接触垫和配置成支持具有小于第一尺寸的第二尺寸的基板第二组接触垫。
在一些实施例中,一种多腔室基板处理工具包括:工厂接口(FI),其与负载锁定腔室选择性地连通;第一前开式标准舱(FOUP),其设置在FI上或耦合到FI,并且配置成向多腔室基板处理工具提供具有第一尺寸的基板或从多腔室基板处理工具提供具有第一尺寸的基板;第二FOUP,设置在FI上或耦合到FI,并且配置成向多腔室基板处理工具提供具有第二尺寸的基板或从多腔室基板处理工具提供具有第二尺寸的基板;以及设置在所述工厂接口中的机器人,其中所述机器人包括配置成支持具有所述第一尺寸和所述第二尺寸两者的基板的一对终端受动器,所述第二尺寸小于所述第一尺寸。
在一些实施例中,一种处理不同尺寸的基板的方法,包括以下步骤:将配置成处理基板的工具中的基板处理机器人的一对终端受动器旋转到第一位置以支持具有第一尺寸的基板;以及将所述一对终端受动器旋转到第二位置以支持具有第二尺寸的基板。
以下描述本发明的其他和进一步实施例。
附图说明
通过参考附图中描绘的本公开的说明性实施例,可以理解以上简要概述并在下面更详细地讨论的本公开的实施例。然而,附图仅示出了本公开的典型实施例,并且因此不应被视为对范围的限制,因为本公开可允许其他等效的实施例。
图1A-1B是根据本公开的至少一些实施例的用于处理不同尺寸的基板的设备的示意性俯视图。
图2A-2B是根据本公开的至少一些实施例的图1的用于处理不同尺寸的基板的设备的示意性前视图。
图3A-3B是根据本公开的至少一些实施例的图1的用于处理不同尺寸的基板的设备的示意性替代前视图。
图4是根据本公开的一些实施例的适于执行用于不同尺寸的处理的方法的多腔室群集工具的平面图。
为了便于理解,在可能的情况下,已使用相同的附图标记来表示附图中共有的相同元件。附图未按比例绘制,并且为了清楚起见可能经简化。一个实施例的元件和特征可有利地并入其他实施例中,而不需进一步引述。
具体实施方式
本文提供了处理不同尺寸的基板的方法和设备的实施例。所公开的方法和设备的实施例有利地使得基板处理机器人能够处理不同尺寸的基板。例如,用于处理不同尺寸的基板的设备可以处理具有第一尺寸的基板(诸如具有例如300mm第一直径的晶片等)以及具有小于第一尺寸的第二尺寸的基板(例如具有例如200mm第二直径的晶片)。因此,所公开的方法与设备的实施例有利地使得基板处理机器人(诸如在300mm处理工具中的基板处理机器人)能够处理不同尺寸的基板,诸如200mm和300mm晶片二者、或其他组合。此外,通过更换机器人上的终端受动器而无需更换整个基板处理机器人也无需担心工厂接口(FI)与基板处理机器人不兼容,可以有利地在现有的基板处理机器人上翻新改进的设备。
本文公开的用于处理不同尺寸的基板的设备的实施例有利地使得配置用于处理第一尺寸的基板的基板处理设备能够处理具有不同尺寸的基板。基板可以是圆形基板(诸如200或300mm晶片等)或具有其他形状因子的基板(诸如矩形或多边形基板之类,例如,用于太阳能、显示器或其他应用中的矩形玻璃基板)。例如,根据本文所公开的教导,可以更换或修改配置成处理300mm晶片的工具中的基板处理机器人,以允许处理例如200mm和300mm晶片两者。如此,基板处理机器人可以在任何给定的时间点处理200mm、300mm、或200mm和300mm两者的晶片工艺。进一步有利地,可以根据本文所公开的教导修改基板处理机器人上的终端受动器,而无需更换整个机器人或担心与FI不兼容。
图1A-1B是根据本公开的至少一些实施例的用于处理不同尺寸的基板的设备100的示意性俯视图。设备100适于与配置成处理具有第一尺寸的基板的基板处理工具相结合使用,诸如以下参照图4所述的多腔室基板处理工具400。
在一些实施例中,设备100包括耦合到支撑板104的一对终端受动器102。在基板拾取与传送期间,支撑板104提供支持并将负载的重量分配在终端受动器102上。终端受动器102可容易地从支撑板104移除,以促进修理、重新配置、更换等。
终端受动器102包括第一组接触垫106A和第二组接触垫106B。终端受动器102和第一及第二组接触垫106A、106B被配置成穿过处理系统中的开口以允许在整个处理系统中处理和传送基板。
第一组接触垫106A配置成支持具有第一尺寸的基板。第二组接触垫106B配置成支持具有小于第一尺寸的第二尺寸的基板。第一和第二接触垫106A、106B进一步配置成不相互干扰。例如,第一组接触垫106A可支持具有第一尺寸的第一基板(由虚线101指示),而第一基板不接触第二组接触垫106B。类似地,第二组接触垫106B可支持具有第二尺寸的第二基板(由虚线103指示),而第二基板不接触第一组接触垫106A。如此,由于由接触垫和终端受动器的配置所提供的间隙,设备100可有利地处理翘曲的基板。
第一与第二组接触垫106A、106B的接触垫可以是用于在基板处理系统中支持基板的任何合适的接触垫。例如,接触垫可包含边缘夹具或边缘接触垫,用于通过它们的外围边缘来支持基板。还可以使用其他类型的接触垫。此外,取决于加工需要,可选择接触垫的位置以处理期望尺寸的基板。
终端受动器102可以选择性地支持更大或更小的基板。例如,在一些实施例中和如图2A-B与3A-B中更清楚示出地,终端受动器102相对于支撑板104可部分地或自由地旋转,使得每个终端受动器102的旋转取向可被控制,以适当地将第一组接触垫106A或第二组接触垫106B定位以供使用,并将未选择的一组接触垫设置在不妨碍所选择一组接触垫的使用的位置。
例如,在一些实施例中,并取决于打算处理的基板尺寸,两个接触垫被设置在每个终端受动器102上与第一基板尺寸相对应的位置处,定义为第一组接触垫。两个接触垫被设置在每个终端受动器102上与第二基板尺寸相对应的位置处,定义为第二组接触垫。第一与第二组接触垫彼此径向分开放置,诸如彼此分开约90度(如图2A-2B所描绘的),或者以仍提供接触垫之间的间隙的更小的角度(如图3A-3B所描述的)放置。在一些实施例中,相对于终端受动器的延长轴测量接触垫的相对角位置。
例如,图2A-2B是根据本公开的至少一些实施例的用于处理图1的不同尺寸的基板的设备的示意性前视图。在图2A中,旋转终端受动器102使得第二组接触垫106B被定位成支持具有第二尺寸的基板(例如,较小的基板),如虚线103所指示。在图2B中,旋转终端受动器102使得第一组接触垫106A被定位成支持具有第一尺寸的基板(例如,较大的基板),如虚线101所指示。
图3A-3B是根据本公开的至少一些实施例的图1的用于处理不同尺寸的基板的设备的示意性替代前视图。在图3A中,旋转终端受动器102使得第二组接触垫106B被定位成支持具有第二尺寸的基板(例如,较小的基板),如虚线103所指示。在图3B中,旋转终端受动器102使得第一组接触垫106A被定位成支持具有第一尺寸的基板(例如,较大的基板),如虚线101所指示。因为图3A-3B中的各组接触垫在角度上彼此更接近,所以终端受动器102不需要旋转那么多以切换配置。
在操作期间,在拾取基板之前(诸如例如,在进入FOUP(前开式标准舱)之前),终端受动器可以旋转,以将一组接触垫定位到第一位置。一旦就位,基板处理设备就将把终端受动器102延伸到FOUP中。在延伸位置的末端,终端受动器102可以旋转到第二位置,在第二位置处该组接触垫(例如,边缘夹持垫)与基板接触。然后,在设备100缩回并将基板传送到其他位置之前,基板将被保持在终端受动器102上。当将基板放置在支撑件上时,可以反转终端受动器的旋转操作以释放基板。
在一些实施例中,可将设备100并入基板传送机器人。例如,返回图1A,支撑板104可被配置作为基板传送机器人的手腕。所述手腕将每个终端受动器102支持在相对于彼此的固定位置,使得对手腕的移动的控制有助于控制终端受动器102的定位。所述手腕耦合到臂108,臂108能在水平方向上移动手腕(和终端受动器102),诸如水平地延伸穿过FOUP或工艺腔室中的开口以向FOUP或工艺腔室递送基板或从FOUP或工艺腔室接收基板。在一些实施例中,手腕能够相对于臂进行水平或垂直旋转运动中的至少一种,诸如例如,通过经由铰链、销、可枢转关节、弯曲部等(示出了可枢转关节110)耦合到臂。臂108可以是包括多个部分和关节以促进更复杂的运动的复合臂。在一些实施例中,臂108可以耦合到组件112用于提供臂围绕中心轴114的垂直和/或旋转运动。臂的此类垂直和/或旋转运动有助于根据需要垂直地和/或旋转地移动手腕(和终端受动器102)以如期望地递送或接收基板。
设备100的部件和基板传送机器人(例如,臂、手腕,终端受动器等)可以由任何工艺合适的材料制成。例如,在一些实施例中,可选择材料以最小化在基板传送期间机器人叶片的偏转。在一些实施例中,可选择材料以最小化在基板传送期间机器人叶片对基板的污染。在高温下向腔室或从腔室进行传送的一些实施例中,可选择材料以最小化在基板传送期间的热效应。
图4根据本公开示意性地示出了具有用于处理不同尺寸的基板的设备的集成多腔室基板处理工具400的非限制性示例的平面图。适用于根据本公开的修改和使用的工具的示例包括,可从加利福尼亚州圣克拉拉市(Santa Clara)的应用材料公司(AppliedMaterials,Inc.)获得的APPLIED 和系列的集成基板处理工具。多腔室基板处理工具400包括耦合到主机的多个处理腔室,主机包括两个传送腔室(例如,传送腔室408和传送腔室433)。
多腔室基板处理工具400包括与负载锁定腔室404选择性地连通的前端环境工厂接口(FI)402。多腔室基板处理工具400通常配置成处理具有第一尺寸的基板(诸如具有例如300mm第一直径的晶片等)。一个或多个前开式标准仓(FOUP)(例如FOUP 401a和FOUP401b)被设置在FI 402上或耦合到FI 402以向多腔室基板处理工具400提供基板或从多腔室基板处理工具400接收基板。在一些实施例中,提供桥接FOUP 401c以允许处理具有小于第一尺寸的第二尺寸的基板(例如具有例如200mm第二直径的晶片)。桥接FOUP 401c被设置在FI 402上或耦合到FI 402。在一些实施例中,桥接FOUP 401c可配置成保持第一尺寸(例如,300mm)的基板载具,在所述基板载具上设置有具有第二尺寸(例如,200mm)的基板。
工厂接口机器人403被设置在FI 402内。工厂接口机器人403可并入用于处理如上所述的不同尺寸的基板的设备100的实施例中的任一者。工厂接口机器人403配置成向FOUP401a、401b和桥接FOUP 401c传送基板/从FOUP 401a、401b和桥接FOUP 401c传送基板,以及在桥接FOUP 401c与负载锁定腔室404之间传送基板。在一个操作示例中,工厂接口机器人403从FOUP 401a获取基板载具,并将所述基板载具放置在桥接FOUP 401c中。该基板载具具有第一尺寸,例如300mm直径。随后,工厂接口机器人403接着从FOUP 401b获取基板并将所述基板放置在桥接FOUP 401c内的基板载具上。该基板具有小于第一尺寸的第二尺寸,例如200mm直径。接下来,工厂接口机器人403可将保持基板的载具一起传送到负载锁定腔室404,使得可在多腔室基板处理工具400中处理具有第二尺寸的基板。在这样的示例中,通过使用单个基板处理设备来便于处理多个尺寸的基板,基板传送设备100有利地使得配置用于处理具有第一尺寸的基板的处理工具(诸如多腔室基板处理工具400)能够处理具有小于第一尺寸的第二尺寸的基板。
负载锁定腔室404提供了在FI 402与第一传送腔室组件410之间的真空接口。第一传送腔室组件410的内部区域通常保持在真空条件下,并提供中间区域,在该中间区域中,将基板或保持基板的基板载具从一个腔室往返移动到另一个腔室和/或负载锁定腔室。
在一些实施例中,第一传送腔室组件410被分成两部分。在本公开的一些实施例中,第一传送腔室组件410包括传送腔室408和真空延伸腔室407。传送腔室408与真空延伸腔室407耦合在一起并彼此流体连通。在处理期间,第一传送腔室组件410的内部容积通常保持在低压或真空条件下。负载锁定腔室404可以分别经由狭缝阀405和406连接到FI 402和真空延伸腔室407。
在一些实施例中,传送腔室408可以是具有底部、盖子和多个侧壁的多边形结构。多个侧壁可以具有贯穿其中形成的开口,并配置成与处理腔室、真空延伸和/或通过腔室连接。图4中所示的传送腔室408具有正方形或矩形形状,并且耦合到处理腔室411、413、通过腔室431和真空延伸腔室407。传送腔室408可分别经由狭缝阀416、418和417与处理腔室411、413和通过腔室431选择性地连通。
在一些实施例中,中央机器人409可安装在传送腔室408中,位于形成在传送腔室408的底部上的机器人埠处。中央机器人409设置在传送腔室408的内部容积420中,并且配置成将基板414(或保持基板的基板载具)在处理腔室411、413、通过腔室431和负载锁定腔室404之间往返移动。在一些实施例中,中央机器人409可包括用于保持基板或保持基板的基板载具的两个叶片,每个叶片安装在装载在同一机器人基座上的可独立控制的机器人臂上。在另一个实施例中,中央机器人409可以具有垂直移动叶片的能力。
真空延伸腔室407配置成向第一传送腔室组件410提供到真空系统的接口。在一些实施例中,真空延伸腔室407包括底部、盖子和侧壁。压力调节埠可以形成在真空延伸腔室407的底部上,并配置成适配真空泵系统。开口形成在侧壁上,使得真空延伸腔室407与传送腔室408流体连通,并且与负载锁定腔室404选择性地连通。
在一些实施例中,真空延伸腔室407包括配置成储存一个或多个基板或保持基板的基板载具的货架(未示出)。直接或间接连接到传送腔室408的处理腔室可以在货架上储存它们的基板或保持基板的基板载具,并且使用中央机器人409来传送它们。
多腔室基板处理工具400可进一步包括由通过腔室431连接到第一传送腔室组件410的第二传送腔室组件430。在一些实施例中,类似于负载锁定腔室,通过腔室431配置成提供在两个处理环境之间的接口。在这样的实施例中,通过腔室431提供在第一传送腔室组件410与第二传送腔室组件430之间的真空接口。
在一些实施例中,第二传送腔室组件430被分成两部分以最小化多腔室基板处理工具400的占地面积。在本公开的一些实施例中,第二传送腔室组件430包括彼此流体连通的传送腔室433和真空延伸腔室432。在处理期间,第二传送腔室组件430的内部容积通常保持在低压或真空条件下。通过腔室431可分别经由狭缝阀417和438连接到传送腔室408和真空延伸腔室432,使得传送腔室408内的压力可以保持在不同的真空水平。
在一些实施例中,传送腔室433可以是具有底部、盖子和多个侧壁的多边形结构。多个侧壁可以具有形成在其中的开口,并配置成与处理腔室、真空延伸和/或通过腔室连接。图4中所示的传送腔室433具有正方形或矩形形状,并且耦合到处理腔室435、436、437、和真空延伸腔室432。传送腔室433可分别经由狭缝阀441、440、439与处理腔室435、436选择性地连通。
中央机器人434安装在传送腔室433中,位于形成在传送腔室433的底部上的机器人埠处。中央机器人434设置在传送腔室433的内部容积449中,并且配置成将基板443(或保持基板的基板载具)在处理腔室435、436、437、和通过腔室431之间往返移动。在一些实施例中,中央机器人434可包括用于保持基板或保持用于保持基板的基板载具132的两个叶片,每个叶片安装在装载在同一机器人基座上的可独立控制的机器臂上。在一些实施例中,中央机器人434可以具有垂直移动叶片的能力。
在一些实施例中,真空延伸腔室432配置成在真空系统与第二传送腔室组件430之间提供接口。在一些实施例中,真空延伸腔室432包括底部、盖子和侧壁。压力调节埠可以形成在真空延伸腔室432的底部上,并配置成适配真空系统。开口贯穿侧壁形成,使得真空延伸腔室432与传送腔室433流体连通,并且与通过腔室431选择性地连通。
在本公开的一些实施例中,真空延伸腔室432包括货架(未示出),该货架类似于以上结合真空延伸腔室407所描述的货架。直接或间接连接到传送腔室433的处理腔室可以在货架上储存基板或保持基板的基板载具。
通常,在具有基座的密封腔室中处理基板,所述基座用于支持设置在该基座上的基板。所述基座可以包括基板支撑件,该基板支撑件具有设置在其中的电极以在处理期间静电地保持基板或保持用于保持基板的基板载具抵靠基板支撑件。对于容忍较高腔室压力的工艺,基座可以替代地包括具有与真空源连通的开口的基板支撑件,用于在处理期间将基板牢固地保持为抵靠基板支撑件。
可以在处理腔室411、413、435、436或437中的任一者中执行的工艺包括沉积、注入和热处理工艺等。在一些实施例中,处理腔室(诸如处理腔室411、413、435、436、或437中的任一者)配置成在基板上或同时在多个基板上执行溅射工艺。在一些实施例中,处理腔室411是一个脱气腔室。在一些实施例中,处理腔室413是预金属化清洁腔室。所述预金属化清洁腔室可使用包含惰性气体(诸如氩之类的)的溅射清洁工艺。在一些实施例中,处理腔室435是沉积腔室。与本文所述的实施例一起使用的沉积腔室可以是任何已知的沉积腔室。
尽管前述内容针对本公开的实施例,但是在不脱离其基本范围的前提下,可设计出本公开的其他和进一步实施例。
Claims (15)
1.一种用于处理不同尺寸的基板的设备,包括:
一对终端受动器,所述一对终端受动器具有配置成支持具有第一尺寸的基板的第一组接触垫和配置成支持具有小于所述第一尺寸的第二尺寸的基板的第二组接触垫。
2.如权利要求1所述的设备,其特征在于,所述一对终端受动器耦合到支撑板并且相对于所述支撑板是可旋转的,并且其中,所述终端受动器的旋转定位所述第一组接触垫或所述第二组接触垫用于接收基板。
3.如权利要求2所述的设备,其特征在于,所述支撑板配置为基板传送机器人的手腕,并且耦合到所述基板传送机器人的臂。
4.如权利要求1所述的设备,其特征在于,所述第一组接触垫和第二组接触垫是边缘夹持垫。
5.如权利要求1所述的设备,其特征在于,所述第一组接触垫和所述第二组接触垫与彼此成角度地定位,相对于每个相应的终端受动器的延长轴达约90度。
6.如权利要求1至5中任一项所述的设备,其特征在于,在每个终端受动器上设置两个接触垫以定义所述第一组接触垫。
7.如权利要求1至5中任一项所述的设备,其特征在于,在每个终端受动器上设置两个接触垫以定义所述第二组接触垫。
8.如权利要求1至5中任一项所述的设备,其特征在于,所述第二组接触垫被设置在所述第一组接触垫的相邻接触垫的位置之间的每个终端受动器上的位置处。
9.一种多腔室基板处理工具,包括:
工厂接口(FI),所述工厂接口与负载锁定腔室选择性地连通;
第一前开式标准舱(FOUP),所述第一前开式标准舱设置在所述FI上或耦合到所述FI,并且配置成向所述多腔室基板处理工具提供具有第一尺寸的基板或从所述多腔室基板处理工具提供具有第一尺寸的基板;
第二FOUP,所述第二FOUP设置在所述FI上或耦合到所述FI,并且配置成向所述多腔室基板处理工具提供具有小于所述第一尺寸的第二尺寸的基板或从所述多腔室基板处理工具提供具有小于所述第一尺寸的第二尺寸的基板;以及
机器人,所述机器人设置在所述工厂接口中,其中所述机器人包括如权利要求1、2、4或5中任一项所述的设备。
10.如权利要求9所述的多腔室基板处理工具,其特征在于,在每个终端受动器上设置两个接触垫以定义所配置的第一组接触垫,并且在每个终端受动器上设置两个接触垫以定义所述第二组接触垫。
11.一种处理不同尺寸的基板的方法,包括:
将配置成处理基板的工具中的基板处理机器人的一对终端受动器旋转到第一位置以支持具有第一尺寸的基板;以及
将所述一对终端受动器旋转到第二位置,以支持具有第二尺寸的基板。
12.如权利要求11所述的方法,进一步包括在将所述一对终端受动器旋转到所述第二位置之前,释放具有所述第一尺寸的所述基板。
13.如权利要求12所述的方法,进一步包括在释放具有所述第一尺寸的所述基板之前,拾取具有所述第一尺寸的所述基板。
14.如权利要求11至13中任一项所述的方法,其特征在于,所述一对终端受动器包括第一组接触垫和第二组接触垫,所述第一组接触垫支持具有所述第一尺寸的所述基板,所述第二组接触垫支持具有所述第二尺寸的所述基板。
15.如权利要求11至13中任一项所述的方法,其特征在于,将所述一对终端受动器旋转到所述第二位置包括:将所述一对终端受动器相对于相应的终端受动器中的每一个的延长轴旋转达约90度。
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US201862631354P | 2018-02-15 | 2018-02-15 | |
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US16/272,811 | 2019-02-11 | ||
US16/272,811 US10930542B2 (en) | 2018-02-15 | 2019-02-11 | Apparatus for handling various sized substrates |
PCT/US2019/017966 WO2019161026A1 (en) | 2018-02-15 | 2019-02-14 | Apparatus for handling various sized substrates |
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CN111656506A true CN111656506A (zh) | 2020-09-11 |
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CN201980010700.XA Pending CN111656506A (zh) | 2018-02-15 | 2019-02-14 | 用于处理各种尺寸基板的设备 |
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US (1) | US10930542B2 (zh) |
KR (1) | KR102452130B1 (zh) |
CN (1) | CN111656506A (zh) |
PH (1) | PH12020551113A1 (zh) |
SG (1) | SG11202006919VA (zh) |
TW (1) | TWI797253B (zh) |
WO (1) | WO2019161026A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024035614A1 (en) * | 2022-08-12 | 2024-02-15 | Applied Materials, Inc. | Multi-size wafer handling frame |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11035552B2 (en) * | 2016-09-08 | 2021-06-15 | Lensvector Inc. | Liquid crystal dynamic beam control device and manufacture |
KR102295249B1 (ko) * | 2019-10-08 | 2021-08-30 | (주)에스티아이 | 기판처리장치 |
US11524392B2 (en) | 2020-11-24 | 2022-12-13 | Applied Materials, Inc. | Minimal contact gripping of thin optical devices |
WO2023224984A1 (en) * | 2022-05-17 | 2023-11-23 | Onto Innovation Inc. | Multi-sized substrate fixture |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060280586A1 (en) * | 2005-05-27 | 2006-12-14 | Innolux Display Corp. | Substrate conveyance apparatus |
KR20100060090A (ko) * | 2008-11-27 | 2010-06-07 | 세메스 주식회사 | 리니어 스케일을 이용하는 기판 이송 장치 및 그의 위치 편차 검출 방법 |
JP2011125967A (ja) * | 2009-12-18 | 2011-06-30 | Hitachi High-Tech Control Systems Corp | ウェーハ搬送ロボット用のハンド、ウェーハ搬送ロボット及びウェーハ搬送装置 |
US20140017042A1 (en) * | 2012-07-10 | 2014-01-16 | Lam Research Corporation | End effector having multiple-position contact points |
US20140033852A1 (en) * | 2012-07-31 | 2014-02-06 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Liquid crystal panel transportation device and support arm structure thereof |
US20170069517A1 (en) * | 2015-09-03 | 2017-03-09 | Kawasaki Jukogyo Kabushiki Kaisha | Substrate transfer device |
CN206293419U (zh) * | 2016-12-15 | 2017-06-30 | 上海精典电子有限公司 | 一种涂胶显影设备传送手臂 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2535489A (en) * | 1947-03-05 | 1950-12-26 | Harold T Edwards | Artificial arm |
US5656088A (en) * | 1991-08-28 | 1997-08-12 | Dainippon Screen Mfg. Co., Ltd. | Apparatus for dipping substrates in processing fluid |
US5700046A (en) * | 1995-09-13 | 1997-12-23 | Silicon Valley Group, Inc. | Wafer gripper |
JP2772283B2 (ja) * | 1996-07-16 | 1998-07-02 | 山形日本電気株式会社 | 真空吸着ピンセットおよびその吸着方法 |
US6213704B1 (en) | 1998-05-20 | 2001-04-10 | Applied Komatsu Technology, Inc. | Method and apparatus for substrate transfer and processing |
US6109677A (en) * | 1998-05-28 | 2000-08-29 | Sez North America, Inc. | Apparatus for handling and transporting plate like substrates |
KR101032340B1 (ko) * | 2004-11-22 | 2011-05-06 | 엘지디스플레이 주식회사 | 평판표시장치용 기판이송로봇 |
JP5123851B2 (ja) * | 2005-07-08 | 2013-01-23 | クロッシング オートメーション インコーポレイテッド | 加工物を格納するための加工物容器 |
KR101003579B1 (ko) * | 2006-02-02 | 2010-12-22 | 가부시키가이샤 야스카와덴키 | 로봇 시스템 |
JP5111285B2 (ja) * | 2008-08-06 | 2013-01-09 | 株式会社日立ハイテクノロジーズ | 試料搬送機構 |
JP5402233B2 (ja) * | 2009-05-19 | 2014-01-29 | 株式会社安川電機 | ロボット及び物品搬送システム |
US9844447B2 (en) * | 2010-04-09 | 2017-12-19 | Deka Products Limited Partnership | System and apparatus for robotic device and methods of using thereof |
KR101215093B1 (ko) * | 2010-05-03 | 2012-12-24 | 삼성전자주식회사 | 이송 로봇 |
US8567837B2 (en) * | 2010-11-24 | 2013-10-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Reconfigurable guide pin design for centering wafers having different sizes |
JP2012216573A (ja) * | 2011-03-31 | 2012-11-08 | Toppan Printing Co Ltd | 基板搬送ロボット |
US20170225322A1 (en) * | 2014-08-08 | 2017-08-10 | Panasonic Corporation | Movement assistance device |
JP6305272B2 (ja) * | 2014-08-14 | 2018-04-04 | 株式会社ディスコ | 搬送装置 |
US10322513B2 (en) * | 2015-12-08 | 2019-06-18 | Genmark Automation, Inc. | Robot end effector applying tensile holding force |
US10607879B2 (en) * | 2016-09-08 | 2020-03-31 | Brooks Automation, Inc. | Substrate processing apparatus |
-
2019
- 2019-02-11 US US16/272,811 patent/US10930542B2/en active Active
- 2019-02-14 TW TW108104904A patent/TWI797253B/zh active
- 2019-02-14 WO PCT/US2019/017966 patent/WO2019161026A1/en active Application Filing
- 2019-02-14 CN CN201980010700.XA patent/CN111656506A/zh active Pending
- 2019-02-14 SG SG11202006919VA patent/SG11202006919VA/en unknown
- 2019-02-14 KR KR1020207026196A patent/KR102452130B1/ko active IP Right Grant
-
2020
- 2020-07-23 PH PH12020551113A patent/PH12020551113A1/en unknown
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060280586A1 (en) * | 2005-05-27 | 2006-12-14 | Innolux Display Corp. | Substrate conveyance apparatus |
KR20100060090A (ko) * | 2008-11-27 | 2010-06-07 | 세메스 주식회사 | 리니어 스케일을 이용하는 기판 이송 장치 및 그의 위치 편차 검출 방법 |
JP2011125967A (ja) * | 2009-12-18 | 2011-06-30 | Hitachi High-Tech Control Systems Corp | ウェーハ搬送ロボット用のハンド、ウェーハ搬送ロボット及びウェーハ搬送装置 |
US20140017042A1 (en) * | 2012-07-10 | 2014-01-16 | Lam Research Corporation | End effector having multiple-position contact points |
US20140033852A1 (en) * | 2012-07-31 | 2014-02-06 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Liquid crystal panel transportation device and support arm structure thereof |
US20170069517A1 (en) * | 2015-09-03 | 2017-03-09 | Kawasaki Jukogyo Kabushiki Kaisha | Substrate transfer device |
CN206293419U (zh) * | 2016-12-15 | 2017-06-30 | 上海精典电子有限公司 | 一种涂胶显影设备传送手臂 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024035614A1 (en) * | 2022-08-12 | 2024-02-15 | Applied Materials, Inc. | Multi-size wafer handling frame |
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SG11202006919VA (en) | 2020-08-28 |
KR102452130B1 (ko) | 2022-10-11 |
WO2019161026A1 (en) | 2019-08-22 |
KR20200108504A (ko) | 2020-09-18 |
US10930542B2 (en) | 2021-02-23 |
US20190252235A1 (en) | 2019-08-15 |
PH12020551113A1 (en) | 2021-07-05 |
TW201935610A (zh) | 2019-09-01 |
TWI797253B (zh) | 2023-04-01 |
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