WO2024035614A1

WO2024035614A1 - Multi-size wafer handling frame

Info

Publication number: WO2024035614A1
Application number: PCT/US2023/029565
Authority: WO
Inventors: James J. Hansen; James D. Strassner; Steven Trey Tindel
Original assignee: Applied Materials, Inc.
Priority date: 2022-08-12
Filing date: 2023-08-04
Publication date: 2024-02-15
Also published as: TW202421394A

Abstract

Embodiments of the present disclosure herein include an apparatus and method for processing a substrate. More specifically, embodiments of this disclosure provide substrate flipping device that includes a gripping actuator, and a substrate securing assembly. The substrate securing assembly comprises an upper structure coupled to the gripping actuator, a lower structure coupled to the gripping actuator, and a plurality of sets of gripping pads attached to the upper structure and the lower structure, wherein each set of gripping pads is configured to secure substrates of different sizes.

Description

MULTI-SIZE WAFER HANDLING FRAME

BACKGROUND

Field

[0001] Embodiments of the present disclosure relate to a flipping device in manufacturing systems, such as semiconductor substrate processing systems, and in particular to a substrate flipping device in a manufacturing system.

Description of the Related Art

[0002] In electronics processing systems, such as semiconductor processing systems, objects, such as substrates, are processed. In some systems, an upper and a lower surface of the object is processed. In semiconductor processing systems, a substrate is transported by robot arm, placed in a processing chamber, and an upper surface of the substrate is processed in the processing chamber. To process the lower surface of the substrate, the substrate must be removed from the processing chamber, flipped such that the lower surface of the substrate is facing upward, and replaced in the processing chamber for processing.

[0003] Some conventional systems have a stand-alone device for rotating and/or flipping substrates. These conventional stand-alone devices are large and are not usable with many semiconductor processing systems or semiconductor processing systems must be configured to accommodate the large stand-alone devices. The conventional stand-alone devices also typically accommodate only one size of substrate, making the device impractical for many semiconductor processing systems. In addition, conventional systems use electronic controls that have an increased complexity of providing rotation and/or flipping of the substrate to a wide range of orientations (e.g., vertical, horizontal, and many intervening diagonal orientations). In some conventional systems, fracturing of substrates (e.g., ultra-thin wafers and substrates) is a problem.

[0004] There is a need in the art for a substrate flipping device that can accommodate multiple sized substrates without fracturing them.

SUMMARY

[0005] The present disclosure generally includes a substrate flipping device that comprises a gripping actuator, and a substrate securing assembly. The substrate securing assembly comprises an upper structure coupled to the gripping actuator, a lower structure coupled to the gripping actuator, and a plurality of sets of gripping pads attached to the upper structure and the lower structure, wherein each set of gripping pads is configured to secure substrates of different sizes.

[0006] Embodiments of the present disclosure may further provide a substrate flipping device that includes a gripping actuator, and a substrate securing assembly. The substrate securing assembly comprises an upper structure comprising a first upper section and a second upper section coupled to the gripping actuator, a lower structure comprising a first lower section and a second lower section coupled to the gripping actuator, two first gripping pads attached to both ends of the first upper section and the first lower section, one first gripping pad attached to both ends of the second upper section and both ends of the second lower section, and one second gripping pad placed on each end on a body of the first upper section, the second upper section, the first lower section, and the second lower section, each second gripping pad being radially positioned inside each of the first gripping pads.

[0007] Embodiments of the present disclosure may further provide a substrate processing system including a transfer chamber, a factory interface disposed between a transfer chamber and a plurality of enclosure systems; and a substrate flipping device disposed in the factory interface, on the factory interface, or in the transfer chamber configured to secure substrates of different sizes. The substrate flipping device comprises a gripping actuator, and a substrate securing assembly. The substrate securing assembly comprises an upper structure coupled to the gripping actuator, a lower structure coupled to the gripping actuator, and a plurality of sets of gripping pads attached to the upper structure and the lower structure, wherein each set of gripping pads is configured to secure substrates of different sizes.

BRIEF DESCRIPTION OF THE DRAWINGS

[0008] So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings. It is to be noted, however, that the appended drawings illustrate only exemplary embodiments and are therefore not to be considered limiting of the scope of the disclosure, as the disclosure may admit to other equally effective embodiments.

[0009] FIG. 1 illustrates a processing system, according to certain embodiments.

[0010] FIGS. 2A-H illustrate substrate flipping assemblies, according to certain embodiments.

[0011] FIG. 3A-B illustrates a substrate flipping device, according to certain embodiments.

[0012] FIG. 4 illustrates a method of using a substrate flipping device, according to certain embodiments.

[0013] To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.

[0014] To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.

DETAILED DESCRIPTION

[0015] The devices, systems, and methods disclosed herein provide a substrate flipping device. The substrate flipping device includes a substrate securing assembly that includes multiple sets of substrate gripping pads to secure substrates of different sizes. The substrate flipping device can be expanded to any number of sizes to secure different substrates of any size. Different sets of gripping pads are configured to secure a substrate of a different size. In one example, a first set of gripping pads includes first gripping pads are used to secure a substrate of a first size and a second set of gripping pads includes second gripping pads are used to secure a substrate of a second size. In embodiments, described herein the substrates may have different material compositions. The first gripping pads are configured to secure a larger sized substrate than the second gripping pads. The first gripping pads are taller than the second gripping pads. The first gripping pads are arranged in a “tooth-like” structure so that they mesh to secure the first sized substrate. The second gripping pads are aligned so that they interlock to secure the second sized substrate while the first gripping pads slide between each other. As explained above, the substrate flipping device can also include additional sets of gripping pads to secure additional substrates of different sizes.

[0016] FIG. 1 illustrates a processing system 100 (e.g., wafer processing system, substrate processing system, semiconductor processing system) according to certain embodiments. The processing system 100 includes a factory interface 101 and enclosure systems 130. Enclosure systems 130 (e.g., cassette, front opening unified pod (FOUR), process kit enclosure system, or the like) are configured for transferring wafers and/or other substrates into and out of the processing system 100. In some embodiments, one or more enclosure systems 130 includes (e.g., completely houses, at least partially houses) a substrate flipping device 105. In some embodiments, as illustrated, a substrate flipping device 105 is disposed in or mounted to the factory interface 101. Alternatively, or additionally, a substrate flipping device 105 is disposed in (as illustrated) or mounted to a transfer chamber 106. In some embodiments, an enclosure system 130 is a system with shelves for aligning carriers and/or process kit rings.

[0017] In some embodiments, the enclosure system 130 (e.g., process kit enclosure system) includes one or more items of content (e.g., one or more of a process kit ring, an empty process kit ring carrier, a process kit ring disposed on a process kit ring carrier, a placement validation wafer, substrates, etc.). In some examples, the enclosure system 130 is coupled to the factory interface 101 to enable automated transfer of a process kit ring on a process kit ring carrier into the processing system 100 for replacement of a used process kit ring.

[0018] In some embodiments, the processing chambers 108 are etch chambers, deposition chambers (including atomic layer deposition, chemical vapor deposition, physical vapor deposition, or plasma enhanced versions thereof), anneal chambers, or the like.

[0019] Factory interface 101 includes a factory interface robot 112. Factory interface robot 112 includes a robot arm, such as a selective compliance assembly robot arm (SCARA) robot. Examples of a SCARA robot include a 2 link SCARA robot, a 3 link SCARA robot, a 4 link SCARA robot, and so on. The factory interface robot 112 includes an end effector on an end of the robot arm. The end effector is configured to pick up and handle specific objects, such as wafers. Alternatively, or additionally, the end effector is configured to handle objects such as a carrier and/or process kit rings (edge rings). The robot arm has one or more links or members (e.g., wrist member, upper arm member, forearm member, etc.) that are configured to move the end effector in different orientations and to different locations. The factory interface robot 112 is configured to transfer objects between enclosure systems 130 (e.g., cassettes, FOUPs) and the transfer chamber 106.

[0020] The transfer chamber 106 includes a chamber robot 110. Chamber robot 110 includes a robot arm with an end effector at an end of the robot arm. The end effector is configured to handle particular objects, such as wafers. In some embodiments, the chamber robot 110 is a SCARA robot, but has fewer links and/or fewer degrees of freedom than the factory interface robot 112 in some embodiments.

[0021] A controller 102 controls various aspects of the processing system 100. In some embodiments, the controller 102 includes one or more controllers. The controller 102 is and/or includes a computing device such as a personal computer, a server computer, a programmable logic controller (PLC), a microcontroller, and so on. The controller 102 includes one or more processing devices, which, in some embodiments, are general-purpose processing devices such as a microprocessor, central processing unit, or the like. More particularly, in some embodiments, the processing device is a complex instruction set computing (CISC) microprocessor, reduced instruction set computing (RISC) microprocessor, very long instruction word (VLIW) microprocessor, or a processor implementing other instruction sets or processors implementing a combination of instruction sets. In some embodiments, the processing device is one or more special-purpose processing devices such as an application specific integrated circuit (ASIC), a field programmable gate array (FPGA), a digital signal processor (DSP), network processor, or the like. In some embodiments, the controller 102 includes a data storage device (e.g., one or more disk drives and/or solid state drives), a main memory, a static memory, a network interface, and/or other components. In some embodiments, the controller 102 executes instructions to perform any one or more of the methods or processes described herein. The instructions are stored on a computer readable storage medium, which include one or more of the main memory, static memory, secondary storage and/or processing device (during execution of the instructions). The controller 102 receives signals from and sends controls to factory interface robot 112 and chamber robot 110 in some embodiments.

[0022] According to one aspect of the disclosure, content is removed from an enclosure system 130 via factory interface robot 112 located in the factory interface 101. A chamber robot 110 located in the transfer chamber 106 removes the content from one of the enclosure systems 130. The chamber robot 110 moves the content into the transfer chamber 106. From the transfer chamber 106, the chamber robot moves the content to a processing chamber 108. While not shown for clarity in FIG. 1 , transfer of the content includes transfer of a process kit ring disposed on a process kit ring carrier, transfer of a substrate disposed on a substrate carrier, transfer of a placement validation wafer, etc. In some embodiments, the substrate may be removed from the substrate carrier, and then the substrate flipping device 105 may flip the substrate. The substrate may then be placed back onto the substrate carrier.

[0023] In some examples, it is contemplated that the enclosure system 130 is coupled to the transfer chamber 106 via a load port mounted to the transfer chamber 106. Content is transferred from the enclosure system 130 by to the transfer chamber 106 by the chamber robot 110. Then, the chamber robot 110 may transfer the content to a processing chamber 108. Additionally, in some embodiments, content is loaded in a substrate support pedestal (SSP). In some embodiments, an additional SSP is positioned in communication with the factory interface 101 opposite the illustrated SSP. Processed content (e.g., a used process kit ring) is to be removed from the processing system 100 in reverse of any manner described herein. When utilizing multiple enclosure systems 130 or a combination of enclosure system 130 and SSP, in some embodiments, one SSP or enclosure system 130 is to be used for unprocessed content (e.g., new process kit rings), while another SSP or enclosure system 130 is to be used for receiving processed content (e.g., used process kit rings).

[0024] The processing system 100 includes chambers, such as factory interface 101 (e.g., equipment front end module (EFEM)), transfer chamber 106, and adjacent chambers (e.g., enclosure system 130, or the like) that are adjacent to the factory interface 101 and/or the transfer chamber 106. Typically, the transfer chamber 106 is sealed. In some embodiments, inert gas (e.g., one or more of nitrogen, argon, neon, helium, krypton, or xenon) is provided into one or more of the chambers (e.g., the factory interface 101 , or the transfer chamber 106) to provide one or more inert environments. In some examples, the factory interface 101 is an inert EFEM that maintains the inert environment (e.g., inert EFEM minienvironment) within the factory interface 101 so that users do not need to enter the factory interface 101 (e.g., the processing system 100 is configured for no manual access within the factory interface 101 ).

[0025] In some embodiments, gas flow (e.g., providing inert gas, providing nitrogen, exhausting gas to provide a vacuum environment, etc.) is provided into and/or from one or more chambers (e.g., the factory interface 101 , or the transfer chamber 106) of the processing system 100.

[0026] In some embodiments, the gas flow is greater than leakage through the one or more chambers to maintain a positive pressure within the one or more chambers. In some embodiments, the exhausted gas flow is greater than leakage through the one or more chambers to maintain a negative pressure within the one or more chambers.

[0027] In some embodiments, the inert gas within the factory interface 101 is recirculated. In some embodiments, a portion of the inert gas is exhausted. In some embodiments, the gas flow of non-recirculated gas into the one or more chambers is greater than the exhausted gas flow and the gas leakage to maintain a positive pressure of inert gas within the one or more chambers. In some embodiments, exhausted gas flow out of the one or more chambers is greater than gas leakage (e.g., and gas flow) into the one or more chambers to maintain a negative pressure (e.g., vacuum environment) within the one or more chambers.

[0028] In some embodiments, the one or more chambers are coupled to one or more valves and/or pumps to provide the gas flow into and/or out of the one or more chambers. A processing device (e.g., controller 102) controls the gas flow into and out of the one or more chambers. In some embodiments, the processing device receives sensor data from one or more sensors (e.g., oxygen sensor, moisture sensor, motion sensor, door actuation sensor, temperature sensor, pressure sensor, etc.) and determines, based on the sensor data, the flow rate of inert gas flowing into and/or flow rate of gas flowing out of the one or more chambers.

[0029] In some embodiments, a chamber (e.g., enclosure system 130, FOIIP, etc.) housing a substrate flipping device 105 is configured to provide gas flow into or out of the chamber. In some examples, gas is exhausted out of the chamber that houses the substrate flipping device 105 to pull inert gas from the factory interface 101 into the chamber and to not contaminate the factory interface 101 .

[0030] FIGS. 2A-H illustrate a substrate flipping device 200, according to certain embodiments. FIG. 2A is a cross-sectional side view of the substrate flipping device 200 securing a first size of substrate. FIG. 2B is a cross-sectional side view of the substrate flipping device 200, securing a second size of substrate. FIG. 2C is a top view of the substrate flipping device 200 in a first configuration and securing a first size of substrate. FIG. 2D is a top view of the substrate flipping device 200 in a second configuration and securing a second size of substrate. FIG. 2E is an isometric view of a substrate securing assembly of the substrate flipping device. FIG. 2F is a zoomed in cross-sectional side view of the substrate flipping device 200 securing a first size of substrate. FIG. 2G is isometric view of a first pad of the substrate flipping device 200 configured to secure the first size of substrate. FIG. 2H is an isometric view of a second pad of the substrate flipping device 200 configured to secure the second size of substrate.

[0031] The substrate flipping device 200 includes a gripping actuator 210, a rotating actuator 222 and a substrate securing assembly 230. The substrate flipping device 200 includes a base structure 250, a back structure 252, and a gripping bracket 212 (e.g., gripping actuator 210 is at least partially disposed in the gripping bracket 212). The gripping bracket 212 may also function as a pneumatic distribution block with assorted channel drilled into the material. In some embodiments, the pneumatic manifold 222 has a pressurized gas inlet and the gripping bracket 212 has a pressurized gas outlet. In some embodiments, one or more portions of the substrate flipping device 200 (e.g., the rotating actuator 222) has a damper (e.g., hydraulic damper (not shown)). In some embodiments, the gripping bracket 212 has one or more mechanical gaskets (e.g., one or more O-rings (not shown)) to seal channels (e.g., pneumatic feed through (not shown), channels (not shown) from the rotating actuator 222 to the gripping actuator 210 via the gripping bracket 212). In some embodiments, the gripping bracket 212 has one or more openings (e.g., drilled holes (not shown)) to fluidly couple the pressurized gas outlet to the one or more channels (e.g., pneumatic pass through (not shown)) in the gripping bracket 212.

[0032] The substrate securing assembly 230 is configured to secure substrates of different sizes in-situ. One or more components of the substrate securing assembly 230 may be rigid to reduce frame droop. To prevent substrate fracture, the gripping force of gripping actuator 210 may be adjusted using a pressure regulator located in controls of the substrate flipping device 200 (not shown) to prevent substrates from fracturing. In one embodiment, one or more components of the substrate securing assembly 230 may be flexible (e.g., upper bracket 234A and lower bracket 234B may be flexible gripping brackets that deflect to protect substrates from fracturing). The substrate securing assembly 230 includes an upper portion 232A and a lower portion 232B that are configured to be in an open position, and multiple closed positions that each correspond to securing a different sized substrate. In one example, the upper portion 232A and the lower portion 232B are configured (but not limited to) to be in a first closed position securing a first sized substrate (Figure 2A), and in a second closed position securing a second sized substrate (Figure 2B). The first sized substrate is larger than the second sized substrate. The upper portion 232A and/or the lower portion 232B are actuated by the gripping actuator 210 to be in any of the closed positions and are actuated by the gripping actuator 210 to be in the open position. Embodiments may include four or more positions to handle three or more substrate sizes. The upper portion 232A includes the upper bracket 234A coupled to the gripping actuator 210 and an upper structure 240A attached to the upper bracket 234A.

[0033] In some embodiments, the upper portion 232A includes a teaching feature 236A (e.g., feature with a flat upper surface, cylindrical feature, feature with a trapezoidal perimeter, etc.). In some embodiments, the teaching feature 236A is disposed on (e.g., attached to, integral to) the upper bracket 234A. The teaching feature 236A causes the substrate flipping device 200 to be auto-teach capable. In some embodiments, an end effector of a robot arm determines the location of the teaching feature 236A. In some examples, the end effector determines the location of the teaching feature 236A by breaking a light transmission path (e.g., light beam, beam triggering path) between a first light path opening (e.g., fiber emitter coupled to a light source) of the end effector and a second light path opening (e.g., fiber receiver coupled to a light receiver) of the end effector. Responsive to determining the location of the teaching feature 236A, the robot determines the location to place and retrieve the substrate (e.g., on the gripping pads 246 and 247). In some embodiments, a teaching feature 236 is located in one or more other locations on the substrate flipping device 200 (e.g., on lower bracket 234B, etc.).

[0034] The lower portion 232B includes the lower bracket 234B coupled to the gripping actuator 210 and a lower structure 240B attached to the lower bracket 234B. The lower portion 232B and each of its components may be identical to the upper portion 232A.

[0035] A plurality of sets of gripping pads are attached to the upper structure 240A and the lower structure 240B. Each set of gripping pads is configured to secure a different sized substrate in a corresponding closed position. The quantity of sets of gripping pads is equal to the quantity of different sized substrates that can be secured. In one example, a first set of first gripping pads 246 and second set of second gripping pads 247 are attached to the structures, allowing two different size substrates to be secured by the substrate securing assembly 230.

[0036] The first gripping pads 246 are configured to secure a first substrate 260 of a first size. The second gripping pads 247 are configured to secure a second substrate 261 of a second size (see e.g. Fig. 2B). The first size is larger than the second size. The first gripping pads 246 are positioned on the ends of the upper structure 240A and the lower structure 240B. The second gripping pads 247 are positioned inside of the first gripping pads 246. In other words, the second gripping pads 247 are closer to the center of the upper structure 240A and the lower structure 240B than the first gripping pads 246. Therefore, there is space between the first gripping pads 246 and the second gripping pads 247 to account for different sized substrates.

[0037] While two sets of gripping pads that are radially arranged are shown, it is contemplated that more than two sets of gripping pads may be radially arranged from one another. Each subsequent set of gripping pads positioned radially closer to the center of the structure (e.g. , closer to the center of upper structure 240A and the center of the lower structure 240B) are vertically shorter than the gripping pads located radially farther away from the center of the structure to accommodate a smaller substrate without interference. For example, the first gripping pads 246 are taller than the second gripping pads 247. The closer each subsequent sets of gripping pads are to the center of the structure, the smaller the size of the substrate secured each set of gripping pads. For example, the first gripping pads 246 secure a substrate (the first substrate 260) that is larger than the substrate (the second substrate 261 ) secured by the second gripping pads 247. A third set of gripping pads positioned closer to the center of the structure than the second gripping pads 247 would be vertically shorter than the second gripping pads 247 and secure a third substrate smaller than the second substrate, and so on.

[0038] In some embodiments, the upper structure 240A and the lower structure 240B are “x” shaped (e.g., both structures have four comers). There are unequal quantities of first gripping pads 246 on vertically aligned comers of the structures. For example on a first side 203 of the substrate securing assembly 230 the upper structure 240A includes two first gripping pads 246 and the lower structure 240B includes one first gripping pad 246. The first gripping pads 246 on the upper structure 240A are horizontally separated with a space between them. The first gripping pad 246 on the lower structure 240B is aligned with the space between the two first gripping pads 246 on the corresponding corner of the upper structure 240A. The lower portion 232B may be orientated so that a top surface of the first gripping pads 246 and the second gripping pads 247 attached to the lower structure 240B face top surfaces of the first gripping pads 246 and the second gripping pads 247 attached to the upper structure 240A.

[0039] Furthermore, on a second side 205 of the substrate securing assembly 230, the upper structure 240A includes one first gripping pad 246 and the lower structure 240B includes two first gripping pads 246. The first gripping pads 246 on the lower structure 240B are horizontally separated with a space between them. The first gripping pad 246 on the upper structure 240A is aligned with the space between the two first gripping pads 246 on the vertically aligned corner of the lower structure 240B. This forms a tooth-like structure that allows the first gripping pads 246 to mesh (i.e., pass) between each other without contacting one another. [0040] The first gripping pads 246 are taller than the second gripping pads 247. The differences in height allow for the first substrate 260 to be secured at a first closing position and the second substrate 261 (see e.g., Fig. 2B) to be secured at a second closing position. The distance 208 between the upper structure 240A and the lower structure 240B is greater in the first closing position than the second closing position.

[0041] The rotating actuator 222 is configured to receive pressurized gas to control the gripping actuator 210. The bracket 212 forms channels (not shown) to provide the pressurized gas from the rotating actuator 222 to the gripping actuator 210 (e.g., without routing pneumatic lines).

[0042] In some embodiments, the substrate flipping device 200 includes one or more speed control valves (not shown) configured to control rotation speed of the rotating actuator 222 and to minimize vibration (e.g., reduce potential for induced substrate vibration) of the substrate flipping device 200. In some embodiments, the substrate flipping device 200 includes a pressure regulator (not shown) configured to adjust system pressure (e.g., to lower gas pressure received to a predetermined operation pressure) to control rotation speed of the rotating actuator 222 and gripping force of the gripping actuator 210 (e.g., both the rotating actuator 222 and gripping actuator 210 operate under the same set pressure).

[0043] In some embodiments, the substrate flipping device 200 includes one or more first sensors (e.g., two sensors (not shown)), coupled to the rotating actuator 222, configured to provide first sensor data indicative of a first position of the rotating actuator 222 (e.g., flipped position, non-flipped position). In some embodiments, the substrate flipping device 200 includes one or more second sensors (e.g., two sensors (not shown)) coupled to the gripping actuator 210 and configured to provide second sensor data indicative of a second position of the gripping actuator 210 (e.g., closed position, open position, etc.). In some embodiments, the substrate flipping device 200 includes a substrate presence sensor 254 (e.g., ultrasonic sensor, optical sensor) configured to provide third sensor data indicative of presence of the substrate and status of flipping of the substrate. Furthermore, the substrate flipping device 200 may include a minimum of two additional sensors (not shown) coupled to the rotating actuator 222 to indicate whether the flipping operation has been completed and, if so, whether the substrate flipping device 200 is in a flipped up or flipped down orientation. [0044] The substrate flipping device 200 is configured to receive one or more different sizes of substrates (e.g., 200 mm and 150 mm). In some embodiments, substrates include one or more of a glass wafer, a silicon wafer, etc. In some embodiments, the substrate flipping device 200 receives a substrate from a robot (e.g., atmospheric robot blade) and flips the substrate 180 degrees (e.g., bottom side becomes top side). In some embodiments, the rotation occurs along the X-axis or Y- axis and takes into account robot entry and substrate placement. In some embodiments, the substrate thickness could be 0.3 mm to 2.5 mm or beyond. In some embodiments, the robot substrate hand-off is along the axis of substrate rotation or perpendicular to the axis of rotation. In some embodiments, there are no moving components (e.g., wires, tubes, manual adjusters, etc.) above and below the substrate plane. In some embodiments, the pneumatic actuators exhaust away from the substrate plane (e.g., below or behind barrier of the enclosure system).

[0045] In some embodiments, the gripping actuator 210 receives pneumatic pressure as input and outputs gripping and open motion (e.g., open position and closed position). The controls of the gripping actuator 210 are pressure and exhaust flow control. In some embodiments, the rotary actuator 222 receives pneumatic pressure as input and outputs rotation motion (e.g., flipped position and non-flipped position, 0 degree position and 180 degree position, etc.). The controls of the rotating actuator 222 are pressure, exhaust flow control, shock absorbers, and end position.

[0046] The sensor 254 (e.g., ultrasonic sensor) receives input of electric voltage and outputs on or off. The control of the sensor 254 is to teach distance. The gripper may include two or more magnetic switches (not shown) such as reed switches (e.g., of the gripping actuator 210). The quantity of magnetic switches depends on the quantity of sets of gripping pads. The quantity of magnetic switches is equal to the number of possible positions of the substrate securing assembly 230. In other words the quantity of magnetic switches is equal to the number of sets of gripping pads (i.e. , the quantity of closed positions) plus one for the open position. For example two sets of gripping pads requires three magnetic switches.

[0047] The magnetic switches have an input of electric voltage and outputs of on and off. The magnetic switches are configured to confirm that the substrate securing assembly 230 is in the proper closed position. For example, the first magnetic switch is configured to be off when the substrate securing assembly 230 is open and on when the substrate securing assembly 230 is securing the first substrate 260 in the first gripping pads 246 (i.e., the first closed position in FIG. 2A). Likewise, the outputs of the second magnetic switch are configured to be off when the substrate securing assembly 230 is open and on when the second gripping pads are securing the second substrate 261 (i.e., the second closed position in FIG. 2B).

[0048] As illustrated in FIG. 2A, one embodiment, the substrate securing assembly 230 is in the first closed position when the first gripping pads 246 are securing the first substrate 260. The first substrate 260 is the maximum sized substrate that can be secured by the substrate flipping device 200. When securing the maximum sized substrate, the substrate securing assembly will stop (stall out) once the first substrate 260 is secured between the first gripping pads 246. Due to the unequal quantities of first gripping pads 246 on each vertically aligned corner of the upper and lower structures 240A-B, the first gripping pads 246 secure the first substrate 260 without interlocking.

[0049] Referring to FIG. 2B, the second gripping pads 247 are securing the second substrate 261 in a second closing position. Due to their positioning, the first gripping pads 246 mesh (pass between one another) as the substrate securing assembly 230 surpasses the first closed position. This allows the shorter second gripping pads 247 to interlock and secure the second substrate 261 . The second gripping pads 247 secure the second substrate 261 in a second closing position. The distance 208 between the upper and lower structures 240A-B is smaller in the second closed position than the first closed position. As described above, it is contemplated that more than two sets of gripping pads may be radially arranged from one another. In examples, where more than two sets of gripping pads are used, each set of gripping pads, except for the gripping pads closest to the center of the structure (e.g., closest to the center of upper the structure 240A and the center of the lower structure 240B), are positioned in a tooth-like structure in the same manner as the first gripping pads 246 and are configured to mesh. For example, if a third set of gripping pads are positioned closer to the center of the structure than the second gripping pads 247, the second gripping pads are positioned in the same manner of the first gripping pads 246 and are configured to mesh. [0050] Referring to Figures 2C-2D, in some embodiments, the first substrate 260 is secured between each of the first gripping pads 246 attached to both the upper structure 240A and the lower structure 240B (e.g., see FIG. 2C). Additionally, each of the second gripping pads 247 attached to both the upper structure 240A and the lower structure 240B are configured to secure the second substrate 261 (e.g., see FIG. 2D). In some examples, the size of the first substrate 260 is 200 mm or 300 mm in diameter and the size of the second substrate 261 is 150mm or 200 mm in diameter.

[0051] Figure 2E illustrates the substrate securing assembly 230 of the substrate flipping device 200. The substrate securing assembly 230 is configured to secure substrates of different sizes in-situ. One or more components of the substrate securing assembly 230 are flexible to protect substrates from fracturing.

[0052] The upper structure 240A includes a first upper section 242A and a second upper section 244A that intersect, along with first gripping pads 246 and second gripping pads 247 attached to the upper structure 240A. The first upper section 242A of the upper structure 240A has a capital “I” shape. The first upper section 242A of the upper structure 240 includes two first gripping pads 246 attached on the ends of the capital “I” shape. The second upper section 244A of the upper structure 240A is a straight line shape and includes a single first gripping pad 246 on each end. Therefore, adjacent comers of the upper structure 240A alternate between including one first gripping pad 246 and two first gripping pads 246.

[0053] The second gripping pads 247 are positioned inside of the first gripping pads 246. In other words, the second gripping pads 247 are closer to the center of the upper structure 240A than the first gripping pads 246. The first gripping pads 246 and the second gripping pads 247 are orientated in opposite directions.

[0054] In some embodiments, the two first gripping pads 246 located in a same corner of the upper structure 240A are horizontally separated. The horizontal space 241 between the two first gripping pads 246 is configured to allow a first gripping pad 246, positioned on a vertically aligned corner of the lower structure 240B, to pass between the two first gripping pads 246. In comers of the upper structure 240A including two first gripping pads 246, the second gripping pads 247 are aligned with the center of the horizontal space 241 between the two first gripping pads 246. In comers of the upper structure 240A with one first gripping pad 246, the centers of the second gripping pad 247 and the first gripping pad 246 are aligned. As explained above, the first gripping pads 246 are taller than the second gripping pads 247.

[0055] The lower structure 240B includes a first lower section 242B and a second lower section 244B, along with first gripping pads 246 and second gripping pads 247 attached to the lower structure 240B.

[0056] The first lower section 242B of the lower structure 240B has a capital “I” shape. The first lower section 242B of the lower structure 240B includes two first gripping pads 246 attached on the ends of the capital “I” shape. The second lower section 244B of the lower structure 240B is a straight line shape and includes a single first gripping pad 246 on each end. A second gripping pad 247 is positioned inside of the first gripping pads 246. In other words, each second gripping pad 247 is closer to the center of the lower structure 240B than the first gripping pads 246.

[0057] Therefore, adjacent corners of the lower structure 240B alternate between including one first gripping pad 246 and two first gripping pads 246. For example the corners of the lower structure 240B that are vertically aligned with the corners of the upper structure 240A having two first gripping pads 246 include one first gripping pad 246 (and vice versa).

[0058] The first upper section 242A of the upper structure 240A and the second lower section 244B of the lower structure 240B are positioned in directions parallel to each other. Likewise, the second upper section 244A of the upper structure 240A and the first lower section 242B of the lower structure 240B are positioned in directions parallel to each other. The horizontal space 241 between the sets of two first gripping pads 246 on the upper structure 240A is aligned with the single first gripping pads 246 on the lower structure 240B. The horizontal space 241 between the sets of first gripping pads 246 on the lower structure 240B are aligned with the single first gripping pads 246 on the upper structure 240A. The second gripping pads 247 on the upper structure 240A and the second gripping pads 247 on the lower structure 240B are each aligned with each other.

[0059] In some embodiments, the first gripping pads 246 and the second gripping pads 247 have different heights. The height 243 of the second gripping pads 247 are configured to allow for them to receive a substrate from a robotic blade. The height 243 of the second gripping pads 247 account for the thickness of the robotic blade, the minimum clearances required above and below the blade, and the maximum possible substrate sag. Therefore, the height 243 of the second gripping pads 247 is between 12 and 16mm, for example, 14 mm.

[0060] The height of the first gripping pads 246 are configured based on the height 243 of the second gripping pads 247 and maximum substrate sag. Therefore, there is a minimum height difference 249 of at least 2.4 mm between a substrate drop-off surface of the first gripping pads 246 and a top surface of the second gripping pads 247.

[0061] In some embodiments, the upper structure 240A attach to both the first gripping pads 246 and the second gripping pads 247 via a fastener 256 (e.g., such as a bolt, screw, etc.). In some embodiments, the fasteners 256 extend through both the upper structure 240A and a portion of the first gripping pads 246 and a portion of the second gripping pads 247. The fasteners 256 extend into a helicoil installed on a bottom face of the first gripping pad 246 and the second gripping pad 247. Furthermore, the upper bracket 234A is attached to the upper structure 240A, via similar attachment means.

[0062] The lower structure 240B attach to the first gripping pads 246 and the second gripping pads 247 via fasteners 256 (e.g., a bolt, screw, etc.). In some embodiments, the fasteners 256 extend through both the lower structure 240B and a portion of the first gripping pads 246 and the second gripping pads 247. The fasteners 256 extend into a helicoil installed on a bottom face of the first and second gripping pads 246-247. Furthermore, the lower bracket 234B is attached to the lower structure 240B, via similar attachment means.

[0063] In some embodiments, the upper bracket 234A and the upper structure 240A attach to each other in a particular configuration and the lower bracket 234B and the lower structure 240B attach to each other in the same configuration so that a robot arm (e.g., a blade) approaches the substrate securing assembly 230 from one or more corresponding directions. In some embodiments, the particular configuration provides larger openings on the left and the right of the substrate securing assembly 230 so that the robot arm approaches the substrate securing assembly 230 from the left and/or the right to place a substrate and remove a substrate. [0064] In one example, the upper and lower structures 240A-B are constructed so that the angle 0 between the front/back of their respective sections combined with the position of the second gripping pads 247 allow at least 5 mm of clearance for a robotic arm to approach place substrates in the substrate securing assembly 230 from the left or right. The angle 0 between corresponding structure portions may be between about 30 and about 90 degrees.

[0065] In some embodiments, the substrate securing assembly 230 is controlled (e.g., placed in an open position, closed position, flipped position, non-flipped position) via pneumatic controls (e.g., providing pressurized gas to the rotating actuator 222 and/or gripping actuator 210). Use of pneumatic controls simplifies operation by allowing (e.g., only allowing) two positions of flipped position and non-flipped position (e.g., since intermediate positions are not required). In some embodiments, the substrate securing assembly 230 is controlled (e.g., placed in an open position, closed position, flipped position, non-flipped position) via electronic controls (e.g., servo control).

[0066] Figure 2F illustrates a zoomed in view of the substrate securing assembly 230 securing the first substrate 260 between the first gripping pads 246. As described above the first gripping pads 246 on vertically aligned comers of the upper and lower structures 240A-B are not aligned with one another. Therefore, the first gripping pads 246 secure the first substrate 260 by each contacting the first substrate 260 at different points while not contacting each other. In other words, the first gripping pads 246 do not interlock with each other.

[0067] Figure 2G illustrates an isometric view of a first gripping pad 246. The first gripping pad 246 includes a body 269 and a lip 272 that separates a first upper surface 270 and a second upper surface 274. The second upper surface 274 is located above the first upper surface 270. The first substrate 260 rests on the first upper surface 270 of the first gripping pads 246 on the lower structure 240B. The first upper surface 270 is tapered by the lip 272 to only contact a small surface of the first substrate 260. Alternatively, the lip 272 may be an entire platform that the can support the first substrate 260. The lip 272 may have a width between 0.5 mm and the diameter of the first substrate 260. [0068] The first substrate 260 is secured by closing the substrate securing assembly 230 until the first upper surface 270 of each first gripping pad 246 on the upper structure 240A contacts (e.g., secures) the first substrate 260. The first substrate 260 is secured between the first upper surface 270 of each first gripping pad 246, and is held in place by the lip 272 of each first gripping pad 246.

[0069] The body 269 of the first gripping pad 246 also includes a pin slot 276. The pin slot 276 may have a width between 2 mm and 5 mm. The pin slot 276 is configured to house a pin. The pin addresses alignment issues of the first gripping pad 246 by restricting its rotational freedom.

[0070] Figure 2H is an isometric drawing of a second gripping pad 247. The second gripping pad 247 includes a body 279, a first upper surface 282, a second upper surface 285, a third upper surface 284, and a lip 287. The lip 287 may have a width between 0.8 mm and 1.2 mm. The front face 283 of the body 279 may be trimmed for clearance of a robotic arm (e.g., a blade) configured to place a substrate in the substrate securing assembly 230.

[0071] As illustrated in Figure 2H, there is an empty space 286 between the first upper surface 282, the second upper surface 285, and the third upper surface 284. The second substrate 261 rests on the second upper surface 285 of each of the second gripping pads 247 attached to the lower structure 240B. In one embodiment, the second upper surface 285 is tapered by the lip 287 to contact a small surface of the second substrate 261. The second substrate 261 is secured by closing the substrate securing assembly 230 until the third upper surface 284 of each of the second gripping pads 247 attached to the upper structure 240A interlock via the empty space 286 of the lower structure 240B (and vice versa) This “half tooth” shape allows the second substrate 261 to be secured between each second upper surface 285 of each of the interlocking second gripping pads 247. This design also enables the use of the same part for upper and lower gripping pads.

[0072] The body 279 of the second gripping pad 247 also includes a pin slot 288. The width of the pin slot 288 may be between about 2 mm and 5 mm. The pin slot 288 is configured to house a pin that is used to restrict the rotational freedom of the second gripping pad 247. [0073] FIG. 3A-3B illustrate a system 300 (e.g., processing system 100 of FIG. 1 ) including the substrate flipping device 200.

[0074] In some embodiments, flipping device 200 can be mounted on a frame 370 to dock against Factory interface 101 in a load port position. In other embodiments, flipping device 200 may be mounted elsewhere inside Factory Interface 101 or transfer chamber 106.

[0075] In some embodiments, an opening 374 of the panel 377 is configured to be sealed to maintain a sealed environment in the system (e.g., factory interface 101 or transfer chamber 106). In some embodiments, the sealed environment includes one or more of a compressed dry air, inert gas (e.g., nitrogen), vacuum (e.g., negative pressure), positive pressure, etc. In some embodiments, gas is exhausted from the enclosure system that houses the substrate flipping device 200 to outside of the system to pull gas from the sealed environment of the system 300 (e.g., factory interface 101 or transfer chamber 106) into the enclosure system and to exhaust contaminants from the enclosure system out of the system 300.

[0076] In some embodiments, the pressurized gas used by the substrate flipping device 200 is selected based on the type of gas in the sealed environment. In some examples, for a sealed environment that uses air (e.g., cleandry air (CDA)), the substrate flipping device 200 uses pressurized air (e.g., CDA).

[0077] In some embodiments, a controller 380 is disposed proximate the substrate flipping device 200. In some embodiments, the controller 380 is disposed on the panel 377. In some embodiments, a cover is placed over the controller 380.

[0078] In some embodiments, the controller 380 provides control of pneumatic actuators (e.g., gripping actuator 210 and rotating actuator 222 of FIG. 2) and receives sensor data via magnetic switches from the rotating actuator 222 and gripping actuator 210.

[0079] In some embodiments, one or more portions of the substrate flipping device 200 (e.g., rotating actuator 222 and gripping actuator 210) are located within an enclosure (e.g., in addition to the enclosure systems 130 around the substrate flipping device 200) to capture any contaminants (e.g., particles). [0080] Alternatively, substrate flipping device 200 may be separated from system 300. For example, the substrate flipping device may be mounted within the equipment front end module, and the panel 377 would not be present and the controller 380 would be disposed in an alternative location (not shown).

[0081] Figure 3B illustrates a zoomed in view of magnetic switches 385, such as reed switches included in the gripping actuator 210. The magnetic switches 385 are configured detect whether the substrate securing assembly 230 is in error. In one example, the gripping actuator 210 may include three magnetic switches.

[0082] The controller 380 can utilize the magnetic switches 385 to ensure that the substrate securing assembly 230 is securing a substrate of the right size. For example, a first magnetic switch 390 is configured to detect when the substrate securing assembly 230 is in the fully open position, a second magnetic switch 395 is configured to detect when the substrate securing assembly 230 is in a first closed position, and a third magnetic switch 397 is configured to detect when the substrate securing assembly 230 is in a second closed position.

[0083] For example, the substrate securing assembly 230 should secure the first substrate 260 in the first gripping pads 246 (i.e., larger substrate) after closing for a known period of time. Therefore, when securing the first substrate 260, after closing for a first pre-programmed period of time, the controller 380 can check if the second magnetic switch 395 is activated. If the second magnetic switch 395 is not activated the controller 380 can determine there is an error and refrain from flipping the substrate securing assembly 230. Likewise, the substrate securing assembly 230 should be securing the second substrate 261 in the second gripping pads 247 (i.e., a smaller substrate) after closing for a second pre-programmed period of time (longer than the first period of time). Therefore, when securing the second substrate 261 , the controller 380 can check if the third magnetic switch 397 is activated after closing for the second pre-programmed period of time. If the third magnetic switch 397 is not activated, the controller 380 can determine there is an error and refrain from flipping the substrate securing assembly 230.

[0084] Additionally, if a magnetic switch is engaged for an unexpected wafer size or gripper state, for example the second magnetic switch 395 is engaged when the third magnetic switch 397 should be engaged (or vice versa), the controller 380 determines there is an error and refrains from flipping the substrate securing assembly 230.

[0085] In other embodiments of substrate securing assembly 230, the upper portion 232A and/or the lower portion 232B are opened, closed, and/or flipped using electric motors or other actuation mechanisms.

[0086] FIG. 4 illustrates a method 400 of using a substrate flipping device 200 according to certain embodiments. Method 400 is performed by processing logic that include hardware (e.g., circuitry, dedicated logic, programmable logic, microcode, processing device, etc.), software (such as instructions run on a processing device, a general purpose computer system, or a dedicated machine), firmware, microcode, or a combination thereof. In some embodiments, method 400 is performed, in part, by controller device (e.g., controller 102 of FIG. 1 and/or controller 380 of FIG. 3). In some embodiments, a non-transitory storage medium stores instructions that when executed by a processing device (e.g., of controller 102, controller 380, etc.) cause the device to perform method 400.

[0087] For simplicity of explanation, method 400 is depicted and described as a series of operations. However, operations in accordance with this disclosure can occur in various orders and/or concurrently and with other operations not presented and described herein. Furthermore, in some embodiments, not all illustrated operations are be performed to implement method 400 in accordance with the disclosed subject matter. In addition, those skilled in the art will understand and appreciate that method 400 could alternatively be represented as a series of interrelated states via a state diagram or events. As described herein, a substrate is placed in the substrate securing assembly 230. Then the gripping actuator 210 causes the substrate securing assembly 230 to move to a closed position to secure a substrate between a set of gripping pads (e.g., the first gripping pads 246 or the second gripping pads 247) based on the size of the substrate, and magnetic switches confirm that the substrate securing assembly 230 is in the correct closed position corresponding to the size of the substrate being secured. Then the substrate securing assembly 230 is flipped via the rotating actuator 222, the gripping actuator 210 returns the substrate securing assembly to an open position, and the substrate is retrieved from the substrate securing assembly 230. [0088] At block 402 of method 400, a substrate securing assembly 230 and the substrate flipping device 200 is in an open position to receive a substrate. In one embodiment, processing logic pneumatically causes, via a gripping actuator 210 of a substrate flipping device 200 (e.g., by sending a first signal to the substrate flipping device), the substrate securing assembly 230 of the substrate flipping device 200 to be in an open position to receive a substrate. An end effector of a robot arm (e.g., a blade) may place a substrate in a first orientation on the first gripping pads 246 on the lower structure 240B or on the second gripping pads 247 of the lower structure based on the size of the substrate. In other embodiments, one or more electric motors or other actuation mechanisms causes the gripping actuator 210 of a substrate flipping device 200 to be in an open position to receive a substrate.

[0089] At block 404, processing logic pneumatically causes, via the gripping actuator 210 (e.g., by sending a second signal to the substrate flipping device 200), the substrate securing assembly 230 to be in a closed position to secure the substrate. As described above the substrate securing assembly 230 may stop in a first closed position or continue to a second closed position based on the size/placement of the substrate. Furthermore, as described above, the substrate securing assembly 230 in not limited to only securing two sizes of substrates. The substrate securing assembly 230 may continue to further closing positions past the second closing position to secure additional differently sized substrates. In other embodiments, one or more electric motors or other actuation mechanisms causes the gripping actuator 210 of a substrate flipping device 200 to be in a closed position to secure a substrate.

[0090] The substrate securing assembly 230 is configured to stop (e.g., stall) at the first closed position when the first substrate 260 is secured between the first gripping pads 246. The substrate securing assembly is configured to continue past the first closing position, causing the first gripping pads 246 to mesh, and continue to the second closing position to secure the second substrate 261 between interlocking second gripping pads 247.

[0091] At block 406, processing logic pneumatically causes, via a rotating actuator 222 of the substrate flipping device (e.g., by sending a third signal to the substrate flipping device), the substrate securing assembly 230 to a flipped position. As explained above prior to flipping the substrate securing assembly, the controller 380 confirms whether the substrate securing assembly is in an error state based on magnetic switches in the gripping actuator 210. In other embodiments, one or more electric motors or other actuation mechanisms causes the rotating actuator 222 of the substrate flipping device 200 to the flipped position to secure the substrate.

[0092] In some embodiments via a pressure regulator of the substrate flipping device 200, system pressure is manually controlled to adjust rotation speed of the rotating actuator 222 and gripping force of the gripping actuator 210. In some embodiments, the processing logic causes a rotating actuator 222 of the substrate flipping device 200 to receive pressurized gas to control the gripping actuator 210. In some embodiments, the rotating actuator 222 and the gripping actuator are controller to be ON or OFF based for pneumatic flow and their rotation speeds are preconfigured.

[0093] While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.

Claims

What is claimed is:

1 . A substrate flipping device comprising: a gripping actuator; and a substrate securing assembly comprising: an upper structure coupled to the gripping actuator; a lower structure coupled to the gripping actuator; and a plurality of sets of gripping pads attached to the upper structure and the lower structure, wherein each set of gripping pads is configured to secure substrates of different sizes.

2. The substrate flipping device of claim 1 , wherein each of the plurality of sets of gripping pads are spaced radially inward from one another, and wherein radially inward sets of gripping pads are configured to secure smaller substrates than radially outward sets of gripping pads.

3. The substrate flipping device of claim 1 , wherein the plurality of sets of gripping pads include a first set of gripping pads configured to secure a first substrate of a first size and a second set of gripping pads configured to secure a second substrate of a second size, the first size and the second size being different.

4. The substrate flipping device of claim 3, wherein the first set of gripping pads comprises: two first gripping pads attached to both ends of a first upper section of the upper structure; one first gripping pad attached to both ends of a second upper section of the upper structure; two first gripping pads attached to ends of a first lower section of the lower structure; and one first gripping pad attached to ends of a second lower section of the lower structure, wherein the first upper section of the upper structure and the second lower section of the lower structure extend in a direction parallel to each other, and the second upper section of the upper structure and the first lower section of the lower structure extend in a direction parallel to each other.

5. The substrate flipping device of claim 4, wherein: the two first gripping pads are attached to the ends of a first upper section of the upper structure are separated by a first horizontal space; and two first gripping pads are attached to the ends of a first lower section of the lower structure are separated by a second horizontal space, the first and second horizontal distances being equal.

6. The substrate flipping device of claim 5, wherein: the one first gripping pad attached to the ends of a second lower section of the lower structure is aligned with the center of the first horizontal space; and the one first gripping pad attached to the ends of a second upper section of the upper structure is aligned with the center of the second horizontal space.

7. The substrate flipping device of claim 3, wherein the first size is 300 mm or 200 mm in diameter, and the second size is 200 mm or 150 mm in diameter.

8. The substrate flipping device of claim 3, wherein the first set of gripping pads and the second set of gripping pads have different heights.

9. A substrate flipping device comprising: a gripping actuator; and a substrate securing assembly comprising: an upper structure comprising a first upper section and a second upper section coupled to the gripping actuator; a lower structure comprising a first lower section and a second lower section coupled to the gripping actuator; two first gripping pads attached to both ends of the first upper section and the first lower section; one first gripping pad attached to both ends of the second upper section and both ends of the second lower section; and one second gripping pad placed on each end on a body of the first upper section, the second upper section, the first lower section, and the second lower section, each second gripping pad being radially positioned inside each of the first gripping pads.

10. The substrate flipping device of claim 9, wherein: the first upper section and the second lower section extend in a direction parallel to each other; and the second upper section and the first lower section extend in a direction parallel to each other.

11 . The substrate flipping device of claim 9, wherein: the two first gripping pads attached to the ends of the first upper section are separated by a first horizontal space; the two first gripping pads attached to the ends of the first lower section are separated by a second horizontal space; the one first gripping pad attached to the ends of the second lower section are aligned with a center of the first horizontal space; and the one first gripping pad attached to the ends of the second upper section are aligned with a center of the second horizontal space.

12. The substrate flipping device of claim 9, wherein the first gripping pads are configured to secure a first substrate of a first size and the second gripping are configured to secure a second substrate of a second size, the first size being different than the second size, and wherein the first size is 300 mm or 200 mm in diameter, and the second size is 200 mm or 150 mm in diameter.

13. The substrate flipping device of claim 9, wherein the first gripping pads are taller than the second gripping pads.

14. The substrate flipping device of claim 9, wherein the second gripping pads are positioned closer to centers of both the upper structure and the lower structure than the first gripping pads.

15. A substrate processing system comprising: a transfer chamber; a factory interface disposed between a transfer chamber and a plurality of enclosure systems; and a substrate flipping device disposed in the factory interface, on the factory interface, or in the transfer chamber configured to secure substrates of different sizes, the substrate flipping device comprising: a gripping actuator; and a substrate securing assembly comprising: an upper structure coupled to the gripping actuator; a lower structure coupled to the gripping actuator; and a plurality of sets of gripping pads attached to the upper structure and the lower structure, wherein each set of gripping pads is configured to secure substrates of different sizes.

16. The substrate processing system of claim 15, wherein the plurality of sets of gripping pads include a first set of gripping pads configured to secure a first substrate of a first size and a second set of gripping pads configured to secure a second substrate of a second size, the first size and the second size being different, and wherein the first size is 300 mm or 200 mm in diameter, and the second size is 200 mm or 150 mm in diameter.

17. The substrate processing system of claim 16, further comprising: a controller; and a memory for storing a program to be executed in the controller, the program comprising instructions when executed cause the controller to: cause, via actuation of the gripping actuator, the substrate securing assembly to be placed in a first closed position to grip a first substrate of a first size between the first set of gripping pads; and cause, via actuation of the gripping actuator, the substrate securing assembly to be placed in a second closed position to grip a second substrate of a second size between the second set of gripping pads.

18. The substrate processing system of claim 16, wherein the first set of gripping pads are taller than the second set of gripping pads.

19. The substrate processing system of claim 17, wherein the controller is further configured to cause via actuation or a rotary actuator the substrate securing assembly to flip after securing the first substrate or the second substrate.

20. The substrate processing system of claim 15, wherein each of the plurality of sets of gripping pads are spaced radially inward from one another, and wherein radially inward sets of gripping pads are configured to secure smaller substrates than radially outward sets of gripping pads.