CN105463382B - 一种提高TiAl合金氧化抗力的涂层及其制备方法 - Google Patents

一种提高TiAl合金氧化抗力的涂层及其制备方法 Download PDF

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CN105463382B
CN105463382B CN201510812754.1A CN201510812754A CN105463382B CN 105463382 B CN105463382 B CN 105463382B CN 201510812754 A CN201510812754 A CN 201510812754A CN 105463382 B CN105463382 B CN 105463382B
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程玉贤
王博
张艺馨
张春刚
刘礼祥
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AECC Shenyang Liming Aero Engine Co Ltd
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Abstract

本发明涉及一种涂层及其制备方法,具体涉及一种提高TiAl合金氧化抗力的涂层及其制备方法。本发明是一种提高TiAl合金氧化抗力的涂层,包括AlSiY底层和YSZ陶瓷面层;AlSiY底层采用真空电弧镀制备,并进行高温扩散和湿吹砂处理;柱状晶结构YSZ陶瓷面层采用电子束物理气相沉积方法制备,呈典型柱状晶结构。本发明的提高TiAl合金氧化抗力的涂层与TiAl合金界面相容性好,抗氧化性能优异,应变容限高。

Description

一种提高TiAl合金氧化抗力的涂层及其制备方法
技术领域
本发明涉及一种涂层及其制备方法,具体涉及一种提高TiAl合金氧化抗力的涂层及其制备方法。
背景技术
TiAl合金具有低密度,较高弹性模量以及良好的高温强度等优点,在航空发动机工业有着良好的应用前景。但其高温抗氧化性能的不足无法满足实际应用的要求,因此发展适用于TiAl合金的高温防护涂层是其应用的重要前提之一。
目前人们针对γ–TiAl合金发展了渗铝涂层、MCrAlY包覆涂层、TiAlCr涂层及氮化物涂层。上述涂层都显著提高了TiAl合金的抗氧化性能,但存在以下缺点:1)渗铝涂层,制备涂层时易于出现贯穿性裂纹,氧化时可沿裂纹氧化,并产生横向开裂,影响其长期氧化性能和力学性能;2)MCrAlY涂层氧化过程中涂层与TiAl合金发生严重的互扩散,形成硬而脆的互扩散带,影响涂层体系的长期抗氧化性能;3)TiAlCr涂层靶材较脆,不易熔炼,且涂层沉积效率低;从附图1中可以观察到,氧化100hrs后TiAl基体和NiCrAlY涂层之间发生了明显的互扩散,形成硬而脆的互扩散带,形成裂纹,显著损害基材的力学性能;4)氮化物涂层内应力大且与TiAl合金基体相容性不好。
因此,如何在保证提高TiAl合金抗氧化性能的同时保证涂层与TiAl合金的界面匹配性及稳定性成为发展TiAl合金高温防护涂层的关键问题。
发明内容
本发明提供一种提高TiAl合金氧化抗力的涂层及其制备方法,其涂层与TiAl合金界面相容性好,抗氧化性能优异,应变容限高。
本发明是一种提高TiAl合金氧化抗力的涂层,包括AlSiY底层和YSZ陶瓷面层;AlSiY底层采用真空电弧镀制备,并进行高温扩散和湿吹砂处理;柱状晶结构YSZ陶瓷面层采用电子束物理气相沉积方法制备,呈典型柱状晶结构。
上述的提高TiAl合金氧化抗力的涂层的制备方法,包括如下步骤:
一、采用真空电弧镀方法在TiAl合金基体表面制备20μm左右的AlSiY涂层,然后在1010~1080℃进行真空扩散热处理2~4小时,制得扩散态AlSiY底层厚度为40~60μm;
二、采用电子束物理气相沉积(EB-PVD)方法,在AlSiY底层上制备YSZ陶瓷面层,陶瓷面层成分为6~8%Y2O3部分稳定的ZrO2,采用离子清洗5~10分钟,利用电子束加热TiAl合金基体至800~850℃,所制备的陶瓷面层呈典型的柱状晶结构;
三、所制得的陶瓷面层在600~800℃进行空气稳定化退火4~20小时。
本发明的有益效果如下:
(1)、采用真空电弧镀AlSiY涂层、后进行真空扩散热处理所制备的底层与TiAl合金界面相容性好,抗氧化性能优异,表面可以快速形成连续致密的Al2O3氧化膜。
(2)、对扩散态AlSiY底层采用湿吹砂表面强化平整技术,可以提高防护涂层界面结合力,改善YSZ陶瓷面层结构。
(3)、采用电子束物理气相沉积(EB-PVD)制备的柱状晶结构YSZ陶瓷面层可以提高涂层的应变容限,提高防护涂层抗冷热循环能力。
(4)、陶瓷面层制备过程中离子清洗、基体加热等技术有助于去除界面污染物,提高防护涂层界面结合力。
(5)、陶瓷面层后处理有助于提高陶瓷面层的组织稳定性。
(6)、所述防护涂层界面结合良好,抗氧化性能优异,应变容限高。
附图说明
图1为TiAl合金和NiCrAlY涂层恒温氧化100小时后的截面形貌;
图2为TiAl合金、扩散态AlSiY涂层、扩散态AlSiY底层+EB-PVDYSZ陶瓷面层试样在1000℃恒温氧化100小时的氧化动力学曲线;
图3为TiAl合金、扩散态AlSiY涂层、扩散态AlSiY底层+EB-PVDYSZ陶瓷面层试样在1000℃恒温氧化100小时后的宏观形貌;
图4为TiAl合金试样1000℃恒温氧化100小时后的表面形貌;
图5为扩散态AlSiY涂层的表面形貌;
图6为扩散态AlSiY涂层1000℃恒温氧化100小时后的表面形貌;
图7为扩散态AlSiY底层+EB-PVDYSZ陶瓷面层试样1000℃恒温氧化100小时后的截面形貌;
图8为扩散态AlSiY底层+EB-PVDYSZ陶瓷面层试样1000℃恒温氧化100小时后的线扫描结果。
具体实施方式
采用真空电弧镀方法在TiAl合金试样基体表面制备20μm左右的AlSiY涂层,然后在1010~1080℃进行真空扩散热处理2~4小时,制得扩散态AlSiY底层厚度为40~60μm。
对AlSiY底层进行湿吹砂处理,并进行超声波清洗、丙酮溶液浸洗、烘干;湿吹砂工艺参数为:白刚玉砂粒度为180~280目,刚玉砂含量20%~35%,风压0.15MPa~0.25MPa,吹砂距离为180mm~350mm。
将上述试样安装到专用夹具上并用高温合金丝进行紧固。
将试样安装到装载室内,打开机械泵和罗茨泵,进行抽真空,待主真空室、装载室真空度分别低于5×10-2Pa,1Pa时开启两室之间的闸板阀,通入Ar气,对试样表面进行离子轰击清洗5~10min,目的是清除叶片表面污物,提高涂层与基体间的结合强度。
将离子清理后试样及夹具移到主真空室,进行YSZ陶瓷面层沉积。沉积YSZ面层工艺参数为:主真空室压强不大于5×10-2Pa,电子枪电压为17~20KV,靶材加热电流为1.5A,工件转速为15r/min,工件加热温度为800~850℃。
将沉积完YSZ陶瓷面层的试样放于马弗炉中进行600~800℃空气稳定化退火4~20小时。
从附图2可以看出,扩散态AlSiY涂层、扩散态AlSiY底层+EB-PVDYSZ陶瓷面层显著提高了TiAl合金的抗氧化性能。
从附图3可以看出,TiAl合金试样氧化后表面氧化膜大量剥落,扩散态AlSiY涂层、扩散态AlSiY底层+EB-PVDYSZ陶瓷面层试样表面均光滑完整,无剥落现象;这说明涂层界面结合力良好,具有良好的抗冷热循环能力。
从附图4可以看出,TiAl合金试样氧化后形成层状氧化膜,且表面氧化膜大量剥落。
从附图5、6可以看出,扩散态AlSiY涂层试样氧化后表面氧化膜光滑完整,无剥落现象;这说明涂层具有良好的抗氧化能力。
从附图7、8可以看出,扩散态AlSiY底层与YSZ陶瓷面层界面处形成了一层连续致密的Al2O3氧化膜。

Claims (1)

1.一种提高TiAl合金氧化抗力的涂层的制备方法,其特征在于,该涂层包括AlSiY底层和YSZ陶瓷面层;AlSiY底层采用真空电弧镀制备,并进行高温扩散和湿吹砂处理;柱状晶结构YSZ陶瓷面层采用电子束物理气相沉积方法制备,呈典型柱状晶结构;包括如下步骤:
一、采用真空电弧镀方法在TiAl合金基体表面制备20μm的AlSiY涂层,然后在1010~1080℃ 进行真空扩散热处理2~4小时,制得扩散态AlSiY底层厚度为40~60μm;
二、采用电子束物理气相沉积(EB-PVD)方法,在AlSiY底层上制备YSZ陶瓷面层,陶瓷面层成分为6~8%Y2O3部分稳定的ZrO2,采用离子清洗5~10分钟,利用电子束加热TiAl合金基体至800~850℃,所制备的陶瓷面层呈典型的柱状晶结构;
三、所制得的陶瓷面层在600~800℃进行空气稳定化退火4~20小时。
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