CN104451675B - 高抗热震性陶瓷封严涂层的制备方法 - Google Patents

高抗热震性陶瓷封严涂层的制备方法 Download PDF

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CN104451675B
CN104451675B CN201410650673.1A CN201410650673A CN104451675B CN 104451675 B CN104451675 B CN 104451675B CN 201410650673 A CN201410650673 A CN 201410650673A CN 104451675 B CN104451675 B CN 104451675B
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于月光
章德铭
刘建明
沈婕
侯伟骜
彭浩然
鲁秋源
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Beijing General Research Institute of Mining and Metallurgy
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Abstract

本发明公开了一种高抗热震性陶瓷封严涂层的制备方法。本发明对传统陶瓷封严涂层的结构进行改进，在陶瓷面层与MCrAlY粘结底层之间制备一层致密连续的陶瓷薄膜，使陶瓷薄膜与MCrAlY粘结底层无缺陷结合，并为陶瓷面层的沉积提供一个良好的基面，从而改善陶瓷层与金属层的界面结合状态，提高涂层的抗热震性能。该陶瓷薄膜的制备工艺可以是超低压等离子‑薄膜技术(LPPS‑TF)或CVD等致密薄膜制备技术，薄膜的厚度为10nm～200μm，成分可以各类氧化物陶瓷或与面层成分一样及相近，组织结构可以是均一的或是梯度的。

Description

高抗热震性陶瓷封严涂层的制备方法
技术领域
本发明涉及一种用于航空发动机气路封严的高抗热震性可磨耗陶瓷封严涂层的制备方法，属于航空航天技术领域。
背景技术
可磨耗封严涂层可减小发动机转子和静子之间的间隙，降低油耗、提高发动机效率和运行安全性。陶瓷基可磨耗封严涂层具有耐高温、耐腐蚀和隔热的优点，在航空发动机和地面燃气轮机的中高压涡轮外环部位均有应用，应用温度高达1200℃，是目前应用温度最高的一类可磨耗封严涂层。但是由于陶瓷材料与高温合金等金属基体在热膨胀系数上的差异，陶瓷封严涂层在应用中存在抗热震性差、容易脱落掉块等问题。
陶瓷封严涂层一般由可磨耗的陶瓷面层和MCrAlY粘结底层组成，MCrAlY粘结底层可以起到防护基体和调合陶瓷层与高温合金基体热膨胀系数的作用。陶瓷面层直接喷涂在MCrAlY粘结底层上，由于陶瓷面层沉积时的“固-液”混合特征，使得结合界面处存在大量的缺陷，成为涂层的薄弱地带，涂层的脱落往往发生在界面处。
发明内容
本发明的目的是提供一种提高陶瓷面层与MCrAlY粘结底层结合状态的方法，从而提高涂层的抗热震性。本发明的目的通过以下技术方案实现。
高抗热震性陶瓷封严涂层的制备方法，包括以下步骤：
(1)对待喷涂工件表面做常规预处理，包括除油、除锈、喷砂等操作；
(2)在预处理后的工件表面喷涂MCrAlY粘结底层；
(3)在MCrAlY粘结底层之上制备一层高致密连续的陶瓷薄膜层；
(4)在陶瓷薄膜层之上制备陶瓷面层。
该陶瓷薄膜层一方面与MCrAlY粘结底层形成连续无缺陷的界面结合，提高涂层界面处抗热应力的能力，另一方面为陶瓷面层的沉积提供了一个良好的陶瓷基面，避免其直接与性质差别很大的金属层直接接触，从而极大的改善了陶瓷面层与金属底层的结合状态，显著提高涂层的抗热震性。
陶瓷薄膜的制备工艺可以是低压等离子薄膜工艺(LPPS-TF)、CVD化学气相沉积工艺、PVD物理气相沉积和磁控溅射工艺等各类可进行致密陶瓷薄膜制备的工艺技术，其中LPPS-TF技术在制备本发明所述高致密连续陶瓷薄膜方面更有优势。陶瓷薄膜的厚度可以是10nm～200μm，更优的厚度是1～100μm，最优的薄膜厚度是2～20μm。陶瓷薄膜的成分一般与面层材料一致，或在热膨胀系数与MCrAlY底层有更佳匹配性的氧化物陶瓷。在完成MCrAlY底层涂覆后或在完成可磨耗陶瓷面层涂覆后可对涂层进行热处理，热处理的目的主要是消除MCrAlY底层中的热应力，并在可控条件下使MCrAlY粘结层表面生成一层热生长氧化膜(TGO)，以提高涂层的抗热震性。热处理的温度可以是400～1200℃，更好是800～1100℃，最好是900～1050℃，热处理的时间可以是30min～6h，更好是1h～4h，最好是2h～4h。
本发明所提供的方法，能够极大改善陶瓷面层与金属底层的结合状态，显著提高涂层的抗热震性，同时具有方法简便、工艺成熟的优点。
具体实施方式
实施例1
高抗热震性陶瓷封严涂层的制备方法，包括以下步骤：
步骤一：对高温合金基体进行清洗，吹砂粗化；
步骤二：在高温合金表面采取低压等离子(LPPS)制备MCrAlY粘结底层，涂层厚度100～200μm；
步骤三：在MCrAlY粘结底层表面，采用LPPS-TF技术制备氧化钇部分稳定氧化锆(YSZ)陶瓷薄膜层，薄膜厚度5～10μm；
步骤四：在YSZ薄膜层表面采用大气等离子(APS)工艺制备YSZ可磨耗陶瓷面层，涂层厚度1.5～2mm；
步骤五：在真空炉中对涂层进行真空热处理，热处理温度1100℃，热处理时间4h。
实施例2
高抗热震性陶瓷封严涂层的制备方法，包括以下步骤：
步骤一：对高温合金基体进行清洗，吹砂粗化；
步骤二：在高温合金表面采取低压等离子(LPPS)制备MCrAlY粘结底层，涂层厚度100～200μm；
步骤三：在MCrAlY粘结底层表面，采用CVD化学气相沉积技术制备氧化钇部分稳定氧化锆(YSZ)陶瓷薄膜层，薄膜厚度20～50μm；
步骤四：在YSZ薄膜层表面采用大气等离子(APS)工艺制备YSZ可磨耗陶瓷面层，涂层厚度1.5～2mm；
步骤五：在真空炉中对涂层进行真空热处理，热处理温度1200℃，热处理时间2h。
实施例3
高抗热震性陶瓷封严涂层的制备方法，包括以下步骤：
步骤一：对高温合金基体进行清洗，吹砂粗化；
步骤二：在高温合金表面采取低压等离子(LPPS)制备MCrAlY粘结底层，涂层厚度100～200μm；
步骤三：在MCrAlY粘结底层表面，采用PVD物理气相沉积制备氧化钇部分稳定氧化锆(YSZ)陶瓷薄膜层，薄膜厚度50～100μm；
步骤四：在YSZ薄膜层表面采用大气等离子(APS)工艺制备YSZ可磨耗陶瓷面层，涂层厚度1.5～2mm；
步骤五：在真空炉中对涂层进行真空热处理，热处理温度800℃，热处理时间6h。
实施例4
高抗热震性陶瓷封严涂层的制备方法，包括以下步骤：
步骤一：对高温合金基体进行清洗，吹砂粗化；
步骤二：在高温合金表面采取低压等离子(LPPS)制备MCrAlY粘结底层，涂层厚度100～200μm；在真空炉中对MCrAlY粘结底层进行真空热处理，热处理温度1100℃，热处理时间4h；
步骤三：在MCrAlY粘结底层表面，采用磁控溅射技术制备氧化钇部分稳定氧化锆(YSZ)陶瓷薄膜层，薄膜厚度10nm～1μm；
步骤四：在YSZ薄膜层表面采用大气等离子(APS)工艺制备YSZ可磨耗陶瓷面层，涂层厚度1.5～2mm；
步骤五：在真空炉中对涂层进行真空热处理，热处理温度900℃，热处理时间4h。

Claims (6)

1.高抗热震性陶瓷封严涂层的制备方法，其特征在于，包括以下步骤：
(1)对待喷涂工件表面做常规预处理；
(2)在预处理后的工件表面喷涂MCrAlY粘结底层；
(3)在MCrAlY粘结底层之上制备一层高致密连续的陶瓷薄膜层，所述制备陶瓷薄膜层的工艺为化学气相沉积和物理气相沉积中的一种，所述陶瓷薄膜层厚度为10nm～200μm；
(4)在陶瓷薄膜层之上制备陶瓷面层，涂层厚度1.5～2mm；
步骤(3)所述陶瓷薄膜层成分与陶瓷面层成分一致。
2.根据权利要求1所述的制备方法，其特征在于，步骤(3)所述的物理气相沉积为低压等离子薄膜工艺或磁控溅射工艺。
3.根据权利要求1所述的制备方法，其特征在于，步骤(3)所述陶瓷薄膜层厚度为1～100μm。
4.根据权利要求1所述的制备方法，其特征在于，步骤(3)所述陶瓷薄膜层厚度为2～20μm。
5.根据权利要求1所述的制备方法，其特征在于，还包括步骤(5)热处理，在步骤(2)、步骤(4)中的至少一个步骤后对制备的MCrAlY粘接底层或陶瓷面层进行热处理。
6.根据权利要求5所述的制备方法，其特征在于，所述的热处理温度为400～1200℃，热处理时间为30min～6h。
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