CN105445273A - Rapid acquisition apparatus for chip image - Google Patents
Rapid acquisition apparatus for chip image Download PDFInfo
- Publication number
- CN105445273A CN105445273A CN201510918576.0A CN201510918576A CN105445273A CN 105445273 A CN105445273 A CN 105445273A CN 201510918576 A CN201510918576 A CN 201510918576A CN 105445273 A CN105445273 A CN 105445273A
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- China
- Prior art keywords
- chip
- guide rail
- installation position
- sensor
- camera
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
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- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
The invention provides a rapid acquisition apparatus for a chip image. The rapid acquisition apparatus comprises a guide rail, which is applicable to providing a moving path; a chip framework, which comprises two parallel columns of installation stations used for holding chips and a plurality of through holes located between the two columns of installation stations and is applicable to moving a chip placed on one of the installation stations along the moving path provided by the guide rail so as to convey the chip placed on one of the installation stations to a preset position, wherein the number of the through holes is identical to the number of each column of installation stations; and an image acquisition device, which comprises a sensor and a camera, wherein the sensor is arranged below the guide rail, the camera is arranged above the guide rail and faces the sensor, and when the chip framework moves along the guide rail, the sensor triggers the camera to shoot the chip placed on one of the installation stations through the through holes in the chip framework and outputs an obtained chip image. Compared with manual manners in the prior art, the rapid acquisition apparatus for the chip image provided by the invention has the advantage of high efficiency.
Description
Technical field
The present invention relates to and utilize image to carry out the technical field of chip detection, particularly relate to a kind of chip image quick obtaining device.
Background technology
One of restriction China's development of computer and universal gordian technique are chips, and the development bottleneck of chip is manufacturing equipment and production technology.Can Godson popularize one of key factor on China's computing machine is exactly the production technology that China's manufacture of microchips must grasp chip.The technology that production technology relates to is a lot, and it is one of important content that the outward appearance wherein in chip manufacturing proces detects.The outward appearance detection system of current chip manufacture process is standard and the technology of American I NTEL and AMD substantially.China does not also have this type of chip outward appearance detection system a set of at present.Therefore China's self-developing chip outward appearance detection system is an extremely important project and engineering to China's chip manufacturing.
In existing production run, or the main quality of mode to chip of manual detection that adopt detects, and how providing a kind of effective image to detect servicing unit to carry out image detection, needing the problem solved with regard to having become those skilled in the art.
Summary of the invention
The shortcoming of prior art in view of the above, the object of the present invention is to provide a kind of chip image quick obtaining device, is suitable for solving the problem needing in prior art manually to come to detect chip.
For achieving the above object and other relevant objects, the invention provides following technical scheme:
A kind of chip image quick obtaining device, comprising:
Guide rail, is suitable for providing mobile route;
Chi frame, comprise the installation position of the confession chip placement that two row are parallel to each other and the multiple through holes between two row installation positions, the chip be placed on installation position is suitable for move that the chip be placed on installation position is transported to predeterminated position along the mobile route that guide rail provides, wherein, the quantity of described through hole is identical with the quantity often arranging installation position;
Image acquiring device, comprise sensor and camera, described sensor setting is in the below of described guide rail, and described camera and described sensor are arranged at above track just over the ground, be suitable for the sensor when chi frame moves along described guide rail to trigger described camera by the through hole on described chi frame and take pictures to the chip be placed on installation position, and obtained chip image is exported.
Preferably, described chi frame comprises two row and to be in a parallel set installation position, often arrange on installation position and there is the equal installation position of 5-7 spacing.
Preferably, described sensor is photoelectric sensor.
As mentioned above, the present invention has following beneficial effect: pass through such scheme, chip is allowed to be placed on the installation position of chi frame, the sensor made way for successively below it along with the movement of chi frame on guide rail carrys out trigger bit camera square thereon by through hole, and realize taking pictures to chip, this mode makes camera fix and allow chip move the mode of carrying out taking pictures, efficiency is high, and be robotization entirely, the manual type compared to existing technology, ultrahigh in efficiency.
Accompanying drawing explanation
Fig. 1 is shown as the schematic diagram that the invention provides a kind of chip image quick obtaining device.
Drawing reference numeral explanation
1 guide rail
2 chi frames
21 installation positions
22 through holes
3 sensors
4 cameras
Embodiment
By particular specific embodiment, embodiments of the present invention are described below, person skilled in the art scholar the content disclosed by this instructions can understand other advantages of the present invention and effect easily.
Notice, structure, ratio, size etc. that this instructions institute accompanying drawings illustrates, content all only in order to coordinate instructions to disclose, understand for person skilled in the art scholar and read, and be not used to limit the enforceable qualifications of the present invention, therefore the not technical essential meaning of tool, the adjustment of the modification of any structure, the change of proportionate relationship or size, do not affecting under effect that the present invention can produce and the object that can reach, still all should drop on disclosed technology contents and obtain in the scope that can contain.Simultaneously, quote in this instructions as " on ", D score, "left", "right", " centre " and " one " etc. term, also only for ease of understanding of describing, and be not used to limit the enforceable scope of the present invention, the change of its relativeness or adjustment, under changing technology contents without essence, when being also considered as the enforceable category of the present invention.
Refer to Fig. 1, provide a kind of schematic diagram of chip image quick obtaining device, as shown in the figure, this chip image quick obtaining device comprises: guide rail 1, chi frame 2 and image acquiring device, and guide rail 1 is suitable for providing mobile route; Chi frame 2 comprises the installation position 21 of the confession chip placement that two row are parallel to each other and the multiple through holes 22 between two row installation positions 21, the chip be placed on installation position 21 is suitable for move that the chip be placed on installation position 21 is transported to predeterminated position along the mobile route that guide rail 1 provides, wherein, the quantity of through hole 22 is identical with the quantity often arranging installation position 21; Image acquiring device comprises sensor 3 and camera 4, sensor 3 is arranged at the below of guide rail 1, and camera 4 and sensor 3 are arranged at above track just over the ground, be suitable for the sensor 3 when chi frame 2 moves along guide rail 1 to trigger camera 4 by the through hole 22 on chi frame 2 and take pictures to the chip be placed on installation position 21, and obtained chip image is exported.
Pass through such scheme, chip is allowed to be placed on the installation position 21 of chi frame 2, the sensor 3 made way for successively below it along with the movement of chi frame 2 on guide rail 1 carrys out trigger bit camera 4 square thereon by through hole 22, realize taking pictures to chip, this mode makes camera 4 fixing and allows chip move the mode of carrying out taking pictures, and efficiency is high, and is robotization entirely, manual type compared to existing technology, ultrahigh in efficiency.
In concrete enforcement, chi frame 2 comprises two row and to be in a parallel set installation position 21, often arrange on installation position 21 and there is the equal installation position 21 of 5-7 spacing.This is a kind of preferred mode, ensure that columns and moderate length, between two chi frames 2, can give upper disposal system one buffering.
In concrete enforcement, sensor 3 can be a photoelectric sensor.And light source is arranged on below chi frame 2, receiver is arranged on camera 4.
Above-described embodiment is illustrative principle of the present invention and effect thereof only, but not is suitable for limiting the present invention.Any person skilled in the art scholar all without prejudice under spirit of the present invention and category, can modify above-described embodiment or changes.Therefore, such as have in art usually know the knowledgeable do not depart from complete under disclosed spirit and technological thought all equivalence modify or change, must be contained by claim of the present invention.
Claims (3)
1. a chip image quick obtaining device, is characterized in that, comprising:
Guide rail, is suitable for providing mobile route;
Chi frame, comprise the installation position of the confession chip placement that two row are parallel to each other and the multiple through holes between two row installation positions, the chip be placed on installation position is suitable for move that the chip be placed on installation position is transported to predeterminated position along the mobile route that guide rail provides, wherein, the quantity of described through hole is identical with the quantity often arranging installation position;
Image acquiring device, comprise sensor and camera, described sensor setting is in the below of described guide rail, and described camera and described sensor are arranged at above track just over the ground, be suitable for the sensor when chi frame moves along described guide rail to trigger described camera by the through hole on described chi frame and take pictures to the chip be placed on installation position, and obtained chip image is exported.
2. chip image quick obtaining device according to claim 1, is characterized in that: described chi frame comprises two row and to be in a parallel set installation position, often arranges on installation position and has the equal installation position of 5-7 spacing.
3. chip image quick obtaining device according to claim 1, is characterized in that: described sensor is photoelectric sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510918576.0A CN105445273A (en) | 2015-12-14 | 2015-12-14 | Rapid acquisition apparatus for chip image |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510918576.0A CN105445273A (en) | 2015-12-14 | 2015-12-14 | Rapid acquisition apparatus for chip image |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105445273A true CN105445273A (en) | 2016-03-30 |
Family
ID=55555723
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510918576.0A Pending CN105445273A (en) | 2015-12-14 | 2015-12-14 | Rapid acquisition apparatus for chip image |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105445273A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101882591A (en) * | 2009-05-05 | 2010-11-10 | 旺宏电子股份有限公司 | Detection method of wafer |
| CN201724908U (en) * | 2010-05-14 | 2011-01-26 | 久元电子股份有限公司 | Chip appearance inspection device |
| CN102023168A (en) * | 2010-11-08 | 2011-04-20 | 北京大学深圳研究生院 | Method and system for detecting chips on semiconductor wafer surface |
| CN103021899A (en) * | 2012-12-21 | 2013-04-03 | 日月光半导体（昆山）有限公司 | Semiconductor product detection machine and detection method thereof |
| CN103364413A (en) * | 2012-04-10 | 2013-10-23 | 北京兆维电子(集团)有限责任公司 | Identifier detection and product grading control system and method |
| CN104502360A (en) * | 2014-12-25 | 2015-04-08 | 中国科学院半导体研究所 | Chip appearance defect detection system |
| CN104949998A (en) * | 2015-07-01 | 2015-09-30 | 华中农业大学 | Online visual inspection device and method for surface dirt of group origin eggs |
| CN205879802U (en) * | 2015-12-14 | 2017-01-11 | 重庆远创光电科技有限公司 | Quick acquisition device of chip image |
-
2015
- 2015-12-14 CN CN201510918576.0A patent/CN105445273A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101882591A (en) * | 2009-05-05 | 2010-11-10 | 旺宏电子股份有限公司 | Detection method of wafer |
| CN201724908U (en) * | 2010-05-14 | 2011-01-26 | 久元电子股份有限公司 | Chip appearance inspection device |
| CN102023168A (en) * | 2010-11-08 | 2011-04-20 | 北京大学深圳研究生院 | Method and system for detecting chips on semiconductor wafer surface |
| CN103364413A (en) * | 2012-04-10 | 2013-10-23 | 北京兆维电子(集团)有限责任公司 | Identifier detection and product grading control system and method |
| CN103021899A (en) * | 2012-12-21 | 2013-04-03 | 日月光半导体（昆山）有限公司 | Semiconductor product detection machine and detection method thereof |
| CN104502360A (en) * | 2014-12-25 | 2015-04-08 | 中国科学院半导体研究所 | Chip appearance defect detection system |
| CN104949998A (en) * | 2015-07-01 | 2015-09-30 | 华中农业大学 | Online visual inspection device and method for surface dirt of group origin eggs |
| CN205879802U (en) * | 2015-12-14 | 2017-01-11 | 重庆远创光电科技有限公司 | Quick acquisition device of chip image |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160330 |