CN105437083A - Sprayer device - Google Patents
Sprayer device Download PDFInfo
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- CN105437083A CN105437083A CN201410512483.3A CN201410512483A CN105437083A CN 105437083 A CN105437083 A CN 105437083A CN 201410512483 A CN201410512483 A CN 201410512483A CN 105437083 A CN105437083 A CN 105437083A
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- liquid
- head body
- nozzle
- ejecting device
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- 239000007788 liquid Substances 0.000 claims abstract description 121
- 230000000903 blocking effect Effects 0.000 claims description 19
- 230000004323 axial length Effects 0.000 claims description 6
- 230000003139 buffering effect Effects 0.000 abstract 9
- 238000005498 polishing Methods 0.000 description 17
- 239000012530 fluid Substances 0.000 description 11
- 239000004065 semiconductor Substances 0.000 description 7
- 238000007517 polishing process Methods 0.000 description 6
- 230000006835 compression Effects 0.000 description 5
- 238000007906 compression Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 239000003989 dielectric material Substances 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- Coating Apparatus (AREA)
Abstract
The invention discloses a sprayer device which comprises a buffering part, a sprayer body, an adjusting device, electrodes and bubble separating parts. The buffering part is provided with a buffering cavity, a liquid inlet end and a liquid outlet end. The sprayer body is provided with a nozzle, a plurality of liquid outlets and a top cover connected with the nozzle. The adjusting device comprises shielding parts and an actuating part, wherein the shielding parts shield the upper portions of the liquid outlets and are located blow the top cover, and the actuating part is located in the buffering cavity and linked with the shielding parts. An adjustable gap is formed between each shielding part and the corresponding liquid outlet, part of liquid output from the buffering part is output through the nozzle, and the other part of the liquid overflows from the gaps. The actuating part is moved according to the volume of liquid which is input to the buffering part, the actuating part and the shielding parts are linked to adjust the sizes of the gaps so as to change the volume of the liquid overflowing from the gaps, and the volume of the liquid output through the nozzle is kept stable. The electrodes are arranged on the inner wall of the buffering cavity and close to the liquid outlet end of the buffering part. The bubble separating parts are connected with the sprayer body and located in the buffering cavity, and the bubble separating parts prevent bubbles generated in the positions of the electrodes from entering the nozzle of the sprayer body.
Description
Technical field
The present invention relates to semiconductor equipment part field, particularly relate to a kind of ejecting device that can export the liquid with stable pattern, this ejecting device is applicable to electrochemical polish.
Background technology
In current polished semiconductor technique, chemically mechanical polishing (CMP) is mainly adopted to remove copper film unnecessary on wafer.Chemical mechanical polishing apparatus comprises turntable, the polishing pad be arranged on turntable, the rubbing head clamping wafer and polishing fluid supply line.During polishing, one downforce acts on rubbing head, thus make polished of wafer to contact with polishing pad, rubbing head drives wafer to rotate, the polishing fluid that polishing fluid supply line provides is had between polished of wafer and polishing pad, by making wafer rotate relative to polishing pad, thus copper film unnecessary on wafer is removed.But, in order to reduce the characteristic size of semiconductor devices further, low-k dielectric materials or air-gap application are in the semiconductor device, low-k dielectric materials or air-gap have more weak mechanical property, the downforce acting on rubbing head in CMP process will cause the damage of low-k dielectric materials, and then reduces the yield of semiconductor devices.
In order to solve the technology drawback that chemically mechanical polishing exists, electrochemical polish technology comes into one's own gradually, electrochemical polish contacts with crystal column surface owing to only having polishing fluid, therefore, it is possible to copper film unnecessary on the removal wafer of mechanical stress, and can not the low k dielectric layers on wafer be caused damage, thus improve the fine ratio of product of semiconductor devices, capture and manufactured the technical bottleneck with the semiconductor devices of small features.In electrochemical polishing process, polishing fluid is injected into crystal column surface by ejecting device.The pattern of the uncontrollable polishing fluid ejected from ejecting device of current ejecting device, when there is fluctuation in the amount of the polishing fluid being supplied to ejecting device, the pattern of the polishing fluid ejected from ejecting device also can fluctuate, thus accurately cannot control the removal speed of copper film and remove uniformity.
Summary of the invention
The object of the invention is to provide a kind of follow-on ejecting device for above-mentioned technical problem, this ejecting device can export the liquid with stable pattern and be applicable to electrochemical polishing process.
For achieving the above object, the present invention proposes a kind of ejecting device, comprises buffer part, head body, adjusting device, electrode and bubble isolated part.Buffer part is provided with cushion chamber, liquid feeding end and outlet end.Head body is fixed on the outlet end of buffer part, the top cover that head body is provided with nozzle, several liquid outlet and is connected with nozzle, and the nozzle of head body is connected with the outlet end of buffer part respectively with several liquid outlet.Adjusting device comprises to block above several liquid outlet and the blocking parts be positioned at below top cover and the actuated components being positioned at cushion chamber, and actuated components and blocking parts link.The gap that can regulate is formed between blocking parts and liquid outlet, a part through the liquid of buffer part output is exported by nozzle, another part is overflowed by gap, actuated components moves according to the size of amount of the liquid inputing to buffer part, the interlock of actuated components and blocking parts regulates the size in gap to change the amount of the liquid overflowed by gap, makes the amount of the liquid exported by nozzle remain stable.Electrode is arranged on the inwall of cushion chamber and the outlet end of close buffer part.Bubble isolated part is connected with head body and is positioned at cushion chamber, and the bubble that bubble isolated part stops electrode place to produce enters the nozzle of head body.
In one embodiment, blocking parts comprises covering, several to locating part, pad and elastic component.Covering is arranged on the top of several liquid outlets of head body and shelters from this several liquid outlet, and covering is provided with several to spacing hole.Severally several be fixed in head body to spacing hole to locating part through what hide, hide and to rise along locating part or decline.Pad is arranged between covering and head body, makes to hide to form gap between head body.Elastic component is arranged between covering and the upper end of locating part.
In one embodiment, actuated components comprises baffle plate and link.The liquid feeding end of buffer part is faced in the cushion chamber that baffle plate is arranged on buffer part.One end of link is connected with baffle plate, and the other end of link is connected with covering.
In one embodiment, the liquid feeding end of buffer part is eliminated parts by a pipe resistance and is connected to a pulse liquid feed device.
In one embodiment, it is hollow pipelines that parts are eliminated in pipe resistance, and one end of hollow pipeline is connected to pulse liquid feed device, and the other end of hollow pipeline is connected to the liquid feeding end of buffer part.
In one embodiment, pulse liquid feed device is pneumatic diaphragm pump.
In one embodiment, several liquid outlet is symmetrically distributed in the circumference of nozzle.
In one embodiment, blocking parts comprises several independently parts, the top of each liquid outlet of head body arrange one independently parts to shelter from this liquid outlet.
In one embodiment, bubble isolated part is cylindrical shape, and bubble isolated part is between nozzle and liquid outlet, and bubble isolated part is provided with some passages, and the peak of the internal orifice of each passage is lower than the minimum point of this passage collar extension.
In one embodiment, electrode is cylindrical shape, and the axial length of electrode is shorter than the axial length of bubble isolated part.
According to the present invention, the liquid part in cushion chamber is sprayed by the nozzle of head body, and another part passes through the liquid outlet of head body and overflows from the gap hidden between head body.When the fluid flow at the liquid feeding end place of buffer part increases, the extruding force that baffle plate is subject to liquid moves upward, thus impel covering to rise along locating part, hide the elastic component arranged between the upper end of locating part and be extruded compression, the gap hidden between head body becomes greatly, and the amount of the liquid overflowed from the gap hidden between head body increases; When the fluid flow at the liquid feeding end place of buffer part reduces, the extruding force that baffle plate is subject to liquid reduces, elastic component release compression stress also makes to hide decline, thus makes the gap smaller between covering and head body, and the amount of the liquid overflowed from the gap hidden between head body reduces.Ejecting device, by Automatic adjusument, is guaranteed the stability of flow of the liquid from nozzle ejection, thus can be exported the liquid with stable pattern.Be arranged on top cover that is above blocking parts and that be connected with nozzle the liquid sprayed from nozzle and the liquid sprayed from liquid outlet are separated, prevent from causing leaking electricity from the nozzle liquid sprayed and the liquid comes into contact sprayed from liquid outlet in electrochemical polishing process.
Accompanying drawing explanation
Fig. 1 discloses the cross-sectional view of an embodiment of ejecting device of the present invention.
Fig. 2 discloses the cross-sectional view of the head body of ejecting device of the present invention.
Fig. 3 discloses the top view of head body of the present invention.
Fig. 4 discloses the top view after head body of the present invention removal top cover.
Fig. 5 discloses the top view of the covering of ejecting device of the present invention.
Fig. 6 discloses the sectional view of covering of the present invention.
Fig. 7 disclose the baffle plate of ejecting device of the present invention and link combine after top view.
Fig. 8 discloses the top view of the electrode of ejecting device of the present invention.
Fig. 9 discloses the sectional view of electrode of the present invention.
Figure 10 discloses the top view of the bubble isolated part of ejecting device of the present invention.
Figure 11 discloses the sectional view of bubble isolated part of the present invention.
Figure 12 discloses the schematic diagram of the application of ejecting device of the present invention.
Detailed description of the invention
By describing technology contents of the present invention, structural feature in detail, reached object and effect, coordinate graphic being described in detail below in conjunction with embodiment.
Considering that the most frequently used in liquid supplying apparatus is pneumatic diaphragm pump, is a kind of pulse liquid feed device, and therefore its liquid exported is pulsed.As elucidated before, pulsed feed flow causes fluid flow to there is larger fluctuation, makes the flow quantity that of nozzle also have larger fluctuation, causes the pattern of liquid unstable.Thus, the ejecting device that the present invention proposes comprises buffer part, head body, adjusting device, electrode and bubble isolated part.Buffer part is provided with cushion chamber, liquid feeding end and outlet end.Head body is fixed on the outlet end of buffer part, the top cover that head body is provided with nozzle, several liquid outlet and is connected with nozzle, and the nozzle of head body is connected with the outlet end of buffer part respectively with several liquid outlet.Adjusting device comprises to block above several liquid outlet and the blocking parts be positioned at below top cover and the actuated components being positioned at cushion chamber, and actuated components and blocking parts link.The gap that can regulate is formed between blocking parts and liquid outlet, a part through the liquid of buffer part output is exported by nozzle, another part is overflowed by gap, actuated components moves according to the size of amount of the liquid inputing to buffer part, the interlock of actuated components and blocking parts regulates the size in gap to change the amount of the liquid overflowed by gap, makes the amount of the liquid exported by nozzle remain stable.Electrode is arranged on the inwall of cushion chamber and the outlet end of close buffer part.Bubble isolated part is connected with head body and is positioned at cushion chamber, and the bubble that bubble isolated part stops electrode place to produce enters the nozzle of head body.
Shown in figure 1, disclose the cross-sectional view of an embodiment of ejecting device of the present invention.As shown in Figure 1, this ejecting device comprises buffer part 21, head body 22, covering 23, baffle plate 24, link 25, electrode 31 and bubble isolated part 32.
Buffer part 21 is provided with cushion chamber 211, liquid feeding end and outlet end.Head body 22 is fixed on the outlet end of buffer part 21.Shown in composition graphs 2 to Fig. 4, the center of head body 22 is provided with nozzle 221, and according to different demands, the shape of nozzle 221 can be square, circular etc., and in the present embodiment, the shape of the nozzle 221 of example is square.Head body 22 is also provided with several liquid outlet 222, and this several liquid outlet 222 is symmetrically distributed in the circumference of nozzle 221, and the shape of this several liquid outlet 222 is fan-shaped.Obviously, the shape of liquid outlet 222 is not limited to exemplified fan-shaped.The nozzle 221 of head body 22 is connected with the outlet end of buffer part 21 respectively with liquid outlet 222.Head body 22 is also provided with the top cover 223 be connected with nozzle 221.
Hide 23 be arranged on the top of several liquid outlets 222 of head body 22 and shelter from this several liquid outlet 222, hide the below that 23 are positioned at top cover 223.Shown in composition graphs 5 and Fig. 6, Fig. 5 and Fig. 6 discloses top view and the sectional view of the covering of ejecting device of the present invention respectively.In one embodiment, the center hiding 23 is provided with through hole 231.Covering 23 is also provided with several to spacing hole 232.Hiding 23 is set in head body 22, and the nozzle 221 of head body 22 passes from the through hole 231 of covering 23.Several locating part 26 to be fixed in head body 22 spacing hole 232 through covering 23 several, thus covering 23 to be limited to the top of several liquid outlets 222 of head body 22 and to shelter from this several liquid outlet 222.Hide between 23 and head body 22 and be provided with pad 27, thus form gap between covering 23 and head body 22.Hide between 23 and the upper end of each locating part 26 and be provided with elastic component 28, hiding 23 can rise along each locating part 26 or decline, and when covering 23 is risen along locating part 26, elastic component 28 is extruded compression, and the gap hidden between 23 and head body 22 becomes large; When covering 23 declines along locating part 26 under the elastic acting force of elastic component 28, hide the gap smaller between 23 and head body 22.Covering 23, locating part 26, pad 27 and elastic component 28 form blocking parts.
In another embodiment, hide 23 and comprise several independently little covering (namely blocking parts comprises several independently parts), the top of each liquid outlet 222 of head body 22 arranges a little covering, to shelter from this liquid outlet 222.Each little covering is provided with a pair spacing hole, and a pair locating part is fixed in head body 22 spacing hole through this.Be provided with pad between each little covering and head body 22, thus form gap between this little covering and head body 22.Each little covering is provided with elastic component with between the upper end of corresponding locating part.
Face the liquid feeding end of buffer part 21 in the cushion chamber 211 that baffle plate 24 is arranged on buffer part 21, shown in composition graphs 7, Fig. 7 disclose the baffle plate of ejecting device of the present invention and link combine after top view.Baffle plate 24 is connected with one end of link 25, and the other end of link 25 is connected with covering 23.Baffle plate 24 and link 25 form actuated components.
Electrode 31 is arranged on the inwall of cushion chamber 211 and the outlet end of close buffer part 21.Shown in composition graphs 8 and Fig. 9, Fig. 8 and Fig. 9 discloses top view and the sectional view of electrode respectively.Electrode 31 is cylindrical shape.In electrochemical polishing process, electrode 31 is connected with the cathodic electricity of power supply.
Bubble isolated part 32 is connected with head body 22 and is positioned at cushion chamber 211, the bubble that bubble isolated part 32 stops electrode 31 place to produce enters the nozzle 221 of head body 22, in electrochemical polishing process, bubble can be prevented to be ejected to crystal column surface with liquid from nozzle 221 and to cause polishing uniformity to reduce.Shown in Figure 10 and Figure 11, Figure 10 and Figure 11 discloses top view and the sectional view of bubble isolated part respectively.Bubble isolated part 32 is cylindrical shape, and the axial length of bubble isolated part 32 is longer than the axial length of electrode 31.Bubble isolated part 32 is between nozzle 221 and liquid outlet 222, and bubble isolated part 32 is provided with some passages 321, and the peak of the internal orifice of each passage 321 is lower than the minimum point of this passage collar extension.Nationality designs thus, and the bubble that electrode 31 place can be stoped to produce enters the nozzle 221 of head body 22, and bubble can only be overflowed from the gap between covering 23 and liquid outlet 222 along with liquid.
With reference to shown in Figure 12, disclose the schematic diagram of the application of ejecting device of the present invention.Aforesaid adjusting device can make the stability of flow of the liquid exported from nozzle, thus can obtain and have stable liquid pattern.The present invention also employs pipe resistance and eliminates parts, such as hollow pipeline in pipeline.As shown in figure 12, in one embodiment, the liquid feeding end of the buffer part 21 of this ejecting device is connected with one end of hollow pipeline 41, and the other end of this hollow pipeline 41 is connected with pneumatic diaphragm pump 51.Liquid exports hollow pipeline 41 to from pneumatic diaphragm pump 51, is supplied in the cushion chamber 211 of buffer part 21 via hollow pipeline 41.A liquid part in cushion chamber 211 is sprayed by the nozzle 221 of head body 22, and another part passes through the liquid outlet 222 of head body 22 and overflows from the gap between covering 23 and head body 22.When pulse crest arrives, the extruding force that baffle plate 24 is subject to liquid moves upward, thus impel covering 23 to rise, hide the elastic component 28 arranged between 23 and the upper end of locating part 26 and be extruded compression, the gap hidden between 23 and head body 22 becomes greatly, and the amount of the liquid overflowed from the gap between covering 23 and head body 22 increases; When pulse trough arrives, the extruding force that baffle plate 24 is subject to liquid reduces, elastic component 28 discharges compression stress and covering 23 is declined, thus makes the gap smaller between covering 23 and head body 22, and the amount of the liquid overflowed from the gap between covering 23 and head body 22 reduces.Be arranged on top cover 223 that is above covering 23 and that be connected with nozzle 221 liquid sprayed from nozzle 221 and the liquid sprayed from liquid outlet 222 are separated, prevent from causing leaking electricity from nozzle 221 liquid sprayed and the liquid comes into contact sprayed from liquid outlet 222 in electrochemical polishing process.Ejecting device, by Automatic adjusument, ensures the stability of flow of the liquid sprayed from nozzle 221, reduces the impact of pneumatic diaphragm pump 51 on the liquid pattern that nozzle 221 sprays, thus can export the liquid with stable pattern.In addition, this ejecting device is connected with hollow pipeline 41, can offset by the level of direction pipe resistance, thus eliminate irregular " Δ " shape (sealene triangle) liquid export pattern.
In sum, ejecting device of the present invention is illustrated by above-mentioned embodiment and correlative type, and what oneself was concrete, full and accurate discloses correlation technique, and those skilled in the art can be implemented according to this.And the above embodiment be only used to illustrate the present invention, instead of be used for restriction of the present invention, interest field of the present invention, should be defined by claim of the present invention.Still all interest field of the present invention should be belonged to as the change of described component number herein or the replacement etc. of equivalence element.
Claims (10)
1. an ejecting device, is characterized in that, comprising:
Buffer part, described buffer part is provided with cushion chamber, liquid feeding end and outlet end;
Head body, described head body is fixed on the outlet end of buffer part, the top cover that head body is provided with nozzle, several liquid outlet and is connected with nozzle, and the nozzle of head body is connected with the outlet end of buffer part respectively with several liquid outlet;
Adjusting device, described adjusting device comprises to block above several liquid outlet and the blocking parts be positioned at below top cover and be positioned at the actuated components of cushion chamber, and described actuated components and blocking parts link;
Electrode, described electrode is arranged on the inwall of cushion chamber and the outlet end of close buffer part;
Bubble isolated part, described bubble isolated part is connected with head body and is positioned at cushion chamber, and the bubble that bubble isolated part stops electrode place to produce enters the nozzle of head body;
Wherein, the gap that can regulate is formed between described blocking parts and liquid outlet, a part through the liquid of buffer part output is exported by nozzle, another part is overflowed by described gap, described actuated components moves according to the size of amount of the liquid inputing to buffer part, the interlock of actuated components and blocking parts regulates the size in gap to change the amount of the liquid overflowed by described gap, makes the amount of the liquid exported by described nozzle remain stable.
2. ejecting device according to claim 1, is characterized in that, described blocking parts comprises:
Hide, covering is arranged on the top of several liquid outlets of head body and shelters from this several liquid outlet, and covering is provided with several to spacing hole;
Several to locating part, severally several be fixed in head body to spacing hole to locating part through what hide, described covering is risen along locating part or is declined;
Pad, pad is arranged between covering and head body, makes to hide to form gap between head body;
Elastic component, elastic component is arranged between covering and the upper end of locating part.
3. ejecting device according to claim 2, is characterized in that, described actuated components comprises:
Baffle plate, faces the liquid feeding end of buffer part in the cushion chamber that baffle plate is arranged on buffer part;
Link, one end of link is connected with baffle plate, and the other end of link is connected with covering.
4. ejecting device according to claim 1, is characterized in that, the liquid feeding end of described buffer part is eliminated parts by a pipe resistance and is connected to a pulse liquid feed device.
5. ejecting device according to claim 4, is characterized in that, it is hollow pipelines that parts are eliminated in described pipe resistance, and one end of hollow pipeline is connected to pulse liquid feed device, and the other end of hollow pipeline is connected to the liquid feeding end of buffer part.
6. ejecting device according to claim 5, is characterized in that, described pulse liquid feed device is pneumatic diaphragm pump.
7. the ejecting device according to any one of claim 1-6, is characterized in that, described several liquid outlet is symmetrically distributed in the circumference of nozzle.
8. ejecting device according to claim 7, is characterized in that, described blocking parts comprises several independently parts, the top of each liquid outlet of head body to arrange described in one independently parts to shelter from this liquid outlet.
9. ejecting device according to claim 1, it is characterized in that, described bubble isolated part is cylindrical shape, and bubble isolated part is between nozzle and liquid outlet, bubble isolated part is provided with some passages, and the peak of the internal orifice of each passage is lower than the minimum point of this passage collar extension.
10. ejecting device according to claim 9, is characterized in that, described electrode is cylindrical shape, and the axial length of electrode is shorter than the axial length of bubble isolated part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410512483.3A CN105437083B (en) | 2014-09-29 | 2014-09-29 | Ejecting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410512483.3A CN105437083B (en) | 2014-09-29 | 2014-09-29 | Ejecting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105437083A true CN105437083A (en) | 2016-03-30 |
| CN105437083B CN105437083B (en) | 2018-11-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410512483.3A Active CN105437083B (en) | 2014-09-29 | 2014-09-29 | Ejecting device |
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| CN (1) | CN105437083B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4236371A1 (en) * | 1992-10-28 | 1994-05-05 | Erno Raumfahrttechnik Gmbh | Injection device and method |
| CN1318207A (en) * | 1998-07-09 | 2001-10-17 | Acm研究公司 | Methods and appts. for electropolishing metal intennections on semiconductor devices |
| US20030073310A1 (en) * | 2001-10-16 | 2003-04-17 | Applied Materials, Inc. | Planarization of metal layers on a semiconductor wafer through non-contact de-plating and control with endpoint detection |
| US20040198190A1 (en) * | 2003-03-27 | 2004-10-07 | Basol Bulent M | Method and apparatus for reduction of defects in wet processed layers |
| WO2005059970A2 (en) * | 2003-12-17 | 2005-06-30 | Acm Research, Inc. | Controlling removal rate uniformity of an electropolishing process in integrated circuit fabrication |
| CN101834120A (en) * | 2009-03-10 | 2010-09-15 | 东京毅力科创株式会社 | Shower head and plasma processing apparatus |
| CN102694061A (en) * | 2011-03-25 | 2012-09-26 | 大日本网屏制造株式会社 | Pattern forming apparatus and pattern forming method |
| CN103692293A (en) * | 2012-09-27 | 2014-04-02 | 盛美半导体设备（上海）有限公司 | Stress-free polishing device and polishing method |
-
2014
- 2014-09-29 CN CN201410512483.3A patent/CN105437083B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4236371A1 (en) * | 1992-10-28 | 1994-05-05 | Erno Raumfahrttechnik Gmbh | Injection device and method |
| CN1318207A (en) * | 1998-07-09 | 2001-10-17 | Acm研究公司 | Methods and appts. for electropolishing metal intennections on semiconductor devices |
| US20030073310A1 (en) * | 2001-10-16 | 2003-04-17 | Applied Materials, Inc. | Planarization of metal layers on a semiconductor wafer through non-contact de-plating and control with endpoint detection |
| US20040198190A1 (en) * | 2003-03-27 | 2004-10-07 | Basol Bulent M | Method and apparatus for reduction of defects in wet processed layers |
| WO2005059970A2 (en) * | 2003-12-17 | 2005-06-30 | Acm Research, Inc. | Controlling removal rate uniformity of an electropolishing process in integrated circuit fabrication |
| CN101834120A (en) * | 2009-03-10 | 2010-09-15 | 东京毅力科创株式会社 | Shower head and plasma processing apparatus |
| CN102694061A (en) * | 2011-03-25 | 2012-09-26 | 大日本网屏制造株式会社 | Pattern forming apparatus and pattern forming method |
| CN103692293A (en) * | 2012-09-27 | 2014-04-02 | 盛美半导体设备（上海）有限公司 | Stress-free polishing device and polishing method |
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| CN105437083B (en) | 2018-11-06 |
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Address after: 201203 building 4, No. 1690, Cailun Road, free trade zone, Pudong New Area, Shanghai Patentee after: Shengmei semiconductor equipment (Shanghai) Co., Ltd Address before: 201203 Shanghai Zhangjiang High Tech Park of Pudong New Area Cailun Road No. fourth 1690 Patentee before: ACM (SHANGHAI) Inc. |
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