CN105436647A8 - 自动再流焊机及自动再流焊方法 - Google Patents

自动再流焊机及自动再流焊方法 Download PDF

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Publication number
CN105436647A8
CN105436647A8 CN201511033886.0A CN201511033886A CN105436647A8 CN 105436647 A8 CN105436647 A8 CN 105436647A8 CN 201511033886 A CN201511033886 A CN 201511033886A CN 105436647 A8 CN105436647 A8 CN 105436647A8
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Prior art keywords
reflow welding
automatic
heating
automatic reflow
dimensional
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CN201511033886.0A
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CN105436647A (zh
CN105436647B (zh
Inventor
孙元鹏
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Shenzhen Zhenhua Microelectronics Co Ltd
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Shenzhen Zhenhua Microelectronics Co Ltd
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Abstract

本发明公开一种自动再流焊机及自动再流焊方法，该自动再流焊机包括：机架；加热机构，包括多个直线并排设置的加热模组，加热模组顶面设有宽度小于待焊接工件的宽度的凸台；二维位移机构；搬运机构，位于加热机构上方并装于二维位移机构上而在二维位移机构带动下实现X轴－Z轴的二维移动，搬运机构包括与二维位移机构相连接以与二维位移机构同步位移的横梁及至少一组定位装设至横梁上的托料臂组，每一托料臂组设有至少一根托料臂；以及控制系统。本发明采用二维移动机构和搬运机构配合，并设多个加热模组，且由控制系统实现自动化控制，可将待焊接工件在各加热模组之间及时进行搬运，工作效率高，能精确控制焊接时间，能有效避免过焊或冷焊。
CN201511033886.0A 2015-12-31 2015-12-31 自动再流焊机 Active CN105436647B (zh)

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CN105436647A CN105436647A (zh) 2016-03-30
CN105436647A8 true CN105436647A8 (zh) 2016-06-01
CN105436647B CN105436647B (zh) 2018-07-13

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106653632A (zh) * 2016-12-29 2017-05-10 淄博才聚电子科技有限公司 一种半导体器件焊接机构
CN112182924B (zh) * 2020-09-10 2022-08-19 湖北三江航天红峰控制有限公司 一种基于代理模型的再流焊焊接工艺参数稳健性设计方法
CN114247956A (zh) * 2022-01-20 2022-03-29 广东百珈亮光电科技有限公司 一种回流焊防过焊装置
CN116213871B (zh) * 2023-03-03 2023-08-25 北京铁科世纪科技有限公司 一种smt贴片的热风式回流焊装置及其方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3127454A1 (de) * 1981-07-11 1983-02-03 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Einrichtung zum automatischen transport von gedruckten leiterplatten
JP2005236071A (ja) * 2004-02-20 2005-09-02 Koki Tec Corp リフロー半田付装置
CN201120513Y (zh) * 2007-11-27 2008-09-24 东莞市众信电子涂装自动化设备厂 自动焊锡机
CN201955690U (zh) * 2010-12-09 2011-08-31 西安中科麦特电子技术设备有限公司 一种回流焊机温度控制系统
CN103116374A (zh) * 2011-11-16 2013-05-22 西安中科麦特电子技术设备有限公司 一种回流焊机的温度控制系统
CN103128392A (zh) * 2011-11-25 2013-06-05 陕西子竹电子有限公司 一种台式回流焊机多温区加热控制系统
CN205464667U (zh) * 2015-12-31 2016-08-17 深圳市振华微电子有限公司 自动再流焊机

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Legal Events

Date Code Title Description
PB01 Publication
SE01 Entry into force of request for substantive examination
CI01 Publication of corrected invention patent application

Correction item: Applicant

Correct: Shenzhen Zhenhua Microelectronics Co., Ltd.

False: SHENZHEN ZHENHUAWEI ELECTRONICS CO., LTD.

Number: 13

Volume: 32

CI02 Correction of invention patent application

Correction item: Applicant

Correct: Shenzhen Zhenhua Microelectronics Co., Ltd.

False: SHENZHEN ZHENHUAWEI ELECTRONICS CO., LTD.

Number: 13

Page: The title page

Volume: 32

CB03 Change of inventor or designer information

Inventor after: Sun Yuanpeng

Inventor after: Zhao Jiangsheng

Inventor before: Sun Yuanpeng

GR01 Patent grant
PE01 Entry into force of the registration of the contract for pledge of patent right

Denomination of invention: Automatic reflow welder

Effective date of registration: 20210208

Granted publication date: 20180713

Pledgee: Shenzhen Branch of China Merchants Bank Co.,Ltd.

Pledgor: SHENZHEN ZHENHUA MICROELECTRONICS Co.,Ltd.

Registration number: Y2021440020003