CN105428324A - Partition plate used for three-dimensional MCM and manufacturing method therefor - Google Patents
Partition plate used for three-dimensional MCM and manufacturing method therefor Download PDFInfo
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- CN105428324A CN105428324A CN201510942044.0A CN201510942044A CN105428324A CN 105428324 A CN105428324 A CN 105428324A CN 201510942044 A CN201510942044 A CN 201510942044A CN 105428324 A CN105428324 A CN 105428324A
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- 238000005192 partition Methods 0.000 title claims abstract description 48
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- 239000000463 material Substances 0.000 claims abstract description 47
- 238000000034 method Methods 0.000 claims abstract description 37
- 238000005245 sintering Methods 0.000 claims description 33
- 239000011521 glass Substances 0.000 claims description 22
- 239000002002 slurry Substances 0.000 claims description 17
- 238000003475 lamination Methods 0.000 claims description 15
- 238000011049 filling Methods 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 238000004080 punching Methods 0.000 claims description 12
- 238000007731 hot pressing Methods 0.000 claims description 11
- 238000001035 drying Methods 0.000 claims description 10
- 239000005365 phosphate glass Substances 0.000 claims description 10
- 238000007581 slurry coating method Methods 0.000 claims description 9
- 239000003989 dielectric material Substances 0.000 claims description 8
- 239000000843 powder Substances 0.000 claims description 8
- 238000002156 mixing Methods 0.000 claims description 7
- 238000005520 cutting process Methods 0.000 claims description 6
- 239000003085 diluting agent Substances 0.000 claims description 6
- 238000000227 grinding Methods 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 6
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 claims description 6
- 125000006850 spacer group Chemical group 0.000 claims description 5
- QKCOQEYUQPYLAB-UHFFFAOYSA-K P(=O)([O-])([O-])[O-].[Zn+2].[B+3] Chemical compound P(=O)([O-])([O-])[O-].[Zn+2].[B+3] QKCOQEYUQPYLAB-UHFFFAOYSA-K 0.000 claims description 4
- 239000000654 additive Substances 0.000 claims description 4
- 230000000996 additive effect Effects 0.000 claims description 4
- 239000011368 organic material Substances 0.000 claims description 4
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 claims description 3
- 229920002160 Celluloid Polymers 0.000 claims description 3
- 239000001293 FEMA 3089 Substances 0.000 claims description 3
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 3
- 229920006217 cellulose acetate butyrate Polymers 0.000 claims description 3
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 3
- RBNWAMSGVWEHFP-UHFFFAOYSA-N trans-p-Menthane-1,8-diol Chemical compound CC(C)(O)C1CCC(C)(O)CC1 RBNWAMSGVWEHFP-UHFFFAOYSA-N 0.000 claims description 3
- LRXTYHSAJDENHV-UHFFFAOYSA-H zinc phosphate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LRXTYHSAJDENHV-UHFFFAOYSA-H 0.000 claims description 3
- 229910000165 zinc phosphate Inorganic materials 0.000 claims description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical group CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 2
- 239000001856 Ethyl cellulose Substances 0.000 claims description 2
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 2
- YZYDPPZYDIRSJT-UHFFFAOYSA-K boron phosphate Chemical compound [B+3].[O-]P([O-])([O-])=O YZYDPPZYDIRSJT-UHFFFAOYSA-K 0.000 claims description 2
- 229910000149 boron phosphate Inorganic materials 0.000 claims description 2
- 229920001249 ethyl cellulose Polymers 0.000 claims description 2
- 235000019325 ethyl cellulose Nutrition 0.000 claims description 2
- 239000011812 mixed powder Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 abstract description 18
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 6
- 229910017083 AlN Inorganic materials 0.000 abstract description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 abstract description 2
- CEOCDNVZRAIOQZ-UHFFFAOYSA-N pentachlorobenzene Chemical compound ClC1=CC(Cl)=C(Cl)C(Cl)=C1Cl CEOCDNVZRAIOQZ-UHFFFAOYSA-N 0.000 abstract description 2
- 230000005855 radiation Effects 0.000 abstract description 2
- 239000000919 ceramic Substances 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 8
- 238000007711 solidification Methods 0.000 description 8
- 230000008023 solidification Effects 0.000 description 8
- 238000003466 welding Methods 0.000 description 8
- 239000011148 porous material Substances 0.000 description 7
- 238000002360 preparation method Methods 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000004377 microelectronic Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 230000011664 signaling Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/486—Via connections through the substrate with or without pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5384—Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Gas-Filled Discharge Tubes (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention provides a partition plate used for a three-dimensional MCM and a manufacturing method therefor. The partition plate adopts multi-layer LTCC unprocessed ceramic belts; unilateral partition plates are manufactured according to the size of the MCM; and then the manufactured multiple unilateral partition plates are spliced into an annularly-structured overall partition plate for connecting the upper and lower sides of the MCM. The partition plate is manufactured by the splicing method, so that the material is saved and the thermal radiation is facilitated; the partition plate and a substrate are manufactured separately, so that convenient operation and flexible process are achieved; and the partition plate manufactured by the manufacturing method also can be used for three-dimensional MCM assembling of aluminium oxide, aluminium nitride, PCB and other substrates.
Description
Technical field
The invention belongs to microelectronics technology, relate to microelectronics assewbly, particularly a kind of dividing plate for three-dimensional MCM and preparation method thereof.
Background technology
Complicated electronic equipment usually comprises multiple MCM (multi-chip module or module) structure, assemble many components and parts.If only at two dimension (2D) surface-assembled components and parts, occupy larger assembling area, the volume of system is difficult to reduce.If system is divided into multiple module, use LTCC(LTCC) make substrate, then system can be divided into multiple LTCC2D-MCM pattern.Connected by polylith 2D-MCM lamination, the components and parts such as the chip assembled, resistance, electric capacity not only launch on two dimensional surface, also arrange in the perpendicular direction, realize the MCM sandwich construction of perpendicular interconnection, form three-dimensional MCM (3D-MCM).Not only volume and surface area obviously reduce the circuit adopting this assembling form of perpendicular interconnection 3D-MCM to make, and due to interconnection line shortening, make interconnection resistance and ghost effect reduce, therefore signal delay shortens, noise and loss also all decline, and can further improve signaling rate.
When 2D-MCM lamination connects, because 2D-MCM surface-assembled has components and parts, between the 2D-MCM of therefore lamination, dividing plate must be had to be separated, in order to avoid components and parts pressurized or impaired.The plated-through hole of power-on and power-off connection effect must be had in dividing plate and play the pad of welding effect.For LTCC3D-MCM, dividing plate adopts the green carrying material identical with substrate to make usually.The manufacturing process of prior art is: first also use metal paste filling perforation in the corresponding site punching of dividing plate green band; Then, the middle part of green band is cut out; Secondly the dividing plate green band after hollowing out and substrate green band are overlapped together; Finally, substrate and the large cavity structure substrate of the integral sintered formation of dividing plate.Conventional LTCC green band is mainly imported material, expensive.The thickness of dividing plate is relevant with the height of components and parts on the MCM treating lamination, and components and parts are higher, and required dividing plate is thicker.These are used as the green band of dividing plate, and except four side partition parts retain, most of region is dug up, and therefore, dividing plate green band utilance is very low.If the dividing plate laminated does not overlap together sintering with substrate, owing to there is larger contraction when LTCC green band sinters, easy evagination in the middle part of four limits when the dividing plate of back-shaped structure sinters separately, every side partition is difficult to keep straight.The design attitude when lead to the hole site on these not straight dividing plates and uniform shrinkage will be easy to deviation occurs, during application and upper and lower MCM formed and misplace, thus affect the connectedness of perpendicular interconnection.
Summary of the invention
For overcoming the deficiencies in the prior art, the object of the present invention is to provide and a kind ofly save material, being conducive to dispelling the heat, making easy to operate, technique flexibly for the dividing plate and preparation method thereof of 3D-MCM.
The present invention is achieved by the following technical solutions:
For a dividing plate of three-dimensional MCM, described dividing plate is the overall dividing plate of the loop configuration be spliced by multiple monolateral dividing plate.
A kind of dividing plate for three-dimensional MCM of the present invention, described dividing plate is provided with multiple electrical interconnection plated-through hole and pad, and described pad is positioned at baffle surface or through-hole surfaces.
A kind of dividing plate for three-dimensional MCM of the present invention, described dividing plate is made up of 4 monolateral dividing plates of rectangle that the two pairs of specifications are the same, comprises two long side partitions and two minor face dividing plates,
The length of described long side partition is the difference of three-dimensional MCM length and minor face spacer width, and the width of long side partition is the difference of three-dimensional MCM width and long side partition width;
Or the length of described long side partition is the length of three-dimensional MCM, the width of long side partition is the half of the difference of three-dimensional MCM width and minor face septum plate length;
Or the length of described minor face dividing plate is the width of three-dimensional MCM, the width of minor face dividing plate is the half of the difference of three-dimensional MCM length and long side partition length.
For a manufacture method for the dividing plate of three-dimensional MCM, comprise the following steps:
(1) adopt multilayer LTCC green band, make monolateral dividing plate according to the size of MCM;
(2) the multiple monolateral dividing plate made is spliced into the overall dividing plate of the loop configuration for connecting upper and lower MCM.
The manufacture method of a kind of dividing plate for three-dimensional MCM of the present invention, the monolateral dividing plate described in step (1) by comprising the punching of justifying dividing plate, metal filling perforation, print pad, lamination, hot pressing, raw to cut, the operation that sinters is made;
Or by comprising the punching of justifying dividing plate, metal filling perforation, print pad, lamination, hot pressing, sintering, ripe operation of cutting be made.
The manufacture method of a kind of dividing plate for three-dimensional MCM of the present invention, step (2) described splicing, for binding paste is coated in monolateral dividing plate stitching portion, makes spliced materials solidify by the mode of drying or drying rear sintering.
The manufacture method of a kind of dividing plate for three-dimensional MCM of the present invention, described binding paste is
Glass material or dielectric material grind to form powdery, add the organic bond of 15 ~ 35wt%, and mixing grinding modulation forms;
Or modulate for there being the organic material of cementation and form;
Or be commercialization FHG P series glass slurry or DB P series glass slurry.
The manufacture method of a kind of dividing plate for three-dimensional MCM of the present invention,
Described dielectric material is the mixed powder of glass material and inorganic additive or is LTCC green carrying material;
Described organic bond is diluent or the mixture for diluent and improver.
The manufacture method of a kind of dividing plate for three-dimensional MCM of the present invention, described glass material is phosphate glass powder or boron phosphate glass powder.
The manufacture method of a kind of dividing plate for three-dimensional MCM of the present invention, described glass material is Zinc phosphate glass powder or boron Zinc phosphate glass powder.
The manufacture method of a kind of dividing plate for three-dimensional MCM of the present invention,
Described inorganic additive is Al
2o
3, SiO
2, MnO
2in any one or two or more combinations;
Described diluent is any one or two or more combinations in turpentine oil, terpinol, propyl alcohol, butyl carbitol acetate;
Described improver is any one or two or more combinations in polyvinyl alcohol, ethyl cellulose, cellulose acetate-butyrate, celluloid.
The manufacture method of a kind of dividing plate for three-dimensional MCM of the present invention,
Described slurry coating thickness is 0.1 ~ 0.3mm;
Described bake out temperature is 130 ~ 150 DEG C, and the time is 8 ~ 10min;
Described sintering temperature is 700 ~ 850 DEG C when using dielectric paste; Be higher than glass softening point 100 ~ 200 DEG C when using glass paste.
Beneficial effect of the present invention is:
1, independent operation technique.For the dividing plate of LTCC3D-MCM, current production method is cut out bulk LTCC green band middle part, then overlaps together sintering with upper strata or underlying substrate and form.The present invention, for independently to make single separator plate, does not need to overlap together sintering with substrate.The after-contraction of single separator plate sintering is even, there is not problem on deformation.In addition, substrate and dividing plate separate and make, and reduce and influence each other, flexible operation in operation, are conducive to improving finished product rate.
2, reduce costs.The mode hollowing out chamber with existing full wafer makes overall dividing plate, and stock utilization is low, if there are higher components and parts in 3D-MCM, block board thickness is often also thick than substrate, and therefore making intact diaphragm needs to consume a large amount of green carrying material.Adopt the overall dividing plate that single separator plate of the present invention is spliced, green carrying material is fully used.When producing 3D-MCM in batches, save green carrying material effect clearly.
3, advantageous heat dissipation.Existing 3D-MCM dividing plate and substrate are sintered together.Dividing plate of the present invention and substrate separate and make, and are connected between dividing plate with substrate by solder bump.Like this, many many convection channel between inner and outside at 3D-MCM, this is conducive to scattering and disappearing of 3D-MCM internal heat.
Accompanying drawing explanation
Fig. 1 is a kind of schematic cross-section for three-dimensional MCM dividing plate of the present invention;
Fig. 2 is the vertical view of a kind of balanced type connecting method for three-dimensional MCM dividing plate of the present invention;
Fig. 3 is the vertical view of a kind of full-length connecting method for three-dimensional MCM dividing plate of the present invention;
Fig. 4 is the vertical view of a kind of width type connecting method for three-dimensional MCM dividing plate of the present invention.
Reference numeral: 1, dividing plate; 2, pad; 3, plated-through hole; 4, stitching portion.
Embodiment
For better understanding the present invention, below in conjunction with embodiment and accompanying drawing, the invention will be further described, and following examples are only that the present invention will be described but not are limited it.
When carrying out 3D-MCM assembling, for making polylith substrate and divider upright interconnect accurate, easy to operate, the dividing plate that the upper surrounding of 2D-MCM plays buffer action needs to be connected usually, becomes the overall dividing plate of a loop configuration.First the present invention makes monolateral dividing plate, then adopts binding material to be stitched together on monolateral dividing plate.Because of dividing plate be used for 3D-MCM time, need experience 200 DEG C even working temperature of more than 300 DEG C, therefore, binding material need resistance to certain high temperature with have certain mechanical strength.First select dividing plate connecting method before splicing separating plate, determine monolateral baffle dimensions with this.In principle, Fig. 2-Fig. 4 can be used for the dividing plate of perpendicular interconnection in the 3D-MCM of any rectangular planar shape.But when making the monolateral dividing plate of certain 3D-MCM, two kinds of septum plate length differences of length and Width are as far as possible minimum.
embodiment 1:
For square 3D-MCM, the connecting method of balanced type shown in Fig. 2 preferably selected by dividing plate, comprise two long side partitions and two minor face dividing plates, the length of long side partition is the difference of 3D-MCM length and minor face spacer width, and the width of long side partition is the difference of 3D-MCM width and minor face septum plate length.
Dividing plate 1 adopts multilayer LTCC green band, is made by operations such as punching, metal filling perforation, printing pad, lamination, hot pressing, Sheng Qie and sintering.When dividing plate 1 life is cut, edge must be concordant.Owing to splicing the impact of rear material thickness, when making each monolateral dividing plate 1, shorten 0.1mm than theoretical value.Have electrical interconnection plated-through hole 3 in dividing plate 1, plated-through hole 3 surface coverage has pad 2, can be used for welding and makes solder bump.Pad 2 had both played electrical interconnection and had also risen mechanically interconnected.When electrical interconnection point is less, the pad 2 of non-intercommunicating pore also can be used.Fig. 1 is dividing plate 1 schematic cross-section.
Trbasic zinc phosphate (ZnO-P is selected during splicing separating plate
2o
5) glass material is as spliced materials.By ZnO-P
2o
5grind to form powdery, add 20wt% turpentine oil, mixing grinding furnishing slurry form uses.When making overall dividing plate 1, first single separator plate 1 is placed on a plane backing plate by design orientation, in the stitching portion 4 of single separator plate 1 with little writing brush or little soft brush by splicing ZnO-P
2o
5glass paste is coated to dividing plate 1 surface, stitching portion 4 and termination, and slurry coating thickness is 0.1mm.After four limits all coat, monolateral dividing plate 1 is spliced between two, and applies certain pressure, unnecessary slurry of extruding carefully is removed, avoid polluting pad 2 on dividing plate 1.By tentatively fixing for the dividing plate 1 of splicing, then, be that after drying 8min under the dividing plate of splicing is placed on 130 DEG C of environment by carrier, can put into sintering furnace and sinter, sintering temperature is 550 DEG C with backing plate.Spliced materials after solidification is combined firmly with dividing plate, has certain mechanical strength, and when taking dynamic, monolateral dividing plate can not be separated from each other and be out of shape, and namely four single separator plate form a whole dividing plate.
embodiment 2:
For the 3D-MCM of 1 long limit/broadside≤1.2 of <, the connecting method of full-length shown in Fig. 3 preferably selected by dividing plate, comprise two long side partitions and two minor face dividing plates, the length of long side partition is the length of three-dimensional MCM, and the width of long side partition is the half of the difference of three-dimensional MCM width and minor face septum plate length.
Dividing plate 1 adopts multilayer LTCC green band, by the punching of justifying dividing plate, metal filling perforation, prints pad, lamination, hot pressing, sintering and the ripe operation such as to cut and is made.Dividing plate 1 is ripe when cutting, and edge must be concordant.Owing to splicing the impact of rear material thickness, when making minor face dividing plate, shorten 0.2mm than theoretical value.Have electrical interconnection plated-through hole 3 in dividing plate 1, plated-through hole 3 surface coverage has pad 2, can be used for welding and makes solder bump.Pad 2 had both played electrical interconnection and had also risen mechanically interconnected.When electrical interconnection point is less, the pad 2 of non-intercommunicating pore also can be used.Fig. 1 is dividing plate 1 schematic cross-section.
Select dielectric material as spliced materials during splicing separating plate.By boron Zinc phosphate glass material (ZnO-B
2o
3-P
2o
5) and Al
2o
3mixture grind to form powdery, Al
2o
3the effect added regulates the sintering temperature of dielectric material and viscosity, make sintering rear bulkhead stitching portion smooth, combine good, then add the mixture of 25wt% terpinol and polyvinyl alcohol, the use of mixing grinding furnishing slurry form.When making overall dividing plate 1, first single separator plate 1 is placed on a plane backing plate by design orientation, with little writing brush or little soft brush, splicing dielectric paste is coated to dividing plate 1 surface, stitching portion 4 and termination in the stitching portion 4 of single separator plate 1, slurry coating thickness is 0.2mm.After four limits all coat, monolateral dividing plate 1 is spliced between two, and applies certain pressure, unnecessary slurry of extruding carefully is removed, avoid polluting pad 2 on dividing plate 1.By tentatively fixing for the dividing plate 1 of splicing, then, be, after drying 9min under the dividing plate of splicing is placed on 140 DEG C of environment by carrier, sintering furnace can be put into and sinter with backing plate.Sintering temperature is 800 DEG C.Spliced materials after solidification is combined firmly with dividing plate, has certain mechanical strength, and when taking dynamic, monolateral dividing plate can not be separated from each other and be out of shape, and namely four single separator plate form a whole dividing plate.
embodiment 3:
For the 3D-MCM of non-square and non-1 long limit/broadside≤1.2 of <, the connecting method of width type shown in Fig. 4 preferably selected by dividing plate, comprise two long side partitions and two minor face dividing plates, the length of minor face dividing plate is the width of three-dimensional MCM, and the width of minor face dividing plate is the half of the difference of three-dimensional MCM length and long side partition length.
Dividing plate 1 adopts multilayer LTCC green band, by the punching of justifying dividing plate, metal filling perforation, prints pad, lamination, hot pressing, sintering and the ripe operation such as to cut and is made.Dividing plate 1 is ripe when cutting, and edge must be concordant.Owing to splicing the impact of rear material thickness, when making long side partition, shorten 0.2mm than theoretical value.Have electrical interconnection plated-through hole 3 in dividing plate 1, plated-through hole 3 surface coverage has pad 2, can be used for welding and makes solder bump.Pad 2 had both played electrical interconnection and had also risen mechanically interconnected.When electrical interconnection point is less, the pad 2 of non-intercommunicating pore also can be used.Fig. 1 is dividing plate 1 schematic cross-section.
Select commercialization FHG series (as FHG502) glass paste as spliced materials during splicing separating plate.When making overall dividing plate 1, first single separator plate 1 is placed on a plane backing plate by design orientation, with little writing brush or little soft brush, splicing FHG502 glass paste is coated to dividing plate 1 surface, stitching portion 4 and termination in the stitching portion 4 of single separator plate 1, slurry coating thickness is 0.3mm.After four limits all coat, monolateral dividing plate 1 is spliced between two, and applies certain pressure, unnecessary slurry of extruding carefully is removed, avoid polluting pad 2 on dividing plate 1.By tentatively fixing for the dividing plate 1 of splicing, then, be that after drying 10min under the dividing plate of splicing is placed on 150 DEG C of environment by carrier, can put into sintering furnace and sinter, sintering temperature is 500 DEG C with backing plate.Spliced materials after solidification is combined firmly with dividing plate, has certain mechanical strength, and when taking dynamic, monolateral dividing plate can not be separated from each other and be out of shape, and namely four single separator plate form a whole dividing plate.
embodiment 4:
For the 3D-MCM of 1 long limit/broadside≤1.2 of <, the connecting method of full-length shown in Fig. 3 preferably selected by dividing plate, comprise two long side partitions and two minor face dividing plates, the length of described long side partition is the length of three-dimensional MCM, and the width of long side partition is the half of the difference of three-dimensional MCM width and minor face septum plate length.
Dividing plate 1 adopts multilayer LTCC green band, is made by operations such as punching, metal filling perforation, printing pad, lamination, hot pressing, Sheng Qie and sintering.When dividing plate 1 life is cut, edge must be concordant.Owing to splicing the impact of rear material thickness, when making minor face dividing plate, shorten 0.15mm than theoretical value.Have electrical interconnection plated-through hole 3 in dividing plate 1, plated-through hole 3 surface coverage has pad 2, can be used for welding and makes solder bump.Pad 2 had both played electrical interconnection and had also risen mechanically interconnected.When electrical interconnection point is less, the pad 2 of non-intercommunicating pore also can be used.Fig. 1 is dividing plate 1 schematic cross-section.
Select the organic material with bonding effect as spliced materials during splicing separating plate.The organic material mixing furnishing slurry form with bonding effect is used.When making overall dividing plate 1, first single separator plate 1 is placed on a plane backing plate by design orientation, with little writing brush or little soft brush, splicing organic ink is coated to dividing plate 1 surface, stitching portion 4 and termination in the stitching portion 4 of single separator plate 1, slurry coating thickness is 0.25mm.After four limits all coat, monolateral dividing plate 1 is spliced between two, and applies certain pressure, unnecessary slurry of extruding carefully is removed, avoid polluting pad 2 on dividing plate 1.By tentatively fixing for the dividing plate 1 of splicing, then, be under the dividing plate of splicing is placed on 150 DEG C of environment by carrier, dry 10min solidification with backing plate.Spliced materials after solidification is combined firmly with dividing plate, has certain mechanical strength, and when taking dynamic, monolateral dividing plate can not be separated from each other and be out of shape, and namely four single separator plate form a whole dividing plate.
embodiment 5:
For square 3D-MCM, the connecting method of balanced type shown in Fig. 2 preferably selected by dividing plate, comprise two long side partitions and two minor face dividing plates, the length of long side partition is the difference of three-dimensional MCM length and minor face spacer width, and the width of long side partition is the difference of three-dimensional MCM width and long side partition width.
Dividing plate 1 adopts multilayer LTCC green band, by the punching of justifying dividing plate, metal filling perforation, prints pad, lamination, hot pressing, sintering and the ripe operation such as to cut and is made.Dividing plate 1 is ripe when cutting, and edge must be concordant.Owing to splicing the impact of rear material thickness, when making monolateral dividing plate, shorten 0.1mm than theoretical value.Have electrical interconnection plated-through hole 3 in dividing plate 1, plated-through hole 3 surface coverage has pad 2, can be used for welding and makes solder bump.Pad 2 had both played electrical interconnection and had also risen mechanically interconnected.When electrical interconnection point is less, the pad 2 of non-intercommunicating pore also can be used.Fig. 1 is dividing plate 1 schematic cross-section.
Select dielectric material as spliced materials during splicing separating plate.By boron Zinc phosphate glass material (ZnO-B
2o
3-P
2o
5) and MnO
2mixture grind to form powdery, MnO
2the effect added regulates the sintering temperature of dielectric material and viscosity, make sintering rear bulkhead stitching portion smooth, combine good, then add the mixture of 35wt% butyl carbitol acetate and celluloid, the use of mixing grinding furnishing slurry form.When making overall dividing plate 1, first single separator plate 1 is placed on a plane backing plate by design orientation, with little writing brush or little soft brush, splicing dielectric paste is coated to dividing plate 1 surface, stitching portion 4 and termination in the stitching portion 4 of single separator plate 1, slurry coating thickness is 0.15mm.After four limits all coat, monolateral dividing plate 1 is spliced between two, and applies certain pressure, unnecessary slurry of extruding carefully is removed, avoid polluting pad 2 on dividing plate 1.By tentatively fixing for the dividing plate 1 of splicing, then, be, after drying 9min under the dividing plate of splicing is placed on 145 DEG C of environment by carrier, sintering furnace can be put into and sinter with backing plate.Sintering temperature is 700 DEG C.Spliced materials after solidification is combined firmly with dividing plate, has certain mechanical strength, and when taking dynamic, monolateral dividing plate can not be separated from each other and be out of shape, and namely four single separator plate form a whole dividing plate.
embodiment 6:
For the 3D-MCM of non-square and non-1 long limit/broadside≤1.2 of <, the connecting method of width type shown in Fig. 4 preferably selected by dividing plate, comprise two long side partitions and two minor face dividing plates, the length of minor face dividing plate is the width of three-dimensional MCM, and the width of minor face dividing plate is the half of the difference of three-dimensional MCM length and long side partition length.
Dividing plate 1 adopts multilayer LTCC green band, is made by operations such as punching, metal filling perforation, printing pad, lamination, hot pressing, Sheng Qie and sintering.When dividing plate 1 life is cut, edge must be concordant.Owing to splicing the impact of rear material thickness, when making long side partition, shorten 0.2mm than theoretical value.Have electrical interconnection plated-through hole 3 in dividing plate 1, plated-through hole 3 surface coverage has pad 2, can be used for welding and makes solder bump.Pad 2 had both played electrical interconnection and had also risen mechanically interconnected.When electrical interconnection point is less, the pad 2 of non-intercommunicating pore also can be used.Fig. 1 is dividing plate 1 schematic cross-section.
Select commercialization DB series (as DB-3A) glass paste as spliced materials during splicing separating plate.When making overall dividing plate 1, first single separator plate 1 is placed on a plane backing plate by design orientation, with little writing brush or little soft brush, splicing DB-3A glass paste is coated to dividing plate 1 surface, stitching portion 4 and termination in the stitching portion 4 of single separator plate 1, slurry coating thickness is 0.2mm.After four limits all coat, monolateral dividing plate 1 is spliced between two, and applies certain pressure, unnecessary slurry of extruding carefully is removed, avoid polluting pad 2 on dividing plate 1.By tentatively fixing for the dividing plate 1 of splicing, then, be, after drying 10min under the dividing plate of splicing is placed on 130 DEG C of environment by carrier, sintering furnace can be put into and sinter with backing plate.Sintering temperature is 600 DEG C.Spliced materials after solidification is combined firmly with dividing plate, has certain mechanical strength, and when taking dynamic, monolateral dividing plate can not be separated from each other and be out of shape, and namely four single separator plate form a whole dividing plate.
embodiment 7:
For square 3D-MCM, the connecting method of balanced type shown in Fig. 2 preferably selected by dividing plate, comprise two long side partitions and two minor face dividing plates, the length of long side partition is the difference of three-dimensional MCM length and minor face spacer width, and the width of long side partition is the difference of three-dimensional MCM width and long side partition width.
Dividing plate 1 adopts multilayer LTCC green band, by the punching of justifying dividing plate, metal filling perforation, prints pad, lamination, hot pressing, sintering and the ripe operation such as to cut and is made.Dividing plate 1 is ripe when cutting, and edge must be concordant.Owing to splicing the impact of rear material thickness, when making monolateral dividing plate, shorten 0.2mm than theoretical value.Have electrical interconnection plated-through hole 3 in dividing plate 1, plated-through hole 3 surface coverage has pad 2, can be used for welding and makes solder bump.Pad 2 had both played electrical interconnection and had also risen mechanically interconnected.When electrical interconnection point is less, the pad 2 of non-intercommunicating pore also can be used.Fig. 1 is dividing plate 1 schematic cross-section.
Select LTCC green band leftover pieces as spliced materials during splicing separating plate.To be pulverized by LTCC green band leftover pieces shape, add 30wt% propyl alcohol and cellulose acetate-butyrate, mixing grinding furnishing slurry form uses.When making overall dividing plate 1, first single separator plate 1 is placed on a plane backing plate by design orientation, with little writing brush or little soft brush, splicing LTCC green band leftover pieces slurry is coated to dividing plate 1 surface, stitching portion 4 and termination in the stitching portion 4 of single separator plate 1, slurry coating thickness is 0.3mm.After four limits all coat, monolateral dividing plate 1 is spliced between two, and applies certain pressure, unnecessary slurry of extruding carefully is removed, avoid polluting pad 2 on dividing plate 1.By tentatively fixing for the dividing plate 1 of splicing, then, be, after drying 8min under the dividing plate of splicing is placed on 150 DEG C of environment by carrier, sintering furnace can be put into and sinter with backing plate.Sintering temperature is 850 DEG C.Spliced materials after solidification is combined firmly with dividing plate, has certain mechanical strength, and when taking dynamic, monolateral dividing plate can not be separated from each other and be out of shape, and namely four single separator plate form a whole dividing plate.
The present invention adopts LTCC material first to make monolateral dividing plate, then is formed the overall dividing plate being applicable to three-dimensional MCM by joining method.The dividing plate that application splicing method makes not only saves material, is conducive to heat radiation, and dividing plate can separate with substrate and makes, and easy to operate, technique is flexible.The dividing plate that the method makes also can be used for the assembling of the three-dimensional MCM of the substrates such as aluminium oxide, aluminium nitride and PCB.
The above execution mode is only be described the preferred embodiment of the present invention; not scope of the present invention is limited; under not departing from the present invention and designing the prerequisite of spirit; the various distortion that those of ordinary skill in the art make technical scheme of the present invention and improvement, all should fall in protection range that claims of the present invention determine.
Claims (12)
1. for a dividing plate of three-dimensional MCM, it is characterized in that, described dividing plate is the overall dividing plate of the loop configuration be spliced by multiple monolateral dividing plate.
2. a kind of dividing plate for three-dimensional MCM according to claim 1, is characterized in that, described dividing plate is provided with multiple electrical interconnection plated-through hole and pad, and described pad is positioned at baffle surface or through-hole surfaces.
3. a kind of dividing plate for three-dimensional MCM according to claim 2, is characterized in that, described dividing plate is made up of 4 monolateral dividing plates of rectangle that the two pairs of specifications are the same, comprises two long side partitions and two minor face dividing plates,
The length of described long side partition is the difference of three-dimensional MCM length and minor face spacer width, and the width of long side partition is the difference of three-dimensional MCM width and long side partition width;
Or the length of described long side partition is the length of three-dimensional MCM, the width of long side partition is the half of the difference of three-dimensional MCM width and minor face septum plate length;
Or the length of minor face dividing plate is the width of three-dimensional MCM, the width of minor face dividing plate is the half of the difference of three-dimensional MCM length and long side partition length.
4. for a manufacture method for the dividing plate of three-dimensional MCM, it is characterized in that, comprise the following steps:
(1) adopt multilayer LTCC green band to make, make monolateral dividing plate according to the size of MCM;
(2) the multiple monolateral dividing plate made is spliced into the overall dividing plate of the loop configuration for connecting upper and lower MCM.
5. the manufacture method of a kind of dividing plate for three-dimensional MCM according to claim 4, is characterized in that, the monolateral dividing plate described in step (1)
By comprising the punching of justifying dividing plate, metal filling perforation, print pad, lamination, hot pressing, raw to cut, the operation that sinters is made;
Or by comprising the punching of justifying dividing plate, metal filling perforation, print pad, lamination, hot pressing, sintering, ripe operation of cutting be made.
6. the manufacture method of a kind of dividing plate for three-dimensional MCM according to claim 5, it is characterized in that, step (2) described splicing, for binding paste is coated in monolateral dividing plate stitching portion, makes spliced materials solidify by the mode of drying or drying rear sintering.
7. the manufacture method of a kind of dividing plate for three-dimensional MCM according to claim 6, it is characterized in that, described binding paste is
Glass material or dielectric material grind to form powdery, add the organic bond of 15 ~ 35wt%, and mixing grinding modulation forms;
Or modulate for there being the organic material of cementation and form;
Or be commercialization FHG P series glass slurry or DB P series glass slurry.
8. the manufacture method of a kind of dividing plate for three-dimensional MCM according to claim 7, is characterized in that,
Described dielectric material is the mixed powder of glass material and inorganic additive or is LTCC green carrying material;
Described organic bond is diluent or the mixture for diluent and improver.
9. the manufacture method of a kind of dividing plate for three-dimensional MCM according to claim 7 or 8, is characterized in that, described glass material is phosphate glass powder or boron phosphate glass powder.
10. the manufacture method of a kind of dividing plate for three-dimensional MCM according to claim 9, is characterized in that, described glass material is Zinc phosphate glass powder or boron Zinc phosphate glass powder.
The manufacture method of 11. a kind of dividing plates for three-dimensional MCM according to claim 8, is characterized in that,
Described inorganic additive is Al
2o
3, SiO
2, MnO
2in any one or two or more combinations;
Described diluent is any one or two or more combinations in turpentine oil, terpinol, propyl alcohol, butyl carbitol acetate;
Described improver is any one or two or more combinations in polyvinyl alcohol, ethyl cellulose, cellulose acetate-butyrate, celluloid.
The manufacture method of 12. a kind of dividing plates for three-dimensional MCM according to claim 6, is characterized in that,
Described slurry coating thickness is 0.1 ~ 0.3mm;
Described bake out temperature is 130 ~ 200 DEG C, and the time is 8 ~ 10min;
Described sintering temperature is 700 ~ 850 DEG C when using dielectric paste; Be higher than glass softening point 100 ~ 200 DEG C when using glass paste.
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| CN105742274A (en) * | 2016-04-27 | 2016-07-06 | 中国电子科技集团公司第十三研究所 | Vertical transition connector for chip package, substrate structure and fabrication method |
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| CN205248254U (en) * | 2015-12-16 | 2016-05-18 | 中国电子科技集团公司第四十三研究所 | A baffle for three -dimensional MCM |
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| JP2001144201A (en) * | 1999-08-31 | 2001-05-25 | Kyocera Corp | Electronic part |
| CN201504226U (en) * | 2009-09-11 | 2010-06-09 | 浙江嘉康电子股份有限公司 | Ceramic shell chip frequency device |
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