CN105405820A - Power module and packaging method therefor - Google Patents
Power module and packaging method therefor Download PDFInfo
- Publication number
- CN105405820A CN105405820A CN201510923764.2A CN201510923764A CN105405820A CN 105405820 A CN105405820 A CN 105405820A CN 201510923764 A CN201510923764 A CN 201510923764A CN 105405820 A CN105405820 A CN 105405820A
- Authority
- CN
- China
- Prior art keywords
- electrode
- power model
- power
- circuit board
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 55
- 238000004806 packaging method and process Methods 0.000 title abstract 2
- 238000003466 welding Methods 0.000 claims abstract description 100
- 229910052751 metal Inorganic materials 0.000 claims abstract description 63
- 239000002184 metal Substances 0.000 claims abstract description 63
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 54
- 229910052802 copper Inorganic materials 0.000 claims abstract description 49
- 239000010949 copper Substances 0.000 claims abstract description 49
- 239000011889 copper foil Substances 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims description 26
- 238000012856 packing Methods 0.000 claims description 7
- 238000001746 injection moulding Methods 0.000 claims description 4
- 238000009833 condensation Methods 0.000 claims description 3
- 230000005494 condensation Effects 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005992 thermoplastic resin Polymers 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 abstract description 19
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 230000035515 penetration Effects 0.000 abstract 1
- 239000004411 aluminium Substances 0.000 description 37
- 229910052782 aluminium Inorganic materials 0.000 description 37
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 37
- 238000005476 soldering Methods 0.000 description 23
- 229910000679 solder Inorganic materials 0.000 description 14
- 229920001707 polybutylene terephthalate Polymers 0.000 description 5
- 238000013461 design Methods 0.000 description 4
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 description 4
- 238000010008 shearing Methods 0.000 description 4
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 230000006978 adaptation Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000015271 coagulation Effects 0.000 description 2
- 238000005345 coagulation Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 230000010358 mechanical oscillation Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000004023 plastic welding Methods 0.000 description 1
- -1 polybutylene terephthalate Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
- H01L21/607—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving the application of mechanical vibrations, e.g. ultrasonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
The invention discloses a power module and a packaging method therefor. The power module comprises a module housing main body and a copper-coated circuit board bearing a modular circuit. The power module is characterized by further comprising a metal electrode fixed to the module housing main body in a penetration manner, wherein the metal electrode comprises an electrode contact part extending out of the power module and an electrode welding part extending to the copper-coated circuit board in the power module; and metal of the electrode welding part is integrally welded with a copper foil of the copper-coated circuit board through an ultrasonic welding technology. By applying the power module, the firmness and reliability of welding points of the power module can be ensured, a process is simplified, the production efficiency of the power module is improved, the internal space of the power module is saved, and the miniaturization of the power module is facilitated.
Description
Technical field
The present invention relates to electronic technology field, specifically, the present invention relates to a kind of power model and method for packing thereof.
Background technology
Power model is the module that power power electronic device becomes by certain function combination embedding.Conventional power model comprises, metal-oxide layer-semiconductor-field-effect transistor, be called for short metal-oxide half field effect transistor (Metal-Oxide-SemiconductorField-EffectTransistor, MOSFET) module, IGBT (InsulatedGateBipolarTransistor, insulated gate bipolar transistor) module, diode (led) module etc.
In the encapsulation technology of conventional power module, what middle low power module electrodes adopted mostly is common soldering process.But, the mutual contact mode of traditional middle low power soldering process, tin welding spot contact material resistivity is high, and material contacting surface is unlike material, is very easy to layering, comes off, cause pad firmly and reliability low.
For ensureing the firm of electrode welding point and reliability, middle high power module generally adopts aluminium wire bonding technology.Aluminium wire welding procedure realizes by with under type: when module frame injection mo(u)lding, the power terminal of electrode and control terminal are injected in module frame in the lump, and reserve barish metal island in module frame inside, the circuit in module is bonded to for aluminium wire.
But, the present inventor finds, because in middle high power module, current ratio is larger, the area of metal island needs reserved enough large space to bind many even tens of aluminium wires, realize technique very loaded down with trivial details, production efficiency is very low, and owing to needing for metal island reserves enough large space, is unfavorable for that the miniaturization of power model is produced.
Summary of the invention
The embodiment of the present invention is for the shortcoming of existing power model, a kind of power model and method for packing thereof are proposed, in order to the firm and reliability of the pad of guaranteed output module, the production efficiency of Simplified flowsheet, raising power model simultaneously, and save power model inner space, be beneficial to the miniaturization of power model.
The embodiment of the present invention, according to an aspect, provides a kind of power model, comprising: module housing main body, be welded with modular circuit cover copper circuit board, it is characterized in that, also comprise: run through the metal electrode being fixed on described module housing main body; Wherein, described metal electrode comprises: extend the electrode contact outside described power model, and in described power model, extend to the electrode welding portion covering copper circuit board; The metal in described electrode welding portion is welded as a whole by ultrasonic welding technique and the described Copper Foil covering copper circuit board.
The embodiment of the present invention, according to another aspect, additionally provides a kind of method for packing of power model, comprising: metal electrode is run through the module housing main body being fixed on described power model; Wherein, described metal electrode comprises: extend the electrode contact outside described power model, and in described power model, extend to the electrode welding portion covering copper circuit board of described power model; Described electrode welding portion is welded as a whole by ultrasonic welding technique and the described copper circuit board that covers.
In technical scheme of the present invention, owing to adopting ultrasonic welding technique, thus in welding body, there is not weld interface, welding material combines together, and very firmly, solder joint shearing force is greater than 300N; Be far longer than the weld strength of conventional art module, reliability significantly improves, and the life-span is longer.Tradition aluminium wire keying posts technology modules is subject to temperature cycles, the impacts such as power cycle.Usually make pad interfacial fatigue, occur the phenomenons such as aluminium wire ruptures, electrode terminal comes off.The terminal of ultra-sonic welded, there will not be above problem.The reliability of power model is significantly improved, and the life-span increases by 500 above.Substantially increase the firm of electrode welding point and reliability.
And Ultrasonic welding processes can remove the oxide layer of welding material contact-making surface automatically, ultrasonic welding process is an of short duration high frequency friction process, also can be removed by friction, do not affect welding quality even if welding material surface exists oxide layer.The soldering method of foregoing description and aluminium wire bonding method, the oxide layer all by welding material surface limits.
Further, the pad that ultrasonic terminal soldering technology is formed, because not Presence of an interface state, interface contact resistance is 0, greatly reduces the resistance of electrode welding point.
Further, in ultrasonic terminal soldering technology, solder side directly by electrode electrode welding portion with cover the area that copper circuit board contacts and determine, effective area is large, but does not take up room, and thus conducting resistance is extremely low.The module of aluminium wire bonding techniques, because the equivalent bonding area of aluminium wire is very little, so conducting resistance is very large, even if weld tens of aluminium wires simultaneously, conducting resistance still can not be ignored.Ultrasonic terminal soldering technology terminal conducting resistance is lower than aluminium wire weld interface conducting resistance 5-10 times;
Further, ultrasonic terminal soldering technical efficiency is very high, and a solder joint welding only needs 1s to complete, and add the work such as preparation for journey, 5s can complete the welding of a solder joint; And the module of aluminium wire welding machine technology is owing to will reduce weld interface conducting resistance, each power electrode terminal often needs to weld tens of aluminium wires, very loaded down with trivial details.The production efficiency of ultrasonic terminal soldering module improves about 10 times than traditional aluminium wire terminal soldering module.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 shows the structural representation of embodiment of the present invention power model inside;
Fig. 2 a, 2b show a power model concrete structure schematic diagram of the embodiment of the present invention;
Fig. 3 shows the method for packing flow chart of embodiment of the present invention power model.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, carry out clear, complete description to the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
Those skilled in the art of the present technique are appreciated that unless expressly stated, and singulative used herein " ", " one ", " described " and " being somebody's turn to do " also can comprise plural form.Should be further understood that, the wording used in specification of the present invention " comprises " and refers to there is described feature, integer, step, operation, element and/or assembly, but does not get rid of and exist or add other features one or more, integer, step, operation, element, assembly and/or their group.Should be appreciated that, when we claim element to be " connected " or " coupling " to another element time, it can be directly connected or coupled to other elements, or also can there is intermediary element.In addition, " connection " used herein or " coupling " can comprise wireless connections or wirelessly to couple.Wording "and/or" used herein comprises one or more whole or arbitrary unit listing item be associated and all combinations.
Those skilled in the art of the present technique are appreciated that unless otherwise defined, and all terms used herein (comprising technical term and scientific terminology), have the meaning identical with the general understanding of the those of ordinary skill in field belonging to the present invention.It should also be understood that, those terms defined in such as general dictionary, should be understood to that there is the meaning consistent with the meaning in the context of prior art, unless and by specific definitions as here, otherwise can not explain by idealized or too formal implication.
The present inventor considers, when package power module, adopts ultrasonic welding technique.The principle of ultrasonic bonding: when ul-trasonic irradiation is in thermoplasticity object, ultrasonic wave can be delivered on thermoplasticity object, and makes it produce dither.When after this object and welding object object contact, the contact-making surface of two articles can produce dither and the friction of atom level, and then produces the instantaneous high-temperature of local.The surfacing of contact-making surface is melted rapidly, and after applying certain pressure, the material of two surface meltings can interpenetrate to the other side, is fused into one.After stopping ultrasonic wave transmitting, the atom of thermoplastic material or molecule coagulation forming again, material is thus formed firm combination, achieves material welding.The welding region that ultrasonic bonding is formed, do not have weld interface, intensity is close to raw-material intensity.
Ultrasonic bonding is applicable to the welding between plastics, and be also applicable to the welding between various of the same race and dissimilar metal, Plastic Welding has been widely used in various field.Metal solder is also only only limitted to various metal wire at present, and the interconnected welding of battery pole piece etc.
Based on this, technical scheme of the present invention, realizes inside modules electrode bind mode by ultrasonic welding technique: the metal electrode of power model is injected into one-shot forming in the module housing main body of power model.And electrode welding portion, at the inner extraction electrode weld part of power model, is welded with the copper circuit board that covers of bearer circuit in power model by ultrasonic welding machine by metal electrode.Due to by ultrasonic bonding, electrode and the atom covered between copper circuit board or molecule coagulation forming again, define firm combination, substantially increase welding firmly and reliability.Simultaneously ultrasonic welding technique technique simple, be easy to automatic assembly line and produce, the production efficiency of power model can be improved.
And the module of the aluminium wire bonding techniques of prior art, because metal island takes up space greatly, and the equivalent bonding area of aluminium wire is very little, so both taken a lot of module interior space, and conducting resistance is very large, even if weld tens of aluminium wires simultaneously, conducting resistance still can not be ignored; And in technical solution of the present invention, electrode welding face is directly determined with the area of the contact-making surface covering copper circuit board by electrode welding portion, effective area is large, and conducting resistance is extremely low, takies module interior space very little simultaneously, is beneficial to the miniaturization of power model.
The technical scheme of the embodiment of the present invention is illustrated below in conjunction with accompanying drawing.
A kind of power model that the embodiment of the present invention provides, its internal structure as shown in Figure 1, comprising: module housing main body 101, run through be fixed on described module housing main body metal electrode 102, cover copper circuit board 103.
Wherein, module housing main body 101 can be specifically thermoplastic resin material.
Metal electrode specifically adopts injection moulding condensation process to run through and is fixed in module housing main body 101, comprising: extend the electrode contact outside described power model, and in described power model, extend to the electrode welding portion covering copper circuit board 103.Preferably, metal electrode material can be specifically copper, nickel-clad copper or silver-plated copper.
Such as, the metal electrode of power model can be specifically control electrode 1021, the external Drive and Control Circuit of its electrode contact, and its electrode welding portion is welded in covers copper circuit board 103.
Or the metal electrode of power model can be specifically power electrode 1022, be responsible for the input and output of power current, its electrode contact is in order to be connected with the circuit outside power model, and its electrode welding portion is welded in covers copper circuit board 103.
Such as, Fig. 2 a, 2b show a concrete power module architectures, and its framework comprises: upper cover plate 202, lower cover 201, and are arranged at the module housing main body 101 (not shown in module housing main body Fig. 2 a, 2b) between upper and lower cover plate.Upper cover plate 202, lower cover 201 are by PET (PETG), and the thermoplastic injection mo(u)ldings such as PBT (polybutylene terephthalate (PBT)), have in metal electrode is embedded in, symmetrical along Y-axis.Upper cover plate 202 is arranged five square bossings, the top 204,205 of two power input of module respectively, described power input is the metal electrode being embedded with diplopore, has one, M5 or M6 nut in each electrode hole, fixing for electrode and external module; The top 206,207,208 upper cover plate 202 being also provided with three power take-offs is wherein embedded with the metal electrode of single hole, has one, M5 or M6 nut in same each electrode hole, fixing for electrode and external module.Upper cover plate is one with the square resin cover plate of circular arc of draw-in groove, covers the inner all exposed electrodes of lower cover and internal circuit.
The power input of module, and the substructure being arranged in lower cover 201 of power take-off is respectively as shown in 209,210,211,212,213 of Fig. 2 a, 2b; Wherein, the electrode hole being positioned at the top of the power input of upper cover plate connects with the electrode hole of the bottom of this power input being positioned at lower cover; Equally, the electrode hole being positioned at the top of the power take-off of upper cover plate connects with the electrode hole of the bottom of this power take-off being positioned at lower cover.The electrode hole being positioned at upper cover plate of power input, as the electrode contact extended outside power model of metal electrode, and power input runs through module housing main body 101, extend in power model cover copper circuit board 103 part as electrode welding portion.Equally, the electrode hole being positioned at upper cover plate of power take-off, as the electrode contact extended outside power model of metal electrode, and power take-off runs through module housing main body 101, extend in power model cover copper circuit board 103 part as electrode welding portion.
Power input, and the substructure of power take-off is surrounded a cylindrical structure by the hollow square cylindrical bodies of an oblique angle tangent plane and is formed, be hollow design in cylinder, there is hexagonal groove inside, inner placement metal nuts.
The upper cover plate of the power model as shown in Fig. 2 a, 2b has six groups of acicular terminal 230, often organizing two acicular terminal 230 and form, is the control electrode of power model, external PCB drive plate.
Preferably, the electrode welding portion of metal electrode is bent, and forms step shape as shown in Figure 1 so that with cover copper circuit board 103 and weld.In fact, the electrode welding portion of step shape comprises and the sheet metal covering copper circuit board 103 and parallel, and also comprises the support metal body being connected to electrode contact from described sheet metal; The shape of this sheet metal can be square, circular or dome square, its area is 4cm
2-16cm
2; This support metal body can be forniciform, also can be straight, and those skilled in the art can design according to the concrete structure of power model inner space.
In the electrode welding portion of metal electrode 102, solder side directly by sheet metal with cover the area that copper circuit board contacts and determine, effective area is large, but does not take up room, and thus conducting resistance is extremely low.The module of aluminium wire bonding techniques, because the equivalent bonding area of aluminium wire is very little, so conducting resistance is very large, even if weld tens of aluminium wires simultaneously, conducting resistance still can not be ignored.Ultrasonic terminal soldering technology terminal conducting resistance is lower than aluminium wire weld interface conducting resistance 5-10 times.And the pad that ultrasonic terminal soldering technology is formed, because not Presence of an interface state, interface contact resistance is 0, greatly reduces the resistance of electrode welding point.
Owing to adopting ultrasonic welding technique, thus in welding body, there is not weld interface, welding material combines together, and very firmly, solder joint shearing force is greater than 300N (300 Ns); Be far longer than the weld strength of conventional art module, reliability significantly improves, and the life-span is longer.
Covering copper circuit board 103 can be specifically cover copper pottery DBC plate.The front and back of DBC plate is all attached with the solid Copper Foil of one deck, plays the effect of conductive and heat-conductive simultaneously.DBC plate is loaded with bridge circuit; Preferably, this bridge circuit is made up of chip.Leave the extraction welding region of associated metal electrode at the marginal position of DBC plate, by ultrasonic welding technique, the electrode welding portion by metal electrode welds with the copper product in territory, respective lands.Preferably, the copper foil material covering the welding region of copper circuit board can be specifically copper.
Such as, in the power model as shown in Fig. 2 a, 2b, metal base plate 203 is and covers copper circuit board 103, it is rectangle structure, is copper nickel-plated metal, and there are four circular holes corner as fixing installing hole, after the assemblies such as M5 or M6 screw and radiator can be adopted fixing, be placed in lower cover 201.Outside lower cover 201, the operation hole of three asymmetric semi-circular recesses 218,219,220 is designed on the both sides being positioned at metal base plate 203 (covering copper circuit board), work top fixes this power model, because this power model is symmetrical design, so these three asymmetric operation holes prevent from misplacing dress function in addition.Meanwhile, lower cover 201 inside, along two long limits of metal base plate (covering copper circuit board), is designed with multiple rectangular recess 221, and the effect of these grooves reduces the shrinkage stress in injection molding process, can reduce material stress simultaneously.Fillet process is all done in all corners of power model, and this design can make the product demoulding smoothly in process of production, can promote degree of being designed beautifully and touch feeling again; And, can realizing with shrinking the larger PET material of no-load voltage ratio, also realize with shrinking the smaller PBT material of no-load voltage ratio.
Above-mentioned upper cover plate 202 is by thermoplastic injection mo(u)ldings such as PET or PBT, is filleted corner square structure, Central Symmetry.
Above-mentioned power model can be specifically MOSFET module, IGBT module or diode (led) module, and its method for packing, idiographic flow as shown in Figure 3, comprises the steps:
S301: metal electrode 102 is run through the module housing main body 101 being fixed on power model.
In this step, injection moulding condensation process is adopted to be fixed in the module housing main body 101 of power model by metal electrode 102, and make metal electrode 102 run through module housing main body 101, extend to outside power model, so that be connected with the circuit outside power model; Meanwhile, metal electrode 102 extends to and covers copper circuit board 103 in described power model so that with cover copper circuit board 103 and weld.
S302: by the electrode welding portion of metal electrode 102 by ultrasonic welding technique with cover copper circuit board 103 and be welded as a whole.
Particularly, the soldering tip of ultrasonic brazing unit is pressed on the electrode welding portion of metal electrode 102, after electrode welding portion is contacted with the welding region covering copper circuit board, produce dither, and then make the contact-making surface of two articles produce dither and the friction of atom level, and then produce the instantaneous high-temperature of local, the surfacing of contact-making surface is melted rapidly, after applying certain pressure, the material of two surface meltings can interpenetrate to the other side, is fused into one.
Preferably, consider in supersonic welding termination process, mechanical oscillation are on the impact covering device on copper circuit board, and ensure welding quality again, the technological parameter of the ultra-sonic welded adopted in technical solution of the present invention comprises: 1. power bracket 800W-3.5KW (800 watts-3.5 kilowatts) simultaneously; 2. energy 60J-200J (60 burnt-200 is burnt); 3. pressure limit 50N-100N (50 Ns-100 Ns); 4. amplitude 30um-70um (30 microns-70 microns); 5. time 0.5s-1s (0.5 second-1 second).
Apply the technological parameter of above-mentioned ultra-sonic welded, the good welds that can ensure electrode and cover between copper circuit board, in the scope simultaneously making mechanical oscillation be in cover copper circuit board and device thereof to bear, avoid the damage of circuit.
Owing to adopting ultrasonic welding technique, thus in welding body, there is not weld interface, welding material combines together, and very firmly, solder joint shearing force is greater than 300N; Be far longer than the weld strength of conventional art module, reliability significantly improves, and the life-span is longer.Tradition aluminium wire keying posts technology modules is subject to temperature cycles, the impacts such as power cycle.Usually make pad interfacial fatigue, occur the phenomenons such as aluminium wire ruptures, electrode terminal comes off.The terminal of ultra-sonic welded, there will not be above problem.The reliability of power model is significantly improved, and the life-span increases by 500 above.Substantially increase the firm of electrode welding point and reliability.
And Ultrasonic welding processes can remove the oxide layer of welding material contact-making surface automatically, ultrasonic welding process is an of short duration high frequency friction process, also can be removed by friction, do not affect welding quality even if welding material surface exists oxide layer.The soldering method of foregoing description and aluminium wire bonding method, the oxide layer all by welding material surface limits.
Ultrasonic terminal soldering technical efficiency is very high, and a solder joint welding only needs 1s to complete, and add the work such as preparation for journey, 5s can complete the welding of a solder joint; And the module of aluminium wire welding machine technology is owing to will reduce weld interface conducting resistance, each power electrode terminal often needs to weld tens of aluminium wires, very loaded down with trivial details.The production efficiency of ultrasonic terminal soldering module improves about 10 times than traditional aluminium wire terminal soldering module.
S303: the overall package completing power model.
Particularly, be assemblied in covering copper circuit board in the module housing part of power model, and by module housing part and the supporting installation of module housing main body 101, realize the overall package of power model.
To sum up, in technical scheme of the present invention, owing to adopting ultrasonic welding technique, thus in welding body, there is not weld interface, welding material combines together, and very firmly, solder joint shearing force is greater than 300N; Be far longer than the weld strength of conventional art module, reliability significantly improves, and the life-span is longer.Tradition aluminium wire keying posts technology modules is subject to temperature cycles, the impacts such as power cycle.Usually make pad interfacial fatigue, occur the phenomenons such as aluminium wire ruptures, electrode terminal comes off.The terminal of ultra-sonic welded, there will not be above problem.The reliability of power model is significantly improved, and the life-span increases by 500 above.Substantially increase the firm of electrode welding point and reliability.
And Ultrasonic welding processes can remove the oxide layer of welding material contact-making surface automatically, ultrasonic welding process is an of short duration high frequency friction process, also can be removed by friction, do not affect welding quality even if welding material surface exists oxide layer.The soldering method of foregoing description and aluminium wire bonding method, the oxide layer all by welding material surface limits.
Further, the pad that ultrasonic terminal soldering technology is formed, because not Presence of an interface state, interface contact resistance is 0, greatly reduces the resistance of electrode welding point.
Further, in ultrasonic terminal soldering technology, solder side directly by electrode electrode welding portion with cover the area that copper circuit board contacts and determine, effective area is large, but does not take up room, and thus conducting resistance is extremely low.The module of aluminium wire bonding techniques, because the equivalent bonding area of aluminium wire is very little, so conducting resistance is very large, even if weld tens of aluminium wires simultaneously, conducting resistance still can not be ignored.Ultrasonic terminal soldering technology terminal conducting resistance is lower than aluminium wire weld interface conducting resistance 5-10 times.
Further, ultrasonic terminal soldering technical efficiency is very high, and a solder joint welding only needs 1s to complete, and add the work such as preparation for journey, 5s can complete the welding of a solder joint; And the module of aluminium wire welding machine technology is owing to will reduce weld interface conducting resistance, each power electrode terminal often needs to weld tens of aluminium wires, very loaded down with trivial details.The production efficiency of ultrasonic terminal soldering module improves about 10 times than traditional aluminium wire terminal soldering module.
Those skilled in the art, at consideration specification and after putting into practice invention disclosed herein, will easily expect other embodiment of the present invention.The application is intended to contain any modification of the present invention, purposes or adaptations, and these modification, purposes or adaptations are followed general principle of the present invention and comprised the undocumented common practise in the art of the disclosure or conventional techniques means.Specification and embodiment are only regarded as exemplary, and true scope of the present invention and spirit are pointed out by claim below.
Should be understood that, the present invention is not limited to precision architecture described above and illustrated in the accompanying drawings, and can carry out various amendment and change not departing from its scope.Scope of the present invention is only limited by appended claim.
Claims (10)
1. a power model, comprising: module housing main body, carry modular circuit cover copper circuit board, it is characterized in that, also comprise: run through the metal electrode being fixed on described module housing main body;
Wherein, described metal electrode comprises: extend the electrode contact outside described power model, and in described power model, extend to the electrode welding portion covering copper circuit board;
The metal in described electrode welding portion is welded as a whole by ultrasonic welding technique and the described Copper Foil covering copper circuit board.
2. power model as claimed in claim 1, it is characterized in that, described metal electrode is specially power electrode, or control electrode.
3. power model as claimed in claim 1, it is characterized in that, described module housing main body is thermoplastic resin material, and described metal electrode is run through by injection moulding condensation process to be fixed on described module housing main body.
4. power model as claimed in claim 1, it is characterized in that, described electrode welding portion is specially step shape, comprising: with the described sheet metal covering copper circuit board and parallel, and be connected to the support metal body of electrode contact from described sheet metal.
5. power model as claimed in claim 4, is characterized in that, the shape of described sheet metal is specially square, circular or dome is square.
6. power model as claimed in claim 4, it is characterized in that, the area of described sheet metal is 4cm
2-16cm
2.
7. power model as claimed in claim 1, is characterized in that, also comprise: upper cover plate and lower cover; Wherein, described upper cover plate is one with the square resin cover plate of circular arc of draw-in groove, and cover the inner all exposed electrodes of lower cover and internal circuit, described module housing main body is arranged between described upper and lower cover plate;
Described upper cover plate is provided with the top of power input or power take-off;
The bottom of power input or power take-off is provided with in described lower cover;
The electrode hole of the electrode hole on the top of described power input and the bottom of this power input is through;
The electrode hole of the electrode hole on the top of described power take-off and the bottom of this rate output is through;
Described electrode hole is as the electrode contact extended outside described power model of described metal electrode.
8. power model as claimed in claim 7, it is characterized in that, described power input is the metal electrode of embedded diplopore, and described power take-off is the metal electrode of embedded single hole.
9. power model as claimed in claim 7, is characterized in that, described in cover copper circuit board and be placed in described lower cover.
10. a method for packing for power model, is characterized in that, comprising:
Metal electrode is run through the module housing main body being fixed on described power model; Wherein, described metal electrode comprises: extend the electrode contact outside described power model, and in described power model, extend to the electrode welding portion covering copper circuit board of described power model;
Described electrode welding portion is welded as a whole by ultrasonic welding technique and the described copper circuit board that covers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510923764.2A CN105405820B (en) | 2015-12-14 | 2015-12-14 | A kind of power module and its packaging method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510923764.2A CN105405820B (en) | 2015-12-14 | 2015-12-14 | A kind of power module and its packaging method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105405820A true CN105405820A (en) | 2016-03-16 |
| CN105405820B CN105405820B (en) | 2018-06-26 |
Family
ID=55471217
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510923764.2A Active CN105405820B (en) | 2015-12-14 | 2015-12-14 | A kind of power module and its packaging method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105405820B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106533133A (en) * | 2016-12-01 | 2017-03-22 | 南通沃特光电科技有限公司 | Packaging method of high-voltage frequency converter power unit |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102800833A (en) * | 2012-08-31 | 2012-11-28 | 江苏宏微科技股份有限公司 | Electrode terminal of power module and welding method thereof |
| CN103779305A (en) * | 2014-01-24 | 2014-05-07 | 嘉兴斯达微电子有限公司 | Metal connecting piece and power semiconductor module |
| CN103928447A (en) * | 2013-01-14 | 2014-07-16 | 内蒙航天动力机械测试所 | Large-power full-airtight semiconductor module packaging structure |
| CN205231047U (en) * | 2015-12-14 | 2016-05-11 | 北京晶川电子技术发展有限责任公司 | Power module |
-
2015
- 2015-12-14 CN CN201510923764.2A patent/CN105405820B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102800833A (en) * | 2012-08-31 | 2012-11-28 | 江苏宏微科技股份有限公司 | Electrode terminal of power module and welding method thereof |
| CN103928447A (en) * | 2013-01-14 | 2014-07-16 | 内蒙航天动力机械测试所 | Large-power full-airtight semiconductor module packaging structure |
| CN103779305A (en) * | 2014-01-24 | 2014-05-07 | 嘉兴斯达微电子有限公司 | Metal connecting piece and power semiconductor module |
| CN205231047U (en) * | 2015-12-14 | 2016-05-11 | 北京晶川电子技术发展有限责任公司 | Power module |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106533133A (en) * | 2016-12-01 | 2017-03-22 | 南通沃特光电科技有限公司 | Packaging method of high-voltage frequency converter power unit |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105405820B (en) | 2018-06-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105765716B (en) | Power semiconductor modular and composite module | |
| JP5076440B2 (en) | Semiconductor device and manufacturing method of semiconductor device | |
| CN103035542B (en) | Method for producting a power semiconductor arrangement | |
| EP3118896B1 (en) | Semiconductor device | |
| JP6686691B2 (en) | Electronic device | |
| CN105304591A (en) | Double sided cooling chip package and method of manufacturing the same | |
| CN105655306A (en) | Double-side welding and single-side heat radiation power module integrated on heat radiation substrate | |
| JP6485397B2 (en) | Electronic device and manufacturing method thereof | |
| WO2018181727A1 (en) | Semiconductor device and manufacturing method therefor, and power conversion device | |
| CN111048499B (en) | Micro light-emitting diode display panel and preparation method thereof | |
| CN109713912B (en) | Power integration module for air conditioner and method of manufacturing the same | |
| JP6226068B2 (en) | Semiconductor device | |
| JP5935374B2 (en) | Manufacturing method of semiconductor module | |
| CN205231047U (en) | Power module | |
| CN103715106B (en) | The manufacture method of a kind of SPM and SPM | |
| JP2010092918A (en) | Connection structure and connection method between plate type electrode and block type electrode | |
| JP2010098036A (en) | Resin case and method of manufacturing the same | |
| JPWO2019194272A1 (en) | Semiconductor device, power conversion device, and manufacturing method of semiconductor device | |
| CN105405820A (en) | Power module and packaging method therefor | |
| CN109546871B (en) | Power integration module for air conditioner and method of manufacturing the same | |
| JP2015015335A (en) | Semiconductor device | |
| KR102100859B1 (en) | Dual side cooling power module and manufacturing method of the same | |
| JP2014027324A (en) | Semiconductor device and method of manufacturing semiconductor device | |
| CN103367305A (en) | Electric connection structure of IGBT (Insulated Gate Bipolar Transistor) device | |
| CN106920793B (en) | Intelligent power module, preparation method of intelligent power module and electric equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |