CN105405820B - A kind of power module and its packaging method - Google Patents
A kind of power module and its packaging method Download PDFInfo
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- CN105405820B CN105405820B CN201510923764.2A CN201510923764A CN105405820B CN 105405820 B CN105405820 B CN 105405820B CN 201510923764 A CN201510923764 A CN 201510923764A CN 105405820 B CN105405820 B CN 105405820B
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- 238000000034 method Methods 0.000 title claims abstract description 64
- 238000004806 packaging method and process Methods 0.000 title abstract description 8
- 238000003466 welding Methods 0.000 claims abstract description 120
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 58
- 229910052751 metal Inorganic materials 0.000 claims abstract description 58
- 239000002184 metal Substances 0.000 claims abstract description 58
- 229910052802 copper Inorganic materials 0.000 claims abstract description 52
- 239000010949 copper Substances 0.000 claims abstract description 52
- 239000011889 copper foil Substances 0.000 claims abstract description 6
- 239000000463 material Substances 0.000 claims description 26
- 230000008569 process Effects 0.000 claims description 16
- 238000013461 design Methods 0.000 claims description 5
- 230000005611 electricity Effects 0.000 claims description 5
- 238000009833 condensation Methods 0.000 claims description 3
- 230000005494 condensation Effects 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 239000007772 electrode material Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005992 thermoplastic resin Polymers 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 239000004411 aluminium Substances 0.000 description 37
- 229910052782 aluminium Inorganic materials 0.000 description 37
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 37
- 238000005516 engineering process Methods 0.000 description 16
- 229910000679 solder Inorganic materials 0.000 description 10
- 238000005476 soldering Methods 0.000 description 10
- 229920001707 polybutylene terephthalate Polymers 0.000 description 5
- 238000001746 injection moulding Methods 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 238000010008 shearing Methods 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 230000005669 field effect Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000003446 ligand Substances 0.000 description 2
- 230000010358 mechanical oscillation Effects 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000003044 adaptive effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000015271 coagulation Effects 0.000 description 1
- 238000005345 coagulation Methods 0.000 description 1
- 239000000571 coke Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000004021 metal welding Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
- H01L21/607—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving the application of mechanical vibrations, e.g. ultrasonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
The invention discloses a kind of power module and its packaging method, wherein, the power module includes：Module housing main body, carry modular circuit cover copper circuit board, which is characterized in that further include：Through the metal electrode for being fixed on the module housing main body；Wherein, the metal electrode includes：It extends the electrode contact outside the power module and the electrode welding portion of covering copper circuit board is extended in the power module；The metal in the electrode welding portion is welded as a whole by ultrasonic welding technique and the copper foil for covering copper circuit board.With the application of the invention, can ensure the secured and reliability of the pad of power module, while simplify technique, improve the production efficiency of power module, and save power module inner space, in favor of the miniaturization of power module.
Description
Technical field
The present invention relates to electronic technology field, specifically, the present invention relates to a kind of power module and its packaging methods.
Background technology
Power module be power power electronic device by certain function combine embedding into module.Common power module
Including, metal oxide layer-semiconductor-field-effect transistor, abbreviation metal-oxide half field effect transistor (Metal-Oxide-
Semiconductor Field-Effect Transistor, MOSFET) module, IGBT (Insulated Gate Bipolar
Transistor, insulated gate bipolar transistor) module, diode (led) module etc..
In the encapsulation technology of conventional power module, what middle low power module electrodes used is mostly common soldering process.
But the mutual contact mode of traditional middle low power soldering process, tin welding spot contact material resistivity is high, and material contacting surface is different materials
Matter is very easy to layering, comes off, leads to the secured low with reliability of pad.
To ensure the secured and reliability of electrode welding point, middle high power module generally uses aluminium wire bonding technology.Aluminium wire
Welding procedure is realized by the following manner：In module frame injection molding, by the power terminal of electrode and control terminal one
And be molded into module frame, and barish metal island is reserved inside module frame, it is bonded to module for aluminium wire
Interior circuit.
But it was found by the inventors of the present invention that due in middle high power module electric current it is bigger, the area of metal island needs
Sufficiently large space to be reserved to bind more even tens of aluminium wires, realizes that technique is very cumbersome, production efficiency is very low, and
And due to needing to reserve sufficiently large space for metal island, it is unfavorable for the miniaturization production of power module.
Invention content
The embodiment of the present invention is directed to the shortcomings that existing power module, proposes a kind of power module and its packaging method, uses
To ensure the secured and reliability of the pad of power module, while simplify technique, improve the production efficiency of power module, and save
Power module inner space is saved, in favor of the miniaturization of power module.
The embodiment of the present invention provides a kind of power module according on one side, including：Module housing main body is welded with
Modular circuit covers copper circuit board, which is characterized in that further includes：Through the metal electrode for being fixed on the module housing main body；
Wherein, the metal electrode includes：It extends the electrode contact outside the power module and prolongs in the power module
Extend to the electrode welding portion for covering copper circuit board；The metal in the electrode welding portion covers copper electricity by ultrasonic welding technique with described
The copper foil of road plate is welded as a whole.
The embodiment of the present invention additionally provides a kind of packaging method of power module according on the other hand, including：By metal
Electrode runs through the module housing main body for being fixed on the power module；Wherein, the metal electrode includes：Extend the power
Electrode contact outside module and the electrode for the covering copper circuit board weldering that the power module is extended in the power module
Socket part；The electrode welding portion is welded as a whole by ultrasonic welding technique and the copper circuit board that covers.
In technical scheme of the present invention, due to using ultrasonic welding technique, so as to which in welding body, there is no welding circles
Face, welding material combine together, and very securely, solder joint shearing force is more than 300N；The welding for being far longer than traditional technology module is strong
Degree, reliability greatly improve, longer life expectancy.Traditional aluminium wire keying posts technology modules are by influences such as temperature cycles, power cycles.
Usually make pad interfacial fatigue, phenomena such as aluminium wire is broken, electrode terminal comes off occur.The terminal of ultrasonic welding is not in
Problem above.Greatly improve the reliability of power module, more than the service life increases by 500.Substantially increase the jail of electrode welding point
Gu and reliability.
Moreover, Ultrasonic welding processes can automatically remove the oxide layer of welding material contact surface, ultrasonic welding process is one
Of short duration high frequency friction process even if welding material surface can also be removed there are oxide layer by friction, does not influence welding quality.Before
The soldering method to continue and aluminium wire bonding method are given an account of, is all limited by the oxide layer on welding material surface.
Further, the pad that ultrasonic terminal welding technique is formed, because there is no interfacial state, interface contact resistance 0,
Greatly reduce the resistance of electrode welding point.
Further, in ultrasonic terminal welding technique, welding surface is directly by the electrode welding portion of electrode with covering copper circuit board phase
The area of contact determines that effective area is big, but is not take up space, thus conducting resistance is extremely low.The module of aluminium wire bonding techniques, by
In the equivalent bonding area very little of aluminium wire, so conducting resistance is very big, even weld tens of aluminium wires simultaneously, conducting resistance according to
Cannot so it ignore.Ultrasonic terminal welding technique terminal conducting resistance is 5-10 times lower than aluminium wire weld interface conducting resistance；
Further, ultrasonic terminal welding technique efficiency is very high, and a solder joint welding only needs 1s can be completed, in addition row
Work, the 5s such as journey preparation can complete the welding of a solder joint；And the module of aluminium wire welding machine technology is led due to weld interface to be reduced
Be powered resistance, and each power electrode terminal is often required for welding tens of aluminium wires, very cumbersome.The life of ultrasonic terminal welding module
It produces efficiency and improves 10 times or so than traditional aluminium wire terminal soldering connection module.
Description of the drawings
It in order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to institute in embodiment
Attached drawing to be used is needed to be briefly described, it should be apparent that, the accompanying drawings in the following description is only some implementations of the present invention
Example, for those of ordinary skill in the art, without creative efforts, can also obtain according to these attached drawings
Obtain other attached drawings.
Fig. 1 shows the structure diagram inside power module of the embodiment of the present invention；
Fig. 2 a, 2b show a power module concrete structure schematic diagram of the embodiment of the present invention；
Fig. 3 shows the packaging method flow chart of power module of the embodiment of the present invention.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete
Whole description, it is clear that described embodiment is only part of the embodiment of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other without creative efforts
Embodiment shall fall within the protection scope of the present invention.
Those skilled in the art of the present technique are appreciated that unless expressly stated, singulative " one " used herein, " one
It is a ", " described " and "the" may also comprise plural form.It is to be further understood that is used in the specification of the present invention arranges
Diction " comprising " refers to there are the feature, integer, step, operation, element and/or component, but it is not excluded that presence or addition
Other one or more features, integer, step, operation, element, component and/or their group.It should be understood that when we claim member
Part is " connected " or during " coupled " to another element, it can be directly connected or coupled to other elements or there may also be
Intermediary element.In addition, " connection " used herein or " coupling " can include wireless connection or wireless coupling.It is used herein to arrange
Take leave whole or any cell and all combination of the "and/or" including one or more associated list items.
Those skilled in the art of the present technique are appreciated that unless otherwise defined all terms used herein are (including technology art
Language and scientific terminology), there is the meaning identical with the general understanding of the those of ordinary skill in fields of the present invention.Should also
Understand, those terms such as defined in the general dictionary, it should be understood that have in the context of the prior art
The consistent meaning of meaning, and unless by specific definitions as here, the meaning of idealization or too formal otherwise will not be used
To explain.
The present inventor is it is considered that when encapsulating power module, using ultrasonic welding technique.Ultrasonic bonding
Principle：When ul-trasonic irradiation is in thermoplasticity object, ultrasonic wave can be transmitted on thermoplasticity object, and it is made to generate high frequency vibrating
It is dynamic.After this object is contacted with welding object object, the contact surface of two articles can generate high-frequency vibration and the friction of atom level, into
And generate the instantaneous high-temperature of part.The surfacing of contact surface is made to melt rapidly, after certain pressure is applied, two surfaces are melted
The substance of change can interpenetrate to other side, be fused into one.After ultrasonic wave transmission is stopped, the atom of thermoplastic substance or molecule weight
New coagulation forming, material is thus formed firm combinations, realize material welding.The welding region that ultrasonic bonding is formed, does not have
There is a weld interface, intensity is close to the intensity of raw material.
Ultrasonic bonding is suitable for the welding between plastics, the welding being also applied between various of the same race and dissimilar metal, plastics
Welding has been widely used in various fields.Metal welding is also only limited to the mutual of various metal wires and battery pole piece etc. at present
Connection welding.
Based on this, technical scheme of the present invention realizes inside modules electrode bind mode by ultrasonic welding technique：Work(
The metal electrode of rate module is injected into one-pass molding in the module housing main body of power module.Moreover, metal electrode is in power
Bearer circuit in electrode welding portion and power module is covered copper by inside modules extraction electrode weld part by ultrasonic welding machine
Circuit board is welded.Due to being frozen into again by ultrasonic bonding, electrode and the atom or molecule that cover between copper circuit board
Type forms firm combination, substantially increases the secured and reliability of welding.Simultaneously ultrasonic welding technique it is simple for process,
It is easy to automatic assembly line production, the production efficiency of power module can be improved.
Moreover, the module of the aluminium wire bonding techniques of the prior art, since metal island takes up space greatly, and the equivalent weldering of aluminium wire
Junction accumulates very little, so both having occupied many module interior spaces, and conducting resistance is very big, even welds tens of aluminium simultaneously
Silk, conducting resistance cannot still be ignored；And in technical solution of the present invention, copper electricity directly by electrode welding portion and is covered in electrode welding face
The area of the contact surface of road plate determines that effective area is big, and conducting resistance is extremely low, while occupies module interior space very little, is conducive to
The miniaturization of power module.
The technical solution of the embodiment of the present invention is illustrated below in conjunction with the accompanying drawings.
A kind of power module provided in an embodiment of the present invention, internal structure as shown in Figure 1, including：Module housing main body
101st, through being fixed on the metal electrode 102 of the module housing main body, cover copper circuit board 103.
Wherein, module housing main body 101 can be specifically thermoplastic resin material.
Metal electrode is specifically run through and is fixed in module housing main body 101 using injection condensation process, including：It extends
Electrode contact outside the power module and the electrode welding for covering copper circuit board 103 is extended in the power module
Portion.Preferably, metal electrode material can be specifically copper, nickel-clad copper or silver-plated copper.
For example, the metal electrode of power module can be specifically coordination electrode 1021, the external driving control of electrode contact
Circuit processed, electrode welding portion, which is welded in, covers copper circuit board 103.
Alternatively, the metal electrode of power module can be specifically power electrode 1022, it is responsible for the input and output of power current,
For its electrode contact to be connected with the circuit outside power module, electrode welding portion, which is welded in, covers copper circuit board 103.
For example, Fig. 2 a, 2b show a specific power module architectures, frame includes：Upper cover plate 202, lower cover
201 and the module housing main body 101 (being not shown in module housing main body Fig. 2 a, 2b) that is set between the above, the lower lid.On
Cover board 202, lower cover 201 are by the warm such as PET (polyethylene terephthalate), PBT (polybutylene terephthalate (PBT))
Plastic material injection molding has metal electrode to be embedded in interior, symmetrical along Y-axis.Five rectangular lug bosses are set on upper cover plate 202
Divide, be the top 204,205 of two power inputs of module respectively, the power input is the metal electricity for being embedded with diplopore
There are one, M5 or M6 nuts in pole in each electrode hole, for the fixation of electrode and external module；It is additionally provided on upper cover plate 202
The top 206,207,208 of three power take-offs is wherein embedded with the metal electrode of single hole, have in similary each electrode hole M5 or
One, M6 nuts, for the fixation of electrode and external module.The rectangular resin cover board of circular arc that upper cover plate carries card slot for one, covering
All exposed electrodes and internal circuit inside lower cover.
The substructure being located in lower cover 201 of the power input of module and power take-off respectively as Fig. 2 a,
In 2b 209,210,211,212,213 shown in；Wherein, the electrode hole positioned at the top of the power input of upper cover plate is with being located at
The electrode hole of the lower part of the power input in lower cover connects；Equally, positioned at the top of the power take-off of upper cover plate
Electrode hole and the electrode hole of lower part of the power take-off in the lower cover connect.Power input is located at upper cover
The electrode hole of plate, as the electrode contact extended outside power module of metal electrode, and power input runs through module
Housing main body 101 extends to the part for covering copper circuit board 103 as electrode welding portion in power module.Equally, power output
The electrode hole positioned at upper cover plate at end, as the electrode contact extended outside power module of metal electrode, and power is defeated
Outlet runs through module housing main body 101, and the part for covering copper circuit board 103 is extended in power module as electrode welding portion.
The substructure of power input and power take-off surrounds one by the hollow square cylindrical bodies of an oblique angle section
A cylindrical structure composition, interior cylinder is hollow design, and there is hexagonal groove in inside, and metal nuts are placed in inside.
Six groups of acicular terminals 230, every group of two acicular terminals are shared on the upper cover plate of power module as shown in Fig. 2 a, 2b
230 composition, be power module coordination electrode, external PCB driving plates.
Preferably, the electrode welding portion of metal electrode is bent, footrest shape as shown in Figure 1 is formed, in order to covering
Copper circuit board 103 is welded.In fact, the electrode welding portion of footrest shape includes the gold parallel with covering copper circuit board 103
Belong to piece, further include the support metallic object that electrode contact is connected to from the sheet metal；The shape of the sheet metal can be it is rectangular,
Round or dome is rectangular, area 4cm2-16cm2；The support metallic object can be forniciform or straight, ability
Field technique personnel can be designed according to the concrete structure of power module inner space.
In the electrode welding portion of metal electrode 102, area that welding surface is directly in contact by sheet metal with covering copper circuit board
It determines, effective area is big, but is not take up space, thus conducting resistance is extremely low.The module of aluminium wire bonding techniques, due to aluminium wire etc.
Bonding area very little is imitated, so conducting resistance is very big, even welds tens of aluminium wires simultaneously, conducting resistance cannot still neglect
Slightly.Ultrasonic terminal welding technique terminal conducting resistance is 5-10 times lower than aluminium wire weld interface conducting resistance.Moreover, ultrasonic terminal soldering
The pad that connection technology is formed, because there is no interfacial state, interface contact resistance 0 greatly reduces the electricity of electrode welding point
Resistance.
Due to using ultrasonic welding technique, so as to which in welding body, there is no weld interface, welding material combines together,
Very securely, solder joint shearing force is more than 300N (300 Ns)；It is far longer than the weld strength of traditional technology module, reliability is substantially
It improves, longer life expectancy.
It can be specifically to cover copper ceramics DBC plates to cover copper circuit board 103.The front and back of DBC plates be all attached with one layer it is solid
Copper foil, while play the role of conductive and heat-conductive.DBC plates are loaded with bridge circuit；Preferably, the bridge circuit is made of chip.
DBC plates marginal position there are associated metal electrode extraction welding region, by ultrasonic welding technique by metal electrode
Electrode welding portion and the copper product in respective lands domain welded.Preferably, cover the copper foil of the welding region of copper circuit board
Material can be specifically copper.
For example, in power module as shown in Fig. 2 a, 2b, metal base plate 203 is to cover copper circuit board 103, is rectangular
Shape structure, is copper nickel-plated metal, and there are four circular hole, as fixation mounting hole, M5 or M6 screws and radiator etc. can be used in quadrangle
After component is fixed, it is placed in lower cover 201.201 outside of lower cover, positioned at the both sides of metal base plate 203 (covering copper circuit board)
The operation hole of three asymmetric semi-circular recesses 218,219,220 is designed, the power module is fixed on work top, due to
The power module is symmetrical design, prevents from misplacing dress function so this three asymmetric operation holes also have.Meanwhile lower cover
Along two long sides of metal base plate (covering copper circuit board) inside 201, it is designed with multiple rectangular recess 221, the work of these grooves
With being the shrinkage stress that reduces in injection molding process, while material stress can be reduced.All corners of power module are whole
Fillet processing is done, this design can make product smoothly demould and be promoted in process of production degree of being designed beautifully and touch feeling；
Moreover, the PET material shunk and become bigger can be used to realize, can also be realized with the smaller PBT material of no-load voltage ratio is shunk.
Above-mentioned upper cover plate 202 is by the thermoplastic materials injection molding such as PET or PBT, for filleted corner square structure, center
Symmetrically.
Above-mentioned power module can be specifically MOSFET modules, IGBT module or diode (led) module, and packaging method has
Body flow is as shown in figure 3, include the following steps：
S301：Metal electrode 102 is run through to the module housing main body 101 for being fixed on power module.
In this step, metal electrode 102 is fixed on to the module housing main body 101 of power module using injection condensation process
In, and metal electrode 102 through module housing main body 101, is extended to outside power module, in order to outside power module
Circuit is attached；Meanwhile metal electrode 102 extends in the power module and covers copper circuit board 103, in order to covering copper
Circuit board 103 welds.
S302：The electrode welding portion of metal electrode 102 is welded as by ultrasonic welding technique with covering copper circuit board 103
One.
Specifically, the soldering tip of ultrasonic brazing unit is pressed on to the electrode welding portion of metal electrode 102 so that electrode welds
After socket part is contacted with covering the welding region of copper circuit board, high-frequency vibration is generated, so that the contact surface of two articles generates atom
The high-frequency vibration of grade and friction, and then the instantaneous high-temperature of part is generated, the surfacing of contact surface is made to melt rapidly, is applying one
After fixed pressure, the substance of two surface meltings can interpenetrate to other side, be fused into one.
Preferably, in view of during ultrasonic bonding, mechanical oscillation are to covering the influence of device on copper circuit board, while again
Ensure welding quality, the technological parameter of the ultrasonic welding used in technical solution of the present invention includes：1. power bracket 800W-
3.5KW (800 watts -3.5 kilowatts)；2. energy 60J-200J (60 cokes -200 are burnt)；3. (50 N -100 of pressure limit 50N-100N
Ox)；4. amplitude 30um-70um (30 microns -70 microns)；5. time 0.5s-1s (- 1 second 0.5 second).
Using the technological parameter of above-mentioned ultrasonic welding, it is ensured that electrode and the good welds between copper circuit board are covered,
Simultaneously so that mechanical oscillation, which are in, covers copper circuit board and its in the range of device can bear, the damage of circuit is avoided.
Due to using ultrasonic welding technique, so as to which in welding body, there is no weld interface, welding material combines together,
Very securely, solder joint shearing force is more than 300N；It is far longer than the weld strength of traditional technology module, reliability greatly improves, the longevity
It orders longer.Traditional aluminium wire keying posts technology modules are by influences such as temperature cycles, power cycles.Usually make pad interface tired
There is phenomena such as aluminium wire is broken, electrode terminal comes off in labor.The terminal of ultrasonic welding is not in problem above.Make power module
Reliability greatly improve, more than the service life increases by 500.Substantially increase the secured and reliability of electrode welding point.
Moreover, Ultrasonic welding processes can automatically remove the oxide layer of welding material contact surface, ultrasonic welding process is one
Of short duration high frequency friction process even if welding material surface can also be removed there are oxide layer by friction, does not influence welding quality.Before
The soldering method to continue and aluminium wire bonding method are given an account of, is all limited by the oxide layer on welding material surface.
Ultrasonic terminal welding technique efficiency is very high, and a solder joint welding only needs 1s can be completed, in addition preparation for journey
Work are waited, 5s can complete the welding of a solder joint；And the module of aluminium wire welding machine technology is due to weld interface conducting resistance to be reduced,
Each power electrode terminal is often required for welding tens of aluminium wires, very cumbersome.The production efficiency of ultrasonic terminal welding module
10 times or so are improved than traditional aluminium wire terminal soldering connection module.
S303：Complete the overall package of power module.
Specifically, copper circuit board will be covered to be assemblied in the module housing ligand of power module, and by module housing ligand with
The overall package of power module is realized in the 101 mating installation of module housing main body.
To sum up, in technical scheme of the present invention, due to using ultrasonic welding technique, so as to which in welding body, there is no welderings
Border face, welding material combine together, and very securely, solder joint shearing force is more than 300N；It is far longer than the weldering of traditional technology module
Intensity is connect, reliability greatly improves, longer life expectancy.Traditional aluminium wire keying posts technology modules are by temperature cycles, power cycle etc.
It influences.Usually make pad interfacial fatigue, phenomena such as aluminium wire is broken, electrode terminal comes off occur.The terminal of ultrasonic welding, will not
There is problem above.Greatly improve the reliability of power module, more than the service life increases by 500.Substantially increase electrode welding point
Secured and reliability.
Moreover, Ultrasonic welding processes can automatically remove the oxide layer of welding material contact surface, ultrasonic welding process is one
Of short duration high frequency friction process even if welding material surface can also be removed there are oxide layer by friction, does not influence welding quality.Before
The soldering method to continue and aluminium wire bonding method are given an account of, is all limited by the oxide layer on welding material surface.
Further, the pad that ultrasonic terminal welding technique is formed, because there is no interfacial state, interface contact resistance 0,
Greatly reduce the resistance of electrode welding point.
Further, in ultrasonic terminal welding technique, welding surface is directly by the electrode welding portion of electrode with covering copper circuit board phase
The area of contact determines that effective area is big, but is not take up space, thus conducting resistance is extremely low.The module of aluminium wire bonding techniques, by
In the equivalent bonding area very little of aluminium wire, so conducting resistance is very big, even weld tens of aluminium wires simultaneously, conducting resistance according to
Cannot so it ignore.Ultrasonic terminal welding technique terminal conducting resistance is 5-10 times lower than aluminium wire weld interface conducting resistance.
Further, ultrasonic terminal welding technique efficiency is very high, and a solder joint welding only needs 1s can be completed, in addition row
Work, the 5s such as journey preparation can complete the welding of a solder joint；And the module of aluminium wire welding machine technology is led due to weld interface to be reduced
Be powered resistance, and each power electrode terminal is often required for welding tens of aluminium wires, very cumbersome.The life of ultrasonic terminal welding module
It produces efficiency and improves 10 times or so than traditional aluminium wire terminal soldering connection module.
Those skilled in the art will readily occur to the present invention its after considering specification and putting into practice invention disclosed herein
Its embodiment.This application is intended to cover the present invention any variations, uses, or adaptations, these modifications, purposes or
Person's adaptive change follows the general principle of the present invention and including the undocumented common knowledge in the art of the disclosure
Or conventional techniques.Description and embodiments are considered only as illustratively, and true scope and spirit of the invention are by following
Claim is pointed out.
It should be understood that the invention is not limited in the precision architecture for being described above and being shown in the drawings, and
And various modifications and changes may be made without departing from the scope thereof.The scope of the present invention is only limited by appended claim.
Claims (10)
1. a kind of power module, including：Module housing main body, carry modular circuit cover copper circuit board, which is characterized in that also
Including：Through the metal electrode for being fixed on the module housing main body；The module housing main body is thermoplastic resin material, with
And the metal electrode is by being molded condensation process through being fixed on the module housing main body；
Wherein, the metal electrode includes：Extend electrode contact outside the power module and in the power module
Inside extend to the electrode welding portion for covering copper circuit board；
The metal in the electrode welding portion is welded as a whole by ultrasonic welding technique and the copper foil for covering copper circuit board；
The power module further comprises：Upper cover plate and lower cover；Wherein, the circular arc side that the upper cover plate carries card slot for one
Shape resin cover board, all exposed electrodes and internal circuit inside covering lower cover, the module housing main body be set to it is described it is upper,
Between lower cover；
The top of power input or power take-off is provided on the upper cover plate；
The lower part of power input or power take-off is provided in the lower cover；
The electrode hole on the top of the power input and the electrode hole of the lower part of the power input penetrate through；
The electrode hole on the top of the power take-off and the electrode hole of the lower part of the rate output terminal penetrate through；
The electrode contact that extends the power module outside of the electrode hole as the metal electrode；
Along two long sides for covering copper circuit board inside the lower cover, it is designed with multiple rectangular recess；
The substructure of the power input or the power take-off is surrounded by the hollow square cylindrical bodies of an oblique angle section
One cylindrical structure composition, the interior cylinder is hollow design, and there is hexagonal groove in inside, and metal nuts are placed in inside.
2. power module as described in claim 1, which is characterized in that the metal electrode is specially power electrode or control
Electrode.
3. power module as described in claim 1, which is characterized in that the electrode welding portion is specially footrest shape, including：
With the support metallic object for covering the parallel sheet metal of copper circuit board and electrode contact is connected to from the sheet metal.
4. power module as claimed in claim 3, which is characterized in that the shape of the sheet metal is specially rectangular, it is round or
Dome is rectangular.
5. power module as claimed in claim 4, which is characterized in that the area of the sheet metal is 4cm2-16cm2。
6. power module as claimed in claim 5, which is characterized in that the power input is the metal electricity of embedded diplopore
Pole, the power take-off are the metal electrode of embedded single hole.
7. power module as claimed in claim 6, which is characterized in that the copper circuit board that covers is placed in the lower cover.
8. power module as claimed in claim 7, which is characterized in that on the outside of the lower cover, positioned at covering the two of copper circuit board
There are three the operation holes of asymmetric semi-circular recesses for side design.
9. the power module as described in claim 1-8 is any, which is characterized in that the metal electrode material is specially：Copper, plating
Ambrose alloy or silver-plated copper；And the copper foil material is specially copper.
10. the power module as described in claim 1-8 is any, which is characterized in that the power module is specially MOSFET moulds
Block, IGBT module or diode (led) module.
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| CN201510923764.2A CN105405820B (en) | 2015-12-14 | 2015-12-14 | A kind of power module and its packaging method |
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|---|---|---|---|
| CN201510923764.2A CN105405820B (en) | 2015-12-14 | 2015-12-14 | A kind of power module and its packaging method |
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| CN105405820A CN105405820A (en) | 2016-03-16 |
| CN105405820B true CN105405820B (en) | 2018-06-26 |
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| CN106533133A (en) * | 2016-12-01 | 2017-03-22 | 南通沃特光电科技有限公司 | Packaging method of high-voltage frequency converter power unit |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102800833A (en) * | 2012-08-31 | 2012-11-28 | 江苏宏微科技股份有限公司 | Electrode terminal of power module and welding method thereof |
| CN103779305A (en) * | 2014-01-24 | 2014-05-07 | 嘉兴斯达微电子有限公司 | Metal connecting piece and power semiconductor module |
| CN103928447A (en) * | 2013-01-14 | 2014-07-16 | 内蒙航天动力机械测试所 | Large-power full-airtight semiconductor module packaging structure |
| CN205231047U (en) * | 2015-12-14 | 2016-05-11 | 北京晶川电子技术发展有限责任公司 | Power module |
-
2015
- 2015-12-14 CN CN201510923764.2A patent/CN105405820B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102800833A (en) * | 2012-08-31 | 2012-11-28 | 江苏宏微科技股份有限公司 | Electrode terminal of power module and welding method thereof |
| CN103928447A (en) * | 2013-01-14 | 2014-07-16 | 内蒙航天动力机械测试所 | Large-power full-airtight semiconductor module packaging structure |
| CN103779305A (en) * | 2014-01-24 | 2014-05-07 | 嘉兴斯达微电子有限公司 | Metal connecting piece and power semiconductor module |
| CN205231047U (en) * | 2015-12-14 | 2016-05-11 | 北京晶川电子技术发展有限责任公司 | Power module |
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| CN105405820A (en) | 2016-03-16 |
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