CN105397231B - A kind of scolding tin pre-heating mean - Google Patents
A kind of scolding tin pre-heating mean Download PDFInfo
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- CN105397231B CN105397231B CN201510832634.8A CN201510832634A CN105397231B CN 105397231 B CN105397231 B CN 105397231B CN 201510832634 A CN201510832634 A CN 201510832634A CN 105397231 B CN105397231 B CN 105397231B
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- solder
- preheating
- scolding tin
- tin
- temperature
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
- B23K3/047—Heating appliances electric
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- Engineering & Computer Science (AREA)
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
A kind of scolding tin pre-heating mean of the present invention,The present invention bonding wire include solder layer and be arranged its in scaling powder,It is applied carries out the pre-heat treatment before high temperature soldering iron scolding tin to solder,Solder can be made to become the software state after preheating by the solid state before preheating,After the scaling powder preheating internal with it of solder layer,Solder layer becomes software state by solid state,During high-temperature soldering,Soft solder layer alleviates the drastically expansive force of scaling powder,It reduces scaling powder moment heated fast in welding process and drastically expands the power that solder joint explosion occurs,Reduce solder joint explosion generation tin sweat(ing) to be splashed to electronical elements surface and cause the phenomenon of short circuit,Its time preheated,Temperature,The on or off of supply current and power supply can intelligentized control method according to the needs of production,Intellectualized operation degree is high,And the splashing amount of solder joint explosion time tin sweat(ing) can be controlled and reduced significantly,Operation is fool proof,The high yield rate of electronic component,Mass effect is good,Reduce production cost.
Description
Technical field
The present invention is applied carries out the technical field of the pre-heat treatment more particularly to a kind of weldering before high temperature soldering iron scolding tin to solder
Tin pre-heating mean.
Background technology
Traditional soldering tin technique due to solder contain fluxing agent, solder during scolding tin, scaling powder can moment to solder
High-temperature quick fusing point weldering is carried out, when scaling powder is in the state quickly heated, scaling powder easy tos produce bubble, and bubble is quick
The power that solder joint explosion occurs for expansion is easy after heating, and the tin sweat(ing) that solder joint explosion generates is splashed to electronical elements surface and easily causes
Electronic component short circuit.Therefore, for traditional soldering tin technique there are the deficiency of above-mentioned technical problem, the applicant research and develop it is a kind of by
The solder layer composition of scaling powder and containing scaling powder inside solder, applies and is carried out to solder before high temperature soldering iron scolding tin
The pre-heat treatment makes solder become the software state after preheating, the solder layer scaling powder internal with it by the solid state before preheating
After preheating, solder layer becomes software state by solid state, and during high-temperature soldering, soft solder layer alleviates scaling powder
Drastically expansive force, reduce scaling powder moment heated fast in welding process drastically expand occur solder joint explosion power, subtract
Lack solder joint explosion generation tin sweat(ing) to be splashed to electronical elements surface and cause the phenomenon of short circuit, the time of preheating, temperature, power supply
The on or off of electric current and power supply can intelligentized control method according to the needs of production, intellectualized operation degree is high, and can control significantly
With the splashing amount for reducing solder joint explosion time tin sweat(ing), operation is fool proof, and the high yield rate of electronic component, mass effect is good, reduces
Production cost, a kind of scolding tin pre-heating mean easy to use really belong to necessary.
Invention content
The technical problem to be solved in the present invention is to provide a kind of scaling powder by inside solder and contain scaling powder
Solder layer forms, and applies and carries out the pre-heat treatment to solder before high temperature soldering iron scolding tin, makes solder by the solid state before preheating
Become the software state after preheating, after the scaling powder preheating internal with it of solder layer, solder layer becomes software shape by solid state
State, during high-temperature soldering, soft solder layer alleviates the drastically expansive force of scaling powder, reduces and helps weldering in welding process
Agent moment heated fast drastically expands the power that solder joint explosion occurs, and reduces solder joint explosion generation tin sweat(ing) and is splashed to electronic component
Surface and the phenomenon for causing short circuit, time of preheating, temperature, supply current and power supply on or off can be according to the need of production
Intelligentized control method is wanted, intellectualized operation degree is high, and can control the splashing amount with reduction solder joint explosion time tin sweat(ing), operation ten significantly
Divide safety, the high yield rate of electronic component, mass effect is good, reduces production cost, scolding tin pre-heating mean easy to use.This hair
It is bright to be achieved through the following technical solutions：
A kind of scolding tin pre-heating mean, the solder by inside solder scaling powder and contain scaling powder solder layer group
At scolding tin preheating principle is to apply to carry out the pre-heat treatment to solder before high temperature soldering iron scolding tin, makes solder by consolidating before preheating
Body state becomes the software state after preheating, and after the scaling powder preheating internal with it of solder layer, solder layer is become by solid state
Software state, during high-temperature soldering, soft solder layer alleviates the drastically expansive force of scaling powder, reduces in welding process
Scaling powder moment heated fast drastically expands the power that solder joint explosion occurs, and reduces solder joint explosion generation tin sweat(ing) and is splashed to electronics
Element surface causes the phenomenon of short circuit, and operation is fool proof, and the speed of preheating is directly proportional to the speed of scolding tin, scolding tin preheating
The required time is≤10 minutes, and the modification scope of the scolding tin preheating temperature is：30 DEG C -100 DEG C, the software tin after the pre-heat treatment
Line carry out high temperature soldering iron scolding tin temperature modification scope be：300℃—500℃.
Preferably, working as the scolding tin pre-heating mean with scolding tin pre-heating system phase in application, the scolding tin pre-heating system includes outer
Protective shell is connected with into Xi Zui with one end of the outer protective shell, is connected with the other end of the outer protective shell
Tin outputting mouth, the appearance set close to the outer protective shell for entering the one end Xi Zui are provided with outer fixing piece, are installed with the outer fixing piece
It is provided with thermocouple sensor, ceramic heating tube, the thermocouple sensor and ceramic heating are provided in the outer protective shell
Pipe connection setting, the ceramic heating tube upper end are provided with ceramic heating tube power cord, the ceramic heating tube power cord setting
Have anode and a cathode, it is described enter Xi Zui be connected to setting with one end of ceramic heating tube, the tin outputting mouth and ceramic heating tube it is another
One end connection setting.
Preferably, the operating process of the scolding tin pre-heating system is：When solder is conveyed into from Xi Zui is entered to ceramic heating
When in pipe, externally fed connects the anode and cathode of ceramic heating tube power cord, and ceramic heating tube connects ceramic heating tube power supply
Line is begun to warm up after being powered, and thermocouple sensor can incude the temperature of ceramic heating tube, can be changed according to the temperature of setting
The electric current of externally fed makes the temperature that ceramic heating tube heats reach setting to change the temperature of ceramic heating tube heating
Numerical value, when becoming software by solid after solder heating, outer emit is detached from the bubble that scaling powder generates when heating with solder automatically, prevents
Only there is the phenomenon that expanding or exploding in bubble, and finally, solder is sent out by tin outputting mouth, prepares for high temperature soldering iron scolding tin.
Preferably, solder layer is before preheating, first the being sealed property destruction of solder layer can be handled, the solder after preheating exists
In welding process, scaling powder can outside be emitted from the impaired place's expansion of solder layer, alleviate the drastically expansive force of scaling powder to a certain extent,
To reduce scaling powder, moment heated fast drastically expands and solder joint brisance occurs in the welding process, reduces solder joint
Explosion generates the phenomenon that tin sweat(ing) splashes.
Preferably, make the pre-heat treatment using the solder of a diameter of 0.8mm, first to the being sealed property destruction of solder layer at
Reason, when carrying out the pre-heat treatment to solder, the time of required preheating is 2 minutes, and the temperature setting of solder preheating is 65 DEG C, preheating
The temperature that treated software solder carries out high temperature soldering iron scolding tin is 380 DEG C, and the yield of tin tin sweat(ing) is less than 5%.
Preferably, the operating procedure of the scolding tin pre-heating mean is：
The being sealed property destruction of solder layer is handled Step 1: the solder is alternative before preheating, to reduce solder joint
The splashing amount of explosion time tin sweat(ing).
Step 2: the bonding wire after the completion of leakproofness destruction is handled is sent in the heating device with insulation performance.
Step 3: setting has preheating temperature and the preheating time of the heating device of insulation performance according to the needs of production.
Step 4: startup power supply, temperature sensing device induction is positioned over the solder in the heating device with insulation performance
Heating temperature, and control power supply supply current size and control power supply on or off, enable solder be rapidly achieved scolding tin need
The preheating temperature wanted.
Step 5: solder is preheated be disposed after become software state, for high temperature soldering iron scolding tin use.
The bonding wire of the present invention includes solder layer, and the scaling powder inside solder layer is arranged, and applies and is welded in high temperature soldering iron
The pre-heat treatment is carried out to solder before tin, solder can be made to become the software state after preheating by the solid state before preheating, it is beneficial
Effect is：After the scaling powder preheating internal with it of solder layer, solder layer becomes software state by solid state, in high-temperature soldering mistake
Cheng Zhong, soft solder layer alleviate the drastically expansive force of scaling powder, reduce scaling powder moment heated fast in welding process
Drastically the power of solder joint explosion occurs for expansion, reduces solder joint explosion generation tin sweat(ing) and is splashed to electronical elements surface and causes short circuit
The phenomenon that, time of preheating, temperature, supply current and power supply on or off can intelligentized control method according to the needs of production,
Intellectualized operation degree is high, and can control the splashing amount with reduction solder joint explosion time tin sweat(ing) significantly, and operation is fool proof, electronics member
The high yield rate of part, mass effect is good, reduces production cost, easy to use.
Description of the drawings
The present invention is described in detail by following preferred embodiments and attached drawing for ease of explanation,.
Fig. 1 is that a kind of scolding tin pre-heating mean of the present invention applies the stereogram in heating device.
Fig. 2 is that a kind of scolding tin pre-heating mean of the present invention applies the sectional view in heating device.
Specific implementation mode
To facilitate the understanding of the present invention, below with reference to relevant drawings to invention is more fully described.In attached drawing
Give the better embodiment of the present invention.But the present invention can realize in many different forms, however it is not limited to herein
Described embodiment.On the contrary, the purpose of providing these embodiments is that making to understand more the disclosure
Add thorough and comprehensive.
Unless otherwise defined, all of technologies and scientific terms used here by the article and belong to the technical field of the present invention
The normally understood meaning of technical staff is identical.Used term is intended merely to description tool in the description of the invention herein
The purpose of the embodiment of body, it is not intended that in the limitation present invention.
In the present embodiment, a kind of scolding tin pre-heating mean of the invention, the solder is by the scaling powder and packet inside solder
Hold the solder layer composition of scaling powder, scolding tin preheating principle is to apply to carry out the pre-heat treatment to solder before high temperature soldering iron scolding tin,
Solder is set to become the software state after preheating by the solid state before preheating, after the scaling powder preheating internal with it of solder layer, tin
Line layer becomes software state by solid state, and during high-temperature soldering, soft solder layer alleviates the drastically expansion of scaling powder
Power reduces scaling powder moment heated fast in welding process and drastically expands the power that solder joint explosion occurs, it is quick-fried to reduce solder joint
The fried tin sweat(ing) that generates is splashed to the phenomenon that electronical elements surface causes short circuit, and operation is fool proof, the speed of preheating and scolding tin
Speed is directly proportional, and the time needed for scolding tin preheating is≤10 minutes, and the modification scope of the scolding tin preheating temperature is：30℃-100
DEG C, the temperature modification scope that the software solder after the pre-heat treatment carries out high temperature soldering iron scolding tin is：300℃—500℃.
Wherein, solder layer before preheating, can first be handled the being sealed property destruction of solder layer, the solder after preheating is welding
In the process, scaling powder can outside be emitted from the impaired place's expansion of solder layer, alleviate the drastically expansive force of scaling powder to a certain extent, to
Reducing scaling powder, moment heated fast drastically expands and solder joint brisance occurs in the welding process, reduces solder joint explosion
Generate the phenomenon that tin sweat(ing) splashes.
Embodiment one makees the solder of a diameter of 0.8mm the pre-heat treatment, and being sealed property first is destroyed before the preheating of solder layer
Processing, solder do not set preheating temperature, and it is 380 DEG C that solder, which carries out the temperature being arranged when high temperature soldering iron scolding tin, the yield of tin sweat(ing)
Less than 60%.
Embodiment two makees the solder of a diameter of 0.8mm the pre-heat treatment, before the preheating of solder layer without leakproofness destruction at
The time of reason, solder preheating is set as 2 minutes, and the temperature setting of solder preheating is 65 DEG C, software solder after the pre-heat treatment into
The temperature of row high temperature soldering iron scolding tin is 380 DEG C, and the yield of tin sweat(ing) is less than 15%.
Embodiment three makees the solder of a diameter of 0.8mm the pre-heat treatment, and being sealed property first is destroyed before the preheating of solder layer
The time of processing, solder preheating is set as 2 minutes, and the temperature setting of solder preheating is 65 DEG C, the software solder after the pre-heat treatment
The temperature for carrying out high temperature soldering iron scolding tin is 380 DEG C, and the yield of tin sweat(ing) is less than 5%.It can be seen that solder makees head before the pre-heat treatment
First the being sealed property destruction of solder layer is handled, the Best Times of solder preheating are chosen for 2 minutes, the optimum temperature of solder preheating
It it is 65 DEG C, when the optimum temperature that the software solder after the pre-heat treatment carries out high temperature soldering iron scolding tin is chosen for 380 DEG C, in this condition
Under, it is not only significantly reduced the yield of tin sweat(ing), also alleviates the drastically expansive force of scaling powder, reduce welding process
Middle scaling powder moment heated fast drastically expands the power that solder joint explosion occurs, and operation is fool proof.
The operating procedure of the scolding tin pre-heating mean is：
The being sealed property destruction of solder layer is handled Step 1: the solder is alternative before preheating, to reduce solder joint
The splashing amount of explosion time tin sweat(ing).
Step 2: the bonding wire after the completion of leakproofness destruction is handled is sent in the heating device with insulation performance.
Step 3: setting has preheating temperature and the preheating time of the heating device of insulation performance according to the needs of production.
Step 4: startup power supply, temperature sensing device induction is positioned over the solder in the heating device with insulation performance
Heating temperature, and control power supply supply current size and control power supply on or off, enable solder be rapidly achieved scolding tin need
The preheating temperature wanted.
Step 5: solder is preheated be disposed after become software state, for high temperature soldering iron scolding tin use.
In another embodiment of the invention, referring to figs. 1 to shown in Fig. 2, it is by the principle of the present invention and scolding tin preheating
System is using the scolding tin pre-heating system includes outer protective shell 1, is connected with into Xi Zui with one end of the outer protective shell 1
2, it is connected with tin outputting mouth 3 with the other end of the outer protective shell 1, close to the outer of the outer protective shell 1 for entering 2 one end of tin nozzle
Table set is provided with outer fixing piece 4, has thermocouple sensor 5 with 4 installation settings of outer fixing piece, is set in the outer protective shell 1
It is equipped with ceramic heating tube 6, the thermocouple sensor 5 connect setting with ceramic heating tube 6, and 6 upper end of the ceramic heating tube is set
Be equipped with ceramic heating tube power cord 61, the ceramic heating tube power cord 61 is provided with anode and cathode, it is described enter tin nozzle 2 and pottery
One end connection setting of porcelain heat-generating pipe 6, the tin outputting mouth 3 are connected to setting with the other end of ceramic heating tube 6.
Its operating process is：When solder is from when entering tin nozzle 2 and being conveyed into ceramic heating tube 6, externally fed connection pottery
The anode and cathode of porcelain heat-generating pipe power cord 61, ceramic heating tube 6 are connected after ceramic heating tube power cord 61 is powered and are begun to warm up,
Thermocouple sensor 5 can incude the temperature of ceramic heating tube 6, can change the electric current of externally fed according to the temperature of setting,
To change the temperature of the heating of ceramic heating tube 6, the temperature that ceramic heating tube 6 heats is made to reach the numerical value of setting, when solder plus
When becoming software by solid after heat, outer emit is detached from the bubble that scaling powder generates when heating with solder automatically, prevents bubble from occurring swollen
The phenomenon that swollen or explosion, finally, solder is sent out by tin outputting mouth 3, is prepared for high temperature soldering iron scolding tin.
The bonding wire of the present invention includes solder layer, and the scaling powder inside solder layer is arranged, and applies and is welded in high temperature soldering iron
The pre-heat treatment is carried out to solder before tin, solder can be made to become the software state after preheating by the solid state before preheating, it is beneficial
Effect is：After the scaling powder preheating internal with it of solder layer, solder layer becomes software state by solid state, in high-temperature soldering mistake
Cheng Zhong, soft solder layer alleviate the drastically expansive force of scaling powder, reduce scaling powder moment heated fast in welding process
Drastically the power of solder joint explosion occurs for expansion, reduces solder joint explosion generation tin sweat(ing) and is splashed to electronical elements surface and causes short circuit
The phenomenon that, time of preheating, temperature, supply current and power supply on or off can intelligentized control method according to the needs of production,
Intellectualized operation degree is high, and can control the splashing amount with reduction solder joint explosion time tin sweat(ing) significantly, and operation is fool proof, electronics member
The high yield rate of part, mass effect is good, reduces production cost, easy to use.
Above-described embodiment, only an example of the present invention is not the implementation for limiting the present invention and interest field,
All technical solutions identical or equivalent with content described in the claims in the present invention should all include in the scope of the present invention.
Claims (2)
1. a kind of scolding tin pre-heating mean, it is characterised in that：The scolding tin pre-heating mean is applied before high temperature soldering iron scolding tin to solder
The pre-heat treatment is carried out, the operating procedure of the scolding tin pre-heating mean is：
Step 1: selectivity handles the being sealed property destruction of solder layer to solder before preheating, to reduce solder joint explosion time tin sweat(ing)
Splashing amount；
Step 2: the solder after the completion of leakproofness destruction is handled is sent in the heating device with insulation performance；
Step 3: setting has preheating temperature and the preheating time of the heating device of insulation performance according to the needs of production；
Step 4: startup power supply, temperature sensing device induction is positioned over adding for the solder in the heating device with insulation performance
Hot temperature, and control the supply current size of power supply and control the on or off of power supply, so that solder is rapidly achieved scolding tin needs
Preheating temperature；
Step 5: solder is preheated be disposed after become software state, for high temperature soldering iron scolding tin use；
The solder by inside solder scaling powder and contain the solder layer of scaling powder and form, the speed and scolding tin of preheating
Speed is directly proportional, and the time needed for scolding tin preheating is≤10 minutes, and the modification scope of the scolding tin preheating temperature is：30℃-100
DEG C, the temperature modification scope that the software solder after the pre-heat treatment carries out high temperature soldering iron scolding tin is：300℃—500℃.
2. a kind of scolding tin pre-heating mean according to claim 1, it is characterised in that：Using the tin of a diameter of 0.8mm
Line makees the pre-heat treatment, and when carrying out the pre-heat treatment to solder, the time of required preheating is 2 minutes, and the temperature setting of solder preheating is
65 DEG C, the temperature that the software solder after the pre-heat treatment carries out high temperature soldering iron scolding tin is 380 DEG C, and the yield of tin sweat(ing) is less than 5%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510832634.8A CN105397231B (en) | 2015-11-26 | 2015-11-26 | A kind of scolding tin pre-heating mean |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510832634.8A CN105397231B (en) | 2015-11-26 | 2015-11-26 | A kind of scolding tin pre-heating mean |
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| Publication Number | Publication Date |
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| CN105397231A CN105397231A (en) | 2016-03-16 |
| CN105397231B true CN105397231B (en) | 2018-11-02 |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106513893A (en) * | 2016-12-30 | 2017-03-22 | 中源智人科技（深圳）股份有限公司 | Laser tin soldering mechanism with preheating device and process with tin soldering mechanism |
| CN111438415B (en) * | 2020-05-18 | 2024-02-06 | 郑州机械研究所有限公司 | Wire feeding device and method thereof |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07251264A (en) * | 1994-03-11 | 1995-10-03 | Japan Unix:Kk | Method for soldering and device therefor |
| CN201023172Y (en) * | 2007-03-16 | 2008-02-20 | 王承鑫 | Side-opening type splash-proof tin wire |
| JP2010110808A (en) * | 2008-11-10 | 2010-05-20 | Shinji Onabeda | Thread solder feeding method of soldering device |
| CN202428083U (en) * | 2011-12-19 | 2012-09-12 | 吴江市合成电子机械厂 | Pre-heating type soldering machine |
| CN202498281U (en) * | 2012-01-09 | 2012-10-24 | 广东益翔自动化科技有限公司 | Preheating device of soldering robot |
| CN203227940U (en) * | 2013-04-16 | 2013-10-09 | 昆山市圣翰锡业有限公司 | Solder wire using environment-friendly fluxes |
| CN103240480A (en) * | 2013-05-20 | 2013-08-14 | 苏州嘉目工程有限公司 | Preheating type tin soldering machine |
| CN103433640A (en) * | 2013-08-24 | 2013-12-11 | 昆山市宏嘉焊锡制造有限公司 | Anti-spattering soldering tin wire structure |
| CN103418928A (en) * | 2013-08-27 | 2013-12-04 | 昆山市宏嘉焊锡制造有限公司 | Novel lead-free solder wire |
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Effective date of registration: 20180919 Address after: 523000 5 building, Lianyi Industrial Park, 383 Wen Tang Road, Dongcheng Street, Dongguan, Guangdong. Applicant after: Dongguan Okata Electronic & Technology Co., Ltd. Address before: 523000 2, 5, Lianyi Industrial Park, 383 Road, Wen Tang Road, Dongcheng District, Dongguan, Guangdong. Applicant before: Wu Shuiyu |
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Address after: 523000 Building 1, No. 7, jinyuling Road, Dongcheng Street, Dongguan City, Guangdong Province Patentee after: Guangdong gangtian Intelligent Technology Co., Ltd Address before: 523000 5 building, Lianyi Industrial Park, 383 Wen Tang Road, Dongcheng Street, Dongguan, Guangdong. Patentee before: Dongguan Okata Electronic & Technology Co.,Ltd. |