CN206305575U - Tin device is sent in one kind preheating - Google Patents

Tin device is sent in one kind preheating Download PDF

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Publication number
CN206305575U
CN206305575U CN201621140139.7U CN201621140139U CN206305575U CN 206305575 U CN206305575 U CN 206305575U CN 201621140139 U CN201621140139 U CN 201621140139U CN 206305575 U CN206305575 U CN 206305575U
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China
Prior art keywords
tin
send
heat conduction
tube
sent
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CN201621140139.7U
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Chinese (zh)
Inventor
罗流华
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DONGGUAN BABU ELECTRONIC TECHNOLOGY Co Ltd
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DONGGUAN BABU ELECTRONIC TECHNOLOGY Co Ltd
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Priority to CN201621140139.7U priority Critical patent/CN206305575U/en
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Abstract

The utility model provides a kind of preheating and send tin device, including heat conduction to send block tin, send tin-tube, send Xi Zui and heat generating core;Described to send tin-tube to send Xi Zui to connect with described, the heat generating core is arranged on the heat conduction and send on block tin, and the heat conduction send block tin to be arranged on described sending on tin-tube;Block tin is sent in the heat generating core, the heat conduction, described to send tin-tube to be Heat Conduction Material.Tin device is sent in the preheating, increased heat generating core on tin architecture basics and block tin is sent in heat conduction in existing sending, make to reach certain temperature before solder horn is contacted by the solder for breaking tin machine or directly send out, so as to avoid the scaling powder in solder, because of unexpected contact high temperature, bumping produces quick-fried tin phenomenon.

Description

Tin device is sent in one kind preheating
Technical field
The utility model is related to tin soldering machine technical field, in particular it relates to tin device is sent in a kind of preheating.
Background technology
Current automatic tin welding machine on the market, the Song Xi mechanisms in scolding tin are all by broken tin machine or directly send tin To the solder horn part of tin soldering machine, but even if the quick-fried tin phenomenon of certain probability still occurs by broken tin for the solder for sending.This is Because automatic tin welding machine is during scolding tin, send tin speed ratio very fast, even across the solder of broken tin, or can be because unexpected High temperature makes the scaling powder bumping in solder produce quick-fried tin phenomenon.
Utility model content
In order to overcome the deficiencies in the prior art, the utility model provides a kind of preheating and send tin device, and tin knot is sent existing Heat generating core is increased on the basis of structure and block tin is sent in heat conduction, made by broken tin machine or the solder directly sent out before solder horn is contacted Certain temperature is reached, so as to avoid the scaling powder in solder because contacting high temperature suddenly and the quick-fried tin phenomenon of bumping generation.
The technical solution of the utility model is as follows:A kind of new preheating send tin device, including heat conduction to send block tin, send tin Pipe, send Xi Zui and heat generating core;Described to send tin-tube to send Xi Zui to connect with described, the heat generating core is arranged on the heat conduction and send block tin On, the heat conduction send block tin to be arranged on described sending on tin-tube;Block tin is sent in the heat generating core, the heat conduction, described to send tin-tube to be Heat Conduction Material.
It is preferred that described send tin-tube to send block tin to send Xi Zui to connect with described through the heat conduction.
It is preferred that the heat generating core is sent on block tin installed in the heat conduction, the heat generating core send tin-tube to be located at institute with described State heat conduction and send block tin homonymy.
It is preferred that the heat generating core is provided with temperature sensor.
It is preferred that the heat generating core, block tin is sent in the heat conduction, described to send tin-tube to be Heat Conduction Material.
It is preferred that described sending also is arranged with collet on tin-tube.
It is preferred that the preheating send tin device also with temperature control component, the attemperating unit controls the hair of the heat generating core Hot temperature, and then control the preheating temperature of the solder.
It is preferred that the preheating temperature of the solder is 80-90 DEG C.
The beneficial effects of the utility model are:Tin device is sent in preheating described in the utility model, by setting heat generating core and leading Heat send block tin that solder is preheating into uniform temperature, and so as to avoid the scaling powder in solder, because of unexpected contact high temperature, bumping generation is quick-fried Tin phenomenon.
Brief description of the drawings:
Fig. 1 is the structural representation for preheating and sending tin device described in the utility model.
Specific embodiment
In order that utility model purpose of the present utility model, technical scheme and technique effect become more apparent, tie below Specific embodiment is closed to be described further the utility model.It should be understood that specific embodiment described herein and correlation Accompanying drawing, is only used for explaining the utility model, is not used to limit the utility model.
Reference picture 1, one kind preheating send tin device, including heat conduction to send block tin 1, send tin-tube 2, send tin mouth 3 and heat generating core 4.Institute State and send tin-tube 2 to send tin mouth 3 to connect with described, the heat generating core 4 is arranged on the heat conduction and send on block tin 1, and block tin 1 is sent in the heat conduction Sent on tin-tube 2 installed in described.The heat generating core 4 connects a heater, and the heater lifts the temperature of heat generating core 4, The heat generating core 4 by heat through the heat conduction send block tin 1 be delivered to it is described send tin-tube 2 and the solder sent in tin-tube 2 so that Preheat the solder to certain temperature.
It is described send tin-tube 2 and it is described send tin mouth 3 to be respectively arranged at the heat conduction to send the both sides of block tin 1, it is described to send tin-tube 2 to pass through The heat conduction send block tin 1 and send tin mouth 3 to connect with described;The heat generating core 4 send tin-tube 2 to send block tin positioned at the heat conduction with described 1 homonymy.The heat generating core 4 is provided with temperature sensor 5.Tin silk by it is described send tin-tube 2 deliver to described in send tin mouth 3, the hair Hot core 4 generates heat, and send block tin 1 to send to by the heat conduction described to send tin-tube 2 and the tin silk sent in tin-tube 2, the tin Silk is heated to uniform temperature.
It is preferred that described sending also is arranged with collet 6 on tin-tube 2.
The preheating send tin device also with temperature control component (not shown), and the attemperating unit controls the heat generating core 4 Heating temp, and then control the preheating temperature of the solder.The preheating temperature of the solder is 80-90 DEG C.The attemperating unit Temperature-control range be 50-200 DEG C.
Above content is to combine specific preferred embodiment further detailed description of the utility model, it is impossible to Assert that specific implementation of the present utility model is confined to these explanations.For the ordinary skill of the utility model art For personnel, without departing from the concept of the premise utility, its framework form can be flexible and changeable, can be produced with subseries Product.Some simple deduction or replace are simply made, the utility model should be all considered as belonging to true by the claims submitted to Fixed scope of patent protection.

Claims (5)

1. tin device is sent in a kind of preheating, it is characterised in that send block tin including heat conduction, send tin-tube, send Xi Zui and heat generating core;It is described to send Tin-tube send Xi Zui to connect with described, and the heat generating core is arranged on the heat conduction and send on block tin, and the heat conduction send block tin to be arranged on institute State and send on tin-tube;Block tin is sent in the heat generating core, the heat conduction, described to send tin-tube to be Heat Conduction Material.
2. tin device is sent in preheating as claimed in claim 1, it is characterised in that it is described send tin-tube through the heat conduction send block tin and It is described to send Xi Zui to connect.
3. tin device is sent in preheating as claimed in claim 1, it is characterised in that the heat generating core send block tin installed in the heat conduction On, the heat generating core send tin-tube to send block tin homonymy positioned at the heat conduction with described.
4. tin device is sent in preheating as claimed in claim 1, it is characterised in that the heat generating core is provided with temperature sensor.
5. tin device is sent in preheating as claimed in claim 1, it is characterised in that described sending also is arranged with collet on tin-tube.
CN201621140139.7U 2016-10-19 2016-10-19 Tin device is sent in one kind preheating Active CN206305575U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201621140139.7U CN206305575U (en) 2016-10-19 2016-10-19 Tin device is sent in one kind preheating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201621140139.7U CN206305575U (en) 2016-10-19 2016-10-19 Tin device is sent in one kind preheating

Publications (1)

Publication Number Publication Date
CN206305575U true CN206305575U (en) 2017-07-07

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201621140139.7U Active CN206305575U (en) 2016-10-19 2016-10-19 Tin device is sent in one kind preheating

Country Status (1)

Country Link
CN (1) CN206305575U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111037029A (en) * 2019-12-27 2020-04-21 格润智能装备(深圳)有限公司 Tin conveying device capable of preheating tin wires and tin wire preheating method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111037029A (en) * 2019-12-27 2020-04-21 格润智能装备(深圳)有限公司 Tin conveying device capable of preheating tin wires and tin wire preheating method thereof

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