CN105356051B - High-power target seeker tile style active phase array antenna - Google Patents
High-power target seeker tile style active phase array antenna Download PDFInfo
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- CN105356051B CN105356051B CN201510785666.7A CN201510785666A CN105356051B CN 105356051 B CN105356051 B CN 105356051B CN 201510785666 A CN201510785666 A CN 201510785666A CN 105356051 B CN105356051 B CN 105356051B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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Abstract
A kind of high-power target seeker tile style active phase array antenna disclosed by the invention, it is desirable to provide a kind of small volume, it is in light weight, temperature-compensating need not be done again, the active phase array antenna that can reliably work.The present invention is achieved by following proposal：Micro-strip antenna array is extended using E types paster as radiation array element by the integral multiple of 4 × 4 array scales, and on antenna medium substrates, tile style TR components integrated tight is connected heat exchanger rectangular grid array layout；Micro-strip antenna array is connected with the high-power transceiving chip of tile style TR components integrates transceiver channel, and every 4 high-power transceiving chips while the TR multifunction chip that is connected, 4 TR multifunction chips collectively form the submatrix circuit module of one 4 × 4, are down connected in power distribution synthesis network.D/C power and beam steering signals realize the control of power supply, highpowerpulse algorithm for power modulation and width phase code by power modulation distributor, realize high-power tile style active phase array antenna directional diagram scanning.
Description
Technical field
The present invention relates to a kind of high-power, high effective heat-storage, High Density Integration target seeker active phase in electronic technology field
Array antenna.
Background technology
In the 1980s, commission Martin's Marietta company of the U.S. have developed target seeker using brick designing technique and put down
Face phased array antenna, the phased array antenna are operated in W-waveband (94GHz), antenna aperture 127mm, share 2208 array elements, battle array
First peak power is 100mW, and synthesis power is 62W.In 2002, U.S. national defense advanced research projects agency invested and developed out miniature
Mechatronic Systems (MEMS) electronic scanning antenna, the target seeker electronically-scanning array use brick designing technique, are operated in X and Ka
Two wave bands；X-band is made up of 60 radiation array element units, and each RF radiation power for radiating array element unit is 500mW, always
Radiant power reaches 30W；Ka wave bands have 768 radiation array element units, and total peak power can reach 30W, mean power 10W.
2008, US Airways guided missile research and development engineering design center also began to verify that the array element brick of Ka frequency ranges 16 based on MEMS is phased
Battle array, the phased array centre frequency is 33.4GHz, and array element spacing is half-wavelength, and array element uses Vivaldi antennas, by Taylor plus
Weigh to reduce secondary lobe.In November, 2010, Boeing is selected in USAF laboratory and Raytheon has carried out two waveband brick
The demonstration and verification work of formula phased array Active Radar/broadband passive radar multimode seekerI, utilizes C-band phased array Active Radar
Target seeker is detected, locks Stealthy Target as early as possible, and the end to aerial target is improved using Ka wave band phased arrays active radar target seeker
Hold tracking accuracy；Broadband Passive Radar Seeker is mainly used in detecting earth-based guidance radar, and using Ka wave bands phased array actively
The high-resolution of radar seeker provides target identification ability, so as to improve to the anti-shutoff capability of ground guidance radar.United States Patent (USP)
US4823136 describes a kind of wafer scale active phase array antenna system, and the system transmits/receives unit by 16 and concentrates on a piece of 3
On the semiconductor wafer of~4 inches of sizes.These transmit/receive unit and employ the Wide-Band Design, the AESA Active Radar work
Make in 9.2~10.2GHz frequency ranges, while active antenna system can carry out Radio frequency interference in the range of 2.0~20.0GHz wide-bands
(ECM).Hughes Electronics of the U.S. describes a kind of Active Electronically Scanned Array in the patent EP621654A2 of European application, passes through
The design method of brick modularization and low cost, functional redundancy design and real-time adaptive compensation are taken, if there is array element in array
Failure, overall performance declines but system still remains on function.
According in April, 2002 Britain《Jian Shi missiles and rockets》Report, safe and sound design bureau of Russia have been developed that several new
Brick phased array antenna, 3 kinds of antennas of displaying are respectively millimeter wave, centimeter wave and decimetric wave wave band, are circle, diameter is about
11 wavelength, gain are about 26dB, and with a width of 8%, maximum sidelobe level is 17.6dB.The scanning of centimeter wave and decimeter-wave antenna
Sector is ± 53 °, and millimeter wave antenna is then ± 45 °.ACU antenna control unit employs separate unit control or the control of antenna submatrix
Mode, can zonal control antenna, can effectively antagonize active electronic interference.At present, use is studied by Russian agate design bureau
In the electron scanning phased array antenna of the active and passive type of target seeker, agate design bureau chief designer Josif Akopian
Represent, the target seeker technology is a brand-new research field, is in experimental stage, still there are some basic problems urgently to solve
Certainly, solves the time that these problems may also need to 1~2 year.There is presently no produce the guiding of these phased arrays for agate design bureau
The plan of module.
According to France《Space flight defence》Report on May 12nd, 2003, QinetiQ companies of Britain are in laboratory, for the first time
Closed test is successfully made to its X-band phased array antenna, so that Britain maintains the leading position in this technical field, together
When make air-ground to be remarkably decreased with air-to-air missile technical risk using the of new generation of phased array.Specifically experiment shows, the active phase
Control array antenna can produce wave beam, wave beam can alignment target all the time, can realize required repertoire by further improvement,
And confrontation future electronic interference performance is significantly improved, its next step target is to develop one have more high mechanical properties, can launch height
The active phase array antenna of powerbeam.The patent GB2409361A of BAE system house of Britain describes a kind of two--mode field
Radar system, there are a wide-band ratio width passive radar and a high frequency phased array Active Radar in the two--mode field antenna house,
Its common optical axis is consistent with antenna house axis, and Active Radar antenna is mounted in antenna house front end, because sufficiently small, will not do
Disturb the visual field of passive radar.
According to the U.S.《Aviation Week》Report on November 17th, 2003, German Government carries for BGT companies and EADS companies
Funding gold, develops Ka frequency range target seeker brick phased arrays, without mechanical scanning, but generates electron beam, there are about 700 it is small-sized
The phased array antenna of T/R module.
Israel is related to a kind of small-sized phased-array radar of missile-borne in the patent US20100052975A1 of U. S. application, bag
Including one can launch and the Active Phased-Array Antenna of collectiong focusing radiation beam and provide signal to produce radiation beam and control
The circuit in radiation beam direction, the region in front of Missile Motion direction can be scanned with focus beam to detect target.The radar can
To be repeatedly scanned with whole horizontal plane to position target, the coordinate of designated area can also be received and be repeatedly scanned with designated area.
Japan Patent JP2279995A describes a kind of missile-borne phased array antenna system.In the patent, phased array antenna is inclined
From the certain inclination angle of axle is played, asymmetric beam scanning angle is formed around axle is played.By controlling body to roll, increase beam scanning model
Enclose, improve the ability of tracking to rapid flight and fast reserve target.Japan Patent JP8032342A describes a kind of phased array
Radar, the phase and amplitude for the transmitted wave that the phased-array radar is exported by some variable output modules of independent control, can make it
The main lobe of the antenna radiation pattern of output is high, secondary lobe is low, so as to improve detectivity and antijamming capability of the system to electromagnetic wave.
Domestic literature " Phased Array Radar Seeker technology " (cruising missile, 2009) reports Phased Array Radar Seeker
Application present situation, technical characterstic and key technology at home and abroad, while also report domestic and international target seeker phased array antenna
Heat sink conception：Under the conditions of missile-borne, using heat pipe temperature control system, the heat on TR components is passed on antenna array, antenna array is faced the wall and meditated
Plate uses centreless heat pipe in itself, reaches heat by it and is swapped outside battle array with heat exchanger.
To sum up state, at present the target seeker AESA for mainly using brick modularized design of domestic and foreign literature report
Antenna, the heat on TR components mainly passes to reach heat by it on front swapped outside front with heat exchanger, its
Radiating mode is disadvantageous in that:Active phase array antenna poor reliability, because its hot path is long, can not quickly will be high-power
The heat of chip is introduced directly into heat exchanger, causes high-power chip easily to burn；Next to that long hot path causes each passage
The high-power chip temperature difference opposite sex is big, influences chip amplitude-phase consistency, causes target seeker active phase array antenna to need to do temperature
Compensation.At present, it is active for the high-power target seeker tile style that heat can be introduced directly into heat exchanger, need not do temperature-compensating again
Phased array antenna is also without the technical scheme determined.
The content of the invention
The present invention seeks to in place of above-mentioned the shortcomings of the prior art, there is provided a kind of small volume, in light weight, cost
It is low, engineering practicability is high, heat can be introduced directly into heat exchanger, need not do temperature-compensating again, can in hot environment
By the high-power target seeker tile style active phase array antenna of ground work.
The above-mentioned purpose of the present invention can be reached by following measures.A kind of high-power target seeker tile style AESA
Antenna, including micro-strip antenna array 1, tile style TR components 2, heat exchanger 3, power modulation distributor 4 and power distribution polymer fabric
Network 5, it is characterised in that：Micro-strip antenna array 1 is using E types paster 6 as radiation array element, and radiation array element unit spacing is in working frequency
0.45~0.55 wavelength between value, be extended by the integral multiple of 4 × 4 array scales, using rectangular grid array layout
On antenna medium substrates 8, the integrated tight of tile style TR components 2 is connected heat exchanger 3；The feed probes 7 of micro-strip antenna array 1
Through the feed via 10 on antenna medium substrates 8 and Antenna baseplate 9, with being laid out the high-power transmitting-receiving core in tile style TR components 2
Piece 11, which is connected, integrates transceiver channel, and every 4 high-power transceiving chips 11 while the TR multifunction chip 12 that is connected, and forms
The circuit unit of one 2 × 2 tile style TR component 2；Each circuit unit is by SMP radio frequency connectors 16, down through heat exchange
The shielding via 25 on circular metal via 20 and power modulation distributor 4 on device 3, mutually it is connected in power distribution synthesis network 5
SMP radio frequency sockets 31 on；Transmission signal synthesizes the rf input interface 33 of network 5 by power distribution, through microstrip power divider
34 and circulator 35 enter and be distributed in the TR multifunction chips 12 of tile style TR components 2, each TR multifunction chips 12 will input into
The radiofrequency signal come is divided into 4 tunnels, is sent respectively to each high-power transceiving chip 11, then be transferred to micro-strip antenna array 1.This
When, the power supply of outside D/C power inputs from the power outlet 29 on power modulation distributor 4, sequentially enter power supply energy-storage module 27,
Power pulse modulation circuit module 26 and power supply distribution module 22, while external beam control signal is distributed from power modulation
Control socket 28 on device 4 inputs, and is directly entered power supply distribution module 22, the PGA plugs through being connected with low frequency signal network 23
24 outputs, PGA plugs 24 are connected through the rectangular metal via 19 on heat exchanger 3 with the pga socket 17 of tile style TR components 2,
The power supply to tile style TR components 2, highpowerpulse algorithm for power modulation and width phase are realized eventually through low frequency signal control network 13
The control of code, realize space power synthesis and the directional diagram scanning of high-power tile style active phase array antenna.
In such scheme, high-power target seeker tile style active phase array antenna is designed by 4 × 4 submatrix scales,
Scalability of the program design with array scale, can be extended by the integral multiple of 4 × 4 array scales, such as 8 × 8 arrays,
The scales such as 4 × 12 arrays, 16 × 16,20 × 20 arrays.
In such scheme, the magnitude of the high-power power output of transceiving chip 11 is between 5w~150w.
The present invention has the advantages that compared to prior art.
The active phase of High Density Integration tile style that the present invention is extended in structure using the integral multiple of 4 × 4 array scales
Array antenna framework is controlled, compared with traditional brick target seeker phased array antenna, there is small volume, advantage in light weight, can be preferably
Meet the requirement of missile-borne small space and light load.The present invention can be by the High Power Active phased array antenna of 8 × 8 array scales
Volume-diminished 30.7%, weight saving 1.6kg.
The integrated tight of tile style TR components 2 is connected heat exchanger 3, each by using tile style designing technique by the present invention
Circuit unit is down distributed by SMP radio frequency connectors 16 through the circular metal via 20 on heat exchanger 3 and power modulation
Shielding via 25 on device 4, it is connected in the SMP radio frequency sockets 31 of power distribution synthesis network 5；Therefore, in heat dissipation design scheme
On no longer the heat of high-power transceiving chip 11 is passed on antenna array, and swapped, contracted by it and heat exchange with outside device
Short hot path, the danger that high-power transceiving chip 11 can be avoided to be burned out, improves High Power Active phased array antenna
Reliability.Also making each high-power transceiving chip 11 simultaneously, uniform temperature is good under running conditions, High Power Active phased array antenna
No longer need to do temperature-compensating.
The heat exchanger 3 of the present invention can be designed using graphite/paraffin composite phase change material, it is possible to achieve high-power
The high effective heat-storage and light weight design of tile style active phase array antenna.
The present invention is integrated using high-power transceiving chip 11 progress transceiver channel and carried out using TR multifunction chips 12 more
Function four-way integrates, and reduces the number of chips of high-power tile style active phase array antenna, reduces design cost.The present invention
The number of chips of the high-power tile style active phase array antenna of 8 × 8 array scales can be reduced to 83 by 195, chip-count
Amount reduces 112, realizes low-cost design.
Brief description of the drawings
Fig. 1 is the composition frame chart of the high-power tile style active phase array antenna of the present invention.
Fig. 2 is the perspective exploded view of the high-power tile style active phase array antenna of the present invention.
Fig. 3 is the perspective exploded view of Fig. 1 micro-strip antenna arrays 1.
Fig. 4 is the perspective exploded view of a quarter local structure of Fig. 1 tile style TR components 2.
Fig. 5 is the perspective exploded view of Fig. 1 heat exchangers 3.
Fig. 6 is the perspective exploded view of Fig. 1 power modulations distributor 4.
Fig. 7 is the perspective exploded view of Fig. 1 power distributions synthesis network 5.
Fig. 8 is the high-power tile style active phase array antenna thermal design result figure of the present invention.
In figure：1 micro-strip antenna array, 2 tile style TR components, 3 heat exchangers, 4 power modulation distributors, 5 power distributions are closed
Into network, 6E type pasters, 7 feed probes, 8 antenna medium substrates, 9 Antenna baseplates, 10 feed vias, 11 high-power transmitting-receiving cores
Piece, 12TR multifunction chips, 13 low frequency signals control network, 14PCB medium substrates, 15 1 point of four Wilkinson power splitter,
16SMP radio frequency connectors, 17PGA sockets, 18 radio frequency elastic contact pins, 19 rectangular metal vias, 20 circular metal vias, 21 metals
Cavity, 22 power supply distribution modules, 23 low frequency signal networks, 24PGA plugs, 25 shielding vias, 26 power pulse modulation circuit moulds
Block, 27 power supply energy-storage modules, 28 control sockets, 29 power outlets, 30 ptfe substrates, 31SMP radio frequency sockets, 32 radio frequencies
Output interface, 33 rf input interfaces, 34 microstrip power dividers, 35 circulators, 36 low frequency control lines, 37 fiberglass medium substrates.
Embodiment
Refering to Fig. 1-Fig. 2.In embodiment described below, a kind of high-power target seeker tile style active phase array antenna,
Network 5 is synthesized including micro-strip antenna array 1, tile style TR components 2, heat exchanger 3, power modulation distributor 4 and power distribution, its
It is characterised by：Micro-strip antenna array 1 is using E types paster 6 as radiation array element, and radiation array element unit spacing is the 0.45 of working frequency
Value between~0.55 wavelength, it is extended by the integral multiple of 4 × 4 array scales, using rectangular grid array layout in antenna
On medium substrate 8, the integrated tight of tile style TR components 2 is connected heat exchanger 3；The feed probes 7 of micro-strip antenna array 1 pass through day
Via 10 is fed on line medium substrate 8 and Antenna baseplate 9, with being laid out the phase of high-power transceiving chip 11 in tile style TR components 2
Even integrated transceiver channel, and every 4 high-power transceiving chips 11 while the TR multifunction chip 12 that is connected, form one 2
The circuit unit of × 2 tile style TR components 2；Each circuit unit is by SMP radio frequency connectors 16, down through on heat exchanger 3
Circular metal via 20 and power modulation distributor 4 on shielding via 25, be mutually connected in power distribution synthesis network 5 SMP
On radio frequency socket 31；Transmission signal synthesizes the rf input interface 33 of network 5 by power distribution, through microstrip power divider 34 and ring
Shape device 35 enters the TR multifunction chips 12 for being distributed in tile style TR components 2, and each TR multifunction chips 12 are penetrated what input was come in
Frequency signal is divided into 4 tunnels, is sent respectively to each high-power transceiving chip 11, then be transferred to micro-strip antenna array 1.Now, it is outside
D/C power power supply inputs from the power outlet 29 on power modulation distributor 4, sequentially enters power supply energy-storage module 27, power pulse
Modulation circuit module 26 and power supply distribution module 22, while external beam control signal is from the control on power modulation distributor 4
Socket 28 processed inputs, and is directly entered power supply distribution module 22, and the PGA plugs 24 through being connected with low frequency signal network 23 export, PGA
Plug 24 is connected through the rectangular metal via 19 on heat exchanger 3 with the pga socket 17 of tile style TR components 2, eventually through low
Frequency signal control network 13 realizes the control of the power supply to tile style TR components 2, highpowerpulse algorithm for power modulation and width phase code,
Realize space power synthesis and the directional diagram scanning of High Power Active phased array antenna.Then, in the same pulsed operation cycle
It is interior, enter from radiation array element of the reception signal that target reflects through micro-strip antenna array 1 and be distributed in the big of tile style TR components 2
Power transceiving chip 11, while every 4 high-power transceiving chips 11 are connected in a TR multifunction chip 12 jointly, form multichannel
Reception signal enters several point of four Wilkinson power splitter 15, and passes through each one point of four Wilkinson power splitter 15
SMP radio frequency connectors 16, synthesizing multi-path radio frequency receiving signal, the SMP radio frequencies for being down transferred into power distribution synthesis network 5 are inserted
Seat 31, after circulator 35 and microstrip power divider 34, ultimately forms 4 tunnel reception signals and is exported from 4 radio frequency output interfaces 32, and
Also under the power supply of outside D/C power and the control of external beam control signal, realizing to the powering of tile style TR components 2, high-power
The control of pulse-frequency modulation and width phase code, realize high-power tile style active phase array antenna reception signal and/poor direction
Figure scanning.
So that high-power target seeker tile style active phase array antenna is operated in 15GHz, array scale is taken as 8 × 8 as an example.Submatrix
Scale is designed by 4 × 4, and 44 × 4 submatrixs form the high-power tile style active phase array antenna of one 8 × 8.This is high-power
Tile style active phase array antenna mainly includes the heat friendship of micro-strip antenna array 1, tile style TR components 2, and connected tile style TR components 2
Parallel operation 3, power modulation distributor 4, and power distribution synthesis network 5.Micro-strip antenna array 1 is used as radiation array element using E types paster 6
Unit, 0.45~0.55 wavelength for taking working frequency is unit spacing, by rectangular grid array layout in antenna medium substrates 8
Above.Each E types paster 6 carries out the transmitting and reception of radiofrequency signal by feed probes 7, and each feed probes 7 pass through day
Feed via 10 on line medium substrate 8 and Antenna baseplate 9 is connected in the radio frequency elastic contact pin 18 of tile style TR components 2, goes forward side by side one
Step is mutually connected on each high-power transceiving chip 11 of tile style TR components 2.In tile style TR components 2, every 4 high-power transmitting-receiving cores
Piece 11 while the TR multifunction chip 12 that is connected, form the circuit unit of 2 × 2 tile style TR components 2,4 circuit units
One 4 × 4 submatrix circuit module is formed by one point of four Wilkinson power splitter 15,44 × 4 submatrix circuit modules pass through 4
SMP radio frequency connectors 16 on individual one point of four Wilkinson power splitter 15, down through the circular metal mistake on heat exchanger 3
Shielding via 25 on hole 20 and power modulation distributor 4, the SMP radio frequency sockets 31 for being connected in power distribution synthesis network 5.
In tile style TR components 2, the low frequency signal control network 13 for being connected in high-power transceiving chip 11 and TR multifunction chips 12 passes through
PGA plugs 24 on pga socket 17, the power modulation distributor 4 with up passing through the rectangular metal via 19 on heat exchanger 3
It is connected.The circuit layout of whole tile style TR components 2 is on PCB medium substrates 14.It is connected with the integrated tight of tile style TR components 2
It is heat exchanger 3, the high effective heat-storage of the high-power transceiving chip 11 for realizing tile style TR components 2, it is ensured that high-power tile style has
The reliability of source phased array antenna work.Power modulation distributor 4 is integrated on ptfe substrate 30, and outside D/C power supplies
Electricity inputs from power outlet 29, sequentially enters power supply energy-storage module 27, power pulse modulation circuit module 26 and power supply distribution
Module 22, while external beam control signal inputs from control socket 28, power supply distribution module 22 is directly entered, finally by low
Frequency signal network 23 realizes the control of power supply to tile style TR components 2, highpowerpulse algorithm for power modulation and width phase code.Power
Distribution synthesis network 5 realizes that the transmitting all the way of radiofrequency signal and 4 tunnels receive by circulator 35 and microstrip power divider 34.
Within the same pulsed operation cycle, high-power tile style active phase array antenna is first in launching working condition,
The rf input interface 33 that radiofrequency signal is synthesized network 5 by power distribution is inputted, and 4 rings are respectively enterd by microstrip power divider 34
Shape device 35, and the output for the completion radiofrequency signal of SMP radio frequency sockets 31 for passing through power distribution synthesis network 5.SMP radio frequency sockets 31
Circular metal via 20 through on the shielding via 25 and heat exchanger 3 on power modulation distributor 4, is connected in tile style TR groups
The SMP radio frequency connectors 16 of part 2, realize the input of the radiofrequency signal to tile style TR components 2.Then 4 tunnels of radiofrequency signal point difference
4 one point four Wilkinson power splitter, 15,4 one point four Wilkinson power splitters 15 into tile style TR components 2 will input
The radiofrequency signal come in is separated into 4 tunnels and is sent to 16 TR multifunction chips 12, then TR multifunction chips 12 will input again into
The radiofrequency signal come is divided into 4 tunnels, is sent respectively to 64 high-power transceiving chips 11, then be transferred to micro-strip antenna array 1.This
When, the power supply of outside D/C power inputs from the power outlet 29 on power modulation distributor 4, sequentially enter power supply energy-storage module 27,
Power pulse modulation circuit module 26 and power supply distribution module 22, while external beam control signal is distributed from power modulation
Control socket 28 on device 4 inputs, and is directly entered power supply distribution module 22, the PGA plugs through being connected with low frequency signal network 23
24 outputs, and enter the pga socket 17 of tile style TR components 2, realized eventually through low frequency signal control network 13 and give tile style TR groups
The control of the power supply of part 2, highpowerpulse algorithm for power modulation and width phase code, realizes high-power tile style active phase array antenna
Space power synthesis and directional diagram scanning.Then, within the same pulsed operation cycle, high-power tile style active phase array antenna
Then in working condition is received, tile style TR components 2 are entered after micro-strip antenna array 1 from the reception signal that target reflects
64 high-power transceiving chips 11, while 4 high-power transceiving chips 11 are connected in a TR multifunction chip 12, shape jointly
Enter 4 one point four Wilkinson power splitters 15 into 16 tunnel reception signals, and pass through each one point of four Wilkinson power splitter
15 SMP radio frequency connectors 16,4 tunnel reception signals are synthesized, be down transferred to the SMP radio frequency sockets of power distribution synthesis network 5
31, after circulator 35, a point 4 tunnel reception signals export from radio frequency output interface 32.Also in the power supply of outside D/C power and outside
Under portion's beam steering signals control, the power supply to tile style TR components 2, highpowerpulse algorithm for power modulation and width phase code are realized
Control, realize high-power tile style active phase array antenna reception signal and/poor directional diagram scanning.
Refering to Fig. 3.Micro-strip antenna array 1 chooses the E types paster 6 being distributed on antenna medium substrates 8 and is used as radiation array element,
E types paster 6 is down connected in the feed probes 7 through antenna medium substrates 8, and feed probes 7 are down passed through on Antenna baseplate 9
Via 10 is fed, forms the radio-frequency feed to E types paster 6.E types paster 6, can be in unit spacing using feed probes 7 as benchmark
Any spacing (such as taking 0.5 wavelength) being adapted to of choosing is arranged in 4 × 4 submatrixs, 44 × 4 sons between 0.45~0.55 wavelength
Battle array is combined into the micro-strip antenna array 1 of one 8 × 8, so as to realize that high-power tile style active phase array antenna scans model at ± 60 °
The reception of space power synthesis or radiofrequency signal in enclosing.The working frequency of E types paster 6 is 15GHz, can be real using E types paster 6
The Miniaturization Design of existing antenna, the mutual coupling between the radiation array element of micro-strip antenna array 1 is reduced, so that it is guaranteed that high-power tile style is active
Phased array antenna realizes the precise guidance of target.The size of E types paster 6 can be calculated by model-expansion method or Electromagnetic Simulation is soft
Part emulation determines.The radius size of feed probes 7 and the radius size of feed via 10 press 1:2.3 ratio is designed, really
The input impedance for protecting E types paster 6 is 50 ohm.The radiation array element of whole micro-strip antenna array 1 presses connected watt of 8 × 8 array scales
Further it is connected on 64 radio frequency elastic contact pins 18 of formula TR components 2 and with high-power transceiving chip 11.
Refering to Fig. 4.The radio frequency elastic contact pin 18 of tile style TR components 2 up connects the feed probes 7 of micro-strip antenna array 1,
Realize the radio-frequency feed to micro-strip antenna array 1.Each radio frequency elastic contact pin 18 is connected in each big work(by microstrip transmission line
Rate transceiving chip 11.8 × 8 array scales share 64 high-power transceiving chips 11, and each high-power transceiving chip 11 is integrated with
High-power transmit-receive switch, transmission final stage power amplifier, final stage LNA is received, so as to realize the amplification of receiving and transmitting signal power.4 big work(
Rate transceiving chip 11 is connected on a TR multifunction chip 12 jointly by microstrip transmission line, and 8 × 8 array scales share 16
TR multifunction chips 12, every 4 TR multifunction chips 12 are connected together by one one point four Wilkinson power splitters 15,
Form 4 × 4 array scales submatrix circuit module, and by SMP radio frequency connectors 16 realize radiofrequency signal transmitting or
Receive.TR multifunction chips 12 mainly realize the drive amplification to transmission signal, realize that final stage power amplifier saturation exports, logical to receive
Road provides enough gains, ensures that losses at different levels will not significantly influence system noise；Each TR multifunction chips 12 are integrated with one
Receive the small-power transmitting-receiving of driving low-noise amplifier, a transmitting driving power amplifier and a Corechip chip
Switch；Corechip chips are the Primary Components for realizing wave beam control, Corechip integrated chips 6 bit digital phase shifters and 6
Digit digital attenuator, also it is integrated with 12 deserializers and register for realizing the row loading of transmitting-receiving timesharing width phase sequence.
The low frequency signal control network 13 for being connected in high-power transceiving chip 11 and TR multifunction chips 12 is distributed in tile style
On the PCB medium substrates 14 of TR components 2, for controlling the work of 64 high-power transceiving chips 11 and 16 TR multifunction chips 12
Make state.Low frequency signal controls network 13 by pga socket 17 and up through the rectangular metal via 19 on heat exchanger 3
Power modulation distributor 4 on PGA plugs 24 be connected, realize to the power supply of tile style TR components 2, highpowerpulse power tune
The control of system and width phase code.
Refering to Fig. 5.Heat exchanger 3 is mainly the high-power transceiving chip 11 and TR Multifunctional cores for solving tile style TR components 2
The heat accumulation of piece 12.Heat exchanger 3 is formed with the metallic cavity 21 being close on high-power transceiving chip 11 and TR multifunction chips 12, gold
It is consistent with the area of the PCB medium substrates 14 of fixed tile style TR components 2 to belong to the size of cavity 21, is made in metallic cavity 21
There is pga socket 17 and SMP radio frequency connector 16 one-to-one circular metal via of the position of opening respectively with tile style TR components 2
20 and the rectangular metal via 19 more than circular metal number of vias, for pga socket 17 and SMP radio frequency connectors 16 respectively with
The PGA plugs 24 of power modulation distributor 4 are connected with the SMP radio frequency sockets 31 of power distribution synthesis network 5, and metallic cavity 21
Filled with the graphite for heat accumulation/paraffin composite phase change material.
8 rectangular metal vias 19 and 4 circular metal vias 20 are provided with the metallic cavity 21 of heat exchanger 3, it is opened
Hole site corresponds with the pga socket 17 and SMP radio frequency connectors 16 of tile style TR components 2 respectively.The inside of metallic cavity 21 is dug
Sky, fill graphite/paraffin composite phase change material, the heat accumulation for high-power tile style active phase array antenna, it is ensured that high-power to have
Source phased array reliably working, and realize light weight design.The thickness of metallic cavity 21 is by high-power tile style active phase array antenna
Overall heat consumption, the working time of high-power tile style active phase array antenna, the latent heat of graphite/paraffin composite phase change material, graphite/stone
The density of wax composite phase-change material, the area of metallic cavity 21 and quality, high-power transceiving chip 11 and TR multifunction chips 12
Junction temperature of chip determines, can be emulated and determined by hot simulation software.
Refering to Fig. 6.Power modulation distributor 4 is integrated on ptfe substrate 30, and outside D/C power is powered from power supply
Power outlet 29 on modulation allocation device 4 is inputted, and high-power tile style is realized into power supply energy-storage module 27 by low frequency signal line
The energy storage of active phase array antenna power supply, it is real that power supply is then supplied into power pulse modulation circuit module 26 by low frequency signal line
The impulse modulation that now the high-power transceiving chip 11 to tile style TR components 2 and TR multifunction chips 12 are powered, finally by low frequency
Signal wire supply power supply distribution module 22 realizes the distribution to power supply, and the low frequency signal by being connected with power supply distribution module 22
The PGA plugs 24 of network 23 export.External beam control signal is defeated from the control socket 28 on power modulation distributor 4 simultaneously
Enter, power supply distribution module 22 is entered by low frequency control line 36, again by the PGA plugs 24 being connected with low frequency signal network 23
Output, is realized to the high-power transceiving chip 11 of tile style TR components 2 and power supply, the highpowerpulse of TR multifunction chips 12 jointly
The control of algorithm for power modulation and width phase code.
Refering to Fig. 7.Power distribution synthesis network 5 is integrated on fiberglass medium substrate 37.One end of SMP radio frequency sockets 31
Tile style TR with down passing through the shielding via 25 on the circular metal via 20 and power modulation distributor 4 on heat exchanger 3
The SMP radio frequency connectors 16 of component 2 are connected, and realize the transmitting or reception of the radiofrequency signal of tile style TR components 2.SMP radio frequency sockets
31 other ends are connected in circulator 35 by the microstrip transmission line on fiberglass medium substrate 37, after circulator 35, divide two-way
Output, radio frequency receiving signal is exported, share four radio frequency output interfaces through microstrip transmission line from radio frequency output interface 32 all the way
32, another way is connected in the rf input interface 33 of power distribution synthesis network 5, transmitting letter can be achieved through microstrip power divider 34
Number input.
Fig. 8 be the high-power tile style active phase array antenna of the present invention under conditions of 80 DEG C of high temperature, the heat of work 180 seconds is set
Count result.The high-power tile style active phase array antenna of 8 × 8 scales shares 64 high-power chips 11, each high-power chip
11 power outputs are 49dBm.In view of the symmetry of 64 topology layouts of high-power chip 11, a quarter structure setting temperature is taken
Degree monitoring, and monitoring temperature point is set below any 4 high-power chips 11 close to centre position, enter trip temperature prison
Survey.In terms of design result, 4 monitoring temperature points maximum temperature when high-power tile style active phase array antenna works 180 seconds is
103.5 DEG C, meet that junction temperature of chip is less than 150 DEG C of job requirement, high-power tile style active phase array antenna can be 80 DEG C in high temperature
Hot conditions under reliably work, 4 uniform temperatures of high-power chip 11 are within 5 DEG C, it is not necessary to do temperature-compensating again, you can
Meet the requirement on electric performance of high-power tile style active phase array antenna.
The present invention illustrates and shows referring specifically to preferred embodiment, it should be understood by those skilled in the art that can be
Remodeling is made in form and in content without departing from spirit and scope of the invention.
Claims (10)
1. a kind of high-power target seeker tile style active phase array antenna, including the micro-strip antenna array stacked gradually（1）, tile style TR
Component（2）, heat exchanger（3）, power modulation distributor（4）Network is synthesized with power distribution（5）, it is characterised in that：Micro-strip day
Linear array（1）With E type pasters（6）As radiation array element, radiation array element unit spacing the wavelength of working frequency 0.45~0.55 it
Between value, be extended by the integral multiple of 4 × 4 array scales, using rectangular grid array layout in antenna medium substrates（8）
On；Tile style TR components（2）Integrated tight is connected heat exchanger（3）；Micro-strip antenna array（1）Feed probes（7）Through day
Line medium substrate（8）And Antenna baseplate（9）On feed via（10）And layout is in tile style TR components（2）High-power transmitting-receiving
Chip（11）Be connected integrated transceiver channel；Transmission signal synthesizes network by power distribution（5）Rf input interface（33）, warp
Microstrip power divider（34）And circulator（35）Into being distributed in tile style TR components（2）TR multifunction chips（12）, each TR is more
Functional chip（12）The radiofrequency signal that input is come in is divided into 4 tunnels, is sent respectively to each high-power transceiving chip（11）, then pass
It is defeated to arrive micro-strip antenna array（1）；Now, outside D/C power is powered from power modulation distributor（4）On power outlet（29）It is defeated
Enter, sequentially enter power supply energy-storage module（27）, power pulse modulation circuit module（26）And power supply distribution module（22）, together
When external beam control signal from power modulation distributor（4）On control socket（28）Input, it is directly entered power supply distribution mould
Block（22）, through with low frequency signal network（23）Connected PGA plugs（24）Output, PGA plugs（24）Through heat exchanger（3）On
Rectangular metal via（19）With tile style TR components（2）Pga socket（17）It is connected, finally by low frequency signal network（23）It is real
Now give tile style TR components（2）Power supply, the control of highpowerpulse algorithm for power modulation and width phase code, realize that high-power tile style has
Space power synthesis and the directional diagram scanning of source phased array antenna.
A kind of 2. high-power target seeker tile style active phase array antenna as claimed in claim 1, it is characterised in that：Same
In the pulsed operation cycle, the reception signal reflected from target is through micro-strip antenna array（1）Radiation array element enter be distributed in
Tile style TR components（2）High-power transceiving chip（11）, while every 4 high-power transceiving chips（11）A TR is connected in jointly
Multifunction chip（12）, form multipath reception signal and enter several point of four Wilkinson power splitter（15）, and by each
One point of four Wilkinson power splitter（15）SMP radio frequency connectors（16）, synthesizing multi-path radio frequency receiving signal, down transmit into
Enter power distribution synthesis network（5）SMP radio frequency sockets（31）, through circulator（35）And microstrip power divider（34）Afterwards, most end form
Into 4 tunnel reception signals from 4 radio frequency output interfaces（32）Output, and controlled also in the power supply of outside D/C power and external beam
Under signal control, realize and give tile style TR components（2）Power supply, the control of highpowerpulse algorithm for power modulation and width phase code, realize
High-power tile style active phase array antenna reception signal and the scanning of/poor directional diagram.
A kind of 3. high-power target seeker tile style active phase array antenna as claimed in claim 1, it is characterised in that：E type pasters
（6）With feed probes（7）It is any between 0.45~0.55 wavelength of unit spacing to choose suitable spacing arrangement as benchmark
Into 4 × 4 submatrixs, 44 × 4 submatrixs are combined into the micro-strip antenna array of one 8 × 8（1）, so as to realize that High Power Active is phased
Array antenna is ± 60oThe reception of space power synthesis or radiofrequency signal in scanning range.
A kind of 4. high-power target seeker tile style active phase array antenna as claimed in claim 1, it is characterised in that：Each E types
Paster（6）Pass through feed probes（7）Fed, each feed probes（7）Through antenna medium substrates（8）And Antenna baseplate
（9）On feed via（10）It is connected in tile style TR components（2）Radio frequency elastic contact pin（18）.
A kind of 5. high-power target seeker tile style active phase array antenna as claimed in claim 1, it is characterised in that：Each TR is more
Functional chip（12）It is integrated with one and receives driving low-noise amplifier, a transmitting driving power amplifier and one
The small-power transmit-receive switch of Corechip chips；Corechip integrated chips 6 bit digital phase shifters and 6 digit digital attenuators,
Also it is integrated with 12 deserializers and register for realizing the row loading of transmitting-receiving timesharing width phase sequence.
A kind of 6. high-power target seeker tile style active phase array antenna as claimed in claim 1, it is characterised in that：In tile style TR
Component（2）In, every 4 high-power transceiving chips（11）Be connected a TR multifunction chip simultaneously（12）, form tile style TR components
（2）The circuit unit of one 2 × 2,4 circuit units pass through one point of four Wilkinson power splitter（15）Form one 4 × 4
Submatrix circuit module, 44 × 4 submatrix circuit modules pass through 4 one point four Wilkinson power splitters（15）On SMP radio frequencies connect
Connect device（16）, down pass through heat exchanger（3）On circular metal via（20）With power modulation distributor（4）On shielding
Hole（25）, be connected in power distribution synthesis network（5）SMP radio frequency sockets（31）.
A kind of 7. high-power target seeker tile style active phase array antenna as claimed in claim 1, it is characterised in that：Heat exchanger
（3）It is formed with and is close to high-power transceiving chip（11）With TR multifunction chips（12）On metallic cavity（21）, metallic cavity（21）
Size and fixed tile style TR components（2）PCB medium substrates（14）Area it is consistent, in metallic cavity（21）On be formed with
Position of opening respectively with tile style TR components（2）Pga socket（17）With SMP radio frequency connectors（16）One-to-one circular metal
Via（20）With the rectangular metal via more than circular metal number of vias（19）, for pga socket（17）Connected with SMP radio frequencies
Device（16）Respectively with power modulation distributor（4）PGA plugs（24）Network is synthesized with power distribution（5）SMP radio frequency sockets
（31）It is connected, and metallic cavity（21）Filled with the graphite for heat accumulation/paraffin composite phase change material.
A kind of 8. high-power target seeker tile style active phase array antenna as claimed in claim 1, it is characterised in that：Power modulation
Distributor（4）It is integrated in ptfe substrate（30）On, PGA plugs thereon（24）Up pass through heat exchanger（3）On
Rectangular metal via（19）It is connected to tile style TR components（2）Pga socket（17）On.
A kind of 9. high-power target seeker tile style active phase array antenna as claimed in claim 1, it is characterised in that：Power distribution
Synthesize network（5）Pass through circulator（35）And microstrip power divider（34）The transmitting all the way and 4 tunnels for realizing radiofrequency signal receive.
A kind of 10. high-power target seeker tile style active phase array antenna as claimed in claim 1, it is characterised in that：Radio frequency is believed
Number point 4 tunnels respectively enter tile style TR components（2）4 one point four Wilkinson power splitters（15）, each one point four
Wilkinson power splitters（15）The radiofrequency signal that input is come in is separated into 4 tunnels and is sent to TR multifunction chips（12）, then TR
Multifunction chip（12）The radiofrequency signal that input is come in is divided into 4 tunnels again, is sent respectively to 64 high-power transceiving chips（11）,
Micro-strip antenna array is transferred to again（1）.
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| CN201510785666.7A CN105356051B (en) | 2015-11-16 | 2015-11-16 | High-power target seeker tile style active phase array antenna |
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