CN107395148B - Temperature compensation equalizing circuit of TR (transmitter-receiver) component - Google Patents
Temperature compensation equalizing circuit of TR (transmitter-receiver) component Download PDFInfo
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- CN107395148B CN107395148B CN201710635969.XA CN201710635969A CN107395148B CN 107395148 B CN107395148 B CN 107395148B CN 201710635969 A CN201710635969 A CN 201710635969A CN 107395148 B CN107395148 B CN 107395148B
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03G—CONTROL OF AMPLIFICATION
- H03G5/00—Tone control or bandwidth control in amplifiers
- H03G5/16—Automatic control
- H03G5/165—Equalizers; Volume or gain control in limited frequency bands
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
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Abstract
The invention provides a temperature compensation equalizing circuit of a TR component, which comprises a temperature compensation circuit and an equalizing circuit; the temperature compensation circuit adopts a PIN tube core and a direct current bias circuit to realize the temperature compensation function; the direct current bias circuit is formed by connecting a fixed resistor and a thermistor in series; the equalizing circuit comprises equalizing resistors which are realized on the open-circuit transmission line in a mode of adopting a microstrip open-circuit stub line and a lumped resistor; the balance resistors are realized on the aluminum oxide ceramic substrate by gold plating and TaN resistor films, and the short circuit state of the two balance resistors is realized through a gold wire welding process. The ultra-wideband TR component debugging device can be well applied to ultra-wideband TR components, solves the problems of large gain fluctuation and large high-low temperature gain fluctuation in the frequency band of the ultra-wideband TR components, and has the great advantage particularly when being used for debugging amplitude consistency indexes of a plurality of TR components.
Description
Technical Field
The invention relates to a temperature compensation equalizing circuit of a TR component, in particular to a temperature compensation equalizing circuit suitable for an ultra-wideband TR component.
Background
In recent years, electronic warfare equipment is widely applied to an active phased array technology, and equipment performance is greatly broken through. The TR component is the basis of forming a phased array antenna, is a core component of an active phased array, and is applied to the field of electronic warfare, and the ultra wide band and miniaturization are necessary technical characteristics.
At present, a multifunctional chip and a high-density integration technology are widely adopted for an electronic war TR component to realize the ultra-wideband and miniaturization technical characteristics, but the technical difficulties of large gain fluctuation in an application frequency band, large high-temperature and low-temperature gain change and the like exist, and a certain gain compensation technology is required to meet the application requirement. The gain compensation technology for realizing the ultra-wideband TR component mainly comprises gain equalization and temperature compensation technologies.
(1) Gain equalization techniques
Because the frequency band of TR subassembly is wider (3 octaves), the inside passive circuit of TR subassembly interpolation loss can increase along with the frequency increase, and active amplifier gain is higher at the frequency band low end, and the frequency channel high end is lower, just so causes the corresponding fluctuation of the amplitude of TR subassembly great, needs the gain equalizer circuit. The traditional equalizer chip has the defects that the gain equalization amount is fixed and cannot be dynamically adjusted, and the performance index improvement of the amplitude consistency of a plurality of TR components is not facilitated.
(2) Temperature compensation technique
The TR component is internally integrated with multiple functions, such as a receiving and transmitting switch, an amplitude weighted attenuation circuit, a numerical control phase shifting circuit and the like, the insertion loss is large, and a cascade multistage amplifier is needed for obtaining a certain amplitude gain. The gain of the amplifier is negative temperature characteristic (namely, the gain is reduced along with the increase of the temperature), and the TR component which does not use the temperature compensation technology fluctuates by about 10dB due to the use of the multistage amplifier. In order to reduce the temperature gain fluctuation of the TR component, a temperature compensation technology is generally adopted, a T-type or PI-type attenuator is formed by a thermistor in a traditional temperature compensation chip to realize a temperature compensation function, the defects of large insertion loss and incapability of dynamic adjustment exist, and meanwhile, the high-frequency-band temperature compensation effect of the skin effect step-stabilized attenuator is poor.
Disclosure of Invention
The technical problem to be solved by the invention is as follows:
1. the disclosed TR component gain equalization circuit can improve amplitude consistency performance of multiple TR components;
2. the TR component temperature compensation attenuation circuit is small in insertion loss, large in high-low temperature gain compensation range, capable of being dynamically adjusted and good in high-frequency band temperature compensation effect of the step attenuator.
The technical scheme adopted by the invention is as follows:
a temperature compensation equalizing circuit of a TR component comprises a temperature compensation circuit and an equalizing circuit; the temperature compensation circuit adopts a PIN tube core and a direct current bias circuit to realize the temperature compensation function; the direct current bias circuit is formed by connecting a fixed resistor and a thermistor in series; a choke inductor and a diode are sequentially connected between the fixed resistor and the thermistor and then grounded; the choke inductor is connected with the anode of the diode; the anode of the diode is connected with the input end and the output end of the temperature compensation circuit through a coupling capacitor respectively.
The equalizing circuit comprises equalizing resistors which are realized on the open-circuit transmission line in a mode of adopting a microstrip open-circuit stub line and a lumped resistor; the balance resistors are realized on the aluminum oxide ceramic substrate by gold plating and TaN resistor films, and the short circuit state of the two balance resistors is realized through a gold wire welding process.
The equalization resistor comprises more than two series equalization resistors.
The circuit also comprises two isolating circuits; each path of isolation circuit mainly comprises a 90-degree electric bridge; the radio frequency input signal is divided into two paths by one path of isolation circuit, passes through two paths of temperature compensation circuits and two paths of equalization circuits in sequence, and is synthesized by a 90-degree electric bridge of the other path of isolation circuit and then output; each path of isolation circuit also comprises a matching resistor at the isolation end of the 90-degree bridge, and the matching resistor is used for absorbing the reflected signals of the temperature compensation circuit and the equalization circuit; the two temperature compensation circuits and the two equalization circuits are in one-to-one correspondence.
The matching resistance is a 50 ohm matching resistance.
A temperature compensation equalizing circuit of a TR component comprises a temperature compensation circuit and an equalizing circuit; the equalizing circuit comprises equalizing resistors which are realized on the open-circuit transmission line in a mode of adopting a microstrip open-circuit stub line and a lumped resistor; the balance resistors are realized on the aluminum oxide ceramic substrate by gold plating and TaN resistor films, and the short circuit state of the two balance resistors is realized through a gold wire welding process.
The equalization resistor comprises more than two series equalization resistors.
The circuit also comprises two isolating circuits; each path of isolation circuit mainly comprises a 90-degree electric bridge; the radio frequency input signal is divided into two paths by one path of isolation circuit, passes through two paths of temperature compensation circuits and two paths of equalization circuits in sequence, and is synthesized by a 90-degree electric bridge of the other path of isolation circuit and then output; each path of isolation circuit also comprises a matching resistor at the isolation end of the 90-degree bridge, and the matching resistor is used for absorbing the reflected signals of the temperature compensation circuit and the equalization circuit; the two temperature compensation circuits and the two equalization circuits are in one-to-one correspondence.
The matching resistance is a 50 ohm matching resistance.
Compared with the prior art, the invention has the beneficial effects that: the ultra-wideband TR component can be well applied to the ultra-wideband TR component, the problems of large gain fluctuation and large high-low temperature gain fluctuation in the frequency band of the ultra-wideband TR component are solved, and the ultra-wideband TR component has a great advantage particularly in the debugging of the amplitude consistency indexes of a plurality of TR components; the device has good performance in a 6-18GHz broadband TR component test, the gain equalization amount and the temperature compensation range are adjustable, and the input and output standing wave performance is excellent. The method has positive significance for improving the producibility and the debuggability of the ultra-wideband TR component.
Drawings
Fig. 1 is a schematic structural diagram of a temperature compensation circuit according to an embodiment of the present invention.
Fig. 2 is a schematic diagram of a principle structure of an equalizing circuit in an embodiment of the present invention.
Fig. 3 is a schematic diagram of an equivalent circuit structure of the equalizing circuit of the embodiment shown in fig. 2.
Fig. 4 is a schematic structural diagram of a TR device temperature compensation equalizing circuit according to an embodiment of the present invention.
Fig. 5 is a schematic structural diagram of an isolation circuit according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Any feature disclosed in this specification (including any accompanying drawings) may be replaced by alternative features serving equivalent or similar purposes, unless expressly stated otherwise. That is, unless expressly stated otherwise, each feature is only an example of a generic series of equivalent or similar features.
Detailed description of the preferred embodiment 1
A temperature compensation equalizing circuit of a TR component comprises a temperature compensation circuit and an equalizing circuit; the temperature compensation circuit adopts a PIN tube core and a direct current bias circuit to realize the temperature compensation function; the direct current bias circuit is formed by connecting a fixed resistor and a thermistor in series; a choke inductor and a diode are sequentially connected between the fixed resistor and the thermistor and then grounded; the choke inductor is connected with the anode of the diode; the anode of the diode is connected with the input end and the output end of the temperature compensation circuit through a coupling capacitor respectively.
The temperature compensation circuit in the invention is shown in figure 1, a PIN tube core and a peripheral direct current bias circuit are adopted to realize the temperature compensation function, the resistance value of a thermistor is almost 0 ohm when the temperature is high, so that the PIN tube core is almost in a 0 bias state, namely a radio frequency ground open circuit state, and the insertion loss of a temperature compensation circuit network is minimum. The resistance value of the thermistor is increased at low temperature, so that the direct current bias of the PIN tube core is close to a conducting state, namely a radio frequency-to-ground low impedance state, and the insertion loss of the network of the temperature compensation circuit is the largest at low temperature, so that the temperature compensation circuit has the advantages of high and low temperature compensation function, large high and low temperature gain compensation range, dynamic adjustment and the like. The traditional temperature compensation chip adopts a T-type or PI-type attenuator composed of thermistors to realize the temperature compensation function, has the defects of large insertion loss and incapability of dynamic adjustment, and simultaneously has poor high-frequency-band temperature compensation effect due to the skin effect temperature compensation attenuator. In addition, the choke inductor in the temperature compensation circuit mainly has the function of radio frequency isolation, and the coupling capacitor mainly has the functions of isolating direct current voltage and conducting radio frequency signals, namely the function of isolating direct current and conducting alternating current.
Specific example 2
On the basis of the specific embodiment 1, as shown in fig. 2, the equalizing circuit includes an equalizing resistor implemented on an open-circuit transmission line in a microstrip open-circuit stub + lumped resistor manner; the balance resistors are realized on the aluminum oxide ceramic substrate by gold plating and TaN resistor films, and the short circuit state of the two balance resistors is realized through a gold wire welding process.
Fig. 3 shows an equivalent circuit of the equalizer circuit, and the operating principle of the equalizer circuit is that the open stub input impedance is Zin = -j × Z0 × cot (2 pi L/λ), where Z0 is the characteristic impedance of the transmission line, L is the open transmission line length L, and λ is the wavelength of the microwave signal. When the length of the open transmission line is unchanged, assuming that the wavelength corresponding to the frequency f0 is λ 0 and 2 π L/λ 0= π/2, and Zin =0, it is equivalent to grounding the resistor R1, and the insertion loss of the equivalent circuit topology network shown in FIG. 3 is the largest. As the frequency increases, the input impedance of the open stub exhibits a capacitive impedance, and the capacitance value gradually decreases as the frequency increases, assuming that when the frequency is f1, the corresponding wavelength is λ 1, and 2 π L/λ 1=3 π/4, and Zin = ∞ (infinity), which corresponds to an open circuit of the resistor R1, the insertion loss of the equivalent circuit topology network shown in FIG. 3 is minimal, so that the microstrip open stub can implement a microwave amplitude equalizer function. In addition, the dynamic adjustment of the amplitude equalization amount can be realized by realizing the short circuit state of the equalization resistor R1 or R2 through a gold wire welding process. The specific size of the equalizing resistance is specifically set according to the characteristics of the characteristic impedance transmission line.
Specific example 3
On the basis of the specific embodiment 2, the equalizing resistance comprises more than two series equalizing resistances, and in the specific embodiment, comprises two series equalizing resistances R1 and R2. The equalization precision is effectively improved by adopting more than two equalization resistors connected in series, but the number of the equalization resistors should be reasonably designed according to the influence of distributed capacitance.
Specific example 4
On the basis of one of the specific embodiments 1 to 3, as shown in fig. 4 and 5, the circuit further includes two isolation circuits; each path of isolation circuit mainly comprises a 90-degree electric bridge; the radio frequency input signal is divided into two paths by one path of isolation circuit, passes through two paths of temperature compensation circuits and two paths of equalization circuits in sequence, and is synthesized by a 90-degree electric bridge of the other path of isolation circuit and then output; each path of isolation circuit also comprises a matching resistor at the isolation end of the 90-degree bridge, and the matching resistor is used for absorbing reflected signals of the temperature compensation circuit and the equalization circuit, so that the temperature compensation circuit and the equalization circuit are isolated from a peripheral circuit, and the good input-output standing wave ratio of the temperature compensation circuit and the equalization circuit is ensured; the two temperature compensation circuits and the two equalization circuits are in one-to-one correspondence.
Specific example 5
On the basis of specific embodiment 4, the matching resistance is a 50 ohm matching resistance.
Specific example 6
A temperature compensation equalizing circuit of a TR component comprises a temperature compensation circuit and an equalizing circuit; the equalizing circuit comprises equalizing resistors which are realized on the open-circuit transmission line in a mode of adopting a microstrip open-circuit stub line and a lumped resistor; the balance resistors are realized on the aluminum oxide ceramic substrate by gold plating and TaN resistor films, and the short circuit state of the two balance resistors is realized through a gold wire welding process.
Specific example 7
On the basis of the specific embodiment 6, the equalizing resistance includes more than two series equalizing resistances, and in the specific embodiment, includes two series equalizing resistances R1 and R2.
Specific example 8
On the basis of the specific embodiment 6 or 7, the circuit further comprises two isolating circuits; each path of isolation circuit mainly comprises a 90-degree electric bridge; the radio frequency input signal is divided into two paths by one path of isolation circuit, passes through two paths of temperature compensation circuits and two paths of equalization circuits in sequence, and is synthesized by a 90-degree electric bridge of the other path of isolation circuit and then output; each path of isolation circuit also comprises a matching resistor at the isolation end of the 90-degree bridge, and the matching resistor is used for absorbing reflected signals of the temperature compensation circuit and the equalization circuit, so that the temperature compensation circuit and the equalization circuit are isolated from a peripheral circuit, and the good input-output standing wave ratio of the temperature compensation circuit and the equalization circuit is ensured; the two temperature compensation circuits and the two equalization circuits are in one-to-one correspondence.
Specific example 9
On the basis of specific embodiment 8, the matching resistance is a 50 ohm matching resistance.
Claims (5)
1. A temperature compensation equalizing circuit of a TR component is characterized by comprising a temperature compensation circuit and an equalizing circuit; the temperature compensation circuit adopts a PIN tube core and a direct current bias circuit to realize the temperature compensation function; the direct current bias circuit is formed by connecting a fixed resistor and a thermistor in series; a choke inductor and a diode are sequentially connected between the fixed resistor and the thermistor and then grounded; the choke inductor is connected with the anode of the diode; the anode of the diode is connected with the input end and the output end of the temperature compensation circuit through a coupling capacitor respectively.
2. The temperature-compensated equalization circuit for TR components of claim 1, wherein the equalization circuit comprises an equalization resistor implemented on an open transmission line in a microstrip open stub + lumped resistor manner; the balance resistors are realized on the aluminum oxide ceramic substrate by gold plating and TaN resistor films, and the short circuit state of the two balance resistors is realized through a gold wire welding process.
3. The temperature-compensated equalization circuit of a TR assembly of claim 2, wherein the equalization resistor comprises more than two series equalization resistors.
4. The temperature compensation equalizing circuit of the TR component according to one of claims 1 to 3, further comprising two isolation circuits; each isolation circuit consists of a 90-degree electric bridge; the radio frequency input signal is divided into two paths by one path of isolation circuit, passes through two paths of temperature compensation circuits and two paths of equalization circuits in sequence, and is synthesized by a 90-degree electric bridge of the other path of isolation circuit and then output; each path of isolation circuit also comprises a matching resistor at the isolation end of the 90-degree bridge, and the matching resistor is used for absorbing the reflected signals of the temperature compensation circuit and the equalization circuit; the two temperature compensation circuits and the two equalization circuits are in one-to-one correspondence.
5. The temperature compensated equalization circuit of a TR assembly of claim 4, wherein the matching resistor is a 50 ohm matching resistor.
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| CN201710635969.XA CN107395148B (en) | 2017-07-31 | 2017-07-31 | Temperature compensation equalizing circuit of TR (transmitter-receiver) component |
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| CN201710635969.XA CN107395148B (en) | 2017-07-31 | 2017-07-31 | Temperature compensation equalizing circuit of TR (transmitter-receiver) component |
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| CN107395148B true CN107395148B (en) | 2020-06-09 |
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Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109387813B (en) * | 2018-08-31 | 2023-04-11 | 中国电子科技集团公司第二十九研究所 | High-precision frequency measurement method based on broadband radar signal reception |
| JP7133486B2 (en) * | 2019-01-16 | 2022-09-08 | 日立Astemo株式会社 | signal transmission device, signal transmission system |
| CN109962717A (en) * | 2019-04-16 | 2019-07-02 | 中国电子科技集团公司第二十九研究所 | A kind of temperature-compensation circuit of ultra wide band |
| CN112615592A (en) * | 2020-11-25 | 2021-04-06 | 中国电子科技集团公司第二十九研究所 | Miniaturized self-adaptation temperature compensation circuit of high driving capability |
| CN113285679B (en) * | 2021-04-23 | 2022-08-23 | 中国电子科技集团公司第二十九研究所 | Ultra-wideband miniaturized amplitude expanding circuit |
| CN113300682B (en) * | 2021-06-03 | 2022-05-17 | 中国电子科技集团公司第二十九研究所 | Reconfigurable amplitude limiting and attenuation integrated circuit and working method thereof |
| CN115064854B (en) * | 2022-07-27 | 2023-08-22 | 电子科技大学 | Bimodal gain equalizer based on reflection type vector synthesis method |
| CN117200727B (en) * | 2023-11-06 | 2024-01-23 | 中国电子科技集团公司第二十九研究所 | Coaxial gain equalization device |
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| US9383789B2 (en) * | 2012-06-21 | 2016-07-05 | Apple Inc. | Thermal control apparatus and methodology |
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