CN117200727B - Coaxial gain equalization device - Google Patents
Coaxial gain equalization device Download PDFInfo
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- CN117200727B CN117200727B CN202311461444.0A CN202311461444A CN117200727B CN 117200727 B CN117200727 B CN 117200727B CN 202311461444 A CN202311461444 A CN 202311461444A CN 117200727 B CN117200727 B CN 117200727B
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- matching
- ceramic substrate
- transmission line
- coaxial
- equalization
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- 230000005540 biological transmission Effects 0.000 claims abstract description 42
- 239000000919 ceramic Substances 0.000 claims abstract description 40
- 239000000758 substrate Substances 0.000 claims abstract description 40
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 33
- 239000003990 capacitor Substances 0.000 claims abstract description 25
- 238000006243 chemical reaction Methods 0.000 claims abstract description 20
- 229910052737 gold Inorganic materials 0.000 claims abstract description 16
- 239000010931 gold Substances 0.000 claims abstract description 16
- 238000004519 manufacturing process Methods 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 239000010409 thin film Substances 0.000 claims description 4
- 230000008054 signal transmission Effects 0.000 claims description 3
- 230000007704 transition Effects 0.000 claims description 3
- 230000007613 environmental effect Effects 0.000 claims 1
- 238000003825 pressing Methods 0.000 claims 1
- 238000000034 method Methods 0.000 description 9
- 238000004088 simulation Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 8
- 230000004044 response Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D30/00—Reducing energy consumption in communication networks
- Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
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- Non-Reversible Transmitting Devices (AREA)
Abstract
The invention discloses a coaxial gain equalization device, which belongs to the technical field of equalizers, and comprises a ceramic substrate, a microstrip transmission line, a matching capacitor, a matching resistor, a miniaturized resonant branch, a cascading gold wire, a gold strap, an equalization adjusting circuit, a metallized grounding via hole and a coaxial microstrip conversion structure, wherein the microstrip transmission line is used for realizing the interconnection of radio frequency signals, and the miniaturized resonant branch, the equalization adjusting circuit and the gold strap jointly form a band-stop resonant circuit for completing equalization characteristics; the matching capacitor and the matching resistor form matching together and are used for balancing the circuit to finish good transmission matching characteristics; the balance adjustment circuit is used for adjusting the balance quantity and realizing the application requirements of different balance quantities. The invention has small volume, can adjust the balance according to the requirement, meets the balance requirement of different gains, can realize the compensation of the difference value of the high-temperature gain and the low-temperature gain at different temperatures, and improves the coaxial gain balance performance.
Description
Technical Field
The invention relates to the technical field of equalizer, in particular to a coaxial gain equalization device.
Background
In the technical field of electronics, the application requirements of the ultra-wideband of the radio frequency channel are urgent, but the amplitude response frequency response of the high frequency and the low frequency of the radio frequency components and the interconnection cable applied to the ultra-wideband is large in frequency response difference, so that the gain fluctuation of the radio frequency channel is large, the dynamic range of the whole system is further influenced, and the problem that the gain amplitude of the whole radio frequency channel is uneven is solved by adopting an equalizing device to generate attenuation amounts with different magnitudes for different frequencies.
The current equalizer implementation modes at home and abroad generally comprise a waveguide type, a coaxial type, a microstrip type, a chip type and the like, and the equalizer implemented by adopting the current modes is either limited by an internal bare chip and cannot be adjusted (such as the same type), or is required to be integrated in a component, and once the component is capped, the equalizer cannot be adjusted (such as the microstrip type), or is large in size and unfavorable for installation and integration (such as the waveguide type).
The technical defects of the prior equalizer devices greatly limit the service environment and flexibility of the equalizer.
Disclosure of Invention
The invention aims to overcome the defects of the prior art, provides the coaxial gain balancing device, has small volume, can adjust the balancing amount according to the requirement, meets different gain balancing requirements, can realize the compensation of high-low temperature gain difference values at different temperatures, and improves the coaxial gain balancing performance.
The ultra-wideband gain average device is applied to a radio frequency circuit, realizes gain equalization of a radio frequency channel of 0.5-20GHz, can perform equalization amount adjustment according to requirements, meets different gain equalization requirements, and is provided with a temperature compensation circuit for compensating high-low temperature gain difference values at different temperatures.
The invention aims at realizing the following scheme:
a coaxial gain equalization device comprises a ceramic substrate, a microstrip transmission line, a matching capacitor, a matching resistor, a miniaturized resonant branch, a cascading gold wire, a gold strap, an equalization adjustment circuit, a metallized grounding via hole and a coaxial microstrip conversion structure; the microstrip transmission line is positioned on the ceramic substrate and is used for realizing interconnection of radio frequency signals; the matching resistor is arranged on the ceramic substrate, the miniaturized resonant branch, the equalization adjusting circuit and the gold band jointly form a band-stop resonant circuit, the band-stop resonant circuit is used for completing equalization characteristics, and the matching resistor and the microstrip transmission line are interconnected by cascading gold wires; the matching capacitor and the matching resistor form matching together and are used for balancing a circuit to finish good transmission matching characteristics; the balance adjustment circuit is composed of a plurality of series resistors and is used for adjusting the balance quantity and realizing the application requirements of different balance quantities; the cascade gold wire is utilized to realize the series resistance short circuit of the balance adjustment circuit; the metallized grounding via hole is grounded, the coaxial microstrip conversion structure is a carrier and is also used for realizing impedance matching and conversion functions of the microstrip interface and the coaxial interface.
Further, the coaxial microstrip antenna comprises a screw sleeve, wherein the screw sleeve is sleeved on the coaxial microstrip conversion structure and is used for protecting an internal circuit.
Further, the ceramic substrate is an internal circuit carrier, the microstrip transmission line 2 comprises a 50 ohm radio frequency transmission line, the matching capacitor comprises a planar capacitor, and the planar capacitor is arranged on the 50 ohm radio frequency transmission line of the ceramic substrate to realize an impedance matching function.
Further, the matching resistor comprises a thermistor, the thermistor is connected in series between a microstrip transmission line of the ceramic substrate and the miniaturized resonant branch circuit and used for realizing impedance matching and self-adaptive equalization functions, and the resistance value of the thermistor changes regularly along with the ambient temperature and is used for completing the equalization quantity along with the temperature characteristic self-adaptive compensation function.
Further, the balance adjustment circuit is connected in series between the microstrip transmission line of the ceramic substrate and the miniaturized resonant branch circuit, and is used for realizing the balance adjustment function.
Further, the cascade gold wire is in pressure connection with the matching capacitor and the microstrip transmission line and is used for radio frequency signal transmission seen by different functional circuits.
Further, the gold strap is in press connection with the miniaturized resonance branch and the ceramic substrate grounding surface, and is used for grounding the miniaturized resonance branch to realize the short circuit resonance function.
Further, the ceramic substrate, the microstrip transmission line, the miniaturized resonant branch and the balance adjustment circuit are all manufactured by a thin film production process.
Further, the matching resistor is bonded on the ceramic substrate by conductive silver paste.
Further, the ceramic substrate is integrated on the coaxial microstrip transition structure.
The beneficial effects of the invention include:
the invention provides a novel simple realization structure of a coaxial equalizer with adjustable equalizing quantity, which has small volume, can adjust the equalizing quantity, has ultra-wideband characteristic, is applied to a radio frequency circuit, can realize gain equalization of a radio frequency channel of 0.5-20GHz, can adjust the equalizing quantity according to requirements, meets different gain equalization requirements, and simultaneously, is used for compensating high-low temperature gain difference values at different temperatures by designing a temperature compensation circuit in the equalizing device, thereby improving the coaxial gain equalization performance.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the invention, and that other drawings can be obtained according to these drawings without inventive faculty for a person skilled in the art.
Fig. 1 is an external view of a coaxial equalizer structure according to an embodiment of the present invention;
fig. 2 is a view of the inside of a coaxial equalizer structure according to an embodiment of the present invention;
FIG. 3 is a schematic circuit topology diagram of an embodiment of the present invention;
fig. 4 is a simulation result of the 4dB equalization amount according to the embodiment of the present invention; m1 and m2 are two selected points, the abscissa freq represents frequency, the ordinate represents loss magnitude, S (1, 1) represents return loss, and S (2, 1) represents transmission loss;
fig. 5 is a simulation result of the 6dB equalization amount according to the embodiment of the present invention;
fig. 6 is a simulation result of 8dB equalization amount according to an embodiment of the present invention;
FIG. 7 is a 6dB balanced high and low temperature simulation result of an embodiment of the present invention;
in the figure, a 1-ceramic substrate, a 2-microstrip transmission line, a 3-matching capacitor, a 4-matching resistor, a 5-miniaturized resonant branch, a 6-cascaded gold wire, a 7-gold strap, an 8-balance adjustment circuit, a 9-metalized grounding via hole, a 10-screw sleeve and an 11-coaxial microstrip conversion structure.
Detailed Description
All of the features disclosed in all of the embodiments of this specification, or all of the steps in any method or process disclosed implicitly, except for the mutually exclusive features and/or steps, may be combined and/or expanded and substituted in any way.
In the description of the present invention, the terms "film production process", "gold wire bonding process", "taping", "micro-assembly process", and other industry specific terms are used merely for convenience in describing the present invention and are not to be construed as limiting the present invention.
As shown in fig. 1, 2 and 3, the coaxial gain equalization device provided by the invention comprises a ceramic substrate 1, a microstrip transmission line 2, a matching capacitor 3, a matching resistor 4, a miniaturized resonant branch 5, a cascading gold wire 6, a gold strap 7, an equalization adjusting circuit 8, a metallized grounding via hole 9, a coaxial microstrip conversion structure 11 and a screw sleeve 10.
The coaxial microstrip conversion structure 11 is a carrier of the whole invention, and simultaneously, conversion and impedance matching functions of a microstrip circuit and a coaxial interface are completed. The screw sleeve 10 is sleeved on the coaxial microstrip conversion structure and is used for protecting an internal circuit. The ceramic substrate 1 is a circuit carrier of the entire invention.
The matching capacitors 3 (plane capacitors can be adopted) and the matching resistor 4 form matching together, and an equalizing circuit is adopted to complete good transmission matching characteristics.
The miniaturized resonant branch 5, the equalization adjusting circuit 8 and the gold strap 7 together form a band-stop resonant circuit to complete the equalization characteristic.
The balance adjustment circuit 8 is composed of a plurality of series resistors and is used for adjusting the balance quantity and realizing the application requirements of different balance quantities.
The matching resistor 4 can adopt a thermistor, the resistance value of the thermistor changes regularly along with the ambient temperature, and the self-adaptive compensation function of the equalization quantity along with the temperature characteristic is completed.
The assembly production and assembly sequence of the invention is as follows:
the first step: a thin film production process is adopted to process a micro-strip transmission line 2, a matching capacitor 3, a miniaturized resonant branch 5 and an equalization adjusting circuit 8 on a ceramic substrate 1;
and a second step of: bonding the matching resistor 4 on the ceramic substrate 1 by adopting conductive silver paste in a micro-assembly process;
and a third step of: the cascade gold wire 6 is used for realizing interconnection of the matching resistor 4 and the 50 ohm microstrip transmission line 2 by adopting a gold wire bonding process, and the series resistor of the balance adjustment circuit is short-circuited;
fourth step: carrying out wrapping and grounding on the gold tape 7 by using a micro-assembly process;
fifth step: integrating the ceramic substrate 1 on the coaxial microstrip conversion structure 11 by a micro-assembly process;
sixth step: connecting the screw sleeve 10 to the coaxial microstrip conversion structure 11 by tin-lead welding;
the assembly is completed.
The simulation verification of the effect of the embodiment of the invention is shown in fig. 4-7. Wherein, fig. 4 is a simulation result of the 4dB equilibrium amount; fig. 5 is a 6dB equalization simulation result; fig. 6 is a simulation result of 8dB equalization; fig. 7 is a 6dB balanced high and low temperature simulation result.
It should be noted that, within the scope of protection defined in the claims of the present invention, the following embodiments may be combined and/or expanded, and replaced in any manner that is logical from the above specific embodiments, such as the disclosed technical principles, the disclosed technical features or the implicitly disclosed technical features, etc.
Example 1
The coaxial gain equalization device comprises a ceramic substrate 1, a microstrip transmission line 2, a matching capacitor 3, a matching resistor 4, a miniaturized resonant branch 5, a cascaded gold wire 6, a gold strap 7, an equalization adjusting circuit 8, a metallized grounding via hole 9 and a coaxial microstrip conversion structure 11; the microstrip transmission line 2 is positioned on the ceramic substrate 1 and is used for realizing interconnection of radio frequency signals; the matching resistor 4 is arranged on the ceramic substrate 1, the miniaturized resonant branch 5, the equalization adjusting circuit 8 and the gold strap 7 jointly form a band-stop resonant circuit, the band-stop resonant circuit is used for completing equalization characteristics, and the matching resistor 4 and the microstrip transmission line 2 are interconnected by using the cascaded gold wire 6; the matching capacitor 3 and the matching resistor 4 form matching together and are used for equalizing circuits to complete good transmission matching characteristics; the balance adjustment circuit 8 is composed of a plurality of series resistors and is used for adjusting the balance quantity and realizing the application requirements of different balance quantities; the cascade gold wire 6 is utilized to realize the series resistance short circuit of the balance adjustment circuit 8; the metallized grounding via hole 9 is grounded, the coaxial microstrip conversion structure 11 is a carrier, and is also used for realizing impedance matching and conversion functions of the microstrip interface and the coaxial interface.
Example 2
On the basis of embodiment 1, the coaxial microstrip antenna comprises a screw sleeve 10, wherein the screw sleeve 10 is sleeved on a coaxial microstrip conversion structure 11 and is used for protecting an internal circuit.
Example 3
On the basis of embodiment 1, the ceramic substrate 1 is an internal circuit carrier, the microstrip transmission line 2 comprises a 50 ohm radio frequency transmission line, the matching capacitor 3 comprises a planar capacitor, and the planar capacitor is arranged on a 5 ohm radio frequency transmission line of the ceramic substrate 1 to realize an impedance matching function.
Example 4
On the basis of embodiment 1, the matching resistor 4 comprises a thermistor, the thermistor is connected in series between the microstrip transmission line 2 of the ceramic substrate 1 and the miniaturized resonant branch 5, and is used for realizing the functions of impedance matching and self-adaptive equalization, and the resistance value of the thermistor changes regularly along with the ambient temperature, so as to complete the function of self-adaptive compensation along with the temperature characteristic of the equalization quantity.
Example 5
On the basis of embodiment 1, the equalization adjusting circuit 8 is connected in series between the microstrip transmission line 2 of the ceramic substrate 1 and the miniaturized resonant branch 5, so as to realize the equalization adjusting function.
Example 6
On the basis of the embodiment 1, the cascaded gold wire 6 is in press connection with the matching capacitor 3 and the microstrip transmission line 2 and is used for radio frequency signal transmission seen by different functional circuits.
Example 7
On the basis of embodiment 1, the gold strap 7 is pressed against the miniaturized resonant branch 5 and the ground plane of the ceramic substrate 1, so as to ground the miniaturized resonant branch 5 and realize the short-circuit resonant function.
Example 8
On the basis of embodiment 1, the ceramic substrate 1, the microstrip transmission line 2, the miniaturized resonant branch 5 and the balance adjustment circuit 8 are all manufactured by a thin film production process.
Example 9
On the basis of example 1, the matching resistor 4 was bonded to the ceramic substrate 1 with conductive silver paste.
Example 10
On the basis of embodiment 1, the ceramic substrate 1 is integrated on a coaxial microstrip transition structure 11.
In addition to the foregoing examples, those skilled in the art will recognize from the foregoing disclosure that other embodiments can be made and in which various features of the embodiments can be interchanged or substituted, and that such modifications and changes can be made without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (3)
1. The coaxial gain equalization device is characterized by comprising a ceramic substrate (1), a microstrip transmission line (2), a matching capacitor (3), a matching resistor (4), a miniaturized resonant branch (5), a cascading gold wire (6), a gold strap (7), an equalization adjustment circuit (8), a metallized grounding via hole (9) and a coaxial microstrip conversion structure (11);
the microstrip transmission line (2) is positioned on the ceramic substrate (1) and is used for realizing interconnection of radio frequency signals; the matching resistor (4) is arranged on the ceramic substrate (1), the miniaturized resonant branch (5), the equalization adjusting circuit (8) and the gold band (7) form a band-stop resonant circuit together and are used for completing equalization characteristics, and the matching resistor (4) and the microstrip transmission line (2) are interconnected by the aid of the cascaded gold wire (6); the matching capacitor (3) and the matching resistor (4) form matching together and are used for equalizing circuits to complete good transmission matching characteristics; the balance adjustment circuit (8) is composed of a plurality of series resistors and is used for adjusting the balance quantity so as to realize the application requirements of different balance quantities; the cascade gold wire (6) is utilized to realize the series resistance short circuit of the balance adjusting circuit (8); the metallized grounding via hole (9) is grounded, the coaxial microstrip conversion structure (11) is a carrier, and is also used for realizing impedance matching and conversion functions of the microstrip interface and the coaxial interface;
the ceramic substrate (1) is an internal circuit carrier, the microstrip transmission line (2) comprises a 50 ohm radio frequency transmission line, the matching capacitor (3) comprises a plane capacitor, and the plane capacitor is arranged on the 50 ohm radio frequency transmission line of the ceramic substrate (1) to realize an impedance matching function;
the matching resistor (4) comprises a thermistor, the thermistor is connected in series between the microstrip transmission line (2) of the ceramic substrate (1) and the miniaturized resonant branch (5) and is used for realizing the impedance matching and self-adaptive equalization function, the resistance value of the thermistor changes regularly along with the environmental temperature, and the self-adaptive compensation function along with the temperature characteristic of the equalization quantity is completed;
the balance adjustment circuit (8) is connected in series between the micro-strip transmission line (2) of the ceramic substrate (1) and the miniaturized resonant branch (5) and is used for realizing a balance adjustment function;
the cascaded gold wire (6) is pressed on the matched capacitor (3) and the microstrip transmission line (2) and is used for radio frequency signal transmission between different functional circuits;
the gold belt (7) is pressed and connected with the miniaturized resonance branch (5) and the grounding surface of the ceramic substrate (1) in a pressing way, and is used for grounding the miniaturized resonance branch (5) to realize a short circuit resonance function;
the matching resistor (4) is adhered to the ceramic substrate (1) by conductive silver paste;
the ceramic substrate (1) is integrated on the coaxial microstrip conversion structure (11).
2. The coaxial gain equalization device according to claim 1, comprising a sleeve (10), wherein the sleeve (10) is sleeved on the coaxial microstrip transition structure (11) for protecting the internal circuit.
3. Coaxial gain equalization device according to claim 1, characterized in that the ceramic substrate (1), microstrip transmission line (2), miniaturized resonant branch (5) and equalization adjustment circuit (8) are all manufactured by thin film production process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311461444.0A CN117200727B (en) | 2023-11-06 | 2023-11-06 | Coaxial gain equalization device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311461444.0A CN117200727B (en) | 2023-11-06 | 2023-11-06 | Coaxial gain equalization device |
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| Publication Number | Publication Date |
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| CN117200727A CN117200727A (en) | 2023-12-08 |
| CN117200727B true CN117200727B (en) | 2024-01-23 |
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| CN202311461444.0A Active CN117200727B (en) | 2023-11-06 | 2023-11-06 | Coaxial gain equalization device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08125401A (en) * | 1994-10-03 | 1996-05-17 | Internatl Standard Electric Corp | Electronically tunable gain equalizer |
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| CN107395148A (en) * | 2017-07-31 | 2017-11-24 | 中国电子科技集团公司第二十九研究所 | A kind of temperature compensation equalizing circuit of TR components |
| CN208272938U (en) * | 2018-08-01 | 2018-12-21 | 中国航空工业集团公司雷华电子技术研究所 | Harmonics restraint Microwave Equalizer |
| CN209313825U (en) * | 2019-02-26 | 2019-08-27 | 成都天奥电子股份有限公司 | A kind of wideband gain adjustable equalizer based on mechanical adjustable resistance capacitance |
| CN113611999A (en) * | 2021-08-10 | 2021-11-05 | 大连海事大学 | Broadband microwave circuit with low insertion loss and flat negative group delay characteristics |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7446622B2 (en) * | 2003-09-05 | 2008-11-04 | Infinera Corporation | Transmission line with low dispersive properties and its application in equalization |
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2023
- 2023-11-06 CN CN202311461444.0A patent/CN117200727B/en active Active
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|---|---|---|---|---|
| JPH08125401A (en) * | 1994-10-03 | 1996-05-17 | Internatl Standard Electric Corp | Electronically tunable gain equalizer |
| US6111459A (en) * | 1995-09-29 | 2000-08-29 | Matsushita Electric Industrial Co., Ltd. | Multi mode power amplifier and communication unit |
| JP2014192530A (en) * | 2013-03-26 | 2014-10-06 | Mitsubishi Electric Corp | Equalizer |
| CN105470073A (en) * | 2016-01-11 | 2016-04-06 | 中国电子科技集团公司第十研究所 | Ka-waveband microstrip line gain equalizer |
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| CN117200727A (en) | 2023-12-08 |
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