CN105352656A - Test device and test method for pressure sensor - Google Patents
Test device and test method for pressure sensor Download PDFInfo
- Publication number
- CN105352656A CN105352656A CN201410371305.3A CN201410371305A CN105352656A CN 105352656 A CN105352656 A CN 105352656A CN 201410371305 A CN201410371305 A CN 201410371305A CN 105352656 A CN105352656 A CN 105352656A
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- pin connector
- pressure transducer
- test container
- proving installation
- test
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L27/00—Testing or calibrating of apparatus for measuring fluid pressure
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The invention discloses a test device for a pressure sensor. The pressure sensor in a test container is connected to a circuit outside the test container by metal contact pins during test, in such a way that the gas tightness and the physical stability of signal transmission can be ensured, so that test data is accurate and stable, and more accurate forefront line data can be provided for product improvement. The invention also discloses a test method for the pressure sensor.
Description
Technical field
The present invention relates to field of semiconductor device test, particularly a kind of pressure transducer proving installation and method of testing thereof.
Background technology
MEMS (MicroElectroMechanicalSystems, microelectromechanical systems) be utilize ic manufacturing technology and micro-processing technology microstructure, microsensor, microactrator, control treatment circuit even interface, to communicate and power supply etc. is manufactured on miniature integrated system on one or more chip.
Pressure transducer is transducer pressure signal being converted to electrical signal, is the important component part in business-like sensor.Compared with conventional pressure sensor, the pressure transducer adopting MEMS technology to prepare has fairly obvious advantage in volume, power consumption, weight and price etc.At present, the pressure transducer utilizing MEMS technology to make has been widely used in the various fields such as auto industry, biomedicine, Industry Control, the energy and semi-conductor industry.
In research and development and production run, the test of temperature, pressure characterisitic parameter is carried out to pressure transducer very important, the proving installation of pressure transducer is very rare in the market, when carrying out the test of temperature, pressure characterisitic parameter to pressure transducer, the testing tool that general producer meeting self manufacture is easy and proving installation, thus make test data not precisely with stable, affect the adjustment to product and improvement.
Summary of the invention
Given this, the pressure transducer proving installation being necessary to provide a kind of test data accurate and stable and method of testing thereof.
A kind of pressure transducer proving installation, comprise multi-pin connector, test container and gas path module, described multi-pin connector and described test container form removable seal and are connected, and described gas path module and described test container form gas circuit and be tightly connected; Described multi-pin connector comprises the metal ferrule that body and Duo Gen arrange mutually insulated on the body, and the metal ferrule of described multi-pin connector is electrically connected for making the sensor in described test container be formed with the test circuit outside described test container.
Wherein in an embodiment, described multi-pin connector comprises aviation plug.
Wherein in an embodiment, also comprise spininess socket, described test circuit can be formed with described spininess socket and be electrically connected, and described multi-pin connector and described spininess socket are connected.
Wherein in an embodiment, described spininess socket is aviation socket.
Wherein in an embodiment, described multi-pin connector through encapsulation process to ensure impermeability.
Wherein in an embodiment, described encapsulation process is for adding glue sealing.
Wherein in an embodiment, the quantity of described metal ferrule is no less than 4.
Wherein in an embodiment, described multi-pin connector is formed with described test container and is threaded, plugs and to be connected or buckle connects.
Wherein in an embodiment, also comprise the sensor chip seat being arranged in described test container, described sensor chip seat is formed with described multi-pin connector and is electrically connected, and sensor and described sensor chip seat form detachable electrical connection.
A kind of pressure transducer method of testing, comprises step:
Sensor is placed in test container; Sensor is connected on multi-pin connector by pin definitions; Described multi-pin connector and described test container are tightly connected; Test circuit and the electrical connection of described multi-pin connector; Gas path module is installed.
Above-mentioned pressure transducer proving installation and method of testing thereof, pressure transducer during test in test container is connected by the circuit of metal ferrule with the test container external world, both ensure that impermeability, also ensure that the physical stability of Signal transmissions, make test data accurately with stable, the improvement for product provides more accurate line data.
Accompanying drawing explanation
Fig. 1 is the schematic perspective view of an embodiment pressure transducer proving installation;
Fig. 2 is the structural representation of an embodiment pressure transducer proving installation;
Fig. 3 is the process flow diagram of an embodiment pressure transducer proving installation method of testing.
Embodiment
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in detail.
Fig. 1 is the schematic perspective view of an embodiment pressure transducer proving installation.
A kind of pressure transducer proving installation, comprise multi-pin connector 100, test container 200 and gas path module 300, multi-pin connector 100 forms removable seal with test container 200 and is connected, and gas path module 300 and test container 200 form gas circuit and be tightly connected; Multi-pin connector 100 comprises the metal ferrule 120 that body and Duo Gen are arranged on mutually insulated on body, and the metal ferrule 120 of multi-pin connector 100 is electrically connected for making the sensor in test container 100 be formed with the test circuit outside test container 100.
Above-mentioned pressure transducer proving installation, during test, the pressure transducer of test container 200 li is connected with the circuit in test container 200 external world by metal ferrule 120, both ensure that impermeability, also ensure that the physical stability of Signal transmissions, make test data accurately with stable, the improvement for product provides more accurate line data.
Fig. 2 is the structural representation of an embodiment pressure transducer proving installation.
A kind of pressure transducer proving installation, comprise multi-pin connector 100, test container 200, gas path module 300 and spininess socket 400, multi-pin connector 100 forms removable seal with test container 200 and is connected, gas path module 300 and test container 200 form gas circuit and are tightly connected, multi-pin connector 100 and spininess socket 400 are connected, and extraneous test circuit 10 and spininess socket 400 are formed by wire and be electrically connected.Gas path module 300 is for providing test required air pressure.
Multi-pin connector 100 comprises the metal ferrule 120 that body and Duo Gen are arranged on mutually insulated on body, and the metal ferrule 120 of multi-pin connector 100 is electrically connected for making the sensor 20 in test container 100 be formed with the test circuit 10 outside test container 100.The quantity of metal ferrule 120 is no less than 4, usual 4 metal ferrule connecting tests sensor, so the quantity of metal ferrule 120 is preferably more than 12, even more, to guarantee the more sensor of disposable test.Multi-pin connector 100 can be aviation plug, also can be the gland bonnet containing aviation plug, it can be threaded connection, plug the connected modes such as connection or buckle connection is connected with test container 100, can also increase O-ring seal strengthen impermeability in junction.When multi-pin connector 100 is aviation plugs, spininess socket 400 is aviation socket.
Multi-pin connector 100 can also through encapsulation process to ensure impermeability, such as, add the junction of metal ferrule 120 and multi-pin connector 100 body and be coated with fluid sealant and seal to add glue.For avoiding multi-pin connector 100 to leak gas, comprehensive encapsulation process being done to it, the sealing ability up to 7MPa air pressure can be met.
Sensor chip seat 500 is installed in test container 200, sensor chip seat 500 and multi-pin connector 100 can by plug, snap forms and is electrically connected, sensor 20 and sensor chip seat 500 pass through to plug, the dismountable electrical connection of snap.Fast multi-pin connector 100 and sensor 20 can be coupled together by sensor chip seat 500.Sensor chip seat 500 can be designed to the chip carrier mode that industry generally uses in the present embodiment, to reduce costs.
Also disclose a kind of pressure transducer method of testing in the present embodiment, see Fig. 3, comprise step:
Step S100: sensor 20 is placed in test container 200.Be specially and sensor 20 is connected on sensor chip seat 500 by pin definitions peace.
Step S200: sensor 20 is connected on multi-pin connector 100 by pin definitions.Because sensor 20 is connected on sensor chip seat 500, so now sensor chip seat 500 and multi-pin connector 100 are connected by pin definitions peace.
Step S300: multi-pin connector 100 and test container 200 are tightly connected.Test container 200 is threaded connection, plugs connection or the connected mode such as buckle connection is connected with test container 100, ensure impermeability between the two.
Step S400: test circuit 10 and multi-pin connector 100 are electrically connected.Connect equipment by wire etc. test circuit 10 and spininess socket 400 are connected, and then spininess socket 400 and multi-pin connector 100 are connected.
Step S500: install gas path module.The test of sensor temperature pressure characteristic can be carried out with that.
Above-mentioned pressure transducer proving installation and method of testing thereof, pressure transducer during test in test container is connected by the circuit of metal ferrule with the test container external world, both ensure that impermeability, also ensure that the physical stability of Signal transmissions, make test data accurately with stable, the improvement for product provides more accurate line data.
The above embodiment only have expressed several embodiment of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (10)
1. a pressure transducer proving installation, it is characterized in that, comprise multi-pin connector, test container and gas path module, described multi-pin connector and described test container form removable seal and are connected, and described gas path module and described test container form gas circuit and be tightly connected; Described multi-pin connector comprises the metal ferrule that body and Duo Gen arrange mutually insulated on the body, and the metal ferrule of described multi-pin connector is electrically connected for making the sensor in described test container be formed with the test circuit outside described test container.
2. pressure transducer proving installation according to claim 1, is characterized in that, described multi-pin connector comprises aviation plug.
3. pressure transducer proving installation according to claim 1, is characterized in that, also comprises spininess socket, and described test circuit can be formed with described spininess socket and be electrically connected, and described multi-pin connector and described spininess socket are connected.
4. pressure transducer proving installation according to claim 3, is characterized in that, described spininess socket is aviation socket.
5. pressure transducer proving installation according to claim 1, is characterized in that, described multi-pin connector through encapsulation process to ensure impermeability.
6. pressure transducer proving installation according to claim 5, is characterized in that, described encapsulation process is for adding glue sealing.
7. pressure transducer proving installation according to claim 1, is characterized in that, the quantity of described metal ferrule is no less than 4.
8. pressure transducer proving installation according to claim 1, is characterized in that, described multi-pin connector is formed with described test container and is threaded, plugs and to be connected or buckle connects.
9. pressure transducer proving installation according to claim 1, it is characterized in that, also comprise the sensor chip seat being arranged in described test container, described sensor chip seat is formed with described multi-pin connector and is electrically connected, and sensor and described sensor chip seat form detachable electrical connection.
10. a pressure transducer method of testing, is characterized in that, comprises step:
Sensor is placed in test container; Sensor is connected on multi-pin connector by pin definitions; Described multi-pin connector and described test container are tightly connected; Test circuit and the electrical connection of described multi-pin connector; Gas path module is installed.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410371305.3A CN105352656A (en) | 2014-07-30 | 2014-07-30 | Test device and test method for pressure sensor |
| PCT/CN2015/082840 WO2016015537A1 (en) | 2014-07-30 | 2015-06-30 | Pressure sensor testing device and method for using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410371305.3A CN105352656A (en) | 2014-07-30 | 2014-07-30 | Test device and test method for pressure sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105352656A true CN105352656A (en) | 2016-02-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201410371305.3A Pending CN105352656A (en) | 2014-07-30 | 2014-07-30 | Test device and test method for pressure sensor |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN105352656A (en) |
| WO (1) | WO2016015537A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106197810A (en) * | 2016-08-30 | 2016-12-07 | 王建波 | A kind of large range high precision pressure real-time monitoring system based on conduction mechanism and monitoring method thereof |
| CN107631835A (en) * | 2017-09-13 | 2018-01-26 | 中国电子科技集团公司第四十九研究所 | A kind of pressure test device applied to non-leaded package MEMS absolute pressure cake cores |
| CN109900390A (en) * | 2019-04-02 | 2019-06-18 | 珠海格力电器股份有限公司 | Fast and accurately temperature sensing package fault detection method and air-conditioner set |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114324153A (en) * | 2021-12-16 | 2022-04-12 | 河海大学 | Structural object surface crack detection device and detection identification method based on machine pressure sense |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060009939A1 (en) * | 2004-07-07 | 2006-01-12 | Hitachi Global Storage Technologies Netherlands B.V. | Testing/adjusting method and test control apparatus for rotating disk storage devices |
| CN200962065Y (en) * | 2006-09-06 | 2007-10-17 | 浙江博德汽车电子股份有限公司 | Detection device of inlet branch pipe pressure sensor |
| CN202204640U (en) * | 2011-08-24 | 2012-04-25 | 无锡优盛传感器科技有限公司 | High temperature test probe platform for batch ceramic pressure sensors |
| CN202749551U (en) * | 2012-06-29 | 2013-02-20 | 浙江盾安人工环境股份有限公司 | Socket connector for pressure transmitter |
| CN202793689U (en) * | 2012-09-28 | 2013-03-13 | 江苏物联网研究发展中心 | Testing device for pressure sensor temperature characteristic |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4756193A (en) * | 1987-09-11 | 1988-07-12 | Delco Electronics Corporation | Pressure sensor |
| WO1998026266A1 (en) * | 1996-12-09 | 1998-06-18 | Hokkei Industries L.T.D. | Judgement method of acceptance/rejection of pressure sensor |
| US8504313B2 (en) * | 2010-03-22 | 2013-08-06 | Dennis Cardinale | Electronic vacuum gauge and systems and methods of calibration and operation of same |
| CN102175390B (en) * | 2011-02-25 | 2012-11-28 | 南京航空航天大学 | Piezoelectric sensor calibrating device and method |
| CN102539067A (en) * | 2011-12-20 | 2012-07-04 | 北京动力机械研究所 | Device and method for simulating underwater calibration of underwater thrust sensor |
-
2014
- 2014-07-30 CN CN201410371305.3A patent/CN105352656A/en active Pending
-
2015
- 2015-06-30 WO PCT/CN2015/082840 patent/WO2016015537A1/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060009939A1 (en) * | 2004-07-07 | 2006-01-12 | Hitachi Global Storage Technologies Netherlands B.V. | Testing/adjusting method and test control apparatus for rotating disk storage devices |
| CN200962065Y (en) * | 2006-09-06 | 2007-10-17 | 浙江博德汽车电子股份有限公司 | Detection device of inlet branch pipe pressure sensor |
| CN202204640U (en) * | 2011-08-24 | 2012-04-25 | 无锡优盛传感器科技有限公司 | High temperature test probe platform for batch ceramic pressure sensors |
| CN202749551U (en) * | 2012-06-29 | 2013-02-20 | 浙江盾安人工环境股份有限公司 | Socket connector for pressure transmitter |
| CN202793689U (en) * | 2012-09-28 | 2013-03-13 | 江苏物联网研究发展中心 | Testing device for pressure sensor temperature characteristic |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106197810A (en) * | 2016-08-30 | 2016-12-07 | 王建波 | A kind of large range high precision pressure real-time monitoring system based on conduction mechanism and monitoring method thereof |
| CN107631835A (en) * | 2017-09-13 | 2018-01-26 | 中国电子科技集团公司第四十九研究所 | A kind of pressure test device applied to non-leaded package MEMS absolute pressure cake cores |
| CN109900390A (en) * | 2019-04-02 | 2019-06-18 | 珠海格力电器股份有限公司 | Fast and accurately temperature sensing package fault detection method and air-conditioner set |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2016015537A1 (en) | 2016-02-04 |
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| TA01 | Transfer of patent application right |
Effective date of registration: 20170926 Address after: 214028 Xinzhou Road, Wuxi national hi tech Industrial Development Zone, Jiangsu, China, No. 8 Applicant after: Wuxi Huarun Shanghua Technology Co., Ltd. Address before: 214028 Xinzhou Road, Wuxi national hi tech Industrial Development Zone, Jiangsu, China, No. 8 Applicant before: Wuxi CSMC Semiconductor Co., Ltd. |
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160224 |