CN202793689U - Testing device for pressure sensor temperature characteristic - Google Patents
Testing device for pressure sensor temperature characteristic Download PDFInfo
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- CN202793689U CN202793689U CN 201220500936 CN201220500936U CN202793689U CN 202793689 U CN202793689 U CN 202793689U CN 201220500936 CN201220500936 CN 201220500936 CN 201220500936 U CN201220500936 U CN 201220500936U CN 202793689 U CN202793689 U CN 202793689U
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- upper cover
- base plate
- cover plate
- pressure sensor
- sensor
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Abstract
The utility model provides a testing device for pressure sensor temperature characteristics, comprising an upper cover plate, a bottom plate, a temperature controller, and a control computer. An upper surface of the bottom plate is provided with one or more sensor location grooves which are matched with shapes, sizes, and depths of to-be-tested pressure sensors. Hollow boss structures disposed on an inner surface of the upper cover plate and the sensor location grooves on the bottom plate form one or more closed cavities. In the bottom plate under the sensor location grooves, one or more gas channels are embedded, and the gas channels are communicated with the sensor location grooves through gas vias. On bottoms of the sensor location grooves, semiconductor chips used for heating or refrigerating are embedded.
Description
Technical field
The utility model relates to a kind of micro electro mechanical device proving installation, is specifically related to the proving installation of pressure sensor temperature characteristic.
Background technology
The test of pressure transducer, generally include repeatability, the linearity, sensitivity, lagging characteristics, zero partially, zero partially stability, zero point temperature float, the projects such as sensitivity temperature coefficient, full scale temperature coefficient.This just need to when carrying out the pressure transducer test, not only for pressure transducer provides the pressure excitation, and need to provide a controlled high and low temperature environment simultaneously.Yet, the condition restriction of tested equipment, the research and development of pressure transducer and application units are in the process to the sensor component test at present, the temperature environment of pressure environment and variation can't be provided to device in a lot of situations simultaneously, so can't carry out the test of population parameter, the automaticity of its test and efficient are also lower.
Present existing solution is: device under test is installed on the frock clamp, provide pressure environment by frock clamp to device under test, simultaneously, the frock clamp that has encapsulated device under test is placed in the high-low temperature test chamber, provides high and low temperature environment by high-low temperature test chamber.The test macro of this solution, volume is large, and is more scattered, integrated not, is difficult for forming fully automatic system; In addition, this scheme needs the long time to make the test environment temperature reach balance, affects testing efficiency.
The utility model content
The utility model has overcome the shortcoming of proving installation in the above-mentioned existing solution, has proposed a kind of proving installation of Novel pressure sensor temperature characterisitic.The technical scheme that the utility model adopts is:
A kind of pressure sensor temperature characteristic test device comprises upper cover plate, base plate, temperature controller, control computing machine;
Described plate upper surface is provided with one or more sensor localization grooves, the shape of sensor localization groove, size and the degree of depth and testing pressure sensor are complementary, base arrangement below the sensor localization groove is embedded with one or more gas passage, gas passage is connected by gas via-hole with the sensor localization groove, be embedded with semiconductor chip at the sensor localization bottom portion of groove, simultaneously be embedded with electrical path at base arrangement, semiconductor chip is realized electrical connection by the wire in the electrical path and external temperature controller, and temperature controller is connected with the temperature control computing machine;
Described upper cover plate inside surface is provided with one or more cannular boss structures, position, shape and the size of the cannular boss structure of upper cover plate inside surface and plate upper surface sensor localization groove be Corresponding matching one by one, upper cover plate and base plate close fit, the cannular boss structure of upper cover plate inside surface and above the base plate sensor localization groove form one or more airtight chamber, each cannular boss structure place of upper cover plate arranges electrical fitting.The pin of the electric connection point of electrical fitting and testing pressure sensor is complementary, and forms electrical connection during test, by this electrical fitting the electric signal of testing pressure sensor is drawn, and sends the external signal collecting device to.
The electric connecting point of the electrical fitting on the described upper cover plate adopts needle stand, salient point or conductive rubber form.
Described semiconductor chip is annular, has heating and refrigerating function.
Be provided with the base plate pilot hole on the described base plate, be provided with on the upper cover plate and base plate pilot hole upper cover plate pilot hole one to one.
The material of described base plate is the material that the thermal conductivity coefficients such as aluminium oxide ceramics, aluminium nitride ceramics are lower than 100w/mk.
The proving installation of a kind of pressure sensor temperature characteristic that the utility model proposes, compare with the test macro of existing pressure sensor temperature characteristic, its advantage is: the utility model provides the with it airtight chamber that is complementary of shape and size for pressure transducer, adopt the semiconductor chip refrigeration, heat, can reach rapidly the temperature that the pressure transducer test needs, semiconductor chip is annular, freezes, heats evenly; Replaced high-low temperature test chamber, avoided in the high-low temperature test chamber Air Flow on the impact of device, avoided the device inhomogeneous situation of being heated, have lightweight, the characteristics such as volume is little, simple in structure, and heating and cooling are rapid, and reliability is high, and is easy to maintenance.The more important thing is that in addition the temperature of this proving installation is controlled by the control computing machine, more together easy of integration with pressure excitation control software, form fully automatic system.
Description of drawings
Fig. 1 is system of the present utility model composition diagram.
Fig. 2 is base plate synoptic diagram of the present utility model.
Fig. 3 is base plate A-A sectional view of the present utility model.
Fig. 4 is upper cover plate synoptic diagram of the present utility model.
Among the figure: 101-upper cover plate, 102-base plate, 103-temperature controller, 104-controls computing machine, 105-semiconductor chip, 106-sensor localization groove, the 107-gas passage, the 108-gas via-hole, 109-electrical path, 110-base plate pilot hole, the 111-electrical fitting, 112-testing pressure sensor, 113-cannular boss structure, 114-upper cover plate pilot hole.
Embodiment
The utility model is described in further detail below in conjunction with drawings and Examples.
Such as Fig. 1, Fig. 2, Fig. 3, shown in Figure 4, a kind of proving installation of pressure sensor temperature characteristic comprises upper cover plate 101, base plate 102, temperature controller 103 and control computing machine 104.Be provided with one or more sensor localization grooves 106 at base plate 102 upper surfaces, the shape of sensor localization groove 106, size and the degree of depth and testing pressure sensor are complementary; Upper cover plate 101 inside surfaces are provided with the cannular boss structure 113 with sensor localization groove 106 couplings, sensor localization groove 106 on its position, size and shape and the base plate is Corresponding matching one by one, upper cover plate 101 and base plate 102 can close fit, the one or more small-sized airtight chamber of formation between upper cover plate 101 and base plate 102.Sensor localization groove 106 bottoms of base plate 102 are embedded with the semiconductor chip 105 with heating and refrigerating function, utilize the principle of electric heating energy conversion, reach the purpose of freezing and heating in the airtight chamber.Annular semiconductor sheet 105 is realized electrical connection by the wire in the electrical path 109 and external temperature controller 103, and the temperature in the chamber can connect semiconductor chip 105 by temperature controller 103 by control computing machine 104 and accurately control.Be integrated with one or more electrical fittings 111 on the upper cover plate 101, be used for the electric signal of device under test in the airtight chamber is drawn.Also be provided with gas passage 107 and gas via-hole 108 in the base plate 101, be used for passing in the airtight chamber gases at high pressure of accurately controlling through pressure controller.
Embodiment one.
As shown in Figure 1, the proving installation of described pressure sensor temperature characteristic comprises: upper cover plate 101, base plate 102, temperature controller 103 and control computing machine 104.Upper cover plate 101 forms one or more airtight chamber with base plate 102 assemblings, behind the access gases at high pressure, applies voltage by control computing machine 104 with 103 pairs of semiconductor chips 105 of temperature controller, reaches the temperature that sets in the control airtight chamber.
Use this device, warming and cooling rate is fast, with respect to using incubator that high and low temperature environment is provided, has not only reduced the volume of test macro, has more greatly shortened the test duration.
This embodiment can be used for structure of the present utility model and test process are described, but enforcement of the present utility model is not limited only to this embodiment.In the scope that does not break away from the utility model and appended claim, various replacements, variation and modification all are possible.Therefore, protection domain of the present utility model is not limited to embodiment and the disclosed content of accompanying drawing.
Claims (4)
1. a pressure sensor temperature characteristic test device is characterized in that: comprise upper cover plate (101), base plate (102), temperature controller (103), control computing machine (104);
Described base plate (102) upper surface is provided with one or more sensor localization grooves (106), the shape of sensor localization groove (106), size and the degree of depth and testing pressure sensor (112) are complementary, base plate (102) structure below the sensor localization groove (106) is embedded with one or more gas passage (107), gas passage (107) is connected by gas via-hole (108) with sensor localization groove (106), be embedded with semiconductor chip (105) in sensor localization groove (106) bottom, be embedded with electrical path (109) in base plate (102) structure, semiconductor chip (105) is realized electrical connection by the wire in the electrical path (109) and external temperature controller (103), and temperature controller (103) is connected with temperature control computing machine (104);
Described upper cover plate (101) inside surface is provided with one or more cannular boss structures (113), the cannular boss structure (113) of upper cover plate (101) inside surface and the position of base plate (102) upper surface sensor localization groove (106), shape and size be Corresponding matching one by one, upper cover plate (101) and base plate (102) close fit, the cannular boss structure (113) of upper cover plate inside surface forms one or more airtight chamber with sensor localization groove (106) above the base plate, each cannular boss structure (113) of upper cover plate (101) locates to arrange electrical fitting (111), the pin of the electric connection point of electrical fitting (111) and testing pressure sensor (112) is complementary, form electrical connection during test, by electrical connector (111) electric signal of testing pressure sensor (112) is drawn.
2. pressure sensor temperature characteristic test device as claimed in claim 1 is characterized in that: electric connecting point employing needle stand or salient point or the conductive rubber form of the electrical fitting (111) on the described upper cover plate (101).
3. pressure sensor temperature characteristic test device as claimed in claim 1 is characterized in that: described semiconductor chip (105) is annular, has heating and refrigerating function.
4. pressure sensor temperature characteristic test device as claimed in claim 1, it is characterized in that: be provided with base plate pilot hole (110) on the described base plate (102), be provided with on the upper cover plate (101) and base plate pilot hole (110) upper cover plate pilot hole (114) one to one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220500936 CN202793689U (en) | 2012-09-28 | 2012-09-28 | Testing device for pressure sensor temperature characteristic |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220500936 CN202793689U (en) | 2012-09-28 | 2012-09-28 | Testing device for pressure sensor temperature characteristic |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202793689U true CN202793689U (en) | 2013-03-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220500936 Expired - Lifetime CN202793689U (en) | 2012-09-28 | 2012-09-28 | Testing device for pressure sensor temperature characteristic |
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| CN (1) | CN202793689U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102865967A (en) * | 2012-09-28 | 2013-01-09 | 江苏物联网研究发展中心 | Device for testing temperature characteristic of pressure sensor |
| CN103728416A (en) * | 2013-11-20 | 2014-04-16 | 哈尔滨东方报警设备开发有限公司 | Gas sensor module capable of realizing automatic cooling or heating |
| CN105352656A (en) * | 2014-07-30 | 2016-02-24 | 无锡华润上华半导体有限公司 | Test device and test method for pressure sensor |
| CN105738564A (en) * | 2014-12-11 | 2016-07-06 | 哈尔滨东方报警设备开发有限公司 | Gas sensor capable to conduct automatic temperature control |
| CN108254673A (en) * | 2018-01-25 | 2018-07-06 | 福建福顺半导体制造有限公司 | Electrical performance test method and device |
| CN109029839A (en) * | 2018-06-04 | 2018-12-18 | 广州智工控制技术有限公司 | A kind of force-sensing sensor temperature drift detection device and its detection method |
-
2012
- 2012-09-28 CN CN 201220500936 patent/CN202793689U/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102865967A (en) * | 2012-09-28 | 2013-01-09 | 江苏物联网研究发展中心 | Device for testing temperature characteristic of pressure sensor |
| CN103728416A (en) * | 2013-11-20 | 2014-04-16 | 哈尔滨东方报警设备开发有限公司 | Gas sensor module capable of realizing automatic cooling or heating |
| CN105352656A (en) * | 2014-07-30 | 2016-02-24 | 无锡华润上华半导体有限公司 | Test device and test method for pressure sensor |
| CN105738564A (en) * | 2014-12-11 | 2016-07-06 | 哈尔滨东方报警设备开发有限公司 | Gas sensor capable to conduct automatic temperature control |
| CN108254673A (en) * | 2018-01-25 | 2018-07-06 | 福建福顺半导体制造有限公司 | Electrical performance test method and device |
| CN109029839A (en) * | 2018-06-04 | 2018-12-18 | 广州智工控制技术有限公司 | A kind of force-sensing sensor temperature drift detection device and its detection method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130313 |