CN203616048U - Temperature measuring device of pressure sensor - Google Patents
Temperature measuring device of pressure sensor Download PDFInfo
- Publication number
- CN203616048U CN203616048U CN201320758600.5U CN201320758600U CN203616048U CN 203616048 U CN203616048 U CN 203616048U CN 201320758600 U CN201320758600 U CN 201320758600U CN 203616048 U CN203616048 U CN 203616048U
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- sensor
- temperature measuring
- pressure
- sensitive apparatus
- thermistor
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Abstract
A temperature measuring device of a pressure sensor comprises a temperature measuring unit, an insulating pressure ring, a sensitive device substrate, a pressure chip, and sensor shell. The temperature measuring device of the pressure sensor is characterized in that: the temperature measuring unit is a thermistor; the thermistor serving as a patch is fixed to the sensitive device substrate made of metal; the pressure chip is installed at the other side of the sensitive device substrate; and one end of the sensor shell is provided with a medium transmission hole for measurement. An inner wall of the sensor shell is provided with two steps, and the metal substrate is arranged on a first step in the sensor shell through the insulating pressure ring. The advantages of the utility model are that: the assembly structure and process of the sensor are enabled to be simple and easy, and the fabrication and assembly cost of the sensor can be greatly reduced.
Description
Technical field
The utility model relates to a kind of sensor, particularly relates to a kind of temperature measuring equipment of pressure transducer
Background technology
Sensor is widely used as a kind of monitoring equipment in each field, and the decision-making that it is system and processing provide necessary raw data.In the time that sensor is tested a certain data of test substance, owing to being subject to the impact of other extraneous factors (as temperature) on test substance, the measurement data of sensor has certain error, therefore just need to revise and compensation measurement data.For example, in the time that the pressure of gas is measured, just need to consider the impact of temperature variation for gaseous tension.Conventional solution is exactly while integrated temperature measuring unit on the sensitive element of sensor, by the situation of change of real-time detected temperatures, to eliminate the temperature deviation in test data, obtains the actual value that pressure changes.
The temperature measuring unit of conventional pressure sensor is to stretch out from the sensitive element of sensor with " T " font, and is inserted in the package casing of sensor and protects.Because this package casing is often very little, while temperature measuring unit is stretched out again very long, therefore in the time that actual production is assembled, is often difficult to assembling, and manufacturing cost also can be higher.
Summary of the invention
The purpose of this utility model is for the defect existing in prior art, and a kind of temperature measuring equipment of pressure transducer is provided.The utility model comprises: temperature measuring unit, insulation pressure ring, Sensitive Apparatus substrate, pressure chip, sensor outer housing, it is characterized in that temperature measuring unit is thermistor, thermistor is fixed in the mode of paster on the Sensitive Apparatus substrate being made of metal, pressure chip is arranged on the another side of Sensitive Apparatus substrate, and one end of sensor outer housing is provided with the medium transmission hole for measuring.The utility model adopts the Sensitive Apparatus substrate being made of metal to replace FR-4 substrate that original sensor sensing element generally the uses Sensitive Apparatus substrate as novel sensor.Sensitive Apparatus substrate gold mining belongs to makes the conductivity that can improve temperature, improves measuring accuracy.By using this structure, it is simple that the assembly structure of sensor and technique can become, and the manufacture of sensor and assembly cost also can significantly reduce.Pressure chip is arranged on the another side of the Sensitive Apparatus substrate being made of metal, and one end of sensor outer housing is provided with the medium transmission hole for measuring, the Medium Measurement pressure that pressure chip imports by medium transmission hole.
Described sensor outer housing inwall is provided with two steps, and Sensitive Apparatus substrate is arranged on first step in sensor outer housing through insulation pressure ring, and thermistor is fixed on through the enterprising trip temperature of Sensitive Apparatus substrate of insulation pressure ring insulation and measures like this.Thereby the temperature isolation of realization and sensor outer housing 5 to a certain extent, the accuracy of assurance temperature detection.Because heat has partial loss in the process of conduction, can record the temperature difference by the method for computer simulation emulation or experiment in advance, and then carry out certain compensation in thermistor.
The utility model has the advantages that and make the assembly structure of sensor and technique can become simple, the manufacture of sensor and assembly cost also can significantly reduce.
Accompanying drawing explanation
Fig. 1 pressure transducer temperature measurement structure schematic diagram.
In figure: 1 temperature measuring unit, 2 Sensitive Apparatus substrates, 3 insulation pressure rings, 4 pressure chips, 5 sensor outer housings, 6 medium transmission holes.
Embodiment
Further illustrate embodiment of the present utility model below in conjunction with accompanying drawing.
Referring to Fig. 1, the temperature measuring unit 1 of the present embodiment is thermistor, thermistor is integrated on Sensitive Apparatus substrate 2 in the mode of paster, and the present embodiment adopts the Sensitive Apparatus substrate 2 being made of metal to replace FR-4 substrate that original sensor sensing element generally the uses substrate as sensor sensing element.The temperature conductivity of Sensitive Apparatus substrate 2 is higher, so the temperature variation of testing pressure material can be identified and detect by temperature measuring unit 1 by Sensitive Apparatus substrate 2.The structure of the present embodiment makes the assembly structure of sensor and technique can become simple, and the manufacture of sensor and assembly cost also can significantly reduce.Pressure chip 4 is arranged on the another side of Sensitive Apparatus substrate 2, and one end of sensor outer housing 5 is provided with the medium transmission hole 6 for measuring, and pressure chip 4 faces the medium transmission hole 6 of sensor, the Medium Measurement pressure that pressure chip 4 imports by medium transmission hole 6.
Sensor outer housing 5 inwalls are provided with two steps, Sensitive Apparatus substrate 2 is arranged on first step in sensor outer housing 5 through insulation pressure ring 3, temperature measuring unit 1 is that thermistor is placed on the Sensitive Apparatus substrate 2 insulating through insulation pressure ring 3 like this, thereby the temperature isolation of realization and sensor outer housing 5 to a certain extent, the accuracy of assurance temperature detection.Because heat has partial loss in the process of conduction, can record the temperature difference by the method for computer simulation emulation or experiment in advance, and then carry out certain compensation in thermistor.
Claims (2)
1. the temperature measuring equipment of a pressure transducer, comprise: temperature measuring unit, insulation pressure ring, Sensitive Apparatus substrate, pressure chip, sensor outer housing, it is characterized in that temperature measuring unit is thermistor, thermistor is fixed in the mode of paster on the Sensitive Apparatus substrate being made of metal, pressure chip is arranged on the another side of Sensitive Apparatus substrate, and one end of sensor outer housing is provided with the medium transmission hole for measuring.
2. the temperature measuring equipment of pressure transducer according to claim 1, is characterized in that described sensor outer housing inwall is provided with two steps, and Sensitive Apparatus substrate is arranged on first step in sensor outer housing through insulation pressure ring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320758600.5U CN203616048U (en) | 2013-11-26 | 2013-11-26 | Temperature measuring device of pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320758600.5U CN203616048U (en) | 2013-11-26 | 2013-11-26 | Temperature measuring device of pressure sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203616048U true CN203616048U (en) | 2014-05-28 |
Family
ID=50768682
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320758600.5U Expired - Fee Related CN203616048U (en) | 2013-11-26 | 2013-11-26 | Temperature measuring device of pressure sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203616048U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108692769A (en) * | 2018-06-01 | 2018-10-23 | 无锡莱顿电子有限公司 | A kind of temperature pressure combinations sensor |
| CN110068416A (en) * | 2019-05-28 | 2019-07-30 | 无锡莱顿电子有限公司 | A kind of pressure and temp combination sensor |
-
2013
- 2013-11-26 CN CN201320758600.5U patent/CN203616048U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108692769A (en) * | 2018-06-01 | 2018-10-23 | 无锡莱顿电子有限公司 | A kind of temperature pressure combinations sensor |
| CN110068416A (en) * | 2019-05-28 | 2019-07-30 | 无锡莱顿电子有限公司 | A kind of pressure and temp combination sensor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140528 Termination date: 20161126 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |