CN203837873U - Batch debugging device of absolute pressure sensors - Google Patents
Batch debugging device of absolute pressure sensors Download PDFInfo
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- CN203837873U CN203837873U CN201420254818.1U CN201420254818U CN203837873U CN 203837873 U CN203837873 U CN 203837873U CN 201420254818 U CN201420254818 U CN 201420254818U CN 203837873 U CN203837873 U CN 203837873U
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- 238000012360 testing method Methods 0.000 claims abstract description 55
- 230000013011 mating Effects 0.000 claims description 6
- 230000033558 biomineral tissue development Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000003129 oil well Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
The utility model discloses a batch debugging device of absolute pressure sensors. A pressure tank provides a constant-pressure debugging environment, and at least one chip test board carrying a plurality of tested absolute-pressure sensing chips and/or at least one module calibration plate carrying a plurality of calibrated absolute-pressure sensor modules are/is connected with a debugging plate seat placed in a pressure tank accommodating chamber in an interface plugging manner. The number of the debugged absolute-pressure sensing chips and/or the absolute-pressure sensor modules is increased to the maximum limit, and batch debugging is achieved.
Description
Technical field
The utility model relates to art of pressure sensors, relates in particular to a kind of absolute pressure sensor batch debugging device.
Background technology
Pressure transducer is a kind of sensor the most conventional in industrial practice, it is widely used in various industrial automatic control environment, relates to the fields such as water conservancy and hydropower, railway traffic, intelligent building, production automatic control, Aero-Space, military project, petrochemical industry, oil well, electric power, boats and ships, lathe, pipeline.
Existing pressure transducer core is the pressure sensing chip for induction pressure, on the basis of pressure sensing chip, also need pressure sensing chip to encapsulate mineralization pressure sensor assembly, pressure sensor module, except comprising pressure sensing chip, also comprises the signal processing circuit that the pressure signal of pressure sensing chip output is processed.In producing the process of pressure transducer, need to debug pressure transducer, debugging comprises that the pressure sensing chip to having produced tests, and the pressure sensor module of encapsulation is calibrated.Existing pressure transducer debugging apparatus is all to debug to single sensing chip or to single sensing module, and debugging efficiency is very low, and then affects product production capacity.
Utility model content
In view of this, the utility model provides a kind of absolute pressure sensor batch debugging device, to realize the batch debugging of absolute pressure sensor chip and/or absolute pressure sensor module.
The technological means that the utility model adopts is as follows: a kind of absolute pressure sensor batch debugging device, comprises debug terminal, head tank, debugging panel seat, temperature sensor, source of the gas, chip testing plate and/or modular calibration plate;
Described head tank comprises tank body and lid, and defines a container cavity by tank body and lid; Described tank body offers air intake opening and gas outlet;
Described source of the gas is connected with head tank by described air intake opening;
In the container cavity of described head tank, be provided with debugging panel seat, chip testing plate and/or modular calibration plate, and temperature sensor;
Wherein, described debugging panel seat carries debug circuit, and comprising at least one chip testing plate interface and/or at least one modular calibration plate interface, described debug circuit is electrically connected to described chip testing plate interface and/or modular calibration plate interface, and is electrically connected to described debug terminal;
Described chip testing plate carries chip testing plate circuit, and comprises at least one chip carrier; Tested absolute pressure sensor chip is arranged at described chip carrier, and is electrically connected to described chip testing plate circuit; Described chip testing plate is plugged in described debugging panel seat by described chip testing plate interface, and described chip testing plate circuit is electrically connected to described debug circuit;
Described modular calibration plate carries modular calibration plate circuit, and comprises at least one module base; Be calibrated module and be arranged at described module base, and be connected with described modular calibration plate circuit; Described modular calibration plate is plugged in described debugging panel seat by described modular calibration plate interface, and described modular calibration plate circuit is electrically connected to described debug circuit;
Described temperature sensor is electrically connected to described debug terminal.
Further, described head tank also comprises the reduction valve that is arranged at described tank body.
Further, between described lid and described opening, be provided with the first O-ring seal.
Further, the tank body of described head tank is provided with hermetically sealed connector, and described hermetically sealed connector comprises the first lead-in wire interface and the second lead-in wire interface that is arranged at described container cavity, and is arranged at the 3rd lead-in wire interface and the 4th lead-in wire interface outside the tank body of head tank; Described temperature sensor connects the first lead-in wire interface of hermetically sealed connector by the first lead-in wire, second lead-in wire one end is electrically connected to the first lead-in wire by the 3rd lead-in wire interface, and the other end of the second lead-in wire is electrically connected to described debug terminal.
Further, described debug circuit connects described the second lead-in wire interface by the 3rd lead-in wire, and the 4th lead-in wire one end is electrically connected to described the 3rd lead-in wire by the 4th lead-in wire interface, and the other end of the 4th lead-in wire is electrically connected to described debug terminal.
Further, described chip testing plate comprises the first inserted terminal mating with described chip testing plate interface, described the first inserted terminal comprises the first pad being electrically connected to described chip testing plate circuit, described chip testing plate interface comprises second pad corresponding with described the first pad, and described the second pad is electrically connected to described debug circuit.
Further, described chip testing plate comprises the chip pin interface corresponding with chip carrier described in each, and the pin of described tested absolute pressure sensor chip is electrically connected to described chip pin interface, and described in each, chip pin interface is electrically connected to chip testing plate circuit.
Further, described modular calibration plate comprises the second inserted terminal mating with described modular calibration plate interface, described the second inserted terminal comprises the 3rd pad being electrically connected to described modular calibration plate circuit, described modular calibration plate interface comprises four pad corresponding with described the 3rd pad, and described the 4th pad is electrically connected to described debug circuit.
Further, described modular calibration plate comprises the module pin interface corresponding with module base described in each, described in be calibrated module pin be electrically connected to described module pin interface, described in each, module pin interface is electrically connected to modular calibration plate circuit.
Adopt absolute pressure sensor batch debugging device provided by the utility model, the debugging enironment of a constant voltage is provided by head tank, the mode that at least one carrying chip testing plate of a plurality of tested absolute pressure sensing chips and/or a plurality of modular calibration plates that are calibrated absolute pressure sensor module of at least one carrying are pegged graft by interface is connected with the debugging panel seat in being positioned over head tank container cavity, expand to greatest extent debugged absolute pressure sensing chip and/or the number of absolute pressure sensor module, realized batch debugging.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of absolute pressure sensor batch debugging of the utility model device;
Fig. 2 is the structural representation of the utility model chips test board;
Fig. 3 is the structural representation of modular calibration plate in the utility model.
Embodiment
Below in conjunction with accompanying drawing, principle of the present utility model and feature are described, example, only for explaining the utility model, is not intended to limit scope of the present utility model.
As exemplary embodiments of the present utility model, as Figure 1-3, absolute pressure sensor batch debugging device comprises debug terminal 1, head tank 2, debugging panel seat 3, temperature sensor 4, source of the gas 5, chip testing plate 6 and/or modular calibration plate 7;
Head tank 2 comprises tank body (unmarked) and lid (unmarked), and defines a container cavity A by tank body and lid; Tank body offers air intake opening 8 and gas outlet 9; Further, in the present embodiment, head tank 2 also comprises the reduction valve 10 that is arranged at tank body, in order to guarantee good sealing and stable pressure to be provided, is provided with O-ring seal (not shown) between lid and tank body;
Source of the gas 5 is connected with head tank 2 by air intake opening 8;
In the container cavity A of head tank 2, be provided with debugging panel seat 3, chip testing plate 6 and/or modular calibration plate 7, and temperature sensor 4;
Wherein, debugging panel seat 3 carries debug circuit (not shown), and comprise at least one chip testing plate interface (not shown) and/or at least one modular calibration plate interface (not shown), debug circuit is electrically connected to chip testing plate interface and/or modular calibration plate interface, and is electrically connected to debug terminal 1.
Chip testing plate 6 as shown in Figure 2, carries chip testing plate circuit (not shown), and comprises at least one chip carrier 61; Tested absolute pressure sensor chip (not shown) is arranged at chip carrier 61, and is electrically connected to chip testing plate circuit; Chip testing plate 6 is plugged in debugging panel seat 3 by chip testing plate interface, and chip testing plate circuit is electrically connected to debug circuit;
In the present embodiment, chip testing plate comprises the first inserted terminal 62 mating with chip testing plate interface, the first inserted terminal 62 comprises the first pad 63 being electrically connected to chip testing plate circuit, corresponding, at chip testing plate interface, the second pad (not shown) corresponding with the first pad 63 is set, the second pad is electrically connected to debug circuit, completes thus being electrically connected between chip testing plate circuit and debug circuit;
Further, chip testing plate 6 comprises the chip pin interface (not shown) corresponding with chip carrier described in each 61, the pin of tested absolute pressure sensor chip is electrically connected to chip pin interface, each chip pin interface is electrically connected to chip testing plate circuit, realized thus tested absolute pressure sensor chip and chip testing plate circuit, and the electrical connection between debug circuit.
Modular calibration plate 7 carries modular calibration plate circuit (not shown), and comprises at least one module base 71; Be calibrated module and be arranged at module base 71, and be connected with modular calibration plate circuit; Modular calibration plate 7 is plugged in debugging panel seat 3 by modular calibration plate interface, and modular calibration plate circuit is electrically connected to debug circuit;
In the present embodiment, modular calibration plate 7 comprises the second inserted terminal 72 mating with modular calibration plate interface, the second inserted terminal 72 comprises the 3rd pad 73 being electrically connected to modular calibration plate circuit, accordingly, at modular calibration plate interface, the four pad (not shown) corresponding with the 3rd pad 73 is set, the 4th pad is electrically connected to debug circuit, realized thus being electrically connected between modular calibration plate and debug circuit;
Further, modular calibration plate 7 comprises the module pin interface (not shown) corresponding with each module base 71, the pin that is calibrated module is electrically connected to module pin interface, each module pin interface is electrically connected to modular calibration plate circuit, realized thus and be calibrated module and modular calibration plate circuit, and the electrical connection between debug circuit.
The debug circuit and the temperature sensor 4 that are carried on debugging panel seat 3 are electrically connected to debug terminal 1 respectively; In the present embodiment, in order to realize above-mentioned electrical connection, tank body in head tank 2 is provided with hermetically sealed connector 11, hermetically sealed connector 11 comprises the first lead-in wire interface (not shown) and the second lead-in wire interface (not shown) that is arranged at container cavity A, and is arranged at the 3rd lead-in wire interface (not shown) and the 4th lead-in wire interface (not shown) outside the tank body of head tank 2; Temperature sensor 4 connects the first lead-in wire interface of hermetically sealed connector 11 by the first lead-in wire 13, the other end that second lead-in wire 14 one end are electrically connected to the first lead-in wire 13, the second lead-in wires 14 by the 3rd lead-in wire interface is electrically connected to described debug terminal; Further, debug circuit connects the second lead-in wire interface by the 3rd lead-in wire 12, and the other end that the 4th lead-in wire 15 one end are electrically connected to the 3rd lead-in wire 12, the four lead-in wires 15 by the 4th lead-in wire interface is electrically connected to debug terminal 1.
Adopt absolute pressure sensor batch debugging device provided by the utility model, the debugging enironment of a constant voltage is provided by head tank, the mode that at least one carrying chip testing plate of a plurality of tested absolute pressure sensing chips and/or a plurality of modular calibration plates that are calibrated absolute pressure sensor module of at least one carrying are pegged graft by interface is connected with the debugging panel seat in being positioned over head tank container cavity, expand to greatest extent debugged absolute pressure sensing chip and/or the number of absolute pressure sensor module, realized batch debugging.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all within spirit of the present utility model and principle, any modification of making, be equal to replacement, improvement etc., within all should being included in the scope of the utility model protection.
Claims (9)
1. an absolute pressure sensor batch debugging device, is characterized in that, comprises debug terminal, head tank, debugging panel seat, temperature sensor, source of the gas, chip testing plate and/or modular calibration plate;
Described head tank comprises tank body and lid, and defines a container cavity by tank body and lid; Described tank body offers air intake opening and gas outlet;
Described source of the gas is connected with head tank by described air intake opening;
In the container cavity of described head tank, be provided with debugging panel seat, chip testing plate and/or modular calibration plate, and temperature sensor;
Wherein, described debugging panel seat carries debug circuit, and comprising at least one chip testing plate interface and/or at least one modular calibration plate interface, described debug circuit is electrically connected to described chip testing plate interface and/or modular calibration plate interface, and is electrically connected to described debug terminal;
Described chip testing plate carries chip testing plate circuit, and comprises at least one chip carrier; Tested absolute pressure sensor chip is arranged at described chip carrier, and is electrically connected to described chip testing plate circuit; Described chip testing plate is plugged in described debugging panel seat by described chip testing plate interface, and described chip testing plate circuit is electrically connected to described debug circuit;
Described modular calibration plate carries modular calibration plate circuit, and comprises at least one module base; Be calibrated module and be arranged at described module base, and be connected with described modular calibration plate circuit; Described modular calibration plate is plugged in described debugging panel seat by described modular calibration plate interface, and described modular calibration plate circuit is electrically connected to described debug circuit;
Described temperature sensor is electrically connected to described debug terminal.
2. absolute pressure sensor batch debugging device according to claim 1, is characterized in that, described head tank also comprises the reduction valve that is arranged at described tank body.
3. absolute pressure sensor batch debugging device according to claim 2, is characterized in that, between described lid and tank body, is provided with O-ring seal.
4. absolute pressure sensor batch debugging device according to claim 3, it is characterized in that, the tank body of described head tank is provided with hermetically sealed connector, described hermetically sealed connector comprises the first lead-in wire interface and the second lead-in wire interface that is arranged at described container cavity, and is arranged at the 3rd lead-in wire interface and the 4th lead-in wire interface outside the tank body of head tank; Described temperature sensor connects the first lead-in wire interface of hermetically sealed connector by the first lead-in wire, second lead-in wire one end is electrically connected to the first lead-in wire by the 3rd lead-in wire interface, and the other end of the second lead-in wire is electrically connected to described debug terminal.
5. absolute pressure sensor batch debugging device according to claim 4, it is characterized in that, described debug circuit connects described the second lead-in wire interface by the 3rd lead-in wire, the 4th lead-in wire one end is electrically connected to described the 3rd lead-in wire by the 4th lead-in wire interface, and the other end of the 4th lead-in wire is electrically connected to described debug terminal.
6. absolute pressure sensor batch debugging device according to claim 5, it is characterized in that, described chip testing plate comprises the first inserted terminal mating with described chip testing plate interface, described the first inserted terminal comprises the first pad being electrically connected to described chip testing plate circuit, described chip testing plate interface comprises second pad corresponding with described the first pad, and described the second pad is electrically connected to described debug circuit.
7. absolute pressure sensor batch debugging device according to claim 6, it is characterized in that, described chip testing plate comprises the chip pin interface corresponding with chip carrier described in each, the pin of described tested absolute pressure sensor chip is electrically connected to described chip pin interface, and described in each, chip pin interface is electrically connected to chip testing plate circuit.
8. absolute pressure sensor batch debugging device according to claim 7, it is characterized in that, described modular calibration plate comprises the second inserted terminal mating with described modular calibration plate interface, described the second inserted terminal comprises the 3rd pad being electrically connected to described modular calibration plate circuit, described modular calibration plate interface comprises four pad corresponding with described the 3rd pad, and described the 4th pad is electrically connected to described debug circuit.
9. absolute pressure sensor batch debugging device according to claim 8, it is characterized in that, described modular calibration plate comprises the module pin interface corresponding with module base described in each, the described pin that is calibrated module is electrically connected to described module pin interface, and described in each, module pin interface is electrically connected to modular calibration plate circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420254818.1U CN203837873U (en) | 2014-05-19 | 2014-05-19 | Batch debugging device of absolute pressure sensors |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420254818.1U CN203837873U (en) | 2014-05-19 | 2014-05-19 | Batch debugging device of absolute pressure sensors |
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| Publication Number | Publication Date |
|---|---|
| CN203837873U true CN203837873U (en) | 2014-09-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420254818.1U Expired - Lifetime CN203837873U (en) | 2014-05-19 | 2014-05-19 | Batch debugging device of absolute pressure sensors |
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| CN (1) | CN203837873U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105784268A (en) * | 2016-04-18 | 2016-07-20 | 中国工程物理研究院总体工程研究所 | Multi-channel pressure sensor calibration device based on gas source load |
| CN107202667A (en) * | 2017-03-17 | 2017-09-26 | 南京高华科技股份有限公司 | A kind of core body compensating test automation equipment |
| CN107421686A (en) * | 2017-08-21 | 2017-12-01 | 杭州中感科技有限公司 | Plug-in type pressure sensor calibrating apparatus |
| CN112461445A (en) * | 2020-11-20 | 2021-03-09 | 中国直升机设计研究所 | Helicopter blade surface miniature pressure sensor calibrating device |
-
2014
- 2014-05-19 CN CN201420254818.1U patent/CN203837873U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105784268A (en) * | 2016-04-18 | 2016-07-20 | 中国工程物理研究院总体工程研究所 | Multi-channel pressure sensor calibration device based on gas source load |
| CN107202667A (en) * | 2017-03-17 | 2017-09-26 | 南京高华科技股份有限公司 | A kind of core body compensating test automation equipment |
| CN107421686A (en) * | 2017-08-21 | 2017-12-01 | 杭州中感科技有限公司 | Plug-in type pressure sensor calibrating apparatus |
| CN112461445A (en) * | 2020-11-20 | 2021-03-09 | 中国直升机设计研究所 | Helicopter blade surface miniature pressure sensor calibrating device |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 100085 Beijing city Haidian District on the seven street, Huizhong building room 710 Patentee after: BEIJING WILL CREATE TECHNOLOGY Co.,Ltd. Address before: 100085 Beijing city Haidian District on the seven street, Huizhong building room 710 Patentee before: BEIJING BEETECH TECHNOLOGY CO.,LTD. |
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| CX01 | Expiry of patent term |
Granted publication date: 20140917 |
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| CX01 | Expiry of patent term |