CN105319862A - Light source device and exposure device - Google Patents
Light source device and exposure device Download PDFInfo
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- CN105319862A CN105319862A CN201510319338.8A CN201510319338A CN105319862A CN 105319862 A CN105319862 A CN 105319862A CN 201510319338 A CN201510319338 A CN 201510319338A CN 105319862 A CN105319862 A CN 105319862A
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Abstract
A light source device using a plurality of light sources of different wavelengths is provided, and the light source device needs not be strictly arranged in a predetermined arrangement. A plurality of LD modules 1 and 2 are respectively provided with one LD (lasers Diode) and a condenser lens, and emit lasers of different wavelengths. LDs of the LD module 1 and 2 are controlled by a control unit 99 for lighting, non-lighting and the output (illuminance). Emitted light of three LD modules 1 and one LD module 2 are input to a first fiber bundle part b1 and is gathered to a second optical fiber 7 by means of four first optical fibers 5 and a first connector 6. Three second optical fibers are led to a second fiber bundle part b2, and outgoing end sides are bundled according to array patterns corresponding to the shapes of the light irradiation areas of DMDs 56 in an exposure head 18, are connected to a third optical fiber 9 and are connected to an incident light system 40 via a second connector 10, with leading a laser beam to the exposure head 18 of an exposure device B.
Description
Technical field
The present invention relates to light supply apparatus and exposure device, described light supply apparatus and exposure device are applicable to application such as printed base plate, semiconductor wafer, liquid crystal display based on direct plotting method used in photolithographic exposure process.
Background technology
In the past, for the photolithographic circuit pattern formation of employing and so-called exposure process, widely use the seal type exposure device that have employed photomask, but in recent years, in order to coordinate the fine of circuit, densification and adopt following direct-writing exposure device, described direct-writing exposure device adopts and does not use the optical modulation elements such as the DMD of photomask (digital micro-mirror device, digitalmicromirrordevice) modulate light and expose (patent documentation 1).
But in order to the pattern that can realize fine is formed, the light source adopted in this direct-writing exposure device is that the situation of Single wavelength is more.On the other hand, also there is some resist be exposed and there is broadband light sensitivity, thus if Single wavelength then cannot adequately hardened situation or time shutter elongated situation.
Therefore, propose the light supply apparatus of following structure: as shown in patent documentation 2, use multiple light source with different wavelength characteristics, and utilize lens to carry out optically focused.
Patent documentation 1: Japanese Unexamined Patent Publication 2006-267719
Patent documentation 2: Japanese Unexamined Patent Publication 2012-063390
But, when being configured to the structure adopting multiple light source of different wave length and lens, needing to guarantee that the arrangement mode according to regulation strictly configures array of source and the lens arra of light source, there is the problem that device is complicated.
Summary of the invention
The object of the invention is to the shortcoming solving this prior art.
In order to reach above-mentioned purpose, the feature of light supply apparatus of the present invention is, described light supply apparatus has: 1 laser diode, and its injection has the laser of the wavelength characteristic of regulation; Other laser diode, its injection has the laser of other wavelength characteristics of the wavelength characteristic being different from described regulation; Multiple 1st fibre bundle, it has: 1 article of the 1st optical fiber, and it is at the incident injection light from described 1 laser diode of incidence end and penetrate at exit end; Other the 1st optical fiber, its incidence end incident from described other laser diode injection light and penetrate at exit end; And the 2nd optical fiber, it assembles the injection light of described 1 article of the 1st optical fiber and other the 1st optical fiber, the plurality of 1st fibre bundle by described 1 article of the 1st optical fiber and described other the 1st optical fiber outgoing side according to regulation arrangement carry out boundling, assemble this 1 article of the 1st optical fiber and other the 1st optical fiber injection light and make it incide the incidence end of described 2nd optical fiber;
2nd fibre bundle, it has the 3rd optical fiber of the injection light assembling described 2nd optical fiber, boundling is carried out according to the arrangement of regulation in the outgoing side of multiple 2nd optical fiber in described multiple 1st fibre bundle portion by the 2nd fibre bundle, assembles the injection light of each 2nd optical fiber and makes it incide the incidence end of described 3rd optical fiber; And efferent, it is connected to the output terminal of described 3rd optical fiber, for exporting outside.
Preferred described light supply apparatus has control device, and this control device is lighted individually to described laser diode, non-lighting controls and export at least one control in controlling.Further, preferred described light supply apparatus has control device, and this control device is lighted according to the group of regulation described laser diode, non-lighting controls and export at least one control in controlling.
In addition, exposure device of the present invention is modulated the light sent from light supply apparatus by spatial optical modulation element, and utilize the light after this modulation that photosensitive material is exposed, described spatial optical modulation element is arranged with the multiple pixel portions separately carrying out modulating, it is characterized in that, this exposure device uses above-mentioned light supply apparatus.
According to light supply apparatus of the present invention and exposure device, owing to adopting the light source being mixed with the exposure wavelength of multiple wavelength, therefore, it is possible to the resist of reply wide region.Further, do not need strictly to configure light source according to the arrangement of regulation, and do not need lens arra yet, device can be simplified.Further, setting up of laser diode can be carried out simply, thus realize high illumination simply.
In addition there is the effects such as following: if carrying out lighting control or exporting control of laser diode by arranging control device, just can change the illumination ratio of each wavelength, best conditions of exposure can be provided.
Accompanying drawing explanation
Fig. 1 is the structural drawing of the embodiment that light supply apparatus of the present invention is shown.
Fig. 2 is the stereographic map of the embodiment that exposure device of the present invention is shown.
Fig. 3 is the key diagram of the structure of the photohead diagrammatically illustrated in an embodiment of exposure device of the present invention.
Label declaration
1:LD module; 2:LD module; 3:LD optical fiber; 4: connector; 5: the 1 optical fiber; 6: the 1 connectors; 7: the 2 optical fiber; 9: the 3 optical fiber; 10: the 2 connectors; 12: substrate (exposure object); 14: exposure portion; 18: photohead; 19: light source cell; 40: incident optical system; 41: modulating sections; 42: the 1 imaging optical systems; 43: microlens array; 43a: lenticule; 44: fenestra array; 44a: fenestra; 45: the 2 imaging optical systems (projection optical system); 56:DMD (spatial optical modulation element); 99: control device; B1: the 1 fibre bundle portion; B2: the 2 fibre bundle portion; A: light supply apparatus; B: exposure device B.
Embodiment
Below, embodiments of the present invention are described.
This light supply apparatus is following structure substantially: light different for many wavelength penetrated from laser diode is understood coalescence lead-in light fine, after guiding respectively, in the way of this light path, be polymerized to bundle by several, and utilize connector to be connected to thicker optical fiber to mix.
Below, be described in detail referring to figs. 1 through Fig. 3.
As shown in Figure 1, light supply apparatus A has multiple LD module 1,2.Each LD module 1,2 has 1 laser diode (LD:laserdiode) and collector lens.LD module 1 and LD module 2 have the LD of the laser of injection different wave length (wavelength A, wavelength B), in the present embodiment, the LD module 1 of 3 wavelength A and the LD module 2 of 1 wavelength B are set to 1 group, having 3 groups is altogether 12 LD modules 1,2, utilizes LD optical fiber 3 that each LD module 1,2 is guided to connector 4.
Further, the LD of preferred LD module 1,2 has the wavelength characteristic that wavelength is the scope of 190 ~ 530nm.
In the present embodiment, the wavelength A of the LD of LD module 1 has the wavelength characteristic that there is peak value near 375nm, and the wavelength B of the LD of LD module 2 has the wavelength characteristic that there is peak value near 405nm.
Be configured to: the LD of each LD module 1,2 is controlled by control device 99, it lighted, non-light and its export (illumination) control.Each LD of LD module 1,2 can be configured to be controlled its each by control device 99, also can be configured to control it according to grouping.
Be configured to: the 1st optical fiber 5 each connector 4 being connected with the 1st fibre bundle portion b1, at the incident injection light from the LD of LD module 1,2 of the incidence end of the 1st optical fiber 5, and then penetrate at its exit end.1st fibre bundle portion b1 has the 1st optical fiber 5, the 1st connector 6 and the 2nd optical fiber 7.
To be configured to: the injection light of described 3 LD modules 1 and 1 LD module 2 is incident to the 1st fibre bundle portion b1, to be gathered in 1 article of the 2nd optical fiber 7 via 4 articles of described 1st optical fiber 5 by the 1st connector 6.
1st optical fiber 5 of each LD module 1,2 in its outgoing side with the arrangement of regulation by boundling, and to be connected with 1 article of the 2nd optical fiber 7 via the 1st connector 6.
2nd optical fiber 7 has the core of the size in the light injection region under the state being more than or equal to boundling 4 article of the 1st optical fiber 5, as mentioned above, the light from 4 LD modules 1,2 is gathered in 1 article of the 2nd optical fiber 7.
In the present embodiment, there are 3 the 1st fibre bundle portion b1,12 LD modules 1,2 will be amounted to by 3 the 1st fibre bundle portion b1 and be gathered in 3 article of the 2nd optical fiber 7.
2nd optical fiber 7 is multimode optical fiber, is configured to realize homogenising by the interaction between the interference of the light in optical fiber or pattern.
Article 3, the 2nd optical fiber 7 is directed to the 2nd fibre bundle portion b2 further, boundling is carried out according to the Pareto diagram corresponding with the shape of the light irradiation area for the DMD56 in photohead 18 described later in its outgoing side and becomes the 3rd optical fiber 9.
Be configured to: the outgoing side of the 3rd optical fiber 9 of this 3 article of the 2nd optical fiber 7 of boundling is connected to incident optical system 40 via the 2nd connector 10, and by laser aiming to the photohead 18 of exposure device B.
In addition, in the above-described embodiment, the example of the laser of use 2 kinds of wavelength is shown, but, also can use more kinds of wavelength, and the high output of implement device can be carried out by suitably setting up laser module 1,2.
Because light supply apparatus A described above is by the outgoing side boundling of the 1st optical fiber 5, the 2nd optical fiber 7, by the Laser synthesizing from LD module 1,2, therefore, do not need position LD module 1,2 being arranged in regulation, each LD module 1,2 can configure independently.This improves the degree of freedom of the setting of LD module 1,2.
Further, can lighting number and exporting and change the illumination ratio of each wavelength by the LD by control device 99 control LD module 1,2, the conditions of exposure of required the best can be provided.
By Fig. 2, the structure of digital exposure apparatus (image exposing apparatus) B employing above-mentioned light supply apparatus A is described.
Exposure device B is formed as roughly rectangular flat board, and it has: the pedestal 11 of horizontal arrangement; Moving stage 13, it is installed on this pedestal 11 sliding freely, keeps the substrate 12 as exposure object at the Adsorption on Surface of this moving stage 13; And exposure portion 14, it exposes the substrate 12 remained on this moving stage 13.
Substrate 12 is such as the printed wiring board or glass substrate for plane display device etc. that apply or be pasted with photosensitive material from the teeth outwards.This digital exposure apparatus B exposes described substrate 12, thus such as by Wiring pattern etc. being recorded on the photosensitive material of substrate 12 without mask mode.In addition, be described as follows in the present embodiment: the moving direction of moving stage 13 is set to Y-direction, direction vertical with Y-direction is in the horizontal plane set to X-direction (Width of substrate 12), the vertical direction with horizontal plane is set to Z-direction.Pedestal 11 is formed longer in the Y direction.
The leg 15 that pedestal 11 is mounted respectively in four angles supports.The upper surface 11a of pedestal 11 is provided with 2 guide rails 16 almost parallel with Y-direction.Moving stage 13 is installed on pedestal 11 via each guide rail 16 in the mode slid freely in the Y direction.Further, the driving mechanism (omit and illustrate) that moving stage 13 is formed with by linear electric machine etc. is connected, thus moves in the Y direction according to the driving of this driving mechanism.
Exposure portion 14 is installed on the Y-direction central portion of pedestal 11 via 1 pair of pillar 17.Each pillar 17 is fixed on the X-direction both ends of pedestal 11.Each pillar 17 separates the distance of regulation apart from the upper surface 11a of pedestal 11 and keeps exposure portion 14, can by the downside in exposure portion 14 when moving in the Y direction with convenient moving stage 13.Exposure portion 14 has 16 photoheads 18.These each photoheads 18 irradiate light to by the substrate 12 under it.
Each photohead 18 is lined up 2 row in the X direction and is often arranged each arrangement 8.Configure as follows: the center that each photohead 18 of the 2nd row is respective lays respectively near the 1st adjacent each photohead 18 arranged central authorities each other, 1/2 spacing so that each photohead 18 arranged relative to the 1st staggers in the X direction.By being in staggered configuration like this, the part that cannot be exposed by each photohead 18 of the 1st row be exposed by each photohead 18 of the 2nd row, thus does not exist in the X-direction of substrate 12 and carry out exposure record with gap.In addition, the quantity and the arrangement mode that are arranged at the photohead 18 in exposure portion 14 also suitably can change according to the size etc. of substrate 12.
The view data (image information) corresponding with recording Wiring pattern on the substrate 12 etc. is inputted to graphics processing unit 21.Graphics processing unit 21 makes the frame data for each photohead 18 according to inputted view data.Then, graphics processing unit 21 via signal cable 22 to each photohead 18 incoming frame data.Frame data are such as the data representing the concentration of each pixel of composing images by 2 values (presence or absence of the record of point).
Each photohead 18 is modulated the laser from light supply apparatus A incidence according to frame data, and is projected to being moved the substrate 12 that objective table 13 carries by the light after modulation.Thus, corresponding with the view data being input to graphics processing unit 21 image is exposed record on the substrate 12.
Also be provided with a pair horizontal metroscope 24 of the door 23 being formed as roughly " コ " font and the end being installed on Y-direction on the base 11.Door 23 is to be installed on pedestal 11 substantially in parallel across the mode of each guide rail 16 and X-direction.Door 23 is provided with 3 video cameras 25.Each video camera 25 is connected with the controller (omit and illustrate) of control figure exposure device 10 entirety uniformly.
Each video camera 25 is taken the moving stage 13 by door 23, and acquired view data is outputted to controller.Controller, according to the acquired view data of each video camera 25, calculates the side-play amount of substrate 12 relative to the X-direction of the appropriate position on moving stage 13, Y-direction and θ direction (taking Z-direction as the rotation of axle).The side-play amount calculated is imported into graphics processing unit 21, for the correction of frame data.In addition, the number of units and configuration space etc. of video camera 25 suitably can change according to the size etc. of substrate 12.Further, the calculating of side-play amount is carried out by known image procossing.Now, for ease of calculating side-play amount, preferably alignment mark etc. is set on the substrate 12.
Each horizontal metroscope 24 is connected with controller identically with each video camera 25.The side end face irradiating laser of each horizontal metroscope 24 pairs of moving stages 13, and accept its reflected light, measure the position of moving stage 13 thus.Then, each horizontal metroscope 24 pairs of controllers export the position of the moving stage 13 measured.In addition, in the present embodiment, show the horizontal metroscope 24 of so-called laser interference formula, but be not limited thereto, also can be such as the device etc. using ultrasound wave or stereo camera, as long as the position that can measure moving stage 13 just can use other arbitrary device.
The details of Fig. 3 to the photohead 18 of the exposure device B of said structure and the coupling part of light supply apparatus A is utilized to be described.
Photohead 18 is made up of incident optical system 40, modulating sections 41, the 1st imaging optical system 42, microlens array (MLA:microlensarray) 43, fenestra array (APA:aperturearray) the 44 and the 2nd imaging optical system (projection optical system) 45.Incident optical system 40 is oppositely disposed with the outgoing end of optical fiber 9 via the 2nd connector 10.This incident optical system 40 has: collector lens 50, and it is assembled the laser (LB:laserbeam) penetrated from optical fiber 9; The optical integrator (opticalintegrator) 51 of column, it is configured in the light path of the laser LB after by collector lens 50; Imaging len 52, it makes the laser LB imaging that have passed optical integrator 51; And mirror 53, it reflects by the laser LB of imaging len 52 imaging and makes it incide modulating sections 41.
Optical integrator 51 is such as the light transmission post being formed as quadrangular shape.Optical integrator 51 makes to carry out being totally reflected and the laser LB advanced in inside becomes close to directional light and the light beam of even intensity in beam cross section.Thus, the image exposure of the fine of the deviation of illumination light intensity will be there is not in substrate 12.In addition, in order to improve transmittance, preferably on the incident end face and outgoing end face of optical integrator 51, cover antireflection film.
Modulating sections 41 has TIR (total reflection: totalinternalreflection) prism 55 and the DMD (digital micromirror device: digitalmicromirrordevice) 56 as spatial optical modulation element.TIR prism 55 makes to reflect towards DMD56 via the laser LB of mirror 53 incidence.DMD56 is the mirror device formed as follows: the micro mirror forming pixel is also tilted to be arranged on freely on SRAM (StaticRandomAccessMemory: the static RAM) unit of two-dimensional arrangements by pillar supporting.
DMD56 according to the digital signal being written to sram cell, the angle of inclination of micro mirror is changed and become the state that reflected towards the 1st imaging optical system 42 by irradiated laser LB and by irradiated laser LB towards the state omitting the reflection of illustrated absorber of light.Modulating sections 41 controls according to the inclination of the frame data inputted from graphics processing unit 21 to the micro mirror of each pixel of DMD56, produces the image light corresponding to frame data thus.
1st imaging optical system 42 is made up of lens 57,58, the image light produced is amplified the multiplying power imaging on MLA43 that specify by modulating sections 41.
MLA43 is such as formed as roughly rectangular tabular by quartz glass.Further, MLA43 forms the multiple lenticule 43a with each pixel of DMD56 two-dimensional arrangements accordingly.Each lenticule 43a is that upper surface is plane and lower surface is the plano-convex lens of convex surface.Each lenticule 43a separately carries out imaging to the image light of each micro mirror from DMD56, and will carry out the sharpening of enlarged image light by the 1st imaging optical system 42.In addition, the shape of each lenticule 43a is not limited to plano-convex lens, such as, also can be biconvex lens etc.
APA44 has light-proofness, is formed with multiple fenestra 44a for making image light pass through.Each fenestra 44a identically with each lenticule 43a with each pixel two-dimensional arrangements accordingly of DMD56.APA44 makes each fenestra 44a and each lenticule 43a arranged opposite, makes by the image light of each lenticule 43a imaging separately by corresponding each fenestra 44a.What APA44 prevented the vibration of each micro mirror because of DMD56 etc. and produced passes through without using up, and improves the acutance of exposure image further.
2nd imaging optical system 45 has lens 60,61 and prism to 62, will have passed the image light projection of APA44 on the substrate 12.Each lens 60,61 make the image light that have passed APA44 be amplified to regulation multiplying power or etc. multiplying power incide prism to 62.Prism is set to move freely in the vertical direction to 62, by moving up and down, and regulates the focus of the image light on substrate 12.
Further, show the situation of DMD56 as spatial optical modulation element in the above-described embodiment, but spatial optical modulation element being not limited to this, such as, also can be liquid crystal light shutter etc.In addition, show coating or the situation of substrate 12 as exposure object having attached photosensitive material in the above-described embodiment, but exposure object is not limited to this, such as, also can be sensitive film or printer paper etc.
Claims (7)
1. a light supply apparatus, is characterized in that, described light supply apparatus has:
1 laser diode, its injection has the laser of the wavelength characteristic of regulation;
Other laser diode, its injection has the laser of other wavelength characteristics of the wavelength characteristic being different from described regulation;
Multiple 1st fibre bundle, it has: 1 article of the 1st optical fiber, and it is at the incident injection light from described 1 laser diode of incidence end and penetrate at exit end; Other the 1st optical fiber, its incidence end incident from described other laser diode injection light and penetrate at exit end; And the 2nd optical fiber, it assembles the injection light of described 1 article of the 1st optical fiber and other the 1st optical fiber, the plurality of 1st fibre bundle by described 1 article of the 1st optical fiber and described other the 1st optical fiber outgoing side according to regulation arrangement carry out boundling, assemble this 1 article of the 1st optical fiber and other the 1st optical fiber injection light and make it incide the incidence end of described 2nd optical fiber;
2nd fibre bundle, it has the 3rd optical fiber of the injection light assembling described 2nd optical fiber, boundling is carried out according to the arrangement of regulation in the outgoing side of multiple 2nd optical fiber in described multiple 1st fibre bundle portion by the 2nd fibre bundle, assembles the injection light of each 2nd optical fiber and makes it incide the incidence end of described 3rd optical fiber; And
Efferent, it is connected to the output terminal of described 3rd optical fiber, for exporting outside.
2. light supply apparatus according to claim 1, wherein,
Described light supply apparatus has control device, and this control device is lighted individually to described laser diode, non-lighting controls and export at least one control in controlling.
3. light supply apparatus according to claim 1, wherein,
Described light supply apparatus has control device, and this control device is lighted according to the group of regulation described laser diode, non-lighting controls and export at least one control in controlling.
4. light supply apparatus according to claim 1, wherein,
Described laser diode has the wavelength characteristic be contained in the wave band of 190nm ~ 530nm.
5. light supply apparatus according to claim 1, wherein,
Described 1 laser diode has the wavelength characteristic that there is peak value near 375nm, and other laser diode described has the wavelength characteristic that there is peak value near 405nm.
6. an exposure device, it is modulated the light sent from light supply apparatus by spatial optical modulation element, and utilizes the light after this modulation that photosensitive material is exposed, and described spatial optical modulation element is arranged with the multiple pixel portions separately carrying out modulating, it is characterized in that
This exposure device employs the light supply apparatus described in any one in claim 1 to 5.
7. exposure device according to claim 6, wherein,
Described exposure device has microlens array, and described microlens array is arranged with multiple lenticule, and described multiple lenticule is separately assembled by the multiple light shafts after described multiple pixel portions modulation.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-158267 | 2014-08-02 | ||
| JP2014158267A JP6480680B2 (en) | 2014-08-02 | 2014-08-02 | Illuminance ratio changing method and exposure method |
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| Publication Number | Publication Date |
|---|---|
| CN105319862A true CN105319862A (en) | 2016-02-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510319338.8A Pending CN105319862A (en) | 2014-08-02 | 2015-06-11 | Light source device and exposure device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6480680B2 (en) |
| KR (1) | KR102407563B1 (en) |
| CN (1) | CN105319862A (en) |
| TW (1) | TWI650613B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106019856A (en) * | 2016-07-22 | 2016-10-12 | 合肥芯碁微电子装备有限公司 | Multi-wavelength ultraviolet semiconductor laser for laser direct-writing exposure machine |
| CN110719702A (en) * | 2019-10-18 | 2020-01-21 | 中山新诺科技股份有限公司 | Dual-wavelength welding-proof equipment |
| CN111758062A (en) * | 2018-03-27 | 2020-10-09 | 株式会社住田光学玻璃 | Optical fiber bundle, endoscope body for endoscope, and endoscope |
| CN112368646A (en) * | 2018-07-10 | 2021-02-12 | 应用材料公司 | Dynamic imaging system |
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| TWI771623B (en) * | 2018-11-08 | 2022-07-21 | 日商佳能股份有限公司 | Imprint apparatus and product manufacturing method |
| JP7289633B2 (en) * | 2018-11-08 | 2023-06-12 | キヤノン株式会社 | Imprint apparatus and article manufacturing method |
| CN109799617A (en) * | 2019-03-08 | 2019-05-24 | 北京镭创高科光电科技有限公司 | The even light shaping optical path of multi-wavelength and optical projection system |
| CN113131329A (en) * | 2019-12-31 | 2021-07-16 | 苏州源卓光电科技有限公司 | Multi-wavelength laser |
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| JP4458229B2 (en) * | 2002-08-30 | 2010-04-28 | 日亜化学工業株式会社 | Semiconductor laser light source device for exposure |
| JP4401308B2 (en) * | 2004-03-29 | 2010-01-20 | 富士フイルム株式会社 | Exposure equipment |
| JP4852250B2 (en) * | 2005-02-10 | 2012-01-11 | 千代田工販株式会社 | Spatial illuminance measuring apparatus and spatial illuminance calibration method |
| JP4410134B2 (en) | 2005-03-24 | 2010-02-03 | 日立ビアメカニクス株式会社 | Pattern exposure method and apparatus |
| JP2008256765A (en) * | 2007-04-02 | 2008-10-23 | Fujifilm Corp | Fiber bundle and light source device |
| JP4974826B2 (en) * | 2007-09-27 | 2012-07-11 | 富士フイルム株式会社 | Image recording method and image recording system |
| JP5270891B2 (en) * | 2007-09-28 | 2013-08-21 | 富士フイルム株式会社 | Image recording method and image recording system |
| JP5687013B2 (en) * | 2010-09-14 | 2015-03-18 | 株式会社Ｓｃｒｅｅｎホールディングス | Exposure apparatus and light source apparatus |
| EP2715453A1 (en) * | 2011-06-01 | 2014-04-09 | Eulitha A.G. | Printing periodic patterns using multiple lasers |
| JP2013077732A (en) * | 2011-09-30 | 2013-04-25 | Panasonic Corp | Ultraviolet light irradiation device |
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2014
- 2014-08-02 JP JP2014158267A patent/JP6480680B2/en active Active
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2015
- 2015-05-28 TW TW104117119A patent/TWI650613B/en active
- 2015-06-02 KR KR1020150077850A patent/KR102407563B1/en active IP Right Grant
- 2015-06-11 CN CN201510319338.8A patent/CN105319862A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106019856A (en) * | 2016-07-22 | 2016-10-12 | 合肥芯碁微电子装备有限公司 | Multi-wavelength ultraviolet semiconductor laser for laser direct-writing exposure machine |
| CN111758062A (en) * | 2018-03-27 | 2020-10-09 | 株式会社住田光学玻璃 | Optical fiber bundle, endoscope body for endoscope, and endoscope |
| CN111758062B (en) * | 2018-03-27 | 2022-05-31 | 株式会社住田光学玻璃 | Optical fiber bundle, endoscope body for endoscope, and endoscope |
| CN112368646A (en) * | 2018-07-10 | 2021-02-12 | 应用材料公司 | Dynamic imaging system |
| CN112368646B (en) * | 2018-07-10 | 2024-06-04 | 应用材料公司 | Dynamic imaging system |
| CN110719702A (en) * | 2019-10-18 | 2020-01-21 | 中山新诺科技股份有限公司 | Dual-wavelength welding-proof equipment |
| CN110719702B (en) * | 2019-10-18 | 2022-01-25 | 中山新诺科技股份有限公司 | Dual-wavelength welding-proof equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI650613B (en) | 2019-02-11 |
| KR20160016571A (en) | 2016-02-15 |
| KR102407563B1 (en) | 2022-06-10 |
| JP2016035509A (en) | 2016-03-17 |
| JP6480680B2 (en) | 2019-03-13 |
| TW201610597A (en) | 2016-03-16 |
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Application publication date: 20160210 |