JP7289633B2 - Imprint apparatus and article manufacturing method - Google Patents

Description

The present invention relates to an imprint apparatus and an article manufacturing method.

As a method for manufacturing articles such as semiconductor devices and MEMS, the imprint material is molded by bringing the imprint material on the substrate into contact with the mold and curing the imprint material while the mold is in contact. method is known.

In Patent Document 1, a resist is dropped on a pattern formation region of a substrate, a template is pressed against the resist, a light irradiation region including the boundary between the pattern formation region and the region outside the pattern formation region is irradiated with light, and then a pattern is formed. An imprinting apparatus that irradiates a formation region with light is described. By irradiating the light-irradiated region with light, the resist on the light-irradiated region is cured to prevent the resist from entering the pattern formation region. Patent Document 2 describes an imprint apparatus that includes a heating mechanism that deforms a pattern region of a substrate by heating, and a shape correction mechanism that deforms the pattern region of a mold. It also describes the use of a digital mirror device as a means of shaping the heating distribution.

JP 2013-069918 A JP 2013-102132 A

In the imprint apparatus, various devices can be arranged above the mechanism that holds and drives the mold. For example, a curing section for curing the imprint material on the substrate, a deformation section for deforming the substrate by irradiating the substrate with light and heating it, and a detection for detecting the relative position between the substrate and the mold. Devices such as systems can be deployed. The area in which these devices are arranged is limited, and it has been very difficult to arrange various devices. Moreover, the arrangement of various devices may increase the size of the apparatus.

An object of the present invention is to provide an advantageous technique for simplifying the structure of an imprint apparatus.

An imprinting apparatus of the present invention is an imprinting apparatus that performs an imprinting process of curing an imprinting material supplied onto a substrate in a state in which the imprinting material and the mold are in contact with each other. a first optical system for guiding a first light from a first light source and a second light having a wavelength different from that of the first light from a second light source to the modulator; a second optical system that guides modulated light modulated by the modulator to the substrate, and guides the first modulated light obtained by modulating the first light by the modulator to the substrate so that the mold and the substrate The substrate is deformed for alignment of the second light, and the second modulated light obtained by modulating the second light by the modulator is guided to the substrate, thereby increasing the viscosity of the imprint material supplied onto the substrate. and the substrate is irradiated with the first modulated light and the second modulated light at different timings, and when switching between the first modulated light and the second modulated light, the substrate is irradiated with the first modulated light. and the second modulated light is controlled so that there is a period during which neither the first light source nor the second light source is irradiated, and the light from one of the first light source and the second light source is controlled to enter the modulator, The lighting state of the first light source and the lighting state of the second light source are switched while the modulator is controlled so that the modulated light modulated by the modulator does not reach the substrate. It is characterized by being controlled as follows .

ADVANTAGE OF THE INVENTION According to this invention, an advantageous technique can be provided in order to simplify the structure of an imprint apparatus.

1 is a diagram showing the configuration of an imprint apparatus according to one embodiment of the present invention; FIG. It is a figure which shows the structural example of a light source unit. 4A and 4B are diagrams showing a first operation example (a) and a second operation example (b) of a light source unit in imprint processing executed by an imprint apparatus according to an embodiment of the present invention; FIG. 4 is a diagram showing a temporal change in deformation amount (thermal deformation amount) of a pattern region of a substrate; The figure which illustrates an article manufacturing method. The figure which illustrates an article manufacturing method.

Preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings. In addition, in each figure, the same reference numerals are given to the same members, and redundant explanations are omitted.

(First embodiment)
FIG. 1 shows the configuration of an imprint apparatus 1 according to one embodiment of the present invention. The imprint apparatus 1 performs an imprint process, thereby forming a pattern of the cured imprint material IM on the substrate S. FIG. The imprinting process includes a contact step of contacting the imprint material IM on the substrate S with the mold M, an alignment step of aligning the substrate S and the mold M after the contacting step, and an imprinting step after the alignment step. and a curing step for curing the printing material IM.

A curable composition (also referred to as an uncured resin) that cures when energy for curing is applied is used for the imprint material IM. Electromagnetic waves, heat, and the like are used as energy for curing. As the electromagnetic wave, for example, light such as infrared rays, visible rays, and ultraviolet rays having a wavelength selected from a range of 10 nm or more and 1 mm or less is used.

A curable composition is a composition that is cured by irradiation with light or by heating. A photocurable composition that is cured by light irradiation contains at least a polymerizable compound and a photopolymerization initiator, and may contain a non-polymerizable compound or a solvent, if necessary. The non-polymerizable compound is at least one selected from the group consisting of sensitizers, hydrogen donors, internal release agents, surfactants, antioxidants, polymer components and the like.

The imprint material may be applied to the substrate in the form of a film by a spin coater or a slit coater. Alternatively, the imprint material may be applied onto the substrate in the form of droplets, or in the form of islands or films formed by connecting a plurality of droplets, by the liquid jet head. The viscosity of the imprint material (viscosity at 25° C.) is, for example, 1 mPa·s or more and 100 mPa·s or less.

As the material of the substrate, for example, glass, ceramics, metal, semiconductor, resin, or the like can be used. If necessary, a member made of a material different from that of the substrate may be provided on the surface of the substrate. The substrate is, for example, a silicon wafer, a compound semiconductor wafer, quartz glass.

In this specification and the accompanying drawings, directions are shown in an XYZ coordinate system in which a direction parallel to the surface of the substrate S is the XY plane. The directions parallel to the X, Y, and Z axes in the XYZ coordinate system are defined as the X, Y, and Z directions, respectively, and rotation about the X axis, Y axis, and Z axis are θX and θY, respectively. , θZ. Controlling or driving with respect to the X-axis, Y-axis, and Z-axis means controlling or driving with respect to directions parallel to the X-axis, directions parallel to the Y-axis, and directions parallel to the Z-axis, respectively. In addition, the control or driving of the θX-axis, θY-axis, and θZ-axis relates to rotation about an axis parallel to the X-axis, rotation about an axis parallel to the Y-axis, and rotation about an axis parallel to the Z-axis, respectively. means to control or drive. The position is information that can be specified based on the coordinates of the X, Y, and Z axes, and the orientation is information that can be specified by the values of the θX, θY, and θZ axes. Aligning the substrate or regions thereof with the mold M or regions thereof may include controlling the position and/or orientation of at least one of the substrate S and the mold M. Alignment may also include controls to correct or change the shape of at least one of substrate S and mold M. FIG.

The imprint apparatus 1 can include a substrate driving mechanism SD that holds and drives the substrate S, a base frame BF that supports the substrate driving mechanism SD, and a mold driving mechanism MD that holds and drives the mold M. The substrate driving mechanism SD and the mold driving mechanism MD constitute a driving mechanism DRV that drives at least one of the substrate driving mechanism SD and the mold driving mechanism MD so that the relative position between the substrate S and the mold M is adjusted. The adjustment of the relative position by the drive mechanism DRV drives the contact of the mold M with the imprint material IM on the substrate S and the separation of the mold M from the cured imprint material IM (cured pattern). include.

In the imprinting method of this embodiment, the imprinting material is supplied onto the substrate S, and the supplied imprinting material is brought into contact with the mold (imprinting). Then, after the imprint material is cured while the imprint material and the mold are in contact with each other, the mold is separated from the cured imprint material (mold release), thereby forming a pattern of the imprint material on the substrate. . In the imprinting apparatus of the present embodiment, after the imprinting material on the substrate and the mold are brought into contact with each other, the depressions of the concave-convex pattern formed on the mold are sufficiently filled with the imprinting material, and then the imprinting material is irradiated with ultraviolet rays. harden the imprint material. In this manner, the imprinting apparatus brings the imprinting material supplied onto the substrate into contact with the mold and applies energy for curing to the imprinting material, thereby forming a pattern of a hardened product to which the uneven pattern of the mold is transferred. It is a device that

The substrate drive mechanism SD can include a substrate holder SH that holds the substrate S, a substrate stage SS that supports the substrate holder SH, and a substrate drive actuator SM that drives the substrate S by driving the substrate stage SS. The substrate driving mechanism SD moves the substrate S along a plurality of axes (for example, X-axis, Y-axis, and θZ-axis, preferably X-axis, Y-axis, Z-axis, θX-axis, θY-axis, and θZ-axis). ). The position and orientation of the substrate S can be controlled by measuring the position and orientation of the substrate S with the measuring device 29 and based on the measurement results.

The mold driving mechanism MD can include a mold holding part MH that holds the mold M, and a mold driving actuator MM that drives the mold M by driving the mold holding part MH. The mold holder MH can include a mold deformation mechanism that deforms the mold M. As shown in FIG. The mold deformation mechanism can deform the mold M by applying force to the side surface of the mold M, for example. The mold drive mechanism MD moves the mold M along a plurality of axes (for example, three axes of Z-axis, θX-axis, and θY-axis, preferably six axes of X-axis, Y-axis, Z-axis, θX-axis, θY-axis, and θZ-axis). ). The mold M has a pattern area formed with a pattern to be transferred to the imprint material IM on the substrate S by imprint processing. The mold driving mechanism MD deforms (the pattern region PR of) the mold M into a convex shape toward the substrate S by adjusting the pressure in the space SP on the back side of the mold M (opposite side of the pattern region PR). , flattening pressure regulator PC. With the mold M deformed into a convex shape toward the substrate S, the imprint material IM on the substrate S starts to come into contact with the pattern region PR, and then the imprint material IM comes into contact with the pattern region PR. A pressure regulator PC can regulate the pressure in the space SP so that the area gradually expands.

The imprint apparatus 1 can include a dispenser 5 (supply unit) that supplies, applies, or places the imprint material IM on the substrate S. As shown in FIG. However, the imprint material IM may be supplied, applied or placed on the substrate S in a device external to the imprint apparatus 1 .

In the curing step, the imprint apparatus 1 uses light 9 (curing A light source 2 (curing light source) may be provided for irradiating the light path LP with light). An optical path LP is an optical path leading to the substrate S via the mold M and the imprint material IM. The imprint apparatus 1 can further include a detector 12 that detects the relative positions of the alignment marks provided on the substrate S and the alignment marks provided on the mold M. FIG. The detector 12 can illuminate the alignment marks provided on the substrate S and the alignment marks provided on the mold M with the detection light 15 and pick up an image formed by these alignment marks. The detection light 15 is also understood as light that illuminates the optical path LP. Detector 12 may detect light from the alignment marks.

The mold M is a mold for molding the imprint material on the substrate S. As shown in FIG. A template may also be referred to as a template or master. The mold M has a rectangular outer shape, and has a pattern surface (first surface) 11a on which a pattern (concavo-convex pattern) to be transferred to the substrate S (imprint material thereon) is formed. The mold M can be made of a material that transmits ultraviolet rays (curing light) for curing the imprint material on the substrate S, such as quartz. Also, in the pattern region PR of the mold M, a mold-side mark that functions as an alignment mark is formed.

The imprint apparatus 1 further determines the contact state between the imprint material IM on the substrate S and the mold M (the pattern region PR thereof), or the space between the substrate S and the mold M (the pattern region PR thereof). An imaging unit 6 may be provided for detecting the filling state of the imprint material IM into the container. The imaging unit 6 can also be used to detect foreign matter between the substrate S and the mold M. The imaging unit 6 can illuminate the laminated structure composed of the substrate S, the imprint material IM, and the mold M with the observation light 18 and pick up an image formed by this laminated structure. Observation light 18 is also understood as light illuminating the optical path LP.

The imprint apparatus 1 can further include a light source unit 20 that irradiates the modulated light 21 onto the optical path LP. As will be described later, the light source unit 20 includes a spatial light modulator, and irradiates the optical path LP with modulated light 21 obtained by modulating incident light by this spatial light modulator. The modulated light 21 includes a first modulated light that deforms the substrate S for alignment between the substrate S (shot region) and the mold M (pattern region PR) and a second modulated light that partially cures the imprint material IM. can contain When the optical path LP is irradiated with the first modulated light, the optical path LP is not irradiated with the second modulated light, and when the optical path LP is irradiated with the second modulated light, the optical path LP is not irradiated with the first modulated light. is preferred. However, both the first modulated light and the second modulated light may be applied to the optical path LP as long as the period during which the modulated light 21 is applied to the optical path LP is sufficiently short. The first modulated light and the second modulated light are light whose wavelength ranges do not overlap each other. Alternatively, the first modulated light and the second modulated light may be lights having peaks at different wavelengths. Alternatively, the first modulated light and the second modulated light may be lights having different intensities.

The first modulated light is light modulated such that the substrate S, more specifically, the light intensity distribution (illuminance distribution) that deforms the pattern formation region (shot region) of the substrate S into a target shape is formed on the substrate S. sell. By irradiating the substrate S with the first modulated light, a temperature distribution is formed on the substrate S, and this temperature distribution deforms the pattern formation region of the substrate S into a target shape. When the pattern formation region of the substrate S is deformed into the target shape and the alignment between the pattern formation region of the substrate S and the pattern region PR of the mold M is completed, the curing step (curing light is irradiated onto the imprint material IM by the curing light source 2). and hardening the imprint material IM) is performed. The first modulated light is light having a wavelength that does not cure the imprint material IM.

The second modulated light has a wavelength that cures the imprint material IM, in other words, a wavelength that increases the viscosity (viscoelasticity) of the imprint material IM. The second modulated light may be, for example, light modulated so as to cure the imprint material IM on the substrate S in the peripheral portion (frame-shaped area) of the pattern formation area of the substrate S. . Such irradiation of the second modulated light, which can be called frame exposure, is performed in the contact step and/or the alignment step, and prevents the imprint material IM from being pushed out of the pattern formation area of the substrate S. is advantageous for A mold M used in an imprint apparatus has a region called a mesa portion, and a pattern region PR is formed in the mesa portion. By executing the frame exposure, it is possible to reduce the adhesion of the imprint material to the side surface of the mesa portion that is convex with respect to the substrate.

The respective optical axes of the curing light source 2, the detector 12, the imaging section 6 and the light source unit 20 share the optical path LP. To achieve this, a synthetic mirror 22 and dichroic mirrors 23 and 24 are provided. Synthetic mirror 22 transmits observation light 18 and reflects modulated light 21 . Dichroic mirror 23 transmits observation light 18 and modulated light 21 and reflects detection light 15 . Dichroic mirror 24 transmits observation light 18 , modulated light 21 and detection light 15 and reflects curing light 9 .

The imprint apparatus 1 further controls the substrate driving mechanism SD, the mold driving mechanism MD, the pressure regulator PC, the dispenser 5, the measuring device 29, the curing light source 2, the detector 12, the imaging section 6, the light source unit 20, and the like. A control unit 7 may be provided. The control unit 7 is, for example, a PLD (abbreviation of Programmable Logic Device) such as FPGA (abbreviation of Field Programmable Gate Array), or ASIC (abbreviation of Application Specific Integrated Circuit), or a general-purpose device in which a program is incorporated. or a dedicated computer, or a combination of all or part of these. The control unit 7 may be provided within the imprint apparatus 1 or may be provided at a location separate from the imprint apparatus 1 and remotely controlled.

(Configuration of light source unit)
FIG. 2 shows a configuration example of the light source unit 20. As shown in FIG. The light source unit 20 includes a first light source 121 for generating first light having a first wavelength band for generating first modulated light, and a second light source 121 for generating second modulated light having a second wavelength band. and a second light source 122 that generates a Further, the light source unit 20 includes a DMD as a spatial light modulator (modulator) that generates first modulated light obtained by modulating the first light (incident light) and second modulated light obtained by modulating the second light (incident light). (digital mirror device) 133 may be included. The light source unit 20 also includes a first optical system (125, 126, 111, 132) that causes the first light from the first light source 121 and the second light from the second light source 122 to enter a DMD 133 as a spatial light modulator. can include

In one example, the light source unit 20 may be configured by connecting the illumination section 120 and the modulation section 130 with the optical fiber 110 . The illumination unit 120 may include a first light source 121 , a second light source 122 , a first controller 123 , a second controller 124 and mirrors 125 and 126 . The optical path of the first light generated by the first light source 121 and the optical path of the second light generated by the second light source 122 are shared by mirrors 125 and 126 and connected to the incident portion 111 of the optical fiber 110 . The exit section 112 of the optical fiber 110 is connected to the modulation section 130 .

The first controller 123 controls the first light source 121 according to instructions from the controller 7 . Control of the first light source 121 can include control of lighting and extinguishing of the first light source 121 . Controlling the first light source 121 may further include controlling the intensity of the first light generated by the first light source 121 . For example, the first controller 123 may include a constant current circuit that supplies the first light source 121 with a current having a current value according to the command value from the controller 7 . Alternatively, the first controller 123 includes a drive circuit that drives the first light source 121 according to a command value, and a photoelectric conversion sensor that receives part of the first light emitted by the first light source 121. It may have a configuration to feed back the output to the drive circuit.

The second controller 124 controls the second light source 122 according to instructions from the controller 7 . Control of the second light source 122 may include control of lighting and extinguishing of the second light source 122 . Controlling the secondary light source 122 may also include controlling the intensity of the secondary light generated by the secondary light source 122 . For example, the second controller 124 may include a constant current circuit that supplies the second light source 122 with a current value according to the command value from the controller 7 . Alternatively, the second controller 124 includes a drive circuit that drives the second light source 122 according to the command value, and a photoelectric conversion sensor that receives part of the second light generated by the second light source 122. It may have a configuration to feed back the output to the drive circuit.

The controller 7 can individually control the first light source 121 and the second light source 122 . For example, the control unit 7 can control the first light source 121 and the second light source 122 so that when one of the first light source 121 and the second light source 122 is turned on, the other is turned off. From another point of view, when one of the first light from the first light source 121 and the second light from the second light source 122 is incident on the spatial light modulator (DMD 133), the first light and the second light are A configuration in which the other is not incident on the spatial light modulator can be adopted. This can be realized, for example, by controlling the first and second light sources 121, 122 by the first and second controllers 123, 124, or by a mechanism for selectively blocking one of the first light and the second light.

(About the wavelength of each light)
Here, an example of assignment of wavelengths to the curing light 9, detection light 15, observation light 18, and modulated light 21 (first modulated light and second modulated light) will be described. The curing light 9 is light that cures the imprint material IM, and in one example can have any wavelength range within the range of 300 nm to 380 nm, but may have a wavelength range of 300 nm or less. The detection light 15 is light for detecting alignment marks, and in one example has a wavelength range of 550 nm to 750 nm. The observation light 18 is light for observing the contact state between the imprint material IM and the mold M, the filling state of the imprint material IM in the space between the substrate S and the mold M, and the like. For the observation light 18, for example, a wavelength range that does not overlap with the wavelength ranges of the curing light 9 and the detection light 15 can be selected from a wavelength range of 400 nm to 480 nm. The modulated light 21 includes first modulated light having a wavelength range that does not cure the imprint material IM and second modulated light having a wavelength range that cures the imprint material IM.

The modulated light 21 may be selected from a wavelength range similar to that of the observation light 18, eg, from a wavelength range of 400 nm to 480 nm so as not to overlap the wavelength ranges of the curing light 9 and the detection light 15. FIG. The first modulated light is generated by modulating the first light generated by the first light source 121 by the modulating section 130 (DMD 133). The second modulated light is generated by modulating the second light generated by the second light source 122 by the modulating section 130 (DMD 133). The wavelength of the first light generated by the first light source 121 and the wavelength of the second light generated by the second light source 122 can be determined from the upper limit of the wavelength range in which the imprint material IM is cured. For example, if the upper limit of the wavelength range for curing the imprint material IM is 440 nm, the wavelength of the first light generated by the first light source 121 is set to approximately 460 nm, and the wavelength of the second light generated by the second light source 122 is set to 410 nm. can be to some extent. The first light source 121 and the second light source 122 are preferably light sources that generate single-wavelength light with a narrow wavelength width, and laser diodes, for example, are suitable. In addition, laser diodes are excellent in that they can be switched on and off at high speed.

The light transmitted to the modulation section 130 via the optical fiber 110 is incident on the DMD 133 as a spatial light modulator via the optical system 132 . Optical system 132 may include, for example, a collection optic and an illumination system (eg, a microlens array) that homogenizes light from the collection optic and illuminates DMD 133 . DMD 133 includes a plurality of micromirrors (not shown) that reflect light and actuators that drive the plurality of micromirrors, respectively. Each actuator controls the corresponding micromirror to an angle of −12 degrees (ON state) or +12 degrees (OFF state) with respect to the arrangement plane of the plurality of micromirrors according to the command from the control unit 7 . The light reflected by the ON-state micromirror forms an image on the substrate S as modulated light through the projection optical system 134 (second optical system) that conjugates the DMD 133 and the substrate S to the optical system. do. The light reflected by the micromirror in the OFF state is reflected in a direction that does not reach the substrate S. The area projected onto the substrate S (maximum irradiation area) when all the micromirrors are turned on is larger than the size of the maximum pattern formation area (shot area) of the substrate S. FIG. Considering that the peripheral portion (frame-shaped area) of the pattern formation area of the substrate S is irradiated with the second modulated light, the maximum irradiation area can be set to be larger than the maximum pattern formation area by 1 mm or more. Instead of DMD 133, other spatial light modulators such as liquid crystal displays (LCDs) may be employed.

The optical system that constitutes the modulation unit 130 is composed of first light (first modulated light) having a wavelength that does not cure the imprint material IM and second light (second modulated light) having a wavelength that cures the imprint material IM. Both must pass through. In general DMD, the maximum light intensity that can be irradiated to the micromirror array decreases at wavelengths of 420 nm or less, and furthermore, the micromirror array can be irradiated at around 400 nm, which is the boundary between ultraviolet light and visible light. The maximum light intensity is extremely reduced to about 1/1000. Therefore, it is desirable to bring the wavelength of the first light source 121 and the wavelength of the second light source 122 closer to the upper limit of the wavelength range in which the imprint material IM is cured by using a laser diode or the like having a short wavelength width.

The control unit 7 can generate control data for controlling ON state and OFF state switching of each micromirror of the DMD 133 based on light intensity distribution (illuminance distribution) data to be formed on the surface of the substrate S, for example. . The light intensity distribution data may include, for example, information about the time to turn each micromirror ON and information about the time to turn each micromirror to the OFF state. The larger the number of micromirrors in the ON state and the longer the ON state, the larger the amount of exposure that can be given to the pattern formation region of the substrate S. FIG.

The controller 7 stores light intensity distribution data for modulating the first light to generate the first modulated light and light intensity distribution data for modulating the second light to generate the second modulated light. may include memory for The light intensity distribution data for modulating the first light to generate the first modulated light can include light intensity distribution data for transforming the substrate Sno pattern formation area (shot area) into a target shape. The light intensity distribution data for modulating the second light to generate the second modulated light is the imprint material IM on the substrate S in the peripheral portion (frame region) of the pattern formation region of the substrate S. It may include light intensity distribution data for curing (increasing viscosity) material IM.

The configuration in which the first light source 121 and the second light source 122 share the modulation section 130 is advantageous for downsizing the modulation section 130 or the light source unit 20 , thereby simplifying the structure of the imprint apparatus 1 . This makes it easier to arrange the modulation section 130 near the optical path LP. The configuration in which the illumination unit 120 and the modulation unit 130 are separated from each other is advantageous in that the illumination unit 120 serving as a heat source is arranged at a position far from the optical path LP of the imprint apparatus 1 . However, the illumination section 120 and the modulation section 130 may be arranged close to each other without using the optical fiber 110 . Alternatively, the illumination section 120 may be incorporated into the modulation section 130 . Alternatively, the first light source 121 and the modulation section 130 may be connected by a first optical fiber, and the second light source 122 and the modulation section 130 may be connected by a second optical fiber. The optical path of the first light and the optical path of the second light from the second optical fiber can be combined.

(Operation of light source unit)
FIG. 3A shows a first operation example of the light source unit 20 in imprint processing executed by the imprint apparatus 1 . In FIG. 3A, “imprint processing” indicates the progress of imprint processing. The imprinting process includes a contact step of contacting the imprint material IM on the substrate S with the mold M, an alignment step of aligning the substrate S and the mold M after the contacting step, and an imprinting step after the alignment step. and a curing step for curing the printing material IM. The contact step is a step of bringing the imprint material IM on the substrate S into contact with (the pattern region PR of) the mold M by the drive mechanism DRV. This contacting step starts, for example, by initiating contact between the imprint material IM on the substrate S and the pattern area PR of the mold M deformed into a convex shape, by flattening the entire area of the pattern area PR. It can be a period that ends. The imprinting process includes, as a process accompanying the contacting process, a driving process in which the imprint material IM on the substrate S and the mold M are brought closer to each other by the driving mechanism DRV. described as "drive".

In the alignment step, at least one of the substrate S and the mold M is driven by the drive mechanism DRV so that the pattern formation region of the substrate S and the pattern region PR of the mold M are aligned based on the results detected by the detector 12. be done. In the alignment step, the mold driving mechanism deforms the mold M so that the pattern formation area (shot area) of the substrate S and the pattern area PR of the mold M are aligned based on the results detected by the detector 12. can be Also, in the alignment step, a deformation step, which will be described later, can be performed so that the pattern formation region of the substrate S and the pattern region PR of the mold M are aligned based on the results detected by the detector 12 .

A filling process proceeds in parallel with the alignment process. In the filling step, the imprint material IM between the substrate S and the pattern region PR of the mold M is filled into the recesses forming the pattern of the pattern region PR, and the imprint material IM between the substrate S and the pattern region PR of the mold M is filled. Existing voids disappear. The alignment and fill steps are described as "fill and align" in FIG. 3(a). In one example, the fill step can begin prior to the alignment step. In addition, in FIG. 3A, the curing process is described as "hardening" and the separating process is described as "separating".

In FIG. 3A , “light modulation by DMD” indicates light modulation by the DMD 133 of the light source unit 20 . “C” is a partial curing step, in which the second modulated light generated by modulating the second light, which is the light in the wavelength range for curing (increasing the viscosity) of the imprint material IM, is irradiated onto the optical path LP. indicates that In the partial curing step C in the first embodiment, the imprint material IM in the aforementioned frame-shaped region is cured (so-called frame exposure). “D” is a deformation step, and indicates that the first modulated light generated by modulating the first light, which is light in a wavelength range that does not cure the imprint material IM, is irradiated onto the optical path LP. In the deformation process D, the pattern formation area of the substrate S is deformed for alignment of the pattern formation area of the substrate S and the pattern formation area PR of the mold M. FIG. "OFF" indicates that neither the first modulated light nor the second modulated light is applied to the optical path PL. During the "OFF" period, the DMD 133 is controlled to switch the light intensity distribution from the first modulated light to the second modulated light.

During the period (timing, length of time) of the partial curing step C in which frame exposure is performed, the imprint material IM in the frame-shaped region is cured to prevent the imprint material IM from being pushed out of the pattern formation region of the substrate S. can be determined to The period (timing, length of time) of the deformation process D is determined so that the pattern formation region of the substrate S becomes the target shape at the time when the imprint material IM is cured by the curing light 9 from the curing light source 2 in the curing process. sell. It is desirable to deform the substrate S at least during the alignment period and complete before the curing process begins.

In the first embodiment, the partial curing step C is performed first, and then the deformation step D is performed. It can be executed repeatedly.

FIG. 3B shows a second operation example of the light source unit 20 in imprint processing executed by the imprint apparatus 1 . The notation method follows the notation method of FIG. 3(a). In the second example shown in FIG. 3(b), the "OFF" period in the example shown in FIG. 3(a) is omitted or shortened. The period of the partial curing process C and the period of the deformation process D cannot overlap. Under one possible constraint, the partial curing step C is not performed in the contacting step. This is because even partial hardening of the imprint material IM in the contact step prevents the imprint material IM from spreading and prevents filling in the subsequent filling step. Under such constraints, when the deformation process D is performed after the partial curing process C, the time required for the alignment process and the filling process, which proceed in parallel, is equal to the period of the partial process C and the period of the deformation process D. cannot be shorter than the total time of

In the partial curing step C, frame exposure is performed as described above. The execution period of the frame exposure is determined so as to prevent the imprint material IM from being pushed out of the pattern formation region of the substrate S (the pattern region of the mold M).

In the partial curing step C, damping exposure is performed as described above. The execution time of damping exposure is determined so that the relative vibration between the substrate S and the mold M is reduced and the convergence of alignment is improved.

FIG. 4 shows temporal changes in the amount of deformation (the amount of thermal deformation) of (the pattern region of) the substrate S in the deformation step D of the first and second operation examples shown in FIGS. is exemplified. A change in the amount of deformation can be represented by a function including an exponential function, for example. By obtaining the time constant of this exponential function in advance, the time of each deformation process D and the start timing of the deformation process D can be determined. Also, the intensity of the first light may be adjusted.

By sharing the modulation unit 130 (DMD 133) for light sources of different wavelengths in this way, a plurality of functions can be arranged in the imprint apparatus without complicating the structure of the apparatus.

(Second embodiment)
In the first embodiment, the case where light for increasing the viscosity of the imprint material in the peripheral portion of the shot region is applied as the second modulated light has been described.

The second modulated light in the second embodiment increases the viscosity of the imprint material IM at any point in the pattern formation region of the substrate S, thereby increasing the bonding force between the substrate S and the mold M by the imprint material IM. It can be light modulated in such a way that Irradiation of the second modulated light in this way can be called damping exposure, and is performed in the alignment process, and can improve alignment accuracy. In a state in which the bonding force between the substrate S and the mold M by the imprint material IM is weak (before irradiation with the second modulated light), the substrate S and the mold M can vibrate independently due to disturbance or the like (that is, the substrate S and the mold M can vibrate separately). There is a large relative vibration between M). By irradiating the imprinting material IM with the second modulated light, the viscosity of the imprinting material IM is partially increased, and the bonding force between the substrate S and the mold M is increased. Vibration can be reduced, and convergence of alignment can be improved. In one example, the viscosity ( viscoelasticity) is effective for improving alignment convergence.

Note that the control unit 7 in the second embodiment includes light intensity distribution data for modulating the first light to generate the first modulated light, and light intensity distribution data for modulating the second light to generate the second modulated light. a memory for storing light intensity distribution data; The light intensity distribution data for modulating the second light to generate the second modulated light is obtained through the imprint material IM by increasing the viscosity of the imprint material IM at an arbitrary portion of the pattern formation region of the substrate S. Light intensity distribution data for enhancing the bonding strength between the substrate S and the mold M may be included.

In the partial curing step C in the second embodiment, the viscosity of the imprint material IM is increased at an arbitrary portion of the pattern formation region of the substrate S (so-called damping exposure).

During the period (timing, length of time) of the partial curing step C in which the damping exposure is performed, the viscosity of the imprint material IM is partially increased to increase the bonding force between the substrate S and the mold M. It can be determined to reduce the relative vibration between mold M.

In this way, by sharing the modulation unit 130 (DMD 133) for light sources of different wavelengths, the mechanism for deforming the substrate and the viscosity of the imprint material are increased (vibration damping) without complicating the structure of the device. exposure) mechanism can be arranged.

(Third embodiment)
In the first embodiment, as the first modulated light, light modulated such that the light intensity distribution (illuminance distribution) that transforms the pattern formation region (shot region) of the substrate S into a target shape is formed on the substrate S is irradiated. explained the case of

The first modulated light in the third embodiment increases the viscosity of the imprint material IM at any point in the pattern formation region of the substrate S, thereby increasing the bonding force between the substrate S and the mold M by the imprint material IM. It can be light modulated in such a way that Irradiation of the first modulated light in this way can be called damping exposure, and is performed in the alignment process, and can improve alignment accuracy. In a state in which the bonding force between the substrate S and the mold M by the imprint material IM is weak (before irradiation with the first modulated light), the substrate S and the mold M can vibrate independently due to disturbance or the like (that is, the substrate S and the mold M can vibrate separately). There is a large relative vibration between M). By irradiating the imprinting material IM with the first modulated light, the viscosity of the imprinting material IM is partially increased, and the bonding strength between the substrate S and the mold M is increased. Vibration can be reduced, and convergence of alignment can be improved. In one example, the viscosity ( viscoelasticity) is effective for improving alignment convergence.

Note that the control unit 7 in the third embodiment includes light intensity distribution data for modulating the first light to generate the first modulated light, and light intensity distribution data for modulating the second light to generate the second modulated light. a memory for storing light intensity distribution data; The light intensity distribution data for modulating the first light to generate the first modulated light is obtained through the imprint material IM by increasing the viscosity of the imprint material IM at an arbitrary portion of the pattern formation region of the substrate S. Light intensity distribution data for enhancing the bonding strength between the substrate S and the mold M may be included.

In the partial curing step C in the third embodiment, light is applied to increase the viscosity of the imprint material in the periphery of the shot region (so-called frame exposure). On the other hand, in the third embodiment, the shot area is irradiated with light for reducing the relative vibration between the substrate S and the mold M, instead of the deformation step D of the first embodiment.

The period (timing, length of time) of the damping exposure process for performing the damping exposure is such that the bonding strength between the substrate S and the mold M is increased by partially increasing the viscosity of the imprint material IM. It can be determined to reduce the relative vibration between mold M.

In this way, by sharing the modulation unit 130 (DMD 133) for the light sources having different irradiation area distributions on the substrate, the imprint material in the periphery of the shot area can be distributed without complicating the structure of the apparatus. A viscosity enhancing (frame exposure) mechanism can be arranged.

(Fourth embodiment)
In the first embodiment, the case where the substrate is irradiated with light having two different wavelengths or distributions of the first modulated light and the second modulated light has been described. The light source unit 20 in the fourth embodiment may be provided with a mechanism for irradiating the substrate with the third modulated light in addition to the first modulated light and the second modulated light.

For example, the light source unit of FIG. 2 can be provided with a third light source capable of emitting a third light in a third wavelength band. A third light source may be controlled by a third controller. In this case, the first modulated light is light having a light intensity distribution that transforms the shot region into a target shape, the second modulated light is light that increases the viscosity of the imprint material in the periphery of the shot region, and the third modulated light is , to improve alignment convergence.

When the substrate is sequentially irradiated with light from these light sources, both frame exposure and damping exposure can be performed in the partial curing step C of FIG. In the partial curing step C, when both the frame exposure and the damping exposure are performed, typically the frame exposure can precede the damping exposure. This is because damping exposure is preferably performed in the middle of the alignment process and completed just before the curing process.

In this way, by sharing the modulation unit 130 (DMD 133) for light sources of different wavelengths, the mechanism for deforming the substrate and the viscosity of the imprint material are increased (vibration damping) without complicating the structure of the device. exposure) mechanism can be arranged. In addition, the modulation section 130 can be used in common for light sources having different distributions of irradiation regions on the substrate. It is also possible to configure the light source unit 20 by adding a further light source.

(Product manufacturing method)
A pattern of a cured product formed using an imprint apparatus is used permanently on at least a part of various articles, or temporarily used when manufacturing various articles. Articles are electric circuit elements, optical elements, MEMS, recording elements, sensors, molds, or the like. Examples of electric circuit elements include volatile or nonvolatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensors, and FPGA. Examples of optical elements include microlenses, light guides, waveguides, antireflection films, diffraction gratings, polarizing elements, color filters, light emitting elements, displays, and solar cells. Examples of MEMS include DMDs, microchannels, electromechanical transducers, and the like. Recording elements include optical discs such as CDs and DVDs, magnetic discs, magneto-optical discs, and magnetic heads. Examples of sensors include magnetic sensors, optical sensors, gyro sensors, and the like. Examples of the mold include imprint molds and the like.

The pattern of the cured product is used as it is or temporarily used as a resist mask as at least a part of the article. After etching, ion implantation, or the like in the substrate processing step, the resist mask is removed.

Next, an article manufacturing method for forming a pattern on a substrate by an imprint apparatus, processing the substrate on which the pattern is formed, and manufacturing an article from the substrate subjected to the processing will be described. As shown in FIG. 5A, a substrate 1z such as a silicon wafer having a surface to be processed 2z such as an insulator is prepared. A printing material 3z is applied. Here, a state is shown in which a plurality of droplet-like imprint materials 3z are applied onto the substrate.

As shown in FIG. 5(b), the imprint mold 4z is opposed to the imprint material 3z on the substrate with the uneven pattern formed side thereof facing. As shown in FIG. 5C, the substrate 1 provided with the imprint material 3z and the mold 4z are brought into contact with each other and pressure is applied. The imprint material 3z is filled in the gap between the mold 4z and the workpiece 2z. In this state, when light is irradiated through the mold 4z as energy for curing, the imprint material 3z is cured.

As shown in FIG. 5D, after the imprint material 3z is cured, the mold 4z and the substrate 1z are separated to form a pattern of the cured imprint material 3z on the substrate 1z. The pattern of this cured product has a shape in which the concave portions of the mold correspond to the convex portions of the cured product, and the convex portions of the mold correspond to the concave portions of the cured product. It will be done.

As shown in FIG. 5(e), when etching is performed using the pattern of the cured product as an anti-etching mask, portions of the surface of the workpiece 2z where the cured product is absent or remains thinly are removed, forming grooves 5z. Become. As shown in FIG. 5(f), by removing the pattern of the cured product, an article having grooves 5z formed on the surface of the workpiece 2z can be obtained. Although the pattern of the cured product is removed here, it may be used as an interlayer insulating film included in a semiconductor element or the like, that is, as a constituent member of an article, without being removed after processing.

Next, another method for manufacturing the article will be described. As shown in FIG. 6A, a substrate 1y such as quartz glass is prepared, and then an imprint material 3y is applied to the surface of the substrate 1y by an inkjet method or the like. If necessary, a layer of another material such as a metal or a metal compound may be provided on the surface of the substrate 1y.

As shown in FIG. 6(b), the imprint mold 4y is opposed to the imprint material 3y on the substrate with the side on which the uneven pattern is formed. As shown in FIG. 6(c), the substrate 1y to which the imprint material 3y is applied is brought into contact with the mold 4y, and pressure is applied. The imprint material 3y is filled in the gap between the mold 4y and the substrate 1y. When light is irradiated through the mold 4y in this state, the imprint material 3 is cured.

As shown in FIG. 6D, after the imprint material 3y is cured, the mold 4y and the substrate 1y are separated to form a pattern of the cured imprint material 3y on the substrate 1y. An article having a pattern of the cured product as a constituent member is thus obtained. By etching the substrate 1y using the pattern of the cured product as a mask in the state of FIG. can also

Reference Signs List 1 imprint apparatus S substrate 121 first light source 122 second light source 133 DMD
130 Modulator

Claims (11)

An imprinting apparatus that performs an imprinting process of curing an imprinting material supplied onto a substrate while the imprinting material and the mold are in contact with each other,
a modulator that modulates incident light;
a first optical system for guiding a first light from a first light source and a second light having a different wavelength from the first light from a second light source to the modulator;
a second optical system that guides the modulated light modulated by the modulator to the substrate;
The substrate is deformed for alignment between the mold and the substrate by guiding the first modulated light obtained by modulating the first light with the modulator to the substrate,
increasing the viscosity of the imprint material supplied onto the substrate by guiding the second modulated light obtained by modulating the second light with the modulator to the substrate;
the substrate is irradiated with the first modulated light and the second modulated light at different timings;
When switching between the first modulated light and the second modulated light, the substrate is controlled so that there is a period during which neither the first modulated light nor the second modulated light is irradiated,
the first light source and the second light source are controlled so that light from either one enters the modulator ;
The lighting state of the first light source and the lighting state of the second light source are switched while the modulator is controlled so that the modulated light modulated by the modulator does not reach the substrate. An imprinting apparatus characterized by being controlled to : 2. The imprinting apparatus according to claim 1, wherein one of the first light and the second light is selectively incident on the modulator. 3. The method according to claim 1, wherein the viscosity of the imprint material supplied onto the substrate is increased by guiding the second modulated light to the substrate while the alignment is being performed. The imprinting device described. 4. The optical device according to any one of claims 1 to 3, further comprising an optical element that guides the second light from the second light source to the modulator in an optical path between the first light source and the modulator. The imprinting device described. 5. The imprinting apparatus according to claim 4, wherein the optical element is a mirror. The imprinting apparatus according to any one of claims 1 to 5, wherein the intensity of the first light and the intensity of the second light are different from each other. 7. The imprinting apparatus according to any one of claims 1 to 6, wherein the first optical system includes an optical fiber that guides the first light from the first light source to the modulator. the modulator comprises a digital mirror device;
8. Control is performed to generate a period during which neither the first modulated light nor the second modulated light is applied to the substrate by turning off the digital mirror device. The imprint apparatus according to any one of . A curing light source for irradiating light for curing the imprint material,
9. The imprint material is cured by irradiating the imprint material with light for curing the imprint material after the alignment is completed. The imprinting apparatus according to . 10. The imprinting apparatus according to claim 9, further comprising a synthetic mirror that transmits one of the light from the curing light source and the light modulated by the modulator and reflects the other light. forming a pattern on a substrate with the imprint apparatus according to any one of claims 1 to 10;
processing the substrate on which the pattern is formed;
and manufacturing an article from the substrate.

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