CN105312777A - Laser machining apparatus - Google Patents
Laser machining apparatus Download PDFInfo
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- CN105312777A CN105312777A CN201510346103.8A CN201510346103A CN105312777A CN 105312777 A CN105312777 A CN 105312777A CN 201510346103 A CN201510346103 A CN 201510346103A CN 105312777 A CN105312777 A CN 105312777A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
Abstract
The invention provides a laser machining apparatus. The laser machining apparatus comprises: a workpiece retaining unit to retain a workpiece; a laser beam irradiation unit to irradiate a laser beam to the workpiece retained by the workpiece retaining unit; and a processing feed unit which moves the workpiece retaining unit and the laser beam irradiation unit in a processing feed direction relatively. The laser beam irradiation unit comprises: a laser beam oscillation unit to oscillate a laser beam; and a condenser provided with a condensing lens which condenses the laser beam oscillated from the laser beam oscillation unit, and irradiates the laser beam to the workpiece retained on a chuck table. The laser machining apparatus is provided with a condensing lens pollution detection unit which detects the pollution degree of the condensing lens; and an alarm unit which sends out an alarm when the pollution degree, detected by the condensing lens pollution detection unit, of the condensing lens exceeds an allowable value.
Description
Technical field
The present invention relates to the laser processing device machined object of semiconductor wafer etc. being implemented to Laser Processing.
Background technology
In semiconductor devices manufacturing process, marked off multiple region on the surface of the roughly semiconductor wafer of circular plate shape by the segmentation preset lines of the arrangement in clathrate, the region that this marks off is formed the device of IC, LSI etc.And by cutting off semiconductor wafer along segmentation preset lines, thus segmentation is formed with the region of device and produces each semiconductor devices.In addition, also cut off the optical device wafer of the light-emitting component being laminated with the photo detector of photodiode etc. and laser diode etc. etc. along segmentation preset lines on the surface of sapphire substrate, thus be divided into the optical device of each photodiode, laser diode etc., can electrical equipment be widely used in.
As the method splitting the wafer of above-mentioned semiconductor wafer or optical device wafer etc. along segmentation preset lines, propose following method: irradiate laser beam wafer to absorbefacient wavelength along segmentation preset lines, form laser processing groove by irradiated with pulse laser light, make wafer breakage along the segmentation preset lines being formed with laser processing groove.The laser processing device implementing this Laser Processing has the machined object holding unit of maintenance machined object, the machined object being held in this machined object holding unit is carried out to the laser light irradiation unit of Laser Processing and makes the processing feed unit of machined object holding unit and the relative movement in processing direction of feed of laser light irradiation unit.And the laser beam oscillating unit and having that laser light irradiation unit is configured to have oscillating laser light is assembled and to be vibrated the laser beam that concentrator to the collecting objective that the machined object being held in machined object holding unit irradiates by this laser beam oscillating unit.
But, if irradiate laser beam along the segmentation preset lines of the wafer as the silicon of machined object or sapphire etc., then silicon or sapphire etc. can melt, melt bits, i.e. fragment (debris) can disperse and pollute collecting objective, there is the output reduction of laser beam and the problem of processing quality instability that are radiated on machined object.
In addition, if collecting objective is by fragment pollution, then by being absorbed by the collecting objective of fragment pollution, the problem of collecting objective breakage can be there is by the laser beam oscillating unit laser beam that vibrates.
In order to solve the problem, propose a kind of laser processing device, it has absorbing unit, the dust (for example, referring to patent document 1) of the fragment that the absorption of this absorbing unit generates owing to irradiating laser beam from the concentrator of laser light irradiation unit to machined object etc.
Patent document 1 Japanese Unexamined Patent Publication 2007-69249 publication
But, have in the laser light irradiation unit of the absorbing unit of the dust of absorption fragment etc. above-mentioned, be also difficult to the pollution of the collecting objective preventing the dust of fragment etc. from causing.
Therefore, by the dust pollution of fragment etc. during collecting objective, key is can detect the moment of cleaning collecting objective or change the moment of collecting objective.
Summary of the invention
The present invention completes in view of the foregoing, and its main technical task is, provides a kind of laser processing device possessing the function of the pollution level that can detect collecting objective.
In order to solve above-mentioned major technique problem, the invention provides a kind of laser processing device, it has: machined object holding unit, and it keeps machined object; Laser light irradiation unit, it carries out Laser Processing to the machined object be held on this machined object holding unit; And processing feed unit, it makes this machined object holding unit and the relative movement in processing direction of feed of this laser light irradiation unit, and this laser light irradiation unit has: laser beam oscillating unit, its laser beam that vibrates; And concentrator, it has collecting objective, the laser beam that this collecting objective being vibrated by this laser beam oscillating unit is assembled and irradiates the machined object be held on this machined object holding unit, and the feature of this laser processing device is, has:
Collecting objective pollution detection unit, it detects the pollution level of this collecting objective; And alarm unit, its when by this collecting objective pollution detection unit inspection to the pollution level of collecting objective exceed feasible value give the alarm.
Above-mentioned collecting objective pollution detection unit has: output detector, itself and this adjacent arranging of machined object holding unit, detects the output of the laser beam irradiated from this concentrator; And control unit, it judges below output that this output detector the detects value whether as regulation, below the value that the output that this output detector detects is regulation, exports alarm signal to this alarm unit.
In addition, above-mentioned collecting objective pollution detection unit has: inspection laser beam oscillator, its inspection laser beam that vibrates; Direction converting unit, it is disposed of can retreat on the path of this laser beam oscillating unit of the connection of this machined object holding unit and this concentrator between active position and retreating position, under the state being located in active position place, make the inspection laser beam gone out by this inspection laser beam oscillator vibrates to this concentrator conversion direction; Beam splitter, it makes to be gone out by this inspection laser beam oscillator vibrates and the reverberation irradiating the inspection laser beam on this machined object holding unit via this direction converting unit and this concentrator detects on path at reverberation and carries out branch; Photodetector, it detects the intensity being branched off into the reverberation that this reverberation detects on path by this beam splitter; And control unit, it judges that whether the intensity of the reverberation detected by this photodetector is as below the value specified, below the value that the intensity of the reverberation that this photodetector detects is regulation, exports alarm signal to this alarm unit.
Laser processing device of the present invention has the collecting objective pollution detection unit of the pollution level detecting collecting objective and goes out the alarm unit of alarm when the pollution level of the collecting objective by this collecting objective pollution detection unit inspection exceedes feasible value, therefore operator can learn the cleaning of collecting objective or change the moment, can eliminate the output reduction of the laser beam be radiated on machined object and the problem of processing quality instability and the problem of collecting objective collecting objective breakage by fragment pollution.
Accompanying drawing explanation
Fig. 1 is the stereogram of the laser processing device according to the present invention's formation.
Fig. 2 is the structured flowchart of the laser light irradiation unit in laser processing device setting shown in Fig. 1.
Fig. 3 is the structured flowchart of the control unit in laser processing device setting shown in Fig. 1.
Fig. 4 is the structured flowchart of another embodiment representing collecting objective pollution detection unit.
Label declaration
2: stationary base, 3: chuck table mechanism, 36: chuck table, 37: processing feed unit, 38: index feed unit, 4: laser light irradiation assembly, 5: laser light irradiation unit, 51: pulse laser light oscillating unit, 52: export adjustment unit, 53: concentrator, 532: collecting objective, 6: image unit, 7, 7a: collecting objective pollution detection unit, 71: output detector, 72: check and use laser beam oscillator, 73: direction converting unit, 74: reverberation detects path, 75: beam splitter, 76: collector lens, 77: photodetector, 8: control unit, W: machined object, M: speculum.
Detailed description of the invention
Below, the processing method of the wafer that present invention will be described in detail with reference to the accompanying and the preferred embodiment of laser processing device.
Fig. 1 illustrates the stereogram of the laser processing device formed according to the present invention.Laser processing device shown in Fig. 1 has stationary base 2, can be disposed in this stationary base 2 in the mode of upper movement of the processing direction of feed (X-direction) shown in arrow X and the chuck table mechanism 3 of maintenance machined object and to be configured on pedestal 2 and as the laser light irradiation assembly 4 of laser light irradiation unit.
Above-mentioned chuck table mechanism 3 has along the parallel pair of guide rails 31 be disposed in stationary base 2 of X-direction, 31, so that this guide rail 31 can be disposed in the mode of X-direction movement, the 1st slide block 32 on 31, the 2nd slide block 33 on the 1st slide block 32 is disposed in the mode that can go up movement in the index feed direction (Y direction) shown in the arrow Y orthogonal with X-direction, the brace table 35 on the 2nd slide block 33 is supported in by cylinder part 34, and as the chuck table 36 of machined object holding unit.This chuck table 36 has the sucker 361 formed by porous material, the holding surface of the upper surface as sucker 361 relies on not shown absorbing unit remain the semiconductor wafer of the such as toroidal as machined object.Chuck table 36 as constructed as above rotates by means of the not shown pulse motor be disposed in cylinder part 34.In addition, chuck table 36 is equipped with the clamp 362 for stationary ring framework, and this ring-shaped frame is across the machined object of boundary belt supporting semiconductor wafers etc.
Above-mentioned 1st slide block 32 is provided with at its lower surface and chimeric is directed to groove 321,321 for a pair with above-mentioned pair of guide rails 31,31, and its upper surface is provided with the pair of guide rails 322,322 along the parallel formation of Y direction.1st slide block 32 as constructed as above is configured to be embedded in pair of guide rails 31,31 by means of being directed to groove 321,321, thus can move in the X-axis direction along pair of guide rails 31,31.Chuck table mechanism 3 in illustrated embodiment has for making the 1st slide block 32 along the processing feed unit 37 of pair of guide rails 31,31 movement in the X-axis direction.Processing feed unit 37 has the parallel drive source being disposed in external thread rod 371 between above-mentioned pair of guide rails 31 and 31 and the pulse motor 372 etc. for this external thread rod 371 of rotary actuation.One end of external thread rod 371 is supported in the fixing drive tab 373 of above-mentioned stationary base 2 in the mode rotated freely, and the output shaft transmission of its other end and above-mentioned pulse motor 372 links.In addition, external thread rod 371 is screwed together in through internal thread hole, and this through internal thread hole is formed at the projecting not shown internal thread block of the central portion lower surface of the 1st slide block 32.Therefore, rotate and reverse driving by means of pulse motor 372 pairs of external thread rods 371, thus the 1st slide block 32 moves in the X-axis direction along guide rail 31,31.
Above-mentioned 2nd slide block 33 is provided with at its lower surface and chimeric is directed to groove 331,331 for a pair with the pair of guide rails 322 of the upper surface being arranged at above-mentioned 1st slide block 32,322, be directed to groove 331,331 by making this and be embedded in pair of guide rails 322,322, thus be configured to move in the Y-axis direction.Chuck table mechanism 3 in illustrated embodiment has for making the 2nd slide block 33 along the index feed unit 38 of the pair of guide rails 322,322 being arranged at the 1st slide block 32 movement in the Y-axis direction.Index feed unit 38 has and is parallelly disposed in the external thread rod 381 between above-mentioned pair of guide rails 322 and 322 and the drive source for carrying out the pulse motor 382 of rotary actuation etc. to this external thread rod 381.One end of external thread rod 381 is supported in the fixing drive tab 383 of the upper surface of above-mentioned 1st slide block 32 in the mode rotated freely, and the output shaft transmission of its other end and above-mentioned pulse motor 382 links.In addition, external thread rod 381 is screwed together in through internal thread hole, and this through internal thread hole is formed at the projecting not shown internal thread block of the central portion lower surface of the 2nd slide block 33.Therefore, rotate and reverse driving by means of pulse motor 382 pairs of external thread rods 381, thus the 2nd slide block 33 moves in the Y-axis direction along guide rail 322,322.
Above-mentioned laser light irradiation assembly 4 has the support component 41 be disposed in said base 2, supported by this support component 41 and in fact horizontal-extending housing 42, be disposed in this housing 42 laser light irradiation unit 5 and be disposed in the leading section of housing 42 and detect the image unit 6 of machining area to be laser machined.In addition, image unit 6 is in the illustrated embodiment except relying on the common imaging apparatus (CCD) of luminous ray shooting, also be configured to have and ultrared infrared illumination unit is irradiated to machined object, catch the ultrared optical system of being irradiated by this infrared illumination unit and export the imaging apparatus (infrared C CD) etc. corresponding to the ultrared electric signal caught by this optical system, and the picture signal obtained of making a video recording is sent to control unit described later.
Referring to Fig. 2, above-mentioned laser light irradiation unit 5 is described.
Laser light irradiation unit 5 shown in Fig. 2 has pulse laser light oscillating unit 51, adjust by this pulse laser light oscillating unit 51 vibrate the pulse laser light output output adjustment unit 52 and the pulse laser light that be have adjusted output by this output adjustment unit 52 is assembled and the concentrator 53 carried out is irradiated to the machined object W being held in chuck table 36.Pulse laser light oscillating unit 51 is configured to have the pulsed laser light line oscillator 511 be made up of YAG laser oscillator and the repetition rate setup unit 512 being attached to this pulsed laser light line oscillator 511.Export the output that adjustment unit 52 adjusts the pulse laser light LB1 that to be vibrated by pulse laser light oscillating unit 51.Concentrator 53 is configured to have and makes to be vibrated by pulse laser light oscillating unit 51 and by exporting pulse laser light LB1 that adjustment unit 52 have adjusted output to the direction conversion mirror 531 of the holding surface conversion direction of chuck table 36 and the collecting objective 532 assembling the pulse laser light LB1 that be converted direction by this direction conversion mirror 531 and irradiate the machined object W being held in chuck table 36.Concentrator 53 as constructed as above as shown in Figure 1, is installed on the front end of housing 42.
See figures.1.and.2 and go on to say, the brace table 35 forming chuck table mechanism 3 is equipped with output detector 71, this output detector 71 and the adjacent arranging of chuck table 36 as machined object holding unit, and be configured for the collecting objective pollution detection unit 7 of the pollution level detecting above-mentioned collecting objective 532, detect the output of the laser beam irradiated from concentrator 53.The output of the laser beam received is sent to control unit described later by this output detector 71.
Laser processing device in illustrated embodiment has the control unit 8 shown in Fig. 3.Control unit 8 is made up of computer, have according to control program carry out the central processing unit (CPU) 81, storage control program etc. of calculation process read-only storage (ROM) 82, store operation result etc. and read-write random access memory (RAM) 83, input interface 84 and output interface 85.The input interface 84 of control unit 8 is transfused to the detection signal from above-mentioned image unit 6, output detector 71 etc.And, from the output interface 85 of control unit 6, to above-mentioned processing feed unit 37, index feed unit 38, pulse laser light oscillating unit 51, output adjustment unit 52, export control signal as the display unit 80 etc. of alarm unit.
Laser processing device in illustrated embodiment is as above formed, and below illustrates that it acts on.
By exporting adjustment unit 52 and vibrate to the pulse laser light oscillating unit 51 by above-mentioned laser light irradiation unit 5 and pulse laser light LB1 machined object to absorbefacient wavelength (such as wavelength is 355nm) adjusting and exports, and the machined object W be held in chuck table 36 is irradiated via concentrator 53, thus man-hour is being added to machined object W enforcement abrasion, fragment can disperse and pollute collecting objective 532.In addition, by export adjustment unit 52 to vibrated by pulse laser light oscillating unit 51 and have machined object the wavelength (such as wavelength is 1064nm) of permeability pulse laser light LB1 adjust export, and via concentrator 53 concentrator is positioned the inside of the machined object W kept in chuck table 36 and irradiated with pulse laser light, thus adding man-hour in the inside implementing to be formed in the inside of machined object W upgrading layer, trickle dust also can disperse and pollute collecting objective 532.When the pollution level of this collecting objective 532 has exceeded feasible value, the output being radiated at the pulse laser light LB1 on machined object W as mentioned above can reduce, and there is the problem of processing quality instability.In addition, by being absorbed by the collecting objective 532 of fragment pollution, the problem of collecting objective 532 breakage can be there is by the pulse laser light oscillating unit 51 pulse laser light LB1 that vibrates.Therefore, key is the pollution level of periodic detection collecting objective 532, the pollution level of the collecting objective 532 that prior confirmation is current.
Below, the step of the pollution level detecting collecting objective 532 is described.
First, control unit 8 makes processing feed unit 37 and index feed unit 38 carry out work, is positioned immediately below collecting objective 532 by the output detector 71 that the brace table 35 forming chuck table mechanism 3 arranges.Then, control unit 8 makes pulse laser light oscillating unit 51 carry out work and the pulse laser light LB1 that vibrates, and control to export adjustment unit 52, by the output example of the pulse laser light LB1 that vibrated by pulse laser light oscillating unit 51 as being adjusted to 2W.Its result, the pulse laser light LB1 being adjusted to 2W is radiated on output detector 71 via the collecting objective 532 of concentrator 53.The signal of the output corresponding to received pulse laser light LB1 is sent to control unit 8 by the output detector 71 of as above illuminated pulse laser light LB1.
Control unit 8 judges whether the signal (A) corresponding with the output of the pulse laser light sent from output detector 71 has exceeded the feasible value (10% of such as set output) of the pollution level of collecting objective 532.In the illustrated embodiment, be 2W from the output of the pulse laser light of output detector 7 transmission, thus the feasible value of pollution level is 0.2W.Therefore, control unit 8 more than the value (2W-0.2W=1.8W) that the signal (A) corresponding with the output of the pulse laser light detected by output detector 71 obtains after deduct the 0.2W as feasible value from set output (2W) time (A≤1.8W), can use in the feasible value (0.2W) being judged to be the pollution level at collecting objective 532.And result of determination and signal (A) value corresponding with the output of the pulse laser light LB1 detected by output detector 71 are shown in as on the display unit 80 of alarm unit by control unit 8 together.
On the other hand, value (the 2W-0.2W=1.8W obtained after the 0.2W that the signal (A) corresponding with the output of the pulse laser light LB1 detected by output detector 71 deficiency deducts as feasible value from set output (2W), A < 1.W) when, control unit 8 is judged to be the feasible value (0.2W) of the pollution level having exceeded collecting objective 532, result of determination and signal (A) value corresponding with the output of the pulse laser light LB1 detected by output detector 71 are shown in together as on the display unit 80 of alarm unit.Operator, according to being as above shown in as the result of determination on the display unit 80 of alarm unit and signal (A) value corresponding with the output of the pulse laser light LB1 detected by output detector 71, considers cleaning or the replacing of collecting objective 532.In addition, when being judged to be feasible value (0.2W) of the pollution level having exceeded collecting objective 532, alarm buzzer or warning light can being started and give the alarm.
Then, another embodiment of the collecting objective pollution detection unit of the pollution level for detecting collecting objective 532 is described with reference to Fig. 4.
The collecting objective pollution detection unit 7a of the pollution level for detecting collecting objective 532 shown in Fig. 4 is disposed in above-mentioned laser light irradiation unit 5.That is, the collecting objective pollution detection unit 7a shown in Fig. 4 has: inspection laser beam oscillator 72, its inspection laser beam LB2 that vibrates; Direction converting unit 73, its path between the direction conversion mirror 531 of concentrator 53 forming laser light irradiation unit 5 and collecting objective 532 is disposed of and can the active position shown in double dot dash line and enterprising the advancing of the retreating position shown in solid line moves back, and be located under the state on active position, making to vibrate the inspection laser beam that towards collecting objective 532 conversion direction by inspection laser beam oscillator 72; Beam splitter 75, it makes to be vibrated by inspection laser beam oscillator 72 and the reverberation be radiated at via direction converting unit 73 and collecting objective 532 as the inspection laser beam LB2 in the chuck table 36 of machined object illumination unit carries out branch on reverberation detection path 74; Be disposed in the collector lens 76 on reverberation detection path 74; And photodetector 77, it detects and on reverberation detection path 74, carries out branch and the luminous intensity of the reverberation assembled by collector lens 76 by this beam splitter 75.
Above-mentioned inspection laser beam oscillator 72 output example such as wavelength is 632nm and exports to be the He-Ne laser of 2mW or output example as wavelength is 830nm and exports to be the SLD laser of 3mW.Above-mentioned direction converting unit 73 be configured to have direction conversion mirror 731 and by this direction conversion mirror 731 with the actuator 732 of the mode movement that can active position in the diagram shown in double dot dash line and the retreating position shown in solid line be retreated.Namely, the actuator 732 of direction converting unit 73 is when relying on above-mentioned laser light irradiation unit 5 to implement laser processing operation, direction conversion mirror 731 is positioned on the retreating position shown in solid line, and when detecting the pollution level of collecting objective 532, direction conversion mirror 731 is positioned on the active position shown in double dot dash line.Above-mentioned beam splitter 75 makes to be passed through towards direction conversion mirror 731 by the inspection laser beam oscillator 72 inspection laser beam LB2 that vibrates, and the reverberation being radiated at the inspection laser beam LB2 in chuck table 36 detects path 74 towards reverberation and carries out branch.Above-mentioned collector lens 76 is assembled and on reverberation detection path 74, is carried out branch and the light of reflection by beam splitter 75, and is guided to photodetector 77.Photodetector 77 receives and is directed to the reverberation that reverberation detects path 74, and the signal (voltage signal) corresponding to the luminous intensity of received reverberation is exported to control unit.In addition, as control unit, use the control unit 8 shown in above-mentioned Fig. 3 in the present embodiment, the output signal from photodetector 77 is imported into input interface 84 as shown in Figure 3.
Collecting objective pollution detection unit 7a shown in Fig. 4 is as above formed, and the step of the pollution level detecting collecting objective 532 is below described.
First, control unit 8 makes processing feed unit 37 and index feed unit 38 carry out work, the chuck table 36 forming chuck table mechanism 3 is positioned immediately below collecting objective 532.In addition, preferably on the sucker 361 of chuck table 36, mirror M is placed.Then, control unit 8 makes the actuator 732 of branch units 73 carry out work, is positioned on the active position shown in double dot dash line by direction conversion mirror 731.And control unit 8 makes inspection laser beam oscillator 72 carry out work, vibrate inspection laser beam LB2.Vibrate the inspection laser beam LB2 that via the direction conversion mirror 731 of beam splitter 75, direction converting unit 73, the collecting objective 532 of concentrator 53 and be radiated at the mirror M be held in chuck table 36 by inspection laser beam oscillator 72.The inspection laser beam LB2 be radiated in mirror M is reflected by mirror M, this reverberation is directed to reverberation and detects path 74 via collecting objective 532, direction conversion mirror 731, beam splitter 75, and assembled by collector lens 76 and received by photodetector 77.
As above, the photodetector 77 that have received the reverberation of the inspection laser beam LB2 reflected by mirror M by correspond to the voltage signal (B) of the luminous intensity of reverberation that receives send to control unit 8.Control unit 8 judges whether the voltage signal (B) sent from photodetector 77 has exceeded the feasible value of the pollution level of collecting objective 532.In addition, the feasible value of the pollution level of collecting objective 532 is set to 10% of the unpolluted state of collecting objective 532.Namely, the inspection laser beam LB2 that the direction conversion mirror 731 via beam splitter 75, branch units 73 that vibrated by inspection laser beam oscillator 72, unpolluted collecting objective 532 and be radiated at the mirror M be held in chuck table 36 time reverberation received by photodetector 77 time luminous intensity corresponding to voltage signal (B) such as 1V time, the feasible value of the pollution level of collecting objective 532 is set to 0.1V.Therefore, control unit 8 more than the value (1V-0.1V=0.9V) that the voltage signal (B) that the intensity of the reverberation with the inspection laser beam LB2 detected by photodetector 77 is corresponding obtains after deduct the 0.1V as feasible value from the voltage (1V) corresponding with the luminous intensity under the state of unpolluted collecting objective 532 time (B≤0.9V), can use in the feasible value (0.1V) being judged to be the pollution level being in collecting objective 532.And result of determination and voltage signal (B) value corresponding with the intensity of the reverberation of the inspection laser beam LB2 detected by photodetector 77 are shown in as on the display unit 80 of alarm unit by control unit 8 together.
On the other hand, if the value (1V-0.1V=0.9V that the voltage signal (B) corresponding with the intensity of the reverberation of the inspection laser beam LB2 detected by photodetector 77 obtains after being less than the 0.1V deducted from the voltage (1V) corresponding with the luminous intensity the state of unpolluted collecting objective 532 as feasible value, B < 0.9V) time, be judged to be the feasible value (0.1V) of the pollution level having exceeded collecting objective 532, result of determination and voltage signal (B) value corresponding with the intensity of the reverberation of the inspection laser beam LB2 detected by photodetector 77 are shown in together as on the display unit 80 of alarm unit.Operator, according to being as above shown in as the result of determination on the display unit 80 of alarm unit and voltage signal (B) value corresponding with the intensity of the reverberation of the inspection laser beam LB2 detected by photodetector 77, considers cleaning or the replacing of collecting objective 532.In addition, when being judged to be the feasible value of the pollution level having exceeded collecting objective 532, alarm buzzer or warning light can being started and give the alarm.
Claims (3)
1. a laser processing device, it has: machined object holding unit, and it keeps machined object; Laser light irradiation unit, it carries out Laser Processing to the machined object be held on this machined object holding unit; And processing feed unit, it makes this machined object holding unit and the relative movement in processing direction of feed of this laser light irradiation unit, and this laser light irradiation unit has: laser beam oscillating unit, its laser beam that vibrates; And concentrator, it has collecting objective, the laser beam that this collecting objective being vibrated by this laser beam oscillating unit is assembled and irradiates the machined object be held on this machined object holding unit, and the feature of this laser processing device is, has:
Collecting objective pollution detection unit, it detects the pollution level of this collecting objective; And
Alarm unit, its when by this collecting objective pollution detection unit inspection to the pollution level of collecting objective exceed feasible value give the alarm.
2. laser processing device according to claim 1, wherein,
This collecting objective pollution detection unit has:
Output detector, itself and this adjacent arranging of machined object holding unit, detects the output of the laser beam irradiated from this concentrator; And
Control unit, it judges below output that this output detector the detects value whether as regulation, below the value that the output that this output detector detects is regulation, exports alarm signal to this alarm unit.
3. laser processing device according to claim 1, wherein,
This collecting objective pollution detection unit has:
Check and use laser beam oscillator, its inspection laser beam that vibrates;
Direction converting unit, it is disposed of can retreat on the path of this laser beam oscillating unit of the connection of this machined object holding unit and this concentrator between active position and retreating position, under the state being located in active position place, make the inspection laser beam gone out by this inspection laser beam oscillator vibrates to this concentrator conversion direction;
Beam splitter, it makes to be gone out by this inspection laser beam oscillator vibrates and the reverberation irradiating the inspection laser beam on this machined object holding unit via this direction converting unit and this concentrator is branched off into reverberation detects path;
Photodetector, it detects the intensity being branched off into the reverberation that this reverberation detects on path by this beam splitter; And
Control unit, it judges that whether the intensity of the reverberation that this photodetector detects is as below the value specified, below the value that the intensity of the reverberation that this photodetector detects is regulation, exports alarm signal to this alarm unit.
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| JP2014-134023 | 2014-06-30 | ||
| JP2014134023A JP2016010809A (en) | 2014-06-30 | 2014-06-30 | Laser processing device |
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| KR (1) | KR20160002353A (en) |
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Also Published As
| Publication number | Publication date |
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| KR20160002353A (en) | 2016-01-07 |
| JP2016010809A (en) | 2016-01-21 |
| TW201603928A (en) | 2016-02-01 |
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