JPS60234788A - Method for adjusting optical axis of laser - Google Patents

Method for adjusting optical axis of laser

Info

Publication number
JPS60234788A
JPS60234788A JP59089293A JP8929384A JPS60234788A JP S60234788 A JPS60234788 A JP S60234788A JP 59089293 A JP59089293 A JP 59089293A JP 8929384 A JP8929384 A JP 8929384A JP S60234788 A JPS60234788 A JP S60234788A
Authority
JP
Japan
Prior art keywords
mirror
laser
optical axis
laser light
pinhole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP59089293A
Other languages
Japanese (ja)
Inventor
Masahiro Suzuki
正弘 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Amada Co Ltd
Original Assignee
Amada Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Amada Co Ltd filed Critical Amada Co Ltd
Priority to JP59089293A priority Critical patent/JPS60234788A/en
Publication of JPS60234788A publication Critical patent/JPS60234788A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/035Aligning the laser beam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042Automatically aligning the laser beam

Abstract

PURPOSE:To adjust easily and exactly the optical axis of a laser by making incident the laser light on the 2nd mirror in parallel with a material to be machined through the pinhole of the 1st mirror provided on the laser light exit side of a condenser lens and reflecting the laser light by said mirror. CONSTITUTION:An optical axis adjuster 27 provided with the 1st mirror having a pinhole 21 is proximity to the laser light exit side of the condenser lens 13 and the 2nd mirror 25 imposed on a working table 19 in parallel with the 1st mirror is disposed to a laser beam machine which executes laser machining on the table 19 by conducting horizontally the laser light LB oscillated from a CO2 laser oscillator 3, refracting perpendicularly the laser light by the bent mirror 11 and forming further the focus by the condenser lens 13. The visible laser light LB is oscillated from an He-Ne laser oscillator 15 and is irradiated through the above- mentioned pinhole 21 via a half mirror 17 and the mirror 11. The opertor observes the light LB reflected from the 2nd mirror 25 from above, and adjusts the optical axis of the laser by adjusting the inclination of the mirror 11 until the reflected points P1, P2, etc. coincide with a center O.

Description

【発明の詳細な説明】 [発明の技術分野] この発明は例えばレーザ加工機などのレーザ光の光軸を
調整づ−る方法に関する。
DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a method for adjusting the optical axis of a laser beam of, for example, a laser processing machine.

[技術的背景及び問題点] 一般にレーザ加工機においてはそのレーザの光軸が設計
土足められる理想光軸に一致している事が要求される。
[Technical background and problems] Generally, in a laser processing machine, the optical axis of the laser is required to coincide with the ideal optical axis that is designed.

しかしながらレーザ光の行路上にある出力ミラーやペン
1〜ミラー、その伯の光学系の傾きや位置の微少な変化
によりレーザ光軸が理想光軸からはずれ、加工テーブル
」二の液加J物に対して正確に垂直に入射しないことが
ある。そのようにレーザ光が被加工物に正確に入射せず
、ある角度θだけ傾いて入射づると切断面が斜めに傾き
、正確な切断が出来ないことがある。またバー ′ニン
グという現象も起き易く、結果とし−C切断が不安定に
なるという問題があった。
However, due to slight changes in the inclination and position of the output mirror, pen 1 to mirror, and other optical systems on the path of the laser beam, the laser optical axis deviates from the ideal optical axis, causing the liquid to be added to the processing table. The incident may not be exactly perpendicular to the target. In this way, if the laser beam does not accurately enter the workpiece and is inclined by a certain angle θ, the cutting surface will be inclined obliquely, and accurate cutting may not be possible. Furthermore, the phenomenon of burning is likely to occur, resulting in the problem that -C cutting becomes unstable.

「発明の目的] この発明はこのような従来の問題に鑑み−C/、「され
たものであって、レーザ光が被加工物に対しく正確に垂
直に入射する様に調整Jる事がでさるレーザ光軸調整方
法を提供覆ることを目的と覆る。
``Purpose of the Invention'' This invention has been developed in view of the above-mentioned problems in the prior art. The aim is to provide a method for adjusting the optical axis of a laser.

[発明の概要] この発明は、集光レンズのレーザ先出用側に2枚のミラ
ーを液加]二物と平行に設置し、レーザ光を第1ミラー
のピンホールを通して第2ミラーに入射させ、両ミラー
間でのレーザ光の反θ・J状態を監視しなからレーザ光
の光学系の位置調整を行なうことを特徴とする。
[Summary of the Invention] This invention involves installing two mirrors on the laser first output side of a condensing lens parallel to the two objects, and making the laser beam enter the second mirror through the pinhole of the first mirror. The present invention is characterized in that the position of the laser beam optical system is adjusted while monitoring the anti-θ·J state of the laser beam between both mirrors.

[発明の実施例] 以下、図に示す実施例について詳説する。第1図はこの
発明の一実施例の用いられるレーザ加工機1の全体を示
しており、レーザ光「Bを発振するレーザ発振装置3と
レーザ光LBを集光して板状の被加工物Wを加工するレ
ーザ加■部5とよりなる。
[Embodiments of the Invention] Hereinafter, embodiments shown in the figures will be described in detail. FIG. 1 shows the entirety of a laser processing machine 1 used in an embodiment of the present invention, in which a laser oscillation device 3 that oscillates a laser beam “B” and a laser beam LB are condensed to form a plate-shaped workpiece. It consists of a laser machining section 5 that processes W.

レーザ発振装置3はレーザ光を発生させる装置であって
、例えば、CO2ガスレーザ発振装置が用いられる。そ
し−にのレーザ発振装置3におい(発振されたレーザ光
1Bは出力ミラー7により水平方向に導き出され、導管
9内を水平に導かれて、ベントミラー11に達する。こ
のペン1〜ミラー11においてレーザ光が直角に下方に
屈折され、集光レンズ13に入用づる。ここぐレーザ光
は集光されて液加に物W上に照射され、このレーザ光の
もつエネルギにより被加工物Wを加工づるのである。
The laser oscillation device 3 is a device that generates laser light, and for example, a CO2 gas laser oscillation device is used. Then, in the laser oscillation device 3 (the oscillated laser beam 1B is led out in the horizontal direction by the output mirror 7, guided horizontally in the conduit 9, and reaches the bent mirror 11. The laser beam is refracted downward at right angles and enters the condensing lens 13.The laser beam is condensed and irradiated onto the object W in addition to the liquid, and the energy of this laser beam causes the workpiece W to be It is processed.

この様なレーザ加工Ia1においては、レーザ加■を続
けているとシー11発振装置3からのレーザ光LBのエ
ネルギにより出力ミラー7やベントミラー11が湿度−
[昇して熱膨張して変形したり、その位置を変える事が
ある。その様な変形や位置移動があると、レーザ光LB
の光軸が理想光軸よりずれてしまって被加工物Wに対し
て垂直に入用せず、微少な角度だけ傾いた状態で入用J
る様になる。従って、この様なレーザ光軸の傾きを垂直
な方向に調整する必要がある。
In such laser processing Ia1, as the laser processing continues, the energy of the laser beam LB from the oscillator 3 of the sheet 11 causes the output mirror 7 and the vent mirror 11 to become humid.
[It may rise, thermally expand, deform, or change its position. If such deformation or positional movement occurs, the laser beam LB
The optical axis of the workpiece is deviated from the ideal optical axis, so it cannot be used perpendicularly to the workpiece W, and it must be used at a slight angle.
It will look like this. Therefore, it is necessary to adjust the inclination of such a laser optical axis in the vertical direction.

第2図はこの様なレーザ光軸の調整を行なう一実施例を
示しており、CO2レーザ発振装置3と並列に光軸調整
のための1−1e−Neレーザ発振器15を設置し、光
軸調整には可視光線であるこのHe−Neレーザを用い
る様にしである。He−Neレーザ発振器15からの可
視レーザ光IBはハーフベントミラー17によって水平
方向に垂角に■析されてペン1へミラー11に達する。
FIG. 2 shows an example of adjusting the laser optical axis as described above, in which a 1-1e-Ne laser oscillator 15 for adjusting the optical axis is installed in parallel with the CO2 laser oscillation device 3, and the optical axis is adjusted. This He-Ne laser, which emits visible light, is used for adjustment. The visible laser beam IB from the He--Ne laser oscillator 15 is analyzed horizontally and vertically by the half-bent mirror 17 and reaches the mirror 11 for the pen 1 .

そしてこのペン1〜ミラー11によって再び垂直方向に
!i角に屈折されて集光レンズ13に達し、ここで集光
されて加工テーブル17上に集光する様に設定されてい
る。
And with this pen 1 to mirror 11, it becomes vertical again! The beam is refracted at an i-angle, reaches a condenser lens 13, and is condensed there to be condensed onto a processing table 17.

ところでベントミラ−11が想像線で示した正規の位置
へに対して、若干ずれた位置Bにある時、レーザ光LB
は垂直方向に対してθ度だけ傾いた状態で加:■−デー
ツ゛ル19上に入射づる事になる。
By the way, when the vent mirror 11 is at a position B that is slightly shifted from the normal position shown by the imaginary line, the laser beam LB
will be incident on the laser 19 at an angle of θ degrees with respect to the vertical direction.

このレーリ“九L Bの傾きを検出するために、ピンホ
ール21のある第1ミラー23と第2ミラー25どがゝ
I’ fjに対向Mる様に一体化された光軸調整装置2
7を加工テーブル19上に設置する。第1ミラー23は
集光レンズ13の出用側に近接した状態に設置される。
In order to detect the inclination of this Rayleigh 9LB, an optical axis adjustment device 2 is integrated so that the first mirror 23 with the pinhole 21 and the second mirror 25 face I'fj.
7 is placed on the processing table 19. The first mirror 23 is installed close to the output side of the condenser lens 13 .

今、レーリ′光L Bの光軸が理想光軸である垂直軸C
iに対してθ度傾いIζ状態にある時、集光レンズ13
)から出たレーリ゛光1− Bはピン小−ル21を通つ
C第2ミフー2 bのセンター0より乙名干り゛れ1.
、:位置1)1 に入用Jる事(Jなる。ぞして第2ミ
ー7−25にJ、−)て反則された反射光(、↓、今瓜
は第1ミーノー23の外周部に達し、そこで反射され(
出ひ第2ミ“ノー25のより外側の部分1)2に入r+
>・する。、ぐしく、再び反則されて装置27の外部に
出Cゆくことになる。従って、この第2ミラー25を上
側からみてみると、実際のレーザ光LBが入射している
点1)+、p2の部分に第3図に示ず様にスボッhS+
、S2がみえる。
Now, the optical axis of Rayleigh' light LB is the vertical axis C, which is the ideal optical axis.
When the condenser lens 13 is in the Iζ state tilted by θ degrees with respect to i
) The ray light 1-B emitted from the pin hole 21 passes through the center 0 of the C second mihoo 2b and reaches the center 1.
, :Position 1) 1 is entered (J becomes J, so the second melon 7-25 J, -) and the reflected light is fouled (, ↓, the melon is the outer periphery of the first melon 23 and is reflected there (
Enter the outer part of the second min. 25 1) 2.
>・Do. However, the player is again violated and ends up outside the device 27. Therefore, when looking at this second mirror 25 from above, the point 1)+, p2, where the actual laser beam LB is incident, has a subtone hS+ as shown in FIG.
, S2 can be seen.

そこで、これらのスポットS1.32が第4図に示J様
に1つに重って第2ミラー25のセンター〇十にくる様
にベントミラー11を13位E6からA位置に移動さけ
る。この様にづるならば、レーザ光LBはベントミラー
11によって!fiv1に下りに屈折されてピンホール
21を通して第2ミラー25のセンター〇に入用Jる。
Therefore, the vent mirror 11 is moved from the 13th position E6 to the A position so that these spots S1.32 overlap as one and are located at the center of the second mirror 25 as shown in J in FIG. If it is written like this, the laser beam LB is transmitted by the bent mirror 11! It is refracted downward to the second mirror 25 through the pinhole 21 and enters the center 〇 of the second mirror 25.

、イして、ここで反射されたレーザ光LBは再び第1ミ
ラー23のピンホール21を通って出てゆくことになる
。そのため、第2ミラー25上にはその中心Oにa5り
るスポットだけがみられる事になり、光軸の調整か完了
した事となる。
, and the laser beam LB reflected here goes out through the pinhole 21 of the first mirror 23 again. Therefore, only the spot a5 located at the center O of the second mirror 25 can be seen, indicating that the adjustment of the optical axis has been completed.

上記の光軸調整ではX軸−軸り向のみについてその光軸
調整を行なったが、光軸のずれがY@右方向も生じてい
る様な場合にはY ’l!I11方向についても同様の
調整を行なう必要がある。
In the above optical axis adjustment, the optical axis was adjusted only in the X-axis direction, but if the optical axis misalignment also occurs in the Y@right direction, Y'l! Similar adjustments need to be made in the I11 direction as well.

尚、上記実施例ではヘントミシーについCその位置調整
をして光軸を調整したが、出力ミラーその他の光学系の
変動による光軸のずれをも同様の万d1によって補正り
る事がで゛さる、。
Note that in the above embodiment, the optical axis was adjusted by adjusting the position of the hexagon, but it is also possible to correct the deviation of the optical axis due to fluctuations in the output mirror and other optical systems by using the same method. ,.

[発明の効5!!1 この発明は集光レンズの出用側に第1ミラーと第2ミラ
ーとを平行に対向さけ、レーザ光を第1ミノ−のビン小
−ルを通しく第2ミラーに大剣さLl、(のレーリ゛光
の反射状態をみながら光軸を調整りるムのて゛ある。従
つ(、第2ミラーにピンホールを通し−C人1.+J 
したレーザ光の反(ト)光が再び第゛1−ミフーのビン
ボールから出て行く様に光軸を調?!’Jづる事により
レーザ光の光軸調整が行なえ、レーリー光軸の傾きを容
易に補正する事ができる。
[Efficacy of invention 5! ! 1 This invention places a first mirror and a second mirror facing each other in parallel on the output side of a condensing lens, and directs the laser beam through the first mirror to the second mirror with a large diameter Ll, There is a way to adjust the optical axis while looking at the reflection state of the Rayleigh light.
Adjust the optical axis so that the reflected light of the laser beam exits the 1st Mihu bottle again? ! By adjusting the optical axis of the laser beam, the tilt of the Rayleigh optical axis can be easily corrected.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの発明の一実施例の用いられているレーザ加
工機の正面図、第2図はこの発明の一実施例の光学系図
、第3図は同上実施例における光軸調整前の第2ミラー
の平面図、第4図は光軸調整後の第2ミラーの平面図で
ある。
Fig. 1 is a front view of a laser processing machine used in an embodiment of the present invention, Fig. 2 is a diagram of an optical system of an embodiment of the invention, and Fig. 3 is a diagram of the same embodiment before optical axis adjustment. FIG. 4 is a plan view of the second mirror after optical axis adjustment.

Claims (1)

【特許請求の範囲】[Claims] 集光レンズのレーザ光出剣側にピンホールのある第1ミ
ラーを設り、被加工物に平行に第2ミラーを設けて両ミ
ラーを対向させ、レーザ発振装置からのレーザ光を前記
第1ミラーのピンホールを通しC第2ミラーに入射させ
、この入射レーザの反射光が前記第1ミラーのピンホー
ルを通って出て行くようにレーザ光軸を調整することを
特徴とするレーザ光軸調整方法。
A first mirror with a pinhole is provided on the laser beam output side of the condensing lens, and a second mirror is provided parallel to the workpiece so that both mirrors face each other, and the laser beam from the laser oscillation device is directed to the first mirror. A laser optical axis characterized in that the laser optical axis is adjusted so that the laser beam enters the C second mirror through a pinhole in the mirror, and the reflected light of the incident laser exits through the pinhole in the first mirror. Adjustment method.
JP59089293A 1984-05-07 1984-05-07 Method for adjusting optical axis of laser Pending JPS60234788A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59089293A JPS60234788A (en) 1984-05-07 1984-05-07 Method for adjusting optical axis of laser

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59089293A JPS60234788A (en) 1984-05-07 1984-05-07 Method for adjusting optical axis of laser

Publications (1)

Publication Number Publication Date
JPS60234788A true JPS60234788A (en) 1985-11-21

Family

ID=13966634

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59089293A Pending JPS60234788A (en) 1984-05-07 1984-05-07 Method for adjusting optical axis of laser

Country Status (1)

Country Link
JP (1) JPS60234788A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6386609U (en) * 1986-11-25 1988-06-06
JP2007007660A (en) * 2005-06-28 2007-01-18 Olympus Corp Laser beam machining device
CN103212787A (en) * 2012-01-19 2013-07-24 昆山思拓机器有限公司 Adjusting method for coaxial laser beams
JP2016010809A (en) * 2014-06-30 2016-01-21 株式会社ディスコ Laser processing device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5332264A (en) * 1976-09-06 1978-03-27 Toyota Motor Corp Direct coupled clutch-loaded fluid transmission mechanism
JPS5741765U (en) * 1980-08-25 1982-03-06

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5332264A (en) * 1976-09-06 1978-03-27 Toyota Motor Corp Direct coupled clutch-loaded fluid transmission mechanism
JPS5741765U (en) * 1980-08-25 1982-03-06

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6386609U (en) * 1986-11-25 1988-06-06
JP2007007660A (en) * 2005-06-28 2007-01-18 Olympus Corp Laser beam machining device
CN103212787A (en) * 2012-01-19 2013-07-24 昆山思拓机器有限公司 Adjusting method for coaxial laser beams
JP2016010809A (en) * 2014-06-30 2016-01-21 株式会社ディスコ Laser processing device

Similar Documents

Publication Publication Date Title
US7473867B2 (en) Laser machining apparatus
US6526089B1 (en) Laser marker and method of light spot adjustment therefor
US11420288B2 (en) Laser machining systems and methods
CN102149507A (en) Post-lens steering of a laser beam for micro-machining applications
JP2010082663A (en) Laser beam machine
JP2008055436A (en) Laser beam irradiation device
JPS60234788A (en) Method for adjusting optical axis of laser
US7923659B2 (en) Laser machining method and laser machining apparatus
KR20180071127A (en) Alignment Method for Off-axis Reflective Optical System
US6528761B1 (en) Apparatus for determining the position of the focal point in a laser machining system
WO2021083064A1 (en) Beam expanding collimator based on square block structure, and light path adjusting device and adjusting method therefor
JP4251791B2 (en) Laser processing equipment
JP2021030295A (en) Laser processing device and optical adjustment method
CN205032851U (en) Laser galvanometer scanning system's reflection of light microscope base
JPS6116939Y2 (en)
JPH0315273Y2 (en)
JP2749712B2 (en) Workpiece positioning method in laser processing
JP2002178182A (en) Laser beam machine
KR20170013971A (en) Laser cutting apparatus
JPS6171193A (en) Laser condensing device
US20040188401A1 (en) Laser processing apparatus
JPS5964188A (en) Detector for position of beam bender for laser light
JPH04344884A (en) Photosynthesizing device for laser beam
JPS5973192A (en) Laser working machine
JP2005064331A (en) Beam irradiation apparatus