CN105308749B - 固态图像拾取元件、其制造方法和电子设备 - Google Patents

固态图像拾取元件、其制造方法和电子设备 Download PDF

Info

Publication number
CN105308749B
CN105308749B CN201480032912.5A CN201480032912A CN105308749B CN 105308749 B CN105308749 B CN 105308749B CN 201480032912 A CN201480032912 A CN 201480032912A CN 105308749 B CN105308749 B CN 105308749B
Authority
CN
China
Prior art keywords
photoelectric conversion
organic photoelectric
image pickup
protection film
conversion layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201480032912.5A
Other languages
English (en)
Chinese (zh)
Other versions
CN105308749A (zh
Inventor
定荣正大
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to CN201910510122.8A priority Critical patent/CN110323237B/zh
Priority to CN201910512935.0A priority patent/CN110246861B/zh
Publication of CN105308749A publication Critical patent/CN105308749A/zh
Application granted granted Critical
Publication of CN105308749B publication Critical patent/CN105308749B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K39/00Integrated devices, or assemblies of multiple devices, comprising at least one organic radiation-sensitive element covered by group H10K30/00
    • H10K39/30Devices controlled by radiation
    • H10K39/32Organic image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/50Photovoltaic [PV] devices
    • H10K30/57Photovoltaic [PV] devices comprising multiple junctions, e.g. tandem PV cells
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/80Constructional details
    • H10K30/88Passivation; Containers; Encapsulations
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/549Organic PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Engineering & Computer Science (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Plasma & Fusion (AREA)
  • Light Receiving Elements (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
CN201480032912.5A 2013-07-04 2014-06-25 固态图像拾取元件、其制造方法和电子设备 Expired - Fee Related CN105308749B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201910510122.8A CN110323237B (zh) 2013-07-04 2014-06-25 固态图像拾取元件、其制造方法和电子设备
CN201910512935.0A CN110246861B (zh) 2013-07-04 2014-06-25 固态图像拾取元件、其制造方法和电子设备

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013140398A JP6136663B2 (ja) 2013-07-04 2013-07-04 固体撮像素子およびその製造方法、並びに電子機器
JP2013-140398 2013-07-04
PCT/JP2014/003406 WO2015001771A1 (en) 2013-07-04 2014-06-25 Solid-state image-pickup device, method of manufacturing the same, and electronic apparatus

Related Child Applications (2)

Application Number Title Priority Date Filing Date
CN201910510122.8A Division CN110323237B (zh) 2013-07-04 2014-06-25 固态图像拾取元件、其制造方法和电子设备
CN201910512935.0A Division CN110246861B (zh) 2013-07-04 2014-06-25 固态图像拾取元件、其制造方法和电子设备

Publications (2)

Publication Number Publication Date
CN105308749A CN105308749A (zh) 2016-02-03
CN105308749B true CN105308749B (zh) 2019-07-12

Family

ID=51210706

Family Applications (3)

Application Number Title Priority Date Filing Date
CN201910512935.0A Active CN110246861B (zh) 2013-07-04 2014-06-25 固态图像拾取元件、其制造方法和电子设备
CN201480032912.5A Expired - Fee Related CN105308749B (zh) 2013-07-04 2014-06-25 固态图像拾取元件、其制造方法和电子设备
CN201910510122.8A Active CN110323237B (zh) 2013-07-04 2014-06-25 固态图像拾取元件、其制造方法和电子设备

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN201910512935.0A Active CN110246861B (zh) 2013-07-04 2014-06-25 固态图像拾取元件、其制造方法和电子设备

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201910510122.8A Active CN110323237B (zh) 2013-07-04 2014-06-25 固态图像拾取元件、其制造方法和电子设备

Country Status (5)

Country Link
US (1) US9793324B2 (OSRAM)
JP (1) JP6136663B2 (OSRAM)
KR (1) KR20160030102A (OSRAM)
CN (3) CN110246861B (OSRAM)
WO (1) WO2015001771A1 (OSRAM)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0752437B2 (ja) 1991-08-07 1995-06-05 インターナショナル・ビジネス・マシーンズ・コーポレイション メッセージの進行を追跡する複数ノード・ネットワーク
CN105988629A (zh) * 2015-02-27 2016-10-05 宸鸿科技(厦门)有限公司 触控面板
WO2017061176A1 (ja) * 2015-10-06 2017-04-13 ソニー株式会社 固体撮像素子および固体撮像素子の製造方法
US20170179201A1 (en) * 2015-12-16 2017-06-22 General Electric Company Processes for fabricating organic photodetectors and related photodetectors and systems
JP6775977B2 (ja) * 2016-03-22 2020-10-28 キヤノン株式会社 光電変換装置、及び撮像システム
US10756132B2 (en) 2016-03-29 2020-08-25 Sony Corporation Solid-state imaging device, method of manufacturing the same, and electronic apparatus
US20170309684A1 (en) * 2016-04-25 2017-10-26 Canon Kabushiki Kaisha Photoelectric conversion device and imaging system
KR102486048B1 (ko) 2016-07-20 2023-01-09 소니그룹주식회사 고체 촬상 소자 및 고체 촬상 장치
US10282357B1 (en) 2016-09-15 2019-05-07 Google Llc Dynamic resampling for ranking viewer experiences
JP2018093052A (ja) * 2016-12-02 2018-06-14 ソニーセミコンダクタソリューションズ株式会社 固体撮像素子およびその製造方法、並びに電子機器
US10644073B2 (en) 2016-12-19 2020-05-05 Samsung Electronics Co., Ltd. Image sensors and electronic devices including the same
KR102764011B1 (ko) * 2016-12-23 2025-02-05 삼성전자주식회사 전자 소자 및 그 제조 방법
JP2019071333A (ja) * 2017-10-06 2019-05-09 株式会社ディスコ ウエーハの加工方法
KR102673656B1 (ko) 2018-02-05 2024-06-07 삼성전자주식회사 이미지 센서 및 전자 장치
JP7089931B2 (ja) * 2018-04-16 2022-06-23 浜松ホトニクス株式会社 裏面入射型半導体光検出素子の製造方法
KR102578655B1 (ko) 2019-01-24 2023-09-13 삼성전자주식회사 이미지 센서
WO2020179300A1 (ja) * 2019-03-04 2020-09-10 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置、固体撮像装置の製造方法および電子機器
JP7559753B2 (ja) * 2019-05-24 2024-10-02 ソニーグループ株式会社 撮像素子、積層型撮像素子及び固体撮像装置、並びに、撮像素子の製造方法
KR102730122B1 (ko) * 2019-10-21 2024-11-13 삼성전자주식회사 이미지 센서
KR102317661B1 (ko) * 2019-11-01 2021-10-26 한국과학기술연구원 자외선 파장 선택적 rgb 변환 필름 및 이를 이용한 자외선 이미지 센서
US20230005993A1 (en) * 2019-11-20 2023-01-05 Sony Semiconductor Solutions Corporation Solid-state imaging element
CN112911094A (zh) * 2019-12-04 2021-06-04 索尼半导体解决方案公司 电子设备
JP2022000873A (ja) * 2020-06-19 2022-01-04 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置
US11843022B2 (en) * 2020-12-03 2023-12-12 Sharp Kabushiki Kaisha X-ray imaging panel and method of manufacturing X-ray imaging panel
US11916094B2 (en) * 2021-08-02 2024-02-27 Sharp Display Technology Corporation Photoelectric conversion panel and method for manufacturing photoelectric conversion panel

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4961111B2 (ja) * 2005-02-28 2012-06-27 富士フイルム株式会社 光電変換膜積層型固体撮像素子とその製造方法
JP4911445B2 (ja) * 2005-06-29 2012-04-04 富士フイルム株式会社 有機と無機のハイブリッド光電変換素子
JP5006547B2 (ja) * 2006-01-26 2012-08-22 ルネサスエレクトロニクス株式会社 固体撮像装置
KR100853096B1 (ko) * 2006-12-20 2008-08-19 동부일렉트로닉스 주식회사 이미지 센서 및 그의 제조방법
JP5470928B2 (ja) * 2009-03-11 2014-04-16 ソニー株式会社 固体撮像装置の製造方法
JP5564847B2 (ja) 2009-07-23 2014-08-06 ソニー株式会社 固体撮像装置とその製造方法、及び電子機器
US20130139887A1 (en) * 2011-01-07 2013-06-06 Brite Hellas Ae Scalable production of dye-sensitized solar cells using inkjet printing
JP5572108B2 (ja) * 2011-02-01 2014-08-13 日本放送協会 撮像素子の製造方法、及び、撮像素子
JP2012182426A (ja) * 2011-02-09 2012-09-20 Canon Inc 固体撮像装置、固体撮像装置を用いた撮像システム及び固体撮像装置の製造方法
JP5284438B2 (ja) * 2011-02-09 2013-09-11 キヤノン株式会社 固体撮像装置、及び固体撮像装置の製造方法
JP2013055252A (ja) * 2011-09-05 2013-03-21 Sony Corp 固体撮像素子および製造方法、並びに電子機器
US9184194B2 (en) * 2011-12-21 2015-11-10 Arizona Board Of Regents, A Body Corporate Of The State Of Arizona, Acting For And On Behalf Of Arizona State University Multiband photodetector utilizing serially connected unipolar and bipolar devices
KR20160084162A (ko) * 2015-01-05 2016-07-13 삼성전자주식회사 유기 광전 소자 및 이미지 센서

Also Published As

Publication number Publication date
WO2015001771A1 (en) 2015-01-08
CN110246861B (zh) 2023-06-23
CN110246861A (zh) 2019-09-17
CN110323237B (zh) 2024-03-19
US20160372520A1 (en) 2016-12-22
US9793324B2 (en) 2017-10-17
KR20160030102A (ko) 2016-03-16
CN105308749A (zh) 2016-02-03
CN110323237A (zh) 2019-10-11
JP6136663B2 (ja) 2017-05-31
JP2015015332A (ja) 2015-01-22

Similar Documents

Publication Publication Date Title
CN105308749B (zh) 固态图像拾取元件、其制造方法和电子设备
US9614010B2 (en) Solid-state image sensing device having an organic photoelectric conversion section fills a depression section and solid-state image pickup unit including same
US11049906B2 (en) Imaging device, manufacturing device, and manufacturing method
US9281486B2 (en) Semiconductor device, method of manufacturing semiconductor device, solid-state imaging unit, and electronic apparatus
US9634065B2 (en) Solid-state image pickup device and manufacturing method thereof, and electronic apparatus
CN103972254B (zh) 半导体器件和包括该半导体器件的半导体装置
US10014349B2 (en) Solid state image sensor, production method thereof and electronic device
US9601547B2 (en) Solid-state image pickup device and electronic apparatus
US20140077324A1 (en) Solid-state image pickup device, method of manufacturing solid-state image pickup device, and electronic apparatus
US11127910B2 (en) Imaging device and electronic apparatus
WO2017169757A1 (ja) 固体撮像素子およびその製造方法、並びに電子機器
JP5102692B2 (ja) カラー撮像装置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20190712