CN105307383B - A kind of PCB and PCB layout method - Google Patents
A kind of PCB and PCB layout method Download PDFInfo
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- CN105307383B CN105307383B CN201510566223.9A CN201510566223A CN105307383B CN 105307383 B CN105307383 B CN 105307383B CN 201510566223 A CN201510566223 A CN 201510566223A CN 105307383 B CN105307383 B CN 105307383B
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- 238000000034 method Methods 0.000 title claims abstract description 16
- 230000001681 protective effect Effects 0.000 claims abstract description 65
- 230000005540 biological transmission Effects 0.000 claims abstract description 29
- 230000008054 signal transmission Effects 0.000 claims description 55
- 230000004044 response Effects 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 7
- 230000035699 permeability Effects 0.000 claims description 3
- 230000005674 electromagnetic induction Effects 0.000 description 5
- 230000005611 electricity Effects 0.000 description 4
- 230000005684 electric field Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 241000282312 Proteles Species 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000001939 inductive effect Effects 0.000 description 2
- 239000004744 fabric Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09236—Parallel layout
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Cable Transmission Systems, Equalization Of Radio And Reduction Of Echo (AREA)
Abstract
The invention provides a kind of PCB and PCB layout method, wherein, the PCB includes：At least two differential lines pair；The protective wire being arranged between two neighboring differential lines pair, for when two neighboring differential lines are to transmission signal, producing induced-current；At least one via being arranged on the protective wire, for connecting the protective wire and stratum, when two neighboring differential lines are to transmission signal, the induced-current on the protective wire is imported into stratum.By technical scheme, protective wire is set between differential lines pair, when differential lines are to transmission signal, induced-current is produced on protective wire, differential lines as interference source can be weakened to acting on the intensity of the crosstalk signal of adjacent differential line pair.
Description
Technical field
It is more particularly to a kind of the present invention relates to PCB (Printed Circuit Bord, printed circuit board) technical field
PCB and PCB layout method.
Background technology
Crosstalk refers on PCB, believes when a signal transmits on transport channels because of electromagnetic coupled in adjacent transmission
Certain coupled voltages and couple current are produced on road.
At present, the mode of generally use difference cabling suppresses the crosstalk between adjacent signal transmission channel, as shown in Figure 1
A kind of PCB using differential lines to transmission signal, including the differential lines as signal channel are to 101 and differential lines pair
102, differential lines are to 101 and differential lines to including two bars transmission lines, the signal transmission of each differential lines centering in 102 respectively
Wire rod matter is identical, length is identical, line width is identical, in close proximity to and into parallel cabling, wherein, differential lines are to 101 and differential lines pair
The line width of signal transmssion line in 102 includes 8mil, and differential lines include to 101 and differential lines to the line spacing b between 102
40mil；When differential lines to 101 and differential lines to 102 transmission signal when, differential lines are to 102 because electromagnetic coupled can be in differential lines pair
Equal in magnitude and polarity identical couple current and coupled voltages are superimposed on two bars transmission lines in 101, i.e., in difference
Line is identical to caused crosstalk signal on two bars transmission lines in 101；Due to the mode transmission signal using difference cabling
When, the response signal of corresponding signal receiving end is the difference of the transmission signal of two bars transmission lines, in differential lines are to 101
The response letter that identical crosstalk signal receives to differential lines to signal receiving end corresponding to 101 is superimposed on two bars transmission lines
It is number smaller；Differential lines are identical to 101 operation principle with foregoing differential lines to 102.
But in above-mentioned technical proposal, when the line spacing of two differential lines pair is smaller, still deposited between adjacent differential line pair
In stronger crosstalk signal；Such as differential lines to 101 and differential lines to the line spacing between 102 is 30mil when, differential lines are to 101
It is larger to the crosstalk signal difference on 102 two bars transmission lines to be respectively acting on differential lines, differential lines are believed corresponding in 102
The response signal that number receiving terminal receives can be a greater impact.
The content of the invention
In view of this, the invention provides a kind of PCB, can weaken between adjacent differential line pair caused by crosstalk signal it is strong
Degree.
In a first aspect, the invention provides PCB, including：
At least two differential lines pair；
The protective wire being arranged between two neighboring differential lines pair, for when two neighboring differential lines are to transmission signal,
Produce induced-current；
At least one via being arranged on the protective wire, for connecting the protective wire and stratum, when two neighboring
When differential lines are to transmission signal, the induced-current on the protective wire is imported into stratum.
Further,
The protective wire is identical with the line width for each differential signal transmission that the differential lines centering includes.
Further,
The line width a of differential signal transmission span includes：No more than 8mil.
Further,
The impedance for each differential signal transmission that the impedance of each via includes with the differential lines centering
It is identical.
Further,
The external diameter size of each via is identical；
The span of the external diameter of the via includes：More than 0, less than a, wherein, a represents the line of the signal transmssion line
It is wide.
Further, the impedance Z of each via is calculated by following formulav：
Zv=(r+jwl) h；
Wherein, r be the resistance of each via unit length, j be imaginary number, ω in complex representation be angular frequency, l be
Unit length inductance, the h of each via are PCB substrate thickness；
Wherein, the unit length inductance l of each via is calculated by following formula：
Wherein, μ 0 be space permeability, h be PCB substrate thickness, rvFor the via outer shroud radius；
Wherein, as via outer shroud radius rvDuring less than skin depth δ, the resistance r of the unit length of each via
Calculated by following formula：
Wherein, as via outer shroud radius rvDuring not less than skin depth δ, the resistance r of each via unit length
Calculated by following formula：
Wherein, δ be the skin depth of via, σ be electrical conductivity.
Further,
The number m of the via is calculated by following formula：
V(z)=Zm-1I(z)；
Wherein, V(z)For terminal induced voltage corresponding with the protective wire adjacent differential signal transmission line, I(z)For with guarantor
It is impedance corresponding to every differential signal transmission to protect terminal response electric current, Z corresponding to the adjacent differential signal transmission of line.
Second aspect, the invention provides a kind of PCB wiring method, including：
Protective wire is set between PCB adjacent differential line pair；
Via is set on the protective wire, so that the via connects the protective wire and stratum.
Further, after protective wire being set between the adjacent differential line pair on pcb board, further comprise：
The parameter information of differential lines pair is obtained, determines to need the number of vias that sets and described according to the parameter information
The external diameter of via, wherein, the parameter information includes：The impedance of differential signal transmission, the response electricity of differential signal transmission
Pressure, the response current of differential signal transmission.
Further, determined to need the external diameter of the number of vias and via set, bag according to the parameter information
Include：
The number m of the via is calculated by following formula：
V(z)=Zm-1I(z)；
Wherein, V(z)For terminal induced voltage corresponding with the protective wire adjacent differential signal transmission line, I(z)For with guarantor
It is impedance corresponding to every differential signal transmission to protect terminal response electric current, Z corresponding to the adjacent differential signal transmission of line.
By a kind of PCB provided by the invention and PCB layout method, protection is set between two neighboring differential lines pair
Line, when two neighboring differential lines are to transmission signal, according to electromagnetic induction principle, the differential lines as interference source are to that can protect
Induced-current is produced on line, the sense of current of the faradic direction and interference source is on the contrary, when protective wire produces induced-current
When, the electric field and magnetic field intensity of the differential lines pair as interference source can be weakened, and then weaken the crosstalk letter between adjacent differential line pair
Number intensity.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the required accompanying drawing used in technology description to be briefly described, it should be apparent that, drawings in the following description are the present invention
Some embodiments, for those of ordinary skill in the art, on the premise of not paying creative work, can also basis
These accompanying drawings obtain other accompanying drawings.
Fig. 1 is to use structural representation of the differential lines to the PCB of transmission signal in the prior art；
Fig. 2 is a kind of structural representation for PCB that one embodiment of the invention provides；
Fig. 3 is a kind of wiring method flow chart for PCB that one embodiment of the invention provides.
Embodiment
To make the purpose, technical scheme and advantage of the embodiment of the present invention clearer, below in conjunction with the embodiment of the present invention
In accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is
Part of the embodiment of the present invention, rather than whole embodiments, based on the embodiment in the present invention, those of ordinary skill in the art
The every other embodiment obtained on the premise of creative work is not made, belongs to the scope of protection of the invention.
As shown in Fig. 2 the embodiments of the invention provide a kind of PCB, can include：
At least two differential lines are to 201；
The protective wire 202 being arranged between two neighboring differential lines pair, for when two neighboring differential lines are to transmission signal
When, produce induced-current；
At least one via 203 being arranged on the protective wire, for connecting the protective wire and stratum, when adjacent two
When individual differential lines are to transmission signal, the induced-current on the protective wire is imported into stratum.
By a kind of PCB provided by the invention, protective wire is set between two neighboring differential lines pair, when two neighboring difference
When separated time is to transmission signal, according to electromagnetic induction principle, the differential lines as interference source on protective wire to that can produce induced electricity
The sense of current of stream, the faradic direction and interference source can weaken as dry on the contrary, when protective wire produces induced-current
The electric field and magnetic field intensity of the differential lines pair in source are disturbed, and then weakens the crosstalk signal intensity of adjacent differential line pair.
Specifically, after protective wire being set between differential lines pair, when differential lines are to transmission signal, the difference as interference source
The differential signal transmission of line centering produces one because of electromagnetic induction in the differential signal transmission in adjacent differential lines pair
The induced-current and induced voltage opposite with the sense of current in the differential signal transmission as interference source, meanwhile, protecting
Shield line on can also produce an induced-current opposite with the sense of current in the differential signal transmission as interference source and
Induced voltage；Induced-current on protective wire is also because electromagnetic induction produces in differential signal transmission in adjacent differential lines pair
A raw induced-current opposite with the inductive current direction on protective wire；At this moment, the differential signal in adjacent differential line pair
On transmission line, induced electricity caused by the inductive current direction caused by the differential signal transmission as interference source and protective wire
Stream is in opposite direction, and therefore, induced-current caused by protective wire can offset a part and draw as the differential signal transmission of interference source
The induced-current risen, that is, weaken and act on adjacent differential line to upper crosstalk signal as the differential signal transmission of interference source.
It should also be noted that, it can avoid protecting by setting via that caused electric current on protective wire is imported into stratum here
Electric charge on shield line is gathered in certain on protective wire because protective wire does not form path, triggers other counter productives.
Further, in order to ensure after setting a protective wire between adjacent differential line pair, adjacent differential line centering
The situation of impedance mismatching will not occur for differential signal transmission, in a preferred embodiment of the invention, the protective wire with it is described
The line width for each differential signal transmission that differential lines centering includes is identical.
Further, the technological progress due to electronic product and the requirement of ever-increasing complexity so that circuit design is close
Spend more and more higher, in order to limited wiring space improve PCB can integrated level, it is described in a preferred embodiment of the invention
The line width a of differential signal transmission span includes：No more than 8mil.
It should be noted that meeting that PCB should can as far as possible use the less difference of line width on the premise of manufacturing condition
Signal transmssion line and protective wire, such as, when needs carry out PCB in limited wiring space closely to be connected up, meeting
PCB can be under manufacturing condition, and the line width of differential signal transmission and protective wire can include 4mil；Certainly, without the concern for cloth
On the premise of space of lines, the line width of differential signal transmission and protective wire can also be more than or equal to 8mil.
Further, in order to ensure after being provided with the via of ground connection between two neighboring differential lines pair, adjacent differential
The situation of impedance mismatching will not occur for the differential signal transmission of line centering, in a preferred embodiment of the invention, each institute
The impedance for stating via is identical with the impedance for each differential signal transmission that the differential lines centering includes.
Further, in order to facilitate manufacturer production PCB, in a preferred embodiment of the invention, each via
External diameter size is identical；Specifically, the span of the external diameter of the via includes：More than 0, less than a, wherein, a represent described in
The line width of signal transmssion line.
It should be noted that in the present embodiment, as long as meeting each of the impedance of each via and differential lines centering
The impedance identical condition of differential signal transmission, the parameters of each via, such as external diameter size, internal diameter size
Can also rationally it be set in the case where meeting aforementioned condition etc. specific parameter.
Specifically, the impedance Z of each via can be calculated by following formula (1)v,
Zv=(r+jwl) h； (1)
Wherein, r be the resistance of each via unit length, j be imaginary number, ω in complex representation be angular frequency, l be
Unit length inductance, the h of each via are PCB substrate thickness；
Wherein, the unit length inductance l of each via is calculated by following formula (2),
Wherein, μ 0 be space permeability, h be PCB substrate thickness, rvFor the via outer shroud radius；
Wherein, as via outer shroud radius rvDuring less than skin depth δ, the resistance r of the unit length of each via
Calculated by following formula (3),
Wherein, as via outer shroud radius rvDuring not less than skin depth δ, the resistance r of each via unit length
Calculated by following formula (4),
Further, the impedance identical premise of the differential signal transmission in each via and differential lines pair is met
Under, and the external diameter for working as each via is identical, i.e. when the outer shroud radius of each via is identical, it is necessary in two neighboring differential lines
The number m of the via set between can be calculated by following formula (5),
V(z)=Zm-1I(z)； (5)
Wherein, V(z)For terminal induced voltage corresponding with the protective wire adjacent differential signal transmission line, I(z)For with guarantor
It is impedance corresponding to every differential signal transmission to protect terminal response electric current, Z corresponding to the adjacent differential signal transmission of line.
As shown in figure 3, the embodiments of the invention provide a kind of PCB wiring method, this method may comprise steps of：
Step 301, protective wire is set between adjacent differential line pair.
Here, in order to ensure after setting protective wire between differential lines pair, each that differential lines centering includes is not interfered with
The continuity of the impedance of differential signal transmission, the line width of protective wire should be identical with the line width of differential signal transmission, certainly,
Do not influence differential signal transmission it is successional under the premise of, the protective wire of other line widths and material can also be used.
The setting of protective wire should design initial stage in PCB circuits and complete, and specifically, can pass through the PCB design software such as Protel
To complete the design of PCB circuits.
Step 302, the parameter information of differential lines pair is obtained, is determined to need the number of vias set according to the parameter information
And the external diameter of the via.
Here, parameter information includes but is not limited to the impedance of differential signal transmission, the response of differential signal transmission electricity
Pressure, the response current of differential signal transmission.
Step 303, via is set, and each via connects protective wire and stratum respectively.
Here, each via is arranged on protective wire, for connecting protective wire and stratum, when two neighboring differential lines
During to transmission signal, the induced-current on the protective wire is imported into stratum.
Specifically, in step 303 and step 302, it is necessary to difference described in obtaining step 301 before via is set
The parameters information of separated time pair, the response current of including but not limited to each differential signal transmission, each difference letter
The impedance of the line width of number transmission line, PCB substrate thickness and each differential signal transmission；After determining above-mentioned parameter, it can lead to
Cross the formula (1) described in said apparatus embodiment, formula (2), formula (3), formula (4) and formula (5) and determine that needs are set
The quantity for the via put and the size of via external diameter etc.；And then by the PCB design software design patterns via such as Protel to complete
PCB design.
It should be noted that during PCB design, differential signal transmission can be calculated by softwares such as txline
Impedance and the impedance of via etc..
The present invention is that strength at least has the advantages that：
1st, protective wire is set between two neighboring differential lines pair, when two neighboring differential lines are to transmission signal, according to
Electromagnetic induction principle, as interference source differential lines to can induced-current is produced on protective wire, the faradic direction with
The sense of current of interference source can weaken the electric field of the differential lines pair as interference source on the contrary, when protective wire produces induced-current
And magnetic field intensity, and then weaken the crosstalk signal intensity between adjacent differential line pair.
2nd, by being provided with protective wire between differential lines pair to weaken the crosstalk between two neighboring differential lines pair, due to
The wire spacing of the two neighboring differential lines pair of the intensity of crosstalk signal is relevant between two neighboring differential lines pair, in the prior art,
Make the line spacing between two differential lines pair in differential signal transmission line spacing more than 5 times are generally may require that, are protected by setting
Protect after line, due to reducing the crosstalk signal intensity between adjacent differential line pair, therefore, in PCB layout, adjacent two can be reduced
Line spacing between individual differential lines pair, save wiring space, and then improve PCB high speed cablings can integrated level.
It should be noted that herein, such as first and second etc relational terms are used merely to an entity
Or operation makes a distinction with another entity or operation, and not necessarily require or imply and exist between these entities or operation
Any this actual relation or order.Moreover, term " comprising ", "comprising" or its any other variant be intended to it is non-
It is exclusive to include, so that process, method, article or equipment including a series of elements not only include those key elements,
But also the other element including being not expressly set out, or also include solid by this process, method, article or equipment
Some key elements.In the absence of more restrictions, the key element limited by sentence " including one ", is not arranged
Except other identical factor in the process including the key element, method, article or equipment being also present.
It is last it should be noted that：Presently preferred embodiments of the present invention is the foregoing is only, is merely to illustrate the skill of the present invention
Art scheme, is not intended to limit the scope of the present invention.Any modification for being made within the spirit and principles of the invention,
Equivalent substitution, improvement etc., are all contained in protection scope of the present invention.
Claims (2)
- A kind of 1. printing board PCB, it is characterised in that including：At least two differential lines pair；The protective wire being arranged between two neighboring differential lines pair, for when two neighboring differential lines are to transmission signal, producing Induced-current；At least one via being arranged on the protective wire, for connecting the protective wire and stratum, when two neighboring difference When line is to transmission signal, the induced-current on the protective wire is imported into stratum；The protective wire is identical with the line width for each differential signal transmission that the differential lines centering includes；The line width a of differential signal transmission span includes：No more than 8mil；The impedance of each via is identical with the impedance for each differential signal transmission that the differential lines centering includes；The external diameter size of each via is identical；The span of the external diameter of the via includes：More than 0, less than a, wherein, a represents the line width of the signal transmssion line；Described PCB calculates the impedance Z of each via by following formulav：Zv=(r+jwl) h；Wherein, r be the resistance of each via unit length, j be imaginary number, ω in complex representation be angular frequency, l be each Unit length inductance, the h of the individual via are PCB substrate thickness；Wherein, the unit length inductance l of each via is calculated by following formula：<mrow> <mi>l</mi> <mo>=</mo> <mfrac> <msub> <mi>&mu;</mi> <mn>0</mn> </msub> <mrow> <mn>2</mn> <mi>&pi;</mi> </mrow> </mfrac> <mo>&lsqb;</mo> <mi>h</mi> <mo>&CenterDot;</mo> <mi>l</mi> <mi>n</mi> <mrow> <mo>(</mo> <mfrac> <mrow> <mi>h</mi> <mo>+</mo> <msqrt> <mrow> <msup> <mi>h</mi> <mn>2</mn> </msup> <mo>+</mo> <msup> <msub> <mi>r</mi> <mi>v</mi> </msub> <mn>2</mn> </msup> </mrow> </msqrt> </mrow> <msub> <mi>r</mi> <mi>v</mi> </msub> </mfrac> <mo>)</mo> </mrow> <mo>+</mo> <mfrac> <mn>3</mn> <mn>2</mn> </mfrac> <mrow> <mo>(</mo> <msub> <mi>r</mi> <mi>v</mi> </msub> <mo>-</mo> <msqrt> <mrow> <msup> <mi>h</mi> <mn>2</mn> </msup> <mo>+</mo> <msup> <msub> <mi>r</mi> <mi>v</mi> </msub> <mn>2</mn> </msup> </mrow> </msqrt> <mo>)</mo> </mrow> <mo>&rsqb;</mo> <mo>;</mo> </mrow>Wherein, μ 0 be space permeability, h be PCB substrate thickness, rvFor the via outer shroud radius；Wherein, as via outer shroud radius rvDuring less than skin depth δ, the resistance r of the unit length of each via is under Formula calculates：<mrow> <mi>r</mi> <mo>=</mo> <mfrac> <mn>1</mn> <mrow> <mi>&sigma;</mi> <mi>&pi;</mi> <msup> <mrow> <mo>(</mo> <msub> <mi>r</mi> <mi>v</mi> </msub> <mo>)</mo> </mrow> <mn>2</mn> </msup> </mrow> </mfrac> <mo>;</mo> </mrow>Wherein, as via outer shroud radius rvDuring not less than skin depth δ, the resistance r of each via unit length is under Formula calculates：<mrow> <mi>r</mi> <mo>=</mo> <mfrac> <mn>1</mn> <mrow> <mi>&sigma;</mi> <mi>&pi;</mi> <mi>&delta;</mi> <msup> <mrow> <mo>(</mo> <mn>2</mn> <msub> <mi>r</mi> <mi>v</mi> </msub> <mo>-</mo> <mi>&delta;</mi> <mo>)</mo> </mrow> <mn>2</mn> </msup> </mrow> </mfrac> <mo>;</mo> </mrow>Wherein, δ be the skin depth of via, σ be electrical conductivity；Described PCB, it is characterised in thatThe number m of the via is calculated by following formula：V(z)=Zm-1I(z)；Wherein, V(z)For terminal induced voltage corresponding with the protective wire adjacent differential signal transmission line, I(z)For with protective wire Terminal response electric current, Z are impedance corresponding to every differential signal transmission corresponding to adjacent differential signal transmission.
- A kind of 2. PCB wiring method, it is characterised in that including：Protective wire is set between PCB adjacent differential line pair；Via is set on the protective wire, so that the via connects the protective wire and stratum；After protective wire is set between adjacent differential line pair on pcb board, further comprise：The parameter information of differential lines pair is obtained, the number of vias set according to parameter information determination needs and the via External diameter, wherein, the parameter information includes：The impedance of differential signal transmission, the response voltage of differential signal transmission, difference The response current of sub-signal transmission line；Determined to need the external diameter of the number of vias and via set according to the parameter information, including：The number m of the via is calculated by following formula：V(z)=Zm-1I(z)；Wherein, V(z)For terminal induced voltage corresponding with the protective wire adjacent differential signal transmission line, I(z)For with protective wire Terminal response electric current, Z are impedance corresponding to every differential signal transmission corresponding to adjacent differential signal transmission.
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| TWI683613B (en) | 2017-02-10 | 2020-01-21 | 華碩電腦股份有限公司 | Circuit layout structure |
| CN107613632A (en) * | 2017-09-11 | 2018-01-19 | 宇龙计算机通信科技(深圳)有限公司 | A kind of wiring method of circuit board, circuit board and mobile terminal |
| CN108509367A (en) * | 2018-03-30 | 2018-09-07 | 北京联想核芯科技有限公司 | A kind of bus structures and its wiring method |
| CN113033129B (en) * | 2021-03-03 | 2024-01-16 | 加弘科技咨询(上海)有限公司 | Method, system, equipment and printed circuit board for reducing signal crosstalk of high-speed circuit |
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| CN105307383A (en) | 2016-02-03 |
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