CN105280585B - A kind of processing technology of frame, the diode (led) module comprising the frame and diode (led) module - Google Patents
A kind of processing technology of frame, the diode (led) module comprising the frame and diode (led) module Download PDFInfo
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- CN105280585B CN105280585B CN201510767894.1A CN201510767894A CN105280585B CN 105280585 B CN105280585 B CN 105280585B CN 201510767894 A CN201510767894 A CN 201510767894A CN 105280585 B CN105280585 B CN 105280585B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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Abstract
A kind of processing technology of frame, the diode (led) module comprising the frame and diode (led) module.It is related to the improvement wherein proposed for diode (led) module and its internal structure, processing technology.The problems such as delicate structure, using effect be good and service life is grown, and when use can effectively avoid hot-spot, heat dissipation is uneven.Including n successively adjacent body, gap is left between the adjacent body, 1 chip of n is concatenated by n body, the cathode and anode of the chip are connected on two adjacent bodies, the cathode of the first body and chip connects, the anode of the last position body and chip connects, and is opened up in the middle part of last position body fluted so that the cathode that penultimate body stretches into groove and last position chip is located in groove.Homogeneouslly-radiating can be carried out during present invention work, the heat dissipation effect of frame is improved and extends service life so that the electrical property and stability in use of diode (led) module entirety are significantly enhanced.
Description
Technical field
The present invention relates to photovoltaic apparatus field, more particularly to wherein for diode (led) module and its internal structure, processing work
The improvement that skill proposes.
Background technology
With greatly developing for photovoltaic diode, the species of terminal box also becomes more and more, along with the limitation of cost,
So that people are also more and more stringenter to the performance requirement of diode.In traditional handicraft, the installation of copper sheet need to be carried out in terminal box
And the work such as the installation of diode, welding, the defects of process is more, operation difficulty is big and rejection rate is higher is brought, is become
Those skilled in the art technical problems urgently to be resolved hurrily.
In this regard, the applicant once applied on June 19th, 2013 a entitled " novel photovoltaic diode integration module ",
The utility model patent of Application No. " 201320354641.8 ", completes the string of 3 chips in the case by 4 copper soleplates
Connect, and 4 pin feet by being connected as a single entity with 4 copper soleplates complete the connection with external equipment.
However, people have found since 3 chips are sequentially connected in series in actual use, as shown in figure 4,4 copper soleplates
Middle reality only 3 and copper soleplate that chip N is extremely connected and its corresponding pin feet temperature are higher, remaining 1 idle (temperature phase
To relatively low)；So as to bring 4 pin feet can not Homogeneouslly-radiating, or even the problems such as local temperature is excessive, seriously affected two poles
Stability in use, using effect and the service life of tube chip.
The content of the invention
For the present invention in view of the above problems, propose that a kind of delicate structure, using effect be good and service life length, when use, can
Effectively avoid hot-spot, heat dissipation it is uneven the problems such as, and in structure with splendid stability frame, include the frame
Diode (led) module and diode (led) module processing technology.
The technical scheme is that：The frame includes n successively adjacent bodies, is left between the adjacent body
Gap, n-1 chip is concatenated by n body, and the cathode and anode of the chip are connected on two adjacent bodies, first
The cathode of the position body and chip connects, and the anode of the last position body and chip connects, and is offered in the middle part of last position body
Groove so that the cathode that penultimate body stretches into groove and last position chip is located in groove.
The side of each body is fixedly connected with pin and the side of wherein two bodies is fixedly connected with convergent belt
Welding foot, is equipped with segment difference face between body and the convergent belt welding foot.
Some capillary grooves one are equipped between the body and pin, are equipped between body and the convergent belt welding foot some
Capillary groove two.
The end position body is equipped with backwards to a side end face of groove to be connected as a single entity flange with last position body.
The flange and last position body are perpendicular.
The frame includes four adjacent bodies successively, and four bodies are divided into body one, body two, body
Three and body four, the body one be equipped with a cathode tie point, the body two is equipped with an anode tie point and a cathode
Tie point, the body three are equipped with an anode tie point and a cathode tie point, and the body four is equipped with anode tie point,
So that three chips are sequentially connected in series between four bodies by wire jumper, the middle part of body four opens up fluted, the body
Three, which stretch into the cathode tie point in groove and on body three, is located in groove.
The diode (led) module includes frame, n-1 chip, n-1 roots wire jumper and packaging body, and the frame includes n originally
Body；
The cathode of the n-1 chips is respectively fixedly connected with the first body to penultimate body and n-1 institute
State the one end of the anode of chip respectively with n-1 root wire jumpers to be fixedly connected, n-1 is fixed respectively with the one end of the wire jumper away from chip
Positive number second body is connected to last position body；
The middle part of the n bodies offered glue hole, and the packaging body coats are in n this external and pin and remittance
Stream tape welding pin is extend out to outside packaging body.
The wire jumper is divided into main wire jumper and secondary wire jumper, and the pair wire jumper is arc-shaped and the both ends of secondary wire jumper are fixedly connected with
On the anode of chip, the main wire jumper is arc-shaped, and one end of one end of the main wire jumper and secondary wire jumper is connected as a single entity and fixes
On the anode of connection and chip, the other end of the main wire jumper is then fixedly connected on the body with the chip by chip.
The main wire jumper and secondary wire jumper are each made of aluminum.
It is processed according to the following steps：
1), raw material disposal：The copper sheet of sheet is taken, and is processed into the copper strips of strip；
2), preliminary punching：The profile punching of each pin, convergent belt welding foot is first gradually completing by some piercing dies, then
The punching in gap between completion adjacent frame；N body in same frame is still connected as a single entity at this time, passes through between adjacent frame
Top beam is still connected as a single entity, and two convergent belt welding foots in same frame are still connected as a single entity by bottom girder, and two between adjacent frame
Convergent belt welding foot is still connected as a single entity by contiguous block；
3), power bar is unloaded in processing：Block contiguous block punching is unloaded into power bar into two opposite and symmetrically arranged arcs；
4), flange：Complete in frame the flange of last position body side at the same time by flange mold, and convergent belt welding foot with
The processing in the segment difference face between body；
5), finish：The punching in the gap being gradually completing in same frame between adjacent bodies, at this time top beam, bottom girder and
Power bar is unloaded not cut off yet；
6) frame assembly, is processed：At least two frames are taken to cut off the top between adjacent frame assembly as frame assembly
Beam, and cut off and unload power bar between adjacent frame assembly；
7), weld：First the cathode of chip is welded on corresponding body, then the both ends of wire jumper are respectively welded at
On the anode of body and chip；
8), sealing：Packaging body is melted by adhesive supplier and is coated on each frame, hereafter naturally cools to solid-like
State；
9), cut：First complete the cut-out of the top beam between adjacent frame and unload the excision of power bar, then complete on same frame
The excision of top beam, bottom girder；
10), finished product is processed：Preservative treatment is carried out to the pin and convergent belt welding foot extending out to outside packaging body, and will
Convergent belt welding foot bending camber；Finish.
The redesign that the present invention passes through the groove on newly-increased last position body and the position of last position chip so that last position
Chip will carry out heat transfer by two kinds of paths at work：One is reach and fall by the heat transfer of penultimate body
On the pin that number second is fixedly connected；The second is the heat radiation for the heat transfer and chip for passing through wire jumper and last position body, makes
Heat is obtained to eventually arrive on the pin being fixedly connected with last position body.So so that the heat of last position chip respectively by with inverse
Pin that second body is fixedly connected, the pin being fixedly connected with last position body carry out it is outer dissipate so that several pins
Homogeneouslly-radiating can be carried out in chip operation, effectively prevent the local temperature being likely to occur it is excessive (especially with it is second from the bottom
The pin of position body connection) the problem of, and then effectively improve the heat dissipation effect of frame and extend service life so that two poles
The electrical property and stability in use of tube module entirety are significantly enhanced.
Brief description of the drawings
Fig. 1 is the structure diagram of this case middle frame,
Fig. 2 is the left view of Fig. 1,
Fig. 3 is the sectional view along A-A of Fig. 1,
Fig. 4 is the heat dissipation path schematic diagram of prior art middle frame,
Fig. 5 is the heat dissipation path schematic diagram of this case middle frame,
Fig. 6 is the structure diagram of diode (led) module,
Fig. 7 is the stereogram of Fig. 6；
Fig. 8 is the structure diagram of wire jumper in this case；
Fig. 9 is the work flow schematic diagram one of this case,
Figure 10 is the work flow schematic diagram two of this case,
Figure 11 is the work flow schematic diagram three of this case,
Figure 12 is the work flow schematic diagram four of this case,
Figure 13 is the work flow schematic diagram five of this case,
Figure 14 is the work flow schematic diagram six of this case,
Figure 15 is the work flow schematic diagram seven of this case,
Figure 16 is the work flow schematic diagram eight of this case,
Figure 17 is the work flow schematic diagram nine of this case,
Figure 18 is the work flow schematic diagram ten of this case；
1 is frame assembly in figure, and 11 be frame, and 111 be body, and 1111 be body one, and 1112 be body two, and 1113 be this
Body three, 1114 be body four, and 11141 be groove, and 11142 be flange, and 112 be pin, and 113 be convergent belt welding foot, and 1130 are
Segment difference face, 114 be top beam, and 115 be bottom girder, and 116 be to unload power bar, and 2 be chip, and 3 be wire jumper, and 31 be main wire jumper, and 32 be secondary wire jumper,
4 be packaging body.
Embodiment
For the present invention as shown in Fig. 1-18, the frame 11 includes a adjacent bodies successively of n (n be integer) more than 1
111, gap is left between the adjacent body 111, is passed through n body 111 and is concatenated n-1 chip 2, the cathode of the chip 2
It is connected to anode on two adjacent bodies 111, the first body is connected with the cathode of chip 2, the last position body
It is connected with the anode of chip 2, opens up fluted 11141 in the middle part of last position body so that penultimate body stretches into groove
The cathode of in 11141 and last position chip is located in groove 11141.The present invention by the groove on newly-increased last position body and
The redesign of the position of last position chip so that last position chip will carry out heat transfer by two kinds of paths at work：One is
Reached by the heat transfer of penultimate body on the pin being fixedly connected with penultimate；The second is pass through wire jumper and end
The position heat transfer of body and the heat radiation of chip so that heat is eventually arrived on the pin being fixedly connected with last position body.This
Sample so that the heat of last position chip respectively by be fixedly connected with penultimate body pin, be fixedly connected with last position body
Pin carry out it is outer dissipate so that several pins can carry out Homogeneouslly-radiating in chip operation, effectively prevent to go out
The problem of existing local temperature excessive (pin being especially connected with penultimate body), and then effectively improve frame
Heat dissipation effect simultaneously extends service life so that the electrical property and stability in use of diode (led) module entirety have obtained significantly carrying
Rise.
The side of each body 111 is fixedly connected with pin 112 and company is fixed in the side of wherein two bodies 111
Convergent belt welding foot 113 is connected to, segment difference face 1130 is equipped between the body 111 and convergent belt welding foot.This case will also be existing
Double segment difference faces in technology are changed to single hop difference face, its benefit is that product can be delivered to external connection faster during fever
Material, reduce the temperature of product.
Some capillary grooves one, the body 111 and convergent belt welding foot 113 are equipped between the body 111 and pin 112
Between be equipped with some capillary grooves two.The section of the capillary groove one and capillary groove two may be designed to V-shaped, semicircle or trapezoidal.
The end position body is equipped with backwards to a side end face of groove 11141 to be connected as a single entity flange 11142 with last position body.
Due to the structural adjustment of last position body so that the transverse width of the slot bottom side of groove is too small, is processing and is subsequently making
The structural strength and stability of used time cannot effectively ensure, in this regard, the last position sheet of design that this case passes through flange
Body can obtain enough structural strength and stability when processing includes follow-up use.
The flange 11142 and last position body are perpendicular.Measured through experiment, at this time, the structural strength of last position body is best,
And convenience is best when processing and follow-up use, is optimum embodiment.
This case can be with different shapes such as eight three bodies, two chips, six bodies, five chips or nine bodies chips
In the presence of therefore, below for ease of describing, understanding, being illustrated with four bodies, do representative explanation：The frame include four according to
Secondary adjacent body 111, four bodies are divided into body 1, body 2 1112, body 3 1113 and body four
1114, the body 1 is equipped with a cathode tie point, and the body 2 1112 is being equipped with an anode tie point and one just
Pole tie point, the body 3 1113 are equipped with an anode tie point and a cathode tie point, and the body 4 1114 is equipped with
Anode tie point so that three chips 2 are sequentially connected in series between four bodies 111 by wire jumper, the middle part of body 4 1114
Fluted 11141 are opened up, the cathode tie point that the body 3 1113 stretches into groove 11141 and on body 3 1113 is located at
In groove 11141.As shown in figure 5, the redesign by the position of cathode tie point on groove and body three so that cathode
The chip being connected on body three will carry out heat transfer by two kinds of paths at work：One is passed by the heat of body three
It is delivered to up on the pin being fixedly connected with body three；The second is the hot spoke for the heat transfer and chip for passing through wire jumper and body four
Penetrate so that heat is eventually arrived on the pin being fixedly connected with body four.So so that cathode is connected to the core on body three
The heat of piece is outer scattered by the pin being fixedly connected with body three, the pin being fixedly connected with body four progress respectively, so that
Four pins can carry out Homogeneouslly-radiating in chip operation, effectively prevent the problem of local temperature being likely to occur is excessive, into
And effectively improve the heat dissipation effect of frame and extend service life.
Table 1 below, which is that application is artificial, proves above-mentioned theory, the data obtained when actually measuring：(a, b, c, d represent respectively with
Four pins that body four, body three, body two, body one are fixedly connected)：
Table 1
As seen from the above table, heat dissipation of this case compared to the prior art a, b, c, d everywhere is more uniformly distributed, and does not occur certain
Locate the problem of temperature is excessive.The purpose of Homogeneouslly-radiating can be carried out in chip operation by realizing pin, avoided and be likely to occur
Local temperature it is excessive the problems such as.
The diode (led) module includes frame 11, n-1 chip 2, n-1 roots wire jumper 3 and packaging body 4, and the frame 11 wraps
Include n body 111；
The cathode of the n-1 chips 2 is respectively fixedly connected with the first body to penultimate body and n-1 is a
The one end of the anode of the chip 2 respectively with n-1 roots wire jumper 3 is fixedly connected, and n-1 is with the described one end of wire jumper 3 away from chip 2 point
Positive number second body is not fixedly connected on to last position body；
The middle part of the n bodies 111 offered glue hole, and the packaging body 4 is coated on outside n body 111 and draws
Foot 112 and convergent belt welding foot 113 are extend out to outside packaging body 4.
The wire jumper 3 divides for main wire jumper 31 and secondary wire jumper 32, and the pair wire jumper 32 is arc-shaped and the both ends of secondary wire jumper 32 are equal
It is fixedly connected on the anode of chip 2, the main wire jumper 31 is arc-shaped, one end of the main wire jumper 31 and one end of secondary wire jumper 32
It is connected as a single entity and is fixedly connected and on the anode of chip 2, the other end of the main wire jumper 31 is then fixedly connected on and the chip 2
On an adjacent body 111.Since the connection of wire jumper and chip exists usually in the form of welding, " double bars in this case
The structural form of line " simply, can be lifted effectively between contact area and wire jumper and the chip of wire jumper and chip anode
Bonding strength, so that its VF value (forward voltage) be greatly reduced, (since temperature is lower, the electric current passed through is bigger with temperature rise；Therefore
Temperature rise is lower, and electrical property is better) so that diode (led) module integrally has better electrical property.
The main wire jumper 31 and secondary wire jumper 32 are each made of aluminum.In addition, used mostly to ensure electrical property in the prior art
Material of the silver as wire jumper, due to the use of the structural form of above-mentioned " double jump line " in this case, therefore replaces silver using aluminium, from
And on the premise of it ensure that electrical property, significantly reduce manufacture cost.
Table 2 below, which is that application is artificial, proves above-mentioned theory, the data obtained when actually measuring：
Table 2
As seen from the above table, by the double jump line form of this case, even if changing wire jumper material into aluminium by silver, it is being machined
Excessive change does not occur yet for electrical property afterwards, it is achieved thereby that on the premise of electrical property is ensured, manufacture cost is greatly reduced
Purpose.
The processing technology of diode (led) module, is processed according to the following steps：
1), raw material disposal：As shown in figure 9, taking the copper sheet of sheet, and it is processed into the copper strips of strip；
2), preliminary punching：As shown in Figure 10, each pin 112, convergent belt welding foot are first gradually completing by some piercing dies
113 profile punching, then complete the punching in gap between adjacent frame 11；The n body 111 in same frame is still linked as at this time
Integrally, still it is connected as a single entity by top beam 114 between adjacent frame 11, two convergent belt welding foots 113 in same frame 11 pass through
Bottom girder 115 is still connected as a single entity, and two convergent belt welding foots 113 between adjacent frame 11 are still connected as a single entity by contiguous block；At this time,
The structural strength of " copper strips " entirety is effectively guaranteed by top beam, bottom girder and contiguous block, and it is steady in following process
It is qualitative；
3), power bar is unloaded in processing：As shown in figure 11, by block contiguous block punching into two opposite and symmetrically arranged arcs
Unload power bar 116；Due in next flange step, will be processed one by one to frame, therefore, the presence of segment difference face and flange will
Great distorting stress, serious or even damage frame are brought between adjacent two frame；In this regard, this case is advance in this step
Process two and unload power bar, in this way, in the difference in height (being caused by the convergent belt welding foot of diverse location) in face of adjacent frame, can
Offset by two distracting actions unloaded in the middle part of power bar；And it can then be carried out in adjacent frame by unloading the contraction of power bar when high
Reset, to avoid the influence to following process；
4), flange：As shown in figure 12, the flange 11142 of last position body side in frame is completed at the same time by flange mold, with
And the processing in the segment difference face 1130 between convergent belt welding foot 113 and body 111；
5), finish：The punching in the gap being gradually completing in same frame 11 between adjacent bodies, at this time top beam 114, bottom
Beam 115 and unload power bar 116 and do not cut off yet；And the punching of mounting hole in each pin, convergent belt welding foot is completed, and in each body
Cross the punching in glue hole；
6) frame assembly, is processed：As shown in Figure 13,14, at least two frames 11 are taken to be used as frame assembly 1, cut-out is adjacent
Top beam 114 between frame assembly 1, and cut off and unload power bar 116 between adjacent frame assembly 1；To ensure following process phase
Structural strength between adjacent body, and the clamping convenience etc. during processing, this case at least will be unified into a frame by two frames
Assembly, and processed in hereafter using frame assembly as carrier into accommodating, stable, efficient；
7), weld：As shown in figure 15, first the cathode of chip 2 is welded on corresponding body 111, then by wire jumper 3
Both ends be respectively welded on the anode of body 111 and chip 2；
8), sealing：As shown in figure 16, packaging body 4 is melted by adhesive supplier and be coated on each frame 11, hereafter certainly
So it is cooled to solid state；
9), cut：As shown in Figure 17,18, first complete the cut-out of the top beam 114 between adjacent frame 11 and unload power bar 116
Excision, then complete the excision of top beam 114, bottom girder 115 on same frame；
10), finished product is processed：As shown in figure 18, the pin 112 and convergent belt welding foot 113 to extending out to outside packaging body 4
Preservative treatment is carried out, and by 113 bending camber of convergent belt welding foot；Finish.
Claims (9)
1. a kind of processing method of the diode (led) module comprising frame, the frame includes n adjacent bodies successively, adjacent institute
State and leave gap between body, n-1 chip is concatenated by n body, the cathode and anode of the chip are connected to phase
On two adjacent bodies, it is characterised in that the cathode of the first body and chip connects, the anode of the last position body and chip
Connect, opened up in the middle part of last position body fluted so that penultimate body stretches into the cathode position of in groove and last position chip
In in groove；
It is processed according to the following steps：
1）, raw material disposal：The copper sheet of sheet is taken, and is processed into the copper strips of strip；
2）, preliminary punching：The profile punching of each pin, convergent belt welding foot is first gradually completing by some piercing dies, then is completed
The punching in gap between adjacent frame；N body in same frame is still connected as a single entity at this time, passes through top beam between adjacent frame
Still it is connected as a single entity, two convergent belt welding foots in same frame are still connected as a single entity by bottom girder, two confluences between adjacent frame
Tape welding pin is still connected as a single entity by contiguous block；
3）, processing unload power bar：Block contiguous block punching is unloaded into power bar into two opposite and symmetrically arranged arcs；
4）, flange：Complete the flange of last position body side in frame, and convergent belt welding foot and body at the same time by flange mold
Between segment difference face processing；
5）, finishing：The punching in the gap being gradually completing in same frame between adjacent bodies, top beam, bottom girder and unloads power at this time
Bar is not cut off yet；
6）, processing frame assembly：At least two frames are taken as frame assembly, cut off the top beam between adjacent frame assembly, and
Power bar is unloaded between excision adjacent frame assembly；
7）, welding：First the cathode of chip is welded on corresponding body, then the both ends of wire jumper are respectively welded at body
On the anode of chip；
8）, sealing：Packaging body is melted by adhesive supplier and is coated on each frame, hereafter naturally cools to solid state；
9）, cutting：First complete the cut-out of the top beam between adjacent frame and unload the excision of power bar, then complete to push up on same frame
The excision of beam, bottom girder；
10）, finished product processing：Preservative treatment is carried out to the pin and convergent belt welding foot extending out to outside packaging body, and will confluence
Tape welding pin is bent into arc；Finish.
A kind of 2. processing method of diode (led) module comprising frame according to claim 1, it is characterised in that Mei Yisuo
The side for stating body is fixedly connected with the sides of pin and wherein two bodies and is fixedly connected with convergent belt welding foot, described
Segment difference face is equipped between body and convergent belt welding foot.
3. the processing method of a kind of diode (led) module comprising frame according to claim 2, it is characterised in that described
Some capillary grooves one are equipped between body and pin, some capillary grooves two are equipped between body and the convergent belt welding foot.
A kind of 4. processing method of diode (led) module comprising frame according to claim 2, it is characterised in that the end
Position body is equipped with backwards to a side end face of groove and is connected as a single entity flange with last position body.
5. the processing method of a kind of diode (led) module comprising frame according to claim 4, it is characterised in that described to turn over
Side and last position body are perpendicular.
A kind of 6. processing method of diode (led) module comprising frame according to claim 1, it is characterised in that the frame
Frame includes four adjacent bodies successively, and four bodies are divided into body one, body two, body three and body four, institute
State body one and be equipped with a cathode tie point, the body two is equipped with an anode tie point and a cathode tie point, described
Body three is equipped with an anode tie point and a cathode tie point, and the body four is equipped with anode tie point so that three chips
It is sequentially connected in series by wire jumper between four bodies, the middle part of the body four opens up fluted, the body three stretched into groove,
And the cathode tie point on body three is located in groove.
7. the processing method of a kind of diode (led) module comprising frame according to claim 4, it is characterised in that described two
Pole pipe module includes frame, n-1 chip, n-1 roots wire jumper and packaging body, and the frame includes n body；
The cathode of the n-1 chips is respectively fixedly connected with the first body to penultimate body and the n-1 cores
The one end of the anode of piece respectively with n-1 root wire jumpers is fixedly connected, and n-1 is respectively fixedly connected with the one end of the wire jumper away from chip
On positive number second body to last position body；
The middle part of the n bodies offered glue hole, and the packaging body coats are in n this external and pin and convergent belt
Welding foot is extend out to outside packaging body.
A kind of 8. processing method of diode (led) module comprising frame according to claim 7, it is characterised in that the jump
Line is divided into main wire jumper and secondary wire jumper, and the pair wire jumper is arc-shaped and the both ends of secondary wire jumper are fixedly connected with the anode of chip,
The main wire jumper is arc-shaped, and one end of the main wire jumper is connected as a single entity with one end of secondary wire jumper and is fixedly connected negative with chip
On extremely, the other end of the main wire jumper is then fixedly connected on the body with the chip by chip.
A kind of 9. processing method of diode (led) module comprising frame according to claim 8, it is characterised in that the master
Wire jumper and secondary wire jumper are each made of aluminum.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510767894.1A CN105280585B (en) | 2015-11-11 | 2015-11-11 | A kind of processing technology of frame, the diode (led) module comprising the frame and diode (led) module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510767894.1A CN105280585B (en) | 2015-11-11 | 2015-11-11 | A kind of processing technology of frame, the diode (led) module comprising the frame and diode (led) module |
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| Publication Number | Publication Date |
|---|---|
| CN105280585A CN105280585A (en) | 2016-01-27 |
| CN105280585B true CN105280585B (en) | 2018-04-13 |
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| CN201510767894.1A Active CN105280585B (en) | 2015-11-11 | 2015-11-11 | A kind of processing technology of frame, the diode (led) module comprising the frame and diode (led) module |
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| CN105895592B (en) * | 2016-06-24 | 2018-11-16 | 扬州扬杰电子科技股份有限公司 | A kind of processing technology of frame, the diode comprising the frame and diode |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103022188A (en) * | 2011-09-20 | 2013-04-03 | 无锡尚德太阳能电力有限公司 | Photovoltaic junction box |
| CN203288626U (en) * | 2013-06-19 | 2013-11-13 | 扬州扬杰电子科技股份有限公司 | Novel photovoltaic diode integrated module |
| CN204652304U (en) * | 2015-06-04 | 2015-09-16 | 扬州扬杰电子科技股份有限公司 | Novel frame |
| CN205105154U (en) * | 2015-11-11 | 2016-03-23 | 扬州扬杰电子科技股份有限公司 | Frame, contain diode module of this frame |
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| DE102005034485B4 (en) * | 2005-07-20 | 2013-08-29 | Infineon Technologies Ag | Connecting element for a semiconductor device and method for producing a semiconductor power device |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103022188A (en) * | 2011-09-20 | 2013-04-03 | 无锡尚德太阳能电力有限公司 | Photovoltaic junction box |
| CN203288626U (en) * | 2013-06-19 | 2013-11-13 | 扬州扬杰电子科技股份有限公司 | Novel photovoltaic diode integrated module |
| CN204652304U (en) * | 2015-06-04 | 2015-09-16 | 扬州扬杰电子科技股份有限公司 | Novel frame |
| CN205105154U (en) * | 2015-11-11 | 2016-03-23 | 扬州扬杰电子科技股份有限公司 | Frame, contain diode module of this frame |
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