CN105274478A - Method for electroplating plastic with electromagnetic anti-radiation layer - Google Patents

Method for electroplating plastic with electromagnetic anti-radiation layer Download PDF

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Publication number
CN105274478A
CN105274478A CN201510654234.2A CN201510654234A CN105274478A CN 105274478 A CN105274478 A CN 105274478A CN 201510654234 A CN201510654234 A CN 201510654234A CN 105274478 A CN105274478 A CN 105274478A
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China
Prior art keywords
gas
evaporation
frequency discharge
product
continues
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CN201510654234.2A
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Chinese (zh)
Inventor
王寒骁
席锦华
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Jiangsu Xinsida Electronic Co Ltd
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Jiangsu Xinsida Electronic Co Ltd
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Priority to CN201510654234.2A priority Critical patent/CN105274478A/en
Priority to CN202010471434.5A priority patent/CN111441018A/en
Publication of CN105274478A publication Critical patent/CN105274478A/en
Pending legal-status Critical Current

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Abstract

The invention discloses a method for electroplating plastic with an electromagnetic anti-radiation layer. A plastic product is installed on an evaporation plating device; an evaporation material is put in the evaporation plating device; vacuumization is performed to 6*10<-3> Pa; Ar gas is introduced to 1*10<-1> Pa; continuous radio-frequency discharge is performed so as to ionize all the Ar gas in an ionic state; the evaporation material starts to be powered on, meanwhile the Ar gas is introduced continuously, and continuous radio-frequency discharge is performed; the vacuum degree is maintained at 4*10<-2> Pa; a Cu material is evaporated, and after a 1-minute interval, an IS material is evaporated; and the atmosphere is introduced, so that the whole evaporating process is finished. By the adoption of the method, the deep product can be well machined; the evaporation plating device low in price is used for finishing the product with the performance equivalent to that of sputtering; and a standardized electroplating process is adopted, operation is facilitated, and cost is saved.

Description

A kind of method of electroplating electromagnetism radiation protective layer on plastic cement
Technical field
The invention belongs to application and technical field of vacuum plating, relate to a kind of method of electroplating electromagnetism radiation protective layer, be specifically related to a kind of method of electroplating electromagnetism radiation protective layer on plastic cement.
Background technology
If need the effect reaching inside and outside shielding in product design process, chemical plating, direct spraying electric conduction paint, evaporation coating, sputter can be taked, utilize the direct injection moulding of the conductivity of carbon fiber, electro-conductive material, directly use the multiple methods such as metal shell.But the aspects such as synthesized environmental protection, the mode that wherein most important index electroconductibility is best mainly contains 3 kinds: directly use metal shell, evaporation plating and sputter.
Direct use metal shell, cost is higher, especially complicated for shape matching and have the product of more void column, is difficult to reach.Compare from all kinds of cost performance, sputter and evaporation plating are reasonable selections.
Sputter coating (sputter): in vacuum chamber, discharges to Ar gas (argon gas), forms Ar +, then plated film target end is arranged to negative pole, product is placed in positive pole.Ar +with the target on high speed bombardment positive pole, the atom bombardment of metal targets is departed from, directive product surface, constantly repeatedly, complete the sputter of product surface, if there is multiple target electrode, can sputter multiple material.But sputter, owing to belonging to bombardment deposition, has certain restriction for the degree of depth, if need to reach very high shielding effect simultaneously, its sputtering time can be long.
Vacuum steams (evaporation plating): in vacuum chamber, be positioned over by evaporating materials in heating material, simultaneously by electrified regulation heater strip, evaporated metal, deposits.Although evaporation plating technology and equipment is simple, effect is worse than sputter.
Summary of the invention
In view of this, the object of the invention is to the equipment utilizing evaporation plating, use for reference the principle of sputter, provide a kind of performance to be better than sputter, cost plates the suitable method of electroplating electromagnetism radiation protective layer on plastic cement with evaporation.
For achieving the above object, the invention provides following technical scheme:
Method of electroplating electromagnetism radiation protective layer on plastic cement of the present invention, comprises the steps:
Plastic cement products is installed on evaporation coating apparatus, drops into evaporating materials, be evacuated to 6 × 10 -3pa, logical Ar gas to 1 × 10 -1pa, continues radio frequency discharge and Ar gas is all ionized into ionic condition, start the evaporating materials that is energized, continue to pass into Ar gas simultaneously, and continue radio frequency discharge, keeps vacuum tightness 4 × 10 -2pa, evaporation Cu material, 1 minute, interval, evaporation IS material, logical air, completes and wholely steams process.
Preferably, 1000W radio frequency discharge 3 minutes, is all ionized into ionic condition by Ar gas.
Preferably, add 160V voltage, continue 140s and evaporate Cu material.
Preferably, add 80V voltage, continue 60s and evaporate IS material.
Preferably, surface of plastic product to be processed is carried out further coarse process to be placed in evaporation coating apparatus.
Method of electroplating electromagnetism radiation protective layer on plastic cement of the present invention, because RF discharge sustain has been evaporated to material, in whole metal evaporation stage, the sidewall being beneficial to darker product also can be electroplated preferably and obtain good effect, can ensure degree of depth 5cm completely, the resistance between sidewall 1cm 2 is within 0.5 ohm.The method can well the darker product of working depth; The relatively low evaporation coating apparatus of price is used to complete the performance product suitable with sputter; Standardized electroplating technology, is beneficial to operation, cost-saving.
Embodiment
Be described in detail to the technical scheme in the embodiment of the present invention below, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, the every other embodiment that those of ordinary skill in the art obtain under the prerequisite not making creative work, all belongs to the scope of protection of the invention.
Embodiment 1
Plastic cement products is installed on evaporation coating apparatus, drops into evaporating materials, be evacuated to 6 × 10 -3pa, logical Ar gas to 1 × 10 -1pa, 1000W radio frequency discharge 3 minutes, is all ionized into ionic condition by Ar gas, starts the evaporating materials that is energized, and continues to pass into Ar gas simultaneously, and continues radio frequency discharge, keeps vacuum tightness 4 × 10 -2pa, evaporation Cu material, 1 minute, interval, evaporation IS material, logical air, completes and wholely steams process.
Embodiment 2
Plastic cement products is installed on evaporation coating apparatus, drops into evaporating materials, be evacuated to 6 × 10 -3pa, logical Ar gas to 1 × 10 -1pa, 1000W radio frequency discharge 3 minutes, is all ionized into ionic condition by Ar gas, starts the evaporating materials that is energized, and continues to pass into Ar gas simultaneously, and continues radio frequency discharge, keeps vacuum tightness 4 × 10 -2pa, adds 160V voltage, continues 140s and evaporates Cu material, 1 minute, interval, evaporation IS material, logical air, completes wholely to steam process.
Embodiment 3
Plastic cement products is installed on evaporation coating apparatus, drops into evaporating materials, be evacuated to 6 × 10 -3pa, logical Ar gas to 1 × 10 -1pa, 1000W radio frequency discharge 3 minutes, is all ionized into ionic condition by Ar gas, starts the evaporating materials that is energized, and continues to pass into Ar gas simultaneously, and continues radio frequency discharge, keeps vacuum tightness 4 × 10 -2pa, adds 160V voltage, and continue 140s and evaporate Cu material, 1 minute, interval, adds 80V voltage, continues 60s and evaporates IS material, logical air, completes wholely to steam process.
By the ionization of Ar gas, clean product surface; Surface of plastic product to be processed can be carried out further coarse process, be beneficial to the attachment of metal, steaming rear hundred lattice tape test results is 5B.
Because RF discharge sustain has been evaporated to material, so in whole metal evaporation stage, the sidewall being beneficial to darker product also can be electroplated preferably and obtain good effect, and can ensure degree of depth 5cm completely, the resistance between sidewall 1cm 2 is within 0.5 ohm.
Contriver studies through a large amount of tests, sums up general electroplating technology of the present invention, does not need to adjust according to different products, can realize normalizing operation.
In those skilled in the art, obviously the invention is not restricted to the details of above-mentioned one exemplary embodiment, and when not deviating from spirit of the present invention or essential characteristic, the present invention can be realized in other specific forms.Therefore, no matter from which point, all should embodiment be regarded as exemplary, and be nonrestrictive, scope of the present invention is limited by claims instead of above-mentioned explanation, and all changes be therefore intended in the implication of the equivalency by dropping on claim and scope are included in the present invention.
In addition, be to be understood that, although this specification sheets is described according to embodiment, but not each embodiment only comprises an independently technical scheme, this narrating mode of specification sheets is only for clarity sake, those skilled in the art should by specification sheets integrally, and the technical scheme in each embodiment also through appropriately combined, can form other embodiments that it will be appreciated by those skilled in the art that.

Claims (5)

1. on plastic cement, electroplate a method for electromagnetism radiation protective layer, it is characterized in that, comprise the steps:
Plastic cement products is installed on evaporation coating apparatus, drops into evaporating materials, be evacuated to 6 × 10 -3pa, logical Ar gas to 1 × 10 -1pa, continues radio frequency discharge and Ar gas is all ionized into ionic condition, start the evaporating materials that is energized, continue to pass into Ar gas simultaneously, and continue radio frequency discharge, keeps vacuum tightness 4 × 10 -2pa, evaporation Cu material, 1 minute, interval, evaporation IS material, logical air, completes and wholely steams process.
2. method according to claim 1, is characterized in that: 1000W radio frequency discharge 3 minutes, is all ionized into ionic condition by Ar gas.
3. method according to claim 1, is characterized in that: add 160V voltage, continues 140s and evaporates Cu material.
4. method according to claim 1, is characterized in that: add 80V voltage, continues 60s and evaporates IS material.
5. method according to claim 1, is characterized in that: surface of plastic product to be processed is carried out further coarse process and be placed in evaporation coating apparatus.
CN201510654234.2A 2015-10-10 2015-10-10 Method for electroplating plastic with electromagnetic anti-radiation layer Pending CN105274478A (en)

Priority Applications (2)

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CN201510654234.2A CN105274478A (en) 2015-10-10 2015-10-10 Method for electroplating plastic with electromagnetic anti-radiation layer
CN202010471434.5A CN111441018A (en) 2015-10-10 2015-10-10 Method for electroplating electromagnetic radiation-proof layer on plastic

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CN201510654234.2A CN105274478A (en) 2015-10-10 2015-10-10 Method for electroplating plastic with electromagnetic anti-radiation layer

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109637766A (en) * 2018-12-21 2019-04-16 广州天极电子科技有限公司 A kind of method of adjustment of tantalum nitride membrane resistor resistance value
CN109666896A (en) * 2019-02-02 2019-04-23 江苏新思达电子有限公司 A kind of electromagnetism radiation protective layer EMI technique of the vacuum plating NI on plastic cement
CN109666895A (en) * 2019-02-02 2019-04-23 江苏新思达电子有限公司 A kind of electromagnetism radiation protective layer EMI technique of the vacuum plating Ag on plastic cement
CN109811315A (en) * 2019-02-02 2019-05-28 江苏新思达电子有限公司 A kind of technique of the enhancing surface roughness of the vacuum plating NI on hard disk

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CN103132024A (en) * 2013-03-12 2013-06-05 太仓协乐高分子材料有限公司 Surface metallization process for plastic products
CN103147045A (en) * 2013-03-27 2013-06-12 东莞劲胜精密组件股份有限公司 Metallized surface decorative finishing method of plastic shell
CN103510049A (en) * 2013-09-22 2014-01-15 东莞劲胜精密组件股份有限公司 Treatment method allowing plastic surface to have high metal texture

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DE69317035T2 (en) * 1992-11-09 1998-06-10 Chugai Ings Co Manufacturing process of a molded plastic body with electromagnetic shielding
TW529467U (en) * 2002-09-11 2003-04-21 Nano Electronics And Micro Sys Plating of heat dissipating plate by BGA or CSP sealing
CN1209953C (en) * 2004-01-15 2005-07-06 北京东明化学工业有限公司 Preparing method for surface electromagnetic screening membrane layer in plastic mobile shell

Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
CN103132024A (en) * 2013-03-12 2013-06-05 太仓协乐高分子材料有限公司 Surface metallization process for plastic products
CN103147045A (en) * 2013-03-27 2013-06-12 东莞劲胜精密组件股份有限公司 Metallized surface decorative finishing method of plastic shell
CN103510049A (en) * 2013-09-22 2014-01-15 东莞劲胜精密组件股份有限公司 Treatment method allowing plastic surface to have high metal texture

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109637766A (en) * 2018-12-21 2019-04-16 广州天极电子科技有限公司 A kind of method of adjustment of tantalum nitride membrane resistor resistance value
CN109637766B (en) * 2018-12-21 2021-01-05 广州天极电子科技有限公司 Method for adjusting resistance value of tantalum nitride film resistor
CN109666896A (en) * 2019-02-02 2019-04-23 江苏新思达电子有限公司 A kind of electromagnetism radiation protective layer EMI technique of the vacuum plating NI on plastic cement
CN109666895A (en) * 2019-02-02 2019-04-23 江苏新思达电子有限公司 A kind of electromagnetism radiation protective layer EMI technique of the vacuum plating Ag on plastic cement
CN109811315A (en) * 2019-02-02 2019-05-28 江苏新思达电子有限公司 A kind of technique of the enhancing surface roughness of the vacuum plating NI on hard disk

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Application publication date: 20160127