CN109811315A - A kind of technique of the enhancing surface roughness of the vacuum plating NI on hard disk - Google Patents
A kind of technique of the enhancing surface roughness of the vacuum plating NI on hard disk Download PDFInfo
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- CN109811315A CN109811315A CN201910106012.5A CN201910106012A CN109811315A CN 109811315 A CN109811315 A CN 109811315A CN 201910106012 A CN201910106012 A CN 201910106012A CN 109811315 A CN109811315 A CN 109811315A
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Abstract
The technique for the enhancing surface roughness of vacuum plating NI that the invention discloses a kind of on hard disk, comprising the following steps: hard disk product is installed on evaporation coating apparatus, investment evaporation material is evacuated to 6 × 10‑3Pa leads to Ar gas to 1 × 10‑1Pa continues radio frequency discharge for Ar gas and is all ionized into ionic condition, be initially powered up evaporation material, while being continually fed into Ar gas, and continue radio frequency discharge, keeps vacuum degree 4 × 10‑2Pa evaporates Cu material, is spaced 12 minutes, evaporates NI material, leads to atmosphere, completes entirely to steam process.A kind of technology utilization of the enhancing surface roughness of the vacuum plating NI on hard disk of the present invention equipment of evaporation plating, has used for reference the principle of sputter, performance is better than sputter, and cost is suitable with plating is evaporated.
Description
Technical field
The invention belongs to coating and technical field of vacuum plating more particularly to a kind of enhancings of the vacuum plating NI on hard disk
The technique of surface roughness.
Background technique
If needing to achieve the effect that inside and outside shields in product design process, electroless plating, direct spraying can be taken
Conductive paint evaporation coating, sputter, is directly molded using electric conductivity, the conductive material of carbon fiber, directly using metal shell etc.
A variety of methods.But synthesized environmental protection etc., the best mode of most important one index electric conductivity mainly have 3 kinds: directly making
With metal shell, evaporation plating and sputter.
Metal shell, higher cost are directly used, product that is more complicated particularly with shape and having more void column is difficult
Reach.Compare from all kinds of cost performances, sputter and evaporation plating are relatively good selections.
Sputter coating (sputter): in vacuum chamber, to Ar(argon gas) it discharges, Ar+ is formed, then by plated film target end
It is arranged to cathode, product is placed in anode.Ar+ is with the target on high speed bombardment anode, by the atom bombardment of metal targets
Be detached from, directive product surface constantly repeatedly completes the sputter of product surface, if there is multiple target electrodes, can sputter it is a variety of
Material.But sputter has depth certain limitation, while reaching very high shielding if necessary due to belonging to bombardment deposition
Effect, sputtering time can be long.
Vacuum steams and (evaporates plating): in vacuum chamber, evaporation material being placed in heating material, while being added by being powered
Hot heater strip, evaporated metal are deposited.Although evaporation plating technique and equipment are simple, effect is worse than sputter.
Summary of the invention
It is an object of the invention to the equipment using evaporation plating, use for reference the principle of sputter, provide a kind of performance better than sputter,
Cost and the comparable method that electromagnetism radiation protective layer is electroplated on plastic cement of evaporation plating.
To achieve the goals above, the enhancing table of the technical scheme is to design a kind of on hard disk vacuum plating NI
The technique of surface roughness, comprising the following steps: hard disk product is installed on evaporation coating apparatus, investment evaporation material vacuumizes
To 6 × 10-3Pa leads to Ar gas to 1 × 10-1Pa continues radio frequency discharge for Ar gas and is all ionized into ionic condition, is initially powered up steaming
Material is sent out, while being continually fed into Ar gas, and continue radio frequency discharge, keeps vacuum degree 4 × 10-2Pa evaporates Cu material, interval 12
Minute, NI material is evaporated, atmosphere is led to, completes entirely to steam process.
Preferably, Ar gas is all ionized into ionic condition by 1200W radio frequency discharge 5 minutes.
Preferably, add 160V voltage, continue 140s and evaporate Cu material.
Preferably, add 85V voltage, continue 120s and evaporate NI material.
Preferably, harddisk surface cleaning to be processed is placed in evaporation coating apparatus.
The advantages and beneficial effects of the present invention are: the enhancing surface of vacuum plating NI on hard disk of the invention a kind of is thick
The technique of rugosity, since RF electric discharge continues to that material evaporation is completed, in entire metal evaporation stage, conducive to the side of deeper product
Wall also can preferably be electroplated and obtain good effect, can guarantee that depth 5cm, the resistance between side wall 1cm two o'clock exist completely
Within 0.3 ohm.This method can be very good the deeper product of working depth；It is complete using the relatively low evaporation coating apparatus of price
At performance and the comparable product of sputter；Standardized electroplating technology is conducive to operation, save the cost.
Specific embodiment
With reference to embodiment, the specific embodiment of the present invention is further described.Following embodiment is only used for more
Add and clearly demonstrate technical solution of the present invention, and not intended to limit the protection scope of the present invention.
Embodiment 1
Hard disk product is installed on evaporation coating apparatus, investment evaporation material is evacuated to 6 × 10-3Pa leads to Ar gas to 1 × 10-1Pa, 1200W radio frequency discharge 5 minutes, Ar gas is all ionized into ionic condition, evaporation material is initially powered up, is continually fed into simultaneously
Ar gas, and continue radio frequency discharge, keep vacuum degree 4 × 10-2Pa evaporates Cu material, is spaced 12 minutes, evaporates NI material, leads to
Atmosphere is completed entirely to steam process.
Embodiment 2
Hard disk product is installed on evaporation coating apparatus, investment evaporation material is evacuated to 6 × 10-3Pa leads to Ar gas to 1 × 10-1Pa, 1200W radio frequency discharge 5 minutes, Ar gas is all ionized into ionic condition, evaporation material is initially powered up, is continually fed into simultaneously
Ar gas, and continue radio frequency discharge, keep vacuum degree 4 × 10-2Pa adds 160V voltage, continues 140s and evaporates Cu material, interval 12
Minute, NI material is evaporated, atmosphere is led to, completes entirely to steam process.
Embodiment 3
Hard disk product is installed on evaporation coating apparatus, investment evaporation material is evacuated to 6 × 10-3Pa leads to Ar gas to 1 × 10-1Pa, 1200W radio frequency discharge 5 minutes, Ar gas is all ionized into ionic condition, evaporation material is initially powered up, is continually fed into simultaneously
Ar gas, and continue radio frequency discharge, keep vacuum degree 4 × 10-2Pa adds 160V voltage, continues 140s and evaporates Cu material, interval 12
Minute, add 85V voltage, continue 120s and evaporate NI material, lead to atmosphere, completes entirely to steam process.
Ar gas is ionized, product surface has been cleaned；Special substance harddisk surface to be processed can be carried out further
Coarse processing, conducive to the attachment of metal, steaming rear hundred lattice tape test result is 5B.
Since RF electric discharge continues to that material evaporation is completed, so in entire metal evaporation stage, conducive to deeper product
Side wall also can preferably be electroplated and obtain good effect, can guarantee depth 5cm, the resistance between side wall 1cm two o'clock completely
Within 0.3 ohm.
Inventor sums up general electroplating technology of the invention, does not need according to difference by largely studying
Product be adjusted, normalizing operation may be implemented.
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, Er Qie
In the case where without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is by appended power
Benefit requires rather than above description limits, it is intended that all by what is fallen within the meaning and scope of the equivalent elements of the claims
Variation is included within the present invention.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiments being understood that.
Claims (5)
1. a kind of technique of the enhancing surface roughness of the vacuum plating NI on hard disk, which comprises the following steps: will
Hard disk product is installed on evaporation coating apparatus, and investment evaporation material is evacuated to 6 × 10-3Pa leads to Ar gas to 1 × 10-1Pa is held
Ar gas is all ionized into ionic condition by continuous radio frequency discharge, is initially powered up evaporation material, while being continually fed into Ar gas, and persistently penetrate
Frequency discharges, and keeps vacuum degree 4 × 10-2Pa evaporates Cu material, is spaced 12 minutes, evaporates NI material, leads to atmosphere, completes entire
Steam process.
2. a kind of technique of the enhancing surface roughness of vacuum plating NI on hard disk according to claim 1, feature
It is, continuing radio frequency discharge for the condition that Ar gas is all ionized into ionic condition is 1200W radio frequency discharge 5 minutes.
3. a kind of technique of the enhancing surface roughness of vacuum plating NI on hard disk according to claim 1, feature
It is, the condition of evaporation Cu material is to add 160V voltage, continues 140s.
4. a kind of technique of the enhancing surface roughness of vacuum plating NI on hard disk according to claim 1, feature
It is, the condition of evaporation NI material is to add 85V voltage, continues 120s.
5. a kind of technique of the enhancing surface roughness of vacuum plating NI on hard disk according to claim 1, feature
It is, first cleans hard disk product surface before hard disk product is installed on evaporation coating apparatus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910106012.5A CN109811315A (en) | 2019-02-02 | 2019-02-02 | A kind of technique of the enhancing surface roughness of the vacuum plating NI on hard disk |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910106012.5A CN109811315A (en) | 2019-02-02 | 2019-02-02 | A kind of technique of the enhancing surface roughness of the vacuum plating NI on hard disk |
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| Publication Number | Publication Date |
|---|---|
| CN109811315A true CN109811315A (en) | 2019-05-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910106012.5A Pending CN109811315A (en) | 2019-02-02 | 2019-02-02 | A kind of technique of the enhancing surface roughness of the vacuum plating NI on hard disk |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024012550A1 (en) * | 2022-07-14 | 2024-01-18 | 扬州纳力新材料科技有限公司 | Aluminum composite current collector and preparation method therefor, positive electrode plate, battery, and electric device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000045062A (en) * | 1998-07-28 | 2000-02-15 | Sumitomo Metal Mining Co Ltd | Electromagnetic preventing molding |
| EP1741484A1 (en) * | 2005-07-05 | 2007-01-10 | Samsung Electronics Co., Ltd. | Nanoparticle thin film, method for dispersing nanoparticles and method for producing nanoparticle thin film using the same |
| CN104884251A (en) * | 2012-12-31 | 2015-09-02 | 沙特基础全球技术有限公司 | Metallization and surface coating solution on glass filler high performance amorphous polymer compositions |
| CN105274478A (en) * | 2015-10-10 | 2016-01-27 | 江苏新思达电子有限公司 | Method for electroplating plastic with electromagnetic anti-radiation layer |
-
2019
- 2019-02-02 CN CN201910106012.5A patent/CN109811315A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000045062A (en) * | 1998-07-28 | 2000-02-15 | Sumitomo Metal Mining Co Ltd | Electromagnetic preventing molding |
| EP1741484A1 (en) * | 2005-07-05 | 2007-01-10 | Samsung Electronics Co., Ltd. | Nanoparticle thin film, method for dispersing nanoparticles and method for producing nanoparticle thin film using the same |
| CN104884251A (en) * | 2012-12-31 | 2015-09-02 | 沙特基础全球技术有限公司 | Metallization and surface coating solution on glass filler high performance amorphous polymer compositions |
| CN105274478A (en) * | 2015-10-10 | 2016-01-27 | 江苏新思达电子有限公司 | Method for electroplating plastic with electromagnetic anti-radiation layer |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024012550A1 (en) * | 2022-07-14 | 2024-01-18 | 扬州纳力新材料科技有限公司 | Aluminum composite current collector and preparation method therefor, positive electrode plate, battery, and electric device |
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Application publication date: 20190528 |