CN105273680B - A kind of two-component heat conductive silica gel sheet material and preparation method thereof and equipment - Google Patents
A kind of two-component heat conductive silica gel sheet material and preparation method thereof and equipment Download PDFInfo
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- CN105273680B CN105273680B CN201510799056.2A CN201510799056A CN105273680B CN 105273680 B CN105273680 B CN 105273680B CN 201510799056 A CN201510799056 A CN 201510799056A CN 105273680 B CN105273680 B CN 105273680B
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Abstract
The invention provides a kind of two-component heat conductive silica gel sheet material, including two kinds of components, and component A includes：Dimethyl polysiloxane, polysiloxanes, the copolymer of double hydroxy-end capped dimethyl siloxanes and methyl vinyl silicone, methyl ethylene annular siloxane, heat filling, the epoxide modified silane coupler of double hydroxyalkyls end-blocking of diene base end-blocking；Component B includes：Phenyl hydrogen-containing silicon oil or its mixture, methyl ethylene annular siloxane, platinum group catalyst with containing hydrogen silicone oil；Wherein, the component A and component B are with weight ratio 1:The ratio mixing of (0.7 1).The invention is applied to miniaturization, the heat conduction demand of integrated equipment, on the premise of good combination property is kept, with higher thermal conductivity factor.
Description
Technical field
The invention is related to the synthetically prepared technical field of heat-conducting interface material, more particularly to a kind of to have two-component composition
Organic silicon heat conduction film and preparation method thereof and equipment, it is adaptable to hot transmission and heat between heater element, heat dissipation element
Amount dissipates.
Background technology
, will be integrated more and more in small component with the development of electronic equipment small and functional diversities
Element and function, temperature will be raised quickly during use, be easily caused electronic component hydraulic performance decline, equipment operation speed
Degree slows down, the equipment operation many problems of failure lamp.Therefore, how fast and effeciently will miniaturization, integrated set
More heats of standby middle generation take away one of the important content of discharge as Design of Temperature Control.
Heat-conducting organic silica gel sheet material is the main flow for being used between heating position and radiating position transmit heat in the prior art
Material, with good pliability, electrical insulating property, compressibility, ductility, can be sufficient filling with the table of irregular component
Face, eliminates air, increase contact area, spacing insulation, sealedly antidetonation, effect, are the reasons of heat transfer material in electronic equipment
Think selection.
In the prior art organosilicon Heat Conduction Material mostly by base material of organic silica gel, add heat filling and be aided with various help
Obtained after the one-component mixture material that agent is obtained, repressed shaping, cross cutting, infrared or vulcanizable cures.But in the prior art
Organosilicon Heat Conduction Material have the disadvantage that：(1) because mixture material is one-component material, the addition of heat filling
It is restricted, the limitation of heat filling content causes the heat conductivility of heat conductive silica gel sheet material to be restricted in unit volume, it is difficult to
Adapt to the discharge requirement of more heats, existing heat conductive silica gel sheet material thickness limit value heat-conducting silica gel sheet under 0.3mm, this thickness
The thermal conductivity factor of material is typically up to only capable of reaching 1.5W/mK；(2) because mixture material is one-component material, heat conductive silica gel
The storage stability of raw material also has certain limitation in sheet material preparation process, and uneven phenomenon is solidified while being easily caused,
Usually need to add inhibitor in compositing formula to extend the storage stability of compositing formula and avoid solidification uneven, and suppress
The addition of agent needs strictly to control, it is to avoid produce influence to performance；(3) because increasing heat conducting element is using special-shaped
Shape and structure (such as "convex" shaped), obtained heat conductive silica gel sheet material of the prior art generally requires to cut to adapt to heat conducting element
Shape and structure, substantial amounts of spillage of material and waste will be caused by cutting, and for the heater of special-shaped shape and structure, only be cut
And the loss caused may be up to more than 30%；(4) heat conductive silica gel sheet material solidification process generally requires to be vulcanized and adds vulcanization
Agent, causes serious environmental pollution, is unfavorable for environmental protection and health, though infrared curing is without too many environmental problem,
But solidification process and time uncontrollable problem are still suffered from, is unfavorable for the adjustment of production.
The content of the invention
The invention provides a kind of two-component heat conductive silica gel sheet material, especially first to solve the problems of the prior art
Miniaturization, the heat conduction demand of integrated equipment can be applied to, on the premise of good combination property is kept, led with higher
Hot coefficient.
The two-component heat conductive silica gel sheet material that the invention is provided has two kinds of components：
Component A includes：
a1：The dimethyl polysiloxane of 90-100 parts by weight dienes base end-blocking；
a2：The polysiloxanes of the double hydroxyalkyl end-blockings of 20-40 parts by weight；
a3：The double hydroxy-end capped dimethyl siloxanes and the copolymer of methyl vinyl silicone of 20-40 parts by weight；
a4：0.5-5 parts by weight methyl ethylene annular siloxanes；
a5：150-180 parts by weight heat fillings；
a6：2-5 parts by weight epoxy modified silane couplers；
Component B includes：
b1：40-80 parts by weight phenyl hydrogen-containing silicon oil or its mixture with containing hydrogen silicone oil；
b2：0.5-5 parts by weight methyl ethylene annular siloxanes；
b3：2-10 parts by weight platinum group catalysts；
Wherein, the component A and component B are with weight ratio 1:The ratio mixing of (0.7-1).
Further, the component B can also include：
b4：5-30 parts by weight heat-resisting additives；
And/or
b5：5-30 parts by weight tackifier；
And/or
b6：1-30 parts by weight reinforcing agents.
Wherein, the a1 is one of basis in constituent of the present invention, its viscosity be preferably 100-10000cps it
Between, between preferably 100-5000cps, between more preferably 100-2000cps.Dilute base is exemplary including ethene in the a1
The dilute base of base, pi-allyl, fourth, penta dilute base etc., preferably vinyl.Further, the poly- silica of dimethyl of the a1- dienes base end-blocking
The mean molecule quantity of alkane is preferably 30-100 ten thousand, and the average quality percentage composition of vinyl is preferably 0.1-0.5%.
Wherein, the a2 be constituent of the present invention in basis two, its viscosity be preferably 100-10000cps it
Between, between preferably 100-5000cps, between more preferably 100-2000cps.The a2 while hydrosilylation
Lasting moisturecuring cross-linking process is provided under different humidity temperature conditionss so that sheet material still is able to lasting solidification after shaping, it is to avoid
The uneven phenomenon of local solidification.Further, the mean molecule quantity of the polysiloxanes of the double hydroxyalkyl end-blockings of the a2- is preferably 0.2-
100000.
Wherein, contain hydroxyl in the a3, auxiliary moisturecuring process can be provided while hydrosilylation, be conducive to
Hardening time is adjusted, the controllability of solidification process is realized；Meanwhile, a3 can also play friendship as the crosslinking agent between a1 and a2
Connection and bridging action, beneficial to the curing molding of network polymers, and realize in-situ solidifying effect, greatly reduce cure shrinkage.
The a3 viscosity is preferably below 2000cps.It is further preferred that hydroxyl mass content is between 1-10% in the a3；First
The mass content of base vinylsiloxane is between 10-40%.
Wherein, the methyl ethylene annular siloxane of the a4 and b2 can, its structures preferably identical with identical or different
In contain the alternate cyclic structure of silica, be separately added into component A and component B at the same play crosslinking, soften and disperse effect,
Be conducive to effective mixing of component A and component B mixed processes simultaneously.The a4 and/or b2 non-limiting example includes tetramethyl
Base tetravinyl cyclotetrasiloxane, 2,4- divinyl -2,4,6,6,8,8- hexamethyls cyclotetrasiloxane, the vinyl of hexamethyl six
The siloxanes of ring six, 2,4,6- trivinyl -2,4,6- trimethyl cyclotrisiloxane etc..It should be noted that the ethylene methacrylic
Base annular siloxane is due to for low molecular weight substance, and easily open loop, and addition need to be controlled strictly.
Wherein, the example non-limiting a5 can for silica, aluminum oxide, zinc oxide, magnesia, aluminium nitride,
One or more in silicon nitride, boron nitride, aluminium powder, silver powder, copper powder, graphite, CNT etc..The grain of the a5 heat fillings
Footpath is preferably 0.1-50 μm.
Wherein, the a6 is used to carry out surface modification to the a5, improves the addition and dispersion effect of heat filling.
Epoxide group is introduced in silane coupler, that is, is more beneficial for its cross-linking reaction with other constituents, heat filling is improved and exists
Compatibility in system.The example non-limiting a6 can be γ-(oxygen of 2,3- epoxies third) propyl trimethoxy silicane etc..
Wherein, per molecule has at least two and the strong hydrogen atom closed of silicon in the b1, is the base in constituent of the present invention
This into point three.The introducing of phenyl improves the reactivity and heat resistance of product, but in order to promote crosslinking curing compatibility, needs
The content of strict control phenyl.It is preferred that, the average quality percentage composition of phenyl is 5-20% in the b1.
Wherein, the b3 can be chloroplatinic acid or the complex compound of the polysiloxanes of chloroplatinic acid and ethenyl blocking, such as chlorine platinum
The complex compound of acid and the dimethyl silicone polymer of ethenyl blocking.
Wherein, the example non-limiting b4 can be the one or more in iron oxide, carbon black, gas-phase silica；
It is preferred that, the heat-resisting additive of the b4 is also modified processing through epoxy silane coupling agent, is used for, the epoxy that the b4 is modified
The consumption of silane coupler is preferably the 0.1-3% of b4 mass consumptions.
Wherein, the example non-limiting b5 can be the alkoxy silane containing amido, NCO, such as γ-
Aminopropyl triethoxysilane, γ-aminopropyltrimethoxysilane etc..
Wherein, the example non-limiting b6 can be one kind or many in glass fibre, carbon fiber, ceramic fibre
Kind；It is preferred that, the reinforcing agent of the b6 is also modified processing through epoxy silane coupling agent, is used for, the epoxy that the b6 is modified
The consumption of silane coupler is preferably the 0.1-3% of b4 mass consumptions.
The invention additionally provides a kind of preparation method of two-component heat conductive silica gel sheet material, comprises the steps：
S1：By metering than carrying out surface modification to a5 heat fillings using the epoxide modified silane couplers of a6；
S2：By polysiloxanes, the a3 of metering hydroxyalkyl end-blockings more double than dimethyl polysiloxane, the a2 for blocking a1 dienes base
Copolymer, the a4 methyl ethylene annular siloxanes of double hydroxy-end capped dimethyl siloxanes and methyl vinyl silicone are abundant
After mixing, add through heat filling modified step S1, and be sufficiently mixed uniformly thereto several times, obtain the mixed of component A
Compound；
S3：By metering than by b1 phenyl hydrogen-containing silicon oils or its mixture, b2 methyl ethylene ring-type silicon with containing hydrogen silicone oil
Oxygen alkane, b3 platinum group catalysts and the b4 heat-resisting additives and/or b5 tackifier and/or b6 reinforcing agents that add may be needed to fill
Divide mixing, obtain component B mixture；
S4：After measuring than the mixture of component A mixture and component B is sufficiently mixed, it is molded in mould,
Then through room temperature spontaneous curing or it is heating and curing, obtains heat conductive silica gel sheet material finished product.
Wherein, above-mentioned steps S3 and limitations of the S1 and S2 without sequencing.
Wherein, forming process can be carried out into using the mould and method of common heat conductive silica gel sheet material in the step S4
Type, it also may be preferable for use there is the two-component extrusion forming device of adjustable extruding outlet to carry out the shaping of special-shaped shape, or
The pouring device that preferable use has special-shaped shape casting gate is molded.The heat conductive silica gel sheet material that the invention is provided
The shaping of special-shaped shape can directly be carried out, it is to avoid the loss of post-production, shaped device can be purchased or made by oneself.
The invention additionally provides a kind of two-component extrusion forming device of adjustable extruding outlet, is particularly suitable for use in this
The shaping of the special-shaped shape of the two-component heat conductive silica gel sheet material of innovation and creation, including it is respectively provided with two storings of pressing mechanism
Tank, described two storage tanks are connected to tapping channel, and the tapping channel converges after a segment distance for a hybrid channel,
The hybrid channel end connects discharging opening.
Further, the discharging opening is the bar shaped outlet with controllable width.
Further, it is additionally provided with the hybrid channel in blending tank, the blending tank and may also be further provided with stirring or rub
Pinch mechanism.
The invention has following advantage：
(1) mixture material is bicomponent material, it is possible to increase the addition of heat filling, in heat conductive silica gel sheet material thickness
During for 0.3mm, thermal conductivity factor can reach more than 3.0W/mK；
(2) inhibitor need not be added, storage stability is good, two components can distinguish long-time storage, be carried out again when using
Mixed-forming；
(3) heat cure can be carried out and be aided with moisturecuring, solidification process is controllable；1-2h solidifications, 50- at room temperature can be reached
0.5-1h solidifies under the conditions of 80 DEG C of heatings；And solidification is uniform complete；
(4) combination property is good, is met under conditions of high thermal conductivity coefficient is kept and is even above general heat conductive silica gel sheet material
Other performances, such as hardness, temperature tolerance, intensity, toughness；
(5) cure shrinkage is small, it is adaptable to the straight forming of easy shape and structure, it is to avoid loss is wasted, cost-effective；
(6) without vulcanization and high temperature, environment-friendly, energy consumption is small.
Brief description of the drawings
Fig. 1 is a kind of structural representation of the two-component extrusion forming device of adjustable extruding outlet of the invention；
Fig. 2 is the partial enlarged drawing of discharging opening part in Fig. 1.
Wherein, 1- storage tanks A；2- storage tanks B；3- pressing mechanisms；4- tapping channels A；5- tapping channels B；6- mixing is logical
Road C；7- discharging openings；8- bar shapeds are exported；9- blending tanks；10- is stirred or kneading mechanism.
Embodiment
The invention is further described below.In order to describe conveniently, the equipment in the invention is omitted
Necessary or conventional operating procedure or condition, such as weighing, temperature control, control stir speed (S.S.), those skilled in the art being capable of basis
Arbitrarily adjusted the need for reaction.Under conditions of not conflicting, the feature in the present invention program in each embodiment can phase
Mutually combination.Following embodiments are only the explanation purpose of the present invention, are not intended to limit the invention.
The performance evaluation method of testing of the present invention is as follows：
The hardness of Shao 00：Carried out with reference to GB/T531.1-2008 standards.
Tensile strength：Carried out with reference to GB/T529-2008 standards.
Elongation at break：Carried out with reference to GB/T528-2009 standards.
Breakdown voltage：Carried out with reference to GB/T1695-2009 standards.
Thermal conductivity factor：Carried out with reference to ASTM-D5470 standards.
Temperature tolerance：Film is placed in 1000h in 150 DEG C of environment, observation discoloration, heat conduction and insulation stability.
Cold-resistant thermal impact：Film is carried out into -40-105 DEG C 100 are circulated, and observation discoloration, heat conduction and insulation are stable
Property.
Viscosity described in the invention is the viscosity at 25 DEG C.
Preparing for following each embodiments can be using equipment as illustrated in fig. 1 and 2, including is respectively provided with the storage of pressing mechanism 3
Batch can A1 and storage tank B 2, the storage tank A 1 and storage tank B 2 are connected to tapping channel A 4 and tapping channel B 5,
The tapping channel A 4 and tapping channel B 5 converge after a segment distance for hybrid channel C 6, the ends of hybrid channel C 6
Connect discharging opening 7.Wherein, the discharging opening 7 is the bar shaped outlet 8 with controllable width.It is additionally provided with the hybrid channel C 6
Stirring or kneading mechanism 10, such as agitating paddle are may also be further provided with blending tank 9, the blending tank 9.The batch can A 1 and storage
Pressing mechanism 3 on batch can B 2 can be cylinder.The bar shaped outlet 8 could be arranged to required thickness width, such as 0.3mm
Deng.
The process for preparing the invention heat conductive silica gel sheet material using the said equipment is as follows：
First, by metering than carrying out surface modification to a5 heat fillings using the epoxide modified silane couplers of a6；
Second, by metering than polysiloxanes that the double hydroxyalkyls of dimethyl polysiloxane, a2 that blocks a1 dienes base are blocked,
Copolymer, the a4 methyl ethylene annular siloxanes of the double hydroxy-end capped dimethyl siloxanes of a3 and methyl vinyl silicone fill
Divide after mixing, add thereto through heat filling modified step S1 several times, and be sufficiently mixed uniformly, obtain component A's
Mixture, is placed on storage tank A 1；
3rd, by metering than by b1 phenyl hydrogen-containing silicon oils or its mixture with containing hydrogen silicone oil, b2 methyl ethylene ring-types
Siloxanes, b3 platinum group catalysts and the b4 heat-resisting additives and/or b5 tackifier and/or b6 reinforcing agents that addition may be needed
It is sufficiently mixed, obtains component B mixture, be placed on storage tank B 2；
4th, by pressing mechanism 3 respectively to storage tank A 1 and storage tank B 2, make component A mixture and component B
Mixture is extruded from tapping channel A 4 and tapping channel B 5 respectively in proportion, and in hybrid channel C 6 and blending tank 9 fully
Mixing, most the bar shaped outlet 8 through discharging opening 7 is extruded and is molded afterwards.
5th, by the sheet material of shaping is through room temperature spontaneous curing or is heating and curing, obtain heat conductive silica gel sheet material finished product.
Embodiment 1
Heat conductive silica gel sheet material is prepared using the above apparatus and method, the service condition of raw material is as follows：
Component A includes：
a1：The dimethyl polysiloxane of 90 parts by weight bi-vinyls end-blocking, its viscosity 2000cps, mean molecule quantity is 60
Ten thousand, the average quality percentage composition of vinyl is 0.2%；
a2：The bis-hydroxypropyl terminated polysiloxanes of 40 parts by weight, its viscosity 5000cps, mean molecule quantity is 1.0 ten thousand；
a3：The double hydroxy-end capped dimethyl siloxanes and the copolymer of methyl vinyl silicone of 30 parts by weight, hydroxyl
Mass content is 4%；The mass content of methyl vinyl silicone is 30%；
a4：The siloxanes of 3 parts by weight hexamethyl, six ethene basic ring six；
a5：150 parts by weight silicon nitrides, 20 μm of particle diameter；
a6：5 parts by weight γ-(oxygen of 2,3- epoxies third) propyl trimethoxy silicane；
Component B includes：
b1：The mixture of 40 parts by weight phenyl hydrogen-containing silicon oils and containing hydrogen silicone oil, the average quality percentage composition of phenyl is
10%；
b2：The siloxanes of 2 parts by weight hexamethyl, six ethene basic ring six；
b3：5 parts by weight chloroplatinic acid；
Wherein, the component A and component B are with weight ratio 1:1 ratio mixing.
Embodiment 2
Heat conductive silica gel sheet material is prepared using the above apparatus and method, the service condition of raw material is as follows：
Component A includes：
a1：The dimethyl polysiloxane of 95 parts by weight diallyls end-blocking, its viscosity 1500cps, mean molecule quantity is 80
Ten thousand, the average quality percentage composition of vinyl is 0.5%；
a2：The bis-hydroxypropyl terminated polysiloxanes of 20 parts by weight, its viscosity 3000cps, mean molecule quantity is 0.6 ten thousand；
a3：The double hydroxy-end capped dimethyl siloxanes and the copolymer of methyl vinyl silicone of 30 parts by weight, hydroxyl
Mass content is 4%；The mass content of methyl vinyl silicone is 30%；
a4：The siloxanes of 2 parts by weight hexamethyl, six ethene basic ring six；
a5：The mixture of 160 part by weight of zinc oxide and magnesia, 50 μm of particle diameter；
a6：5 parts by weight γ-(oxygen of 2,3- epoxies third) propyl trimethoxy silicane；
Component B includes：
b1：The mixture of 60 parts by weight phenyl hydrogen-containing silicon oils and containing hydrogen silicone oil, the average quality percentage composition of phenyl is
15%；
b2：2 parts by weight t etram-ethyltetravinylcyclotetrasiloxanes；
b3：The complex compound of the dimethyl silicone polymer of 5 parts by weight chloroplatinic acid and ethenyl blocking；
b4：5 parts by weight surface gammas-coupling agent modified (the coupling agent consumption of (oxygen of 2,3- epoxies third) propyl trimethoxy silicane
For the gas-phase silica 0.5%) of gas-phase silica quality；
b5：5 parts by weight gamma-aminopropyl-triethoxy-silanes.
Wherein, the component A and component B are with weight ratio 1:0.8 ratio mixing.
Embodiment 3
Heat conductive silica gel sheet material is prepared using the above apparatus and method, the service condition of raw material is as follows：
Component A includes：
a1：The dimethyl polysiloxane of 90 parts by weight bi-vinyls end-blocking, its viscosity 2000cps, mean molecule quantity is 60
Ten thousand, the average quality percentage composition of vinyl is 0.2%；
a2：The bis-hydroxypropyl terminated polysiloxanes of 40 parts by weight, its viscosity 5000cps, mean molecule quantity is 1.0 ten thousand；
a3：The double hydroxy-end capped dimethyl siloxanes and the copolymer of methyl vinyl silicone of 30 parts by weight, hydroxyl
Mass content is 4%；The mass content of methyl vinyl silicone is 30%；
a4：The siloxanes of 3 parts by weight hexamethyl, six ethene basic ring six；
a5：150 parts by weight silicon nitrides, 20 μm of particle diameter；
a6：5 parts by weight γ-(oxygen of 2,3- epoxies third) propyl trimethoxy silicane；
b1：The mixture of 60 parts by weight phenyl hydrogen-containing silicon oils and containing hydrogen silicone oil, the average quality percentage composition of phenyl is
15%；
b2：2 parts by weight t etram-ethyltetravinylcyclotetrasiloxanes；
b3：The complex compound of the dimethyl silicone polymer of 5 parts by weight chloroplatinic acid and ethenyl blocking；
b4：5 parts by weight surface gammas-coupling agent modified (the coupling agent consumption of (oxygen of 2,3- epoxies third) propyl trimethoxy silicane
For the gas-phase silica 0.5%) of gas-phase silica quality；
b6：2 parts by weight surface gammas-coupling agent modified (the coupling agent consumption of (oxygen of 2,3- epoxies third) propyl trimethoxy silicane
For the 1%) carbon fiber of carbon fiber quality.
Wherein, the component A and component B are with weight ratio 1:1 ratio mixing.
Comparative example 1
Heat conductive silica gel sheet material is prepared using the above apparatus and method, the service condition of raw material is as follows：
Component A includes：
a1：The dimethyl polysiloxane of 90 parts by weight bi-vinyls end-blocking, its viscosity 2000cps, mean molecule quantity is 60
Ten thousand, the average quality percentage composition of vinyl is 0.2%；
a2：The bis-hydroxypropyl terminated polysiloxanes of 40 parts by weight, its viscosity 5000cps, mean molecule quantity is 1.0 ten thousand；
a4：The siloxanes of 3 parts by weight hexamethyl, six ethene basic ring six；
a5：150 parts by weight silicon nitrides, 20 μm of particle diameter；
a6：5 parts by weight γ-(oxygen of 2,3- epoxies third) propyl trimethoxy silicane；
Component B includes：
b1：The mixture of 40 parts by weight phenyl hydrogen-containing silicon oils and containing hydrogen silicone oil, the average quality percentage composition of phenyl is
10%；
b2：The siloxanes of 2 parts by weight hexamethyl, six ethene basic ring six；
b3：5 parts by weight chloroplatinic acid；
Wherein, the component A and component B are with weight ratio 1:1 ratio mixing.
Comparative example 2
Heat conductive silica gel sheet material is prepared using the above apparatus and method, the service condition of raw material is as follows：
Component A includes：
a1：The dimethyl polysiloxane of 90 parts by weight bi-vinyls end-blocking, its viscosity 2000cps, mean molecule quantity is 60
Ten thousand, the average quality percentage composition of vinyl is 0.2%；
a3：The double hydroxy-end capped dimethyl siloxanes and the copolymer of methyl vinyl silicone of 30 parts by weight, hydroxyl
Mass content is 4%；The mass content of methyl vinyl silicone is 30%；
a4：The siloxanes of 3 parts by weight hexamethyl, six ethene basic ring six；
a5：80 parts by weight silicon nitrides, 20 μm of particle diameter；
a6：5 parts by weight γ-(oxygen of 2,3- epoxies third) propyl trimethoxy silicane；
Component B includes：
b1：The mixture of 40 parts by weight phenyl hydrogen-containing silicon oils and containing hydrogen silicone oil, the average quality percentage composition of phenyl is
10%；
b2：The siloxanes of 2 parts by weight hexamethyl, six ethene basic ring six；
b3：5 parts by weight chloroplatinic acid；
Wherein, the component A and component B are with weight ratio 1:1 ratio mixing.
Comparative example 3
Heat conductive silica gel sheet material is prepared using the above apparatus and method, the service condition of raw material is as follows：
Component A includes：
a1：The dimethyl polysiloxane of 90 parts by weight bi-vinyls end-blocking, its viscosity 2000cps, mean molecule quantity is 60
Ten thousand, the average quality percentage composition of vinyl is 0.2%；
a2：The bis-hydroxypropyl terminated polysiloxanes of 40 parts by weight, its viscosity 5000cps, mean molecule quantity is 1.0 ten thousand；
a3：The double hydroxy-end capped dimethyl siloxanes and the copolymer of methyl vinyl silicone of 30 parts by weight, hydroxyl
Mass content is 4%；The mass content of methyl vinyl silicone is 30%；
a4：Dimethicone of the 3 parts by weight viscosity in 500cps or so；
a5：100 parts by weight silicon nitrides, 20 μm of particle diameter；
a6：5 parts by weight γ-(oxygen of 2,3- epoxies third) propyl trimethoxy silicane；
Component B includes：
b1：The mixture of 40 parts by weight phenyl hydrogen-containing silicon oils and containing hydrogen silicone oil, the average quality percentage composition of phenyl is
10%；
b2：Dimethicone of the 2 parts by weight viscosity in 500cps or so；
b3：5 parts by weight chloroplatinic acid；
Wherein, the component A and component B are with weight ratio 1:1 ratio mixing.
Comparative example 4
Heat conductive silica gel sheet material is prepared using the above apparatus and method, the service condition of raw material is as follows：
Component A includes：
a1：The dimethyl polysiloxane of 95 parts by weight diallyls end-blocking, its viscosity 1500cps, mean molecule quantity is 80
Ten thousand, the average quality percentage composition of vinyl is 0.5%；
a2：The bis-hydroxypropyl terminated polysiloxanes of 20 parts by weight, its viscosity 3000cps, mean molecule quantity is 0.6 ten thousand；
a3：The double hydroxy-end capped dimethyl siloxanes and the copolymer of methyl vinyl silicone of 30 parts by weight, hydroxyl
Mass content is 4%；The mass content of methyl vinyl silicone is 30%；
a4：The siloxanes of 2 parts by weight hexamethyl, six ethene basic ring six；
a5：The mixture of 90 part by weight of zinc oxide and magnesia, 50 μm of particle diameter；
a6：5 parts by weight of ethylene base trimethoxy silanes；
Component B includes：
b1：The mixture of 60 parts by weight phenyl hydrogen-containing silicon oils and containing hydrogen silicone oil, the average quality percentage composition of phenyl is
15%；
b2：2 parts by weight t etram-ethyltetravinylcyclotetrasiloxanes；
b3：The complex compound of the dimethyl silicone polymer of 5 parts by weight chloroplatinic acid and ethenyl blocking；
b4：5 parts by weight surface vinyl trimethoxies are silane coupler modified, and (coupling agent consumption is gas-phase silica quality
0.5%) gas-phase silica；
b5：5 parts by weight gamma-aminopropyl-triethoxy-silanes.
Wherein, the component A and component B are with weight ratio 1:0.8 ratio mixing.
Comparative example 5
Heat conductive silica gel sheet material is prepared using the above apparatus and method, the service condition of raw material is as follows：
Component A includes：
a1：The dimethyl polysiloxane of 95 parts by weight diallyls end-blocking, its viscosity 1500cps, mean molecule quantity is 80
Ten thousand, the average quality percentage composition of vinyl is 0.5%；
a2：The bis-hydroxypropyl terminated polysiloxanes of 20 parts by weight, its viscosity 3000cps, mean molecule quantity is 0.6 ten thousand；
a3：The double hydroxy-end capped dimethyl siloxanes and the copolymer of methyl vinyl silicone of 30 parts by weight, hydroxyl
Mass content is 4%；The mass content of methyl vinyl silicone is 30%；
a4：The siloxanes of 2 parts by weight hexamethyl, six ethene basic ring six；
a5：The mixture of 160 part by weight of zinc oxide and magnesia, 50 μm of particle diameter；
a6：5 parts by weight γ-(oxygen of 2,3- epoxies third) propyl trimethoxy silicane；
Component B includes：
b1：60 parts by weight are free of the containing hydrogen silicone oil of phenyl；
b2：2 parts by weight t etram-ethyltetravinylcyclotetrasiloxanes；
b3：The complex compound of the dimethyl silicone polymer of 5 parts by weight chloroplatinic acid and ethenyl blocking；
b4：5 parts by weight surface gammas-coupling agent modified (the coupling agent consumption of (oxygen of 2,3- epoxies third) propyl trimethoxy silicane
For the gas-phase silica 0.5%) of gas-phase silica quality；
b5：5 parts by weight gamma-aminopropyl-triethoxy-silanes.
Wherein, the component A and component B are with weight ratio 1:0.8 ratio mixing.
Comparative example 6
Heat conductive silica gel sheet material is prepared using the above apparatus and method, the service condition of raw material is as follows：
Component A includes：
a1：The dimethyl polysiloxane of 95 parts by weight diallyls end-blocking, its viscosity 1500cps, mean molecule quantity is 80
Ten thousand, the average quality percentage composition of vinyl is 0.5%；
a2：The bis-hydroxypropyl terminated polysiloxanes of 20 parts by weight, its viscosity 3000cps, mean molecule quantity is 0.6 ten thousand；
a3：The double hydroxy-end capped dimethyl siloxanes and the copolymer of methyl vinyl silicone of 30 parts by weight, hydroxyl
Mass content is 4%；The mass content of methyl vinyl silicone is 30%；
a4：The siloxanes of 4 parts by weight hexamethyl, six ethene basic ring six；
a5：The mixture of 160 part by weight of zinc oxide and magnesia, 50 μm of particle diameter；
a6：5 parts by weight γ-(oxygen of 2,3- epoxies third) propyl trimethoxy silicane；
Component B includes：
b1：The mixture of 60 parts by weight phenyl hydrogen-containing silicon oils and containing hydrogen silicone oil, the average quality percentage composition of phenyl is
15%；
b3：The complex compound of the dimethyl silicone polymer of 5 parts by weight chloroplatinic acid and ethenyl blocking；
b4：5 parts by weight surface gammas-coupling agent modified (the coupling agent consumption of (oxygen of 2,3- epoxies third) propyl trimethoxy silicane
For the gas-phase silica 0.5%) of gas-phase silica quality；
b5：5 parts by weight gamma-aminopropyl-triethoxy-silanes.
Wherein, the component A and component B are with weight ratio 1:0.8 ratio mixing.
The heat conductive silica gel sheet material of above-described embodiment and comparative example acquisition is detected, as a result as shown in table 1.Wherein, portion
Because addO-on therapy changes in point comparative example, and the total amount that adds of heat filling is have impact on, end reaction is in thermal conductivity factor
Aspect is difficult to reach higher heat-conducting effect.
Table 1
Claims (16)
1. a kind of two-component heat conductive silica gel sheet material, including two kinds of components：
Component A includes：
a1：The dimethyl polysiloxane of 90-100 parts by weight dienes base end-blocking；
a2：The polysiloxanes of the double hydroxyalkyl end-blockings of 20-40 parts by weight；
a3：The double hydroxy-end capped dimethyl siloxanes and the copolymer of methyl vinyl silicone of 20-40 parts by weight；
a4：0.5-5 parts by weight methyl ethylene annular siloxanes；
a5：150-180 parts by weight heat fillings；
a6：2-5 parts by weight epoxy modified silane couplers；
Component B includes：
b1：40-80 parts by weight phenyl hydrogen-containing silicon oil or its mixture with containing hydrogen silicone oil；
b2：0.5-5 parts by weight methyl ethylene annular siloxanes；
b3：2-10 parts by weight platinum group catalysts；
Wherein, the component A and component B are with weight ratio 1:The ratio mixing of (0.7-1).
2. a kind of two-component heat conductive silica gel sheet material according to claim 1, it is characterised in that the component B can also be wrapped
Include：
b4：5-30 parts by weight heat-resisting additives；
And/or
b5：5-30 parts by weight tackifier；
And/or
b6：1-30 parts by weight reinforcing agents.
3. a kind of two-component heat conductive silica gel sheet material according to claim 1, it is characterised in that the a1 viscosity is 100-
Between 10000cps.
4. a kind of two-component heat conductive silica gel sheet material according to claim 1, it is characterised in that the a1 viscosity is 100-
Between 5000cps.
5. a kind of two-component heat conductive silica gel sheet material according to claim 1, it is characterised in that the a1 viscosity is 100-
Between 2000cps.
6. a kind of two-component heat conductive silica gel sheet material according to claim 1, it is characterised in that the mean molecule quantity of the a1
For 30-100 ten thousand.
7. a kind of two-component heat conductive silica gel sheet material according to claim 1, it is characterised in that the a1 is ethenyl blocking
Dimethyl polysiloxane, the average quality percentage composition of vinyl is 0.1-0.5%.
8. a kind of two-component heat conductive silica gel sheet material according to claim 1, it is characterised in that the a2 viscosity is 100-
Between 10000cps.
9. a kind of two-component heat conductive silica gel sheet material according to claim 1, it is characterised in that the a2 viscosity is 100-
Between 5000cps.
10. a kind of two-component heat conductive silica gel sheet material according to claim 1, it is characterised in that the a2 viscosity is 100-
Between 2000cps.
11. a kind of two-component heat conductive silica gel sheet material according to claim 1, it is characterised in that the mean molecule of the a2
Measure as 0.2-10 ten thousand.
12. a kind of two-component heat conductive silica gel sheet material according to claim 1, it is characterised in that hydroxyl quality in the a3
Content is between 1-10%；The mass content of methyl vinyl silicone is between 10-40%.
13. a kind of two-component heat conductive silica gel sheet material according to claim 1, it is characterised in that phenyl is flat in the b1
Equal weight/mass percentage composition is 5-20%.
14. a kind of two-component heat conductive silica gel sheet material according to claim 2, it is characterised in that the heat-resisting addition of the b4
Agent and/or b6 reinforcing agent are also modified processing through epoxy silane coupling agent.
15. a kind of preparation method of two-component heat conductive silica gel sheet material described in claim 1, comprises the steps：
S1：By metering than carrying out surface modification to a5 heat fillings using the epoxide modified silane couplers of a6；
S2：By the double hydroxyls of polysiloxanes, a3 of metering hydroxyalkyl end-blockings more double than dimethyl polysiloxane, the a2 for blocking a1 dienes base
The dimethyl siloxane of base end-blocking and copolymer, the a4 methyl ethylene annular siloxanes of methyl vinyl silicone are sufficiently mixed
Afterwards, add through heat filling modified step S1, and be sufficiently mixed uniformly thereto several times, obtain component A mixture；
S3：By metering than by b1 phenyl hydrogen-containing silicon oils or its with the mixture of containing hydrogen silicone oil, b2 methyl ethylenes annular siloxane,
B3 platinum group catalysts and b4 heat-resisting additives and/or b5 tackifier and/or b6 reinforcing agents are sufficiently mixed, and obtain the mixed of component B
Compound；
S4：After measuring than the mixture of component A mixture and component B is sufficiently mixed, it is molded in mould, then
Through room temperature spontaneous curing or it is heating and curing, obtains heat conductive silica gel sheet material finished product；
Wherein, above-mentioned steps S3 and limitations of the S1 and S2 without sequencing.
16. a kind of preparation method of two-component heat conductive silica gel sheet material according to claim 15, it is characterised in that the step
Forming process is molded using the mould and method of common heat conductive silica gel sheet material in rapid S4, or adjustable using having
The two-component extrusion forming device of extruding outlet carries out the shaping of special-shaped shape, or using pouring with special-shaped shape casting gate
Casting device is molded.
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| CN107488436B (en) * | 2017-09-20 | 2022-04-22 | 深圳沃尔提莫电子材料有限公司 | Two-component heat-conducting silica gel sheet containing liquid metal heat-conducting filler |
| CN108559272A (en) * | 2018-04-02 | 2018-09-21 | 东莞太洋橡塑制品有限公司 | Low-temp low-pressure silica gel moulding process |
| CN109627776A (en) * | 2018-11-14 | 2019-04-16 | 深圳市飞荣达科技股份有限公司 | Solidfied material made of heat-conductive silicone composition and its solidification |
| CN113265222B (en) * | 2021-05-27 | 2023-03-17 | 河南守真电子科技有限公司 | Polymer moisture-proof fireproof plugging composite material and use method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1769362A (en) * | 2004-10-28 | 2006-05-10 | 日本聚氨酯工业株式会社 | Manufacturing systems and methods of reactive hot melt adhesive. |
| CN1887562A (en) * | 2006-07-31 | 2007-01-03 | 刘亚青 | Multipurpose polymer forming machine |
| CN104342081A (en) * | 2014-09-17 | 2015-02-11 | 烟台德邦科技有限公司 | Double-component high-temperature vulcanized conductive glue and preparation method thereof |
| CN204622368U (en) * | 2015-04-23 | 2015-09-09 | 浙江太湖远大新材料股份有限公司 | A kind of extruder pre-mixing apparatus |
-
2015
- 2015-11-18 CN CN201510799056.2A patent/CN105273680B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1769362A (en) * | 2004-10-28 | 2006-05-10 | 日本聚氨酯工业株式会社 | Manufacturing systems and methods of reactive hot melt adhesive. |
| CN1887562A (en) * | 2006-07-31 | 2007-01-03 | 刘亚青 | Multipurpose polymer forming machine |
| CN104342081A (en) * | 2014-09-17 | 2015-02-11 | 烟台德邦科技有限公司 | Double-component high-temperature vulcanized conductive glue and preparation method thereof |
| CN204622368U (en) * | 2015-04-23 | 2015-09-09 | 浙江太湖远大新材料股份有限公司 | A kind of extruder pre-mixing apparatus |
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