CN106833510A - New energy high heat conduction low-gravity organic silicon potting adhesive - Google Patents
New energy high heat conduction low-gravity organic silicon potting adhesive Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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Abstract
The invention discloses a kind of new energy high heat conduction low-gravity organic silicon potting adhesive, including A）At least two vinyl are bonded the straight chain type or branched polysiloxane of silicon atom, or their mixture；B) the polysiloxanes that at least two si-h bonds are closed, and comprising at least one epoxy radicals, at least one alkoxy；C）Addition reaction catalyst；D) heat filling processed by special process, refers in particular to the compounded mix of Graphene, chopped carbon fiber, silicon powder, aluminium hydroxide, spherical alumina magnesium and spherical boron nitride.Thermal conductivity >=0.95W/m.K；Proportion≤1.6g/ml.
Description
Technical field
The present invention relates to organic silicon potting adhesive field, more particularly to a kind of new energy high heat conduction low-gravity organosilicon embedding
Glue.
Background technology
Because with excellent electrical insulation capability, high and low temperature resistance, weatherability, anti-flammability, silicon rubber is in every field
It is widely used.With the raising of electronic component density and degree of integration, and new energy field rapid emergence, to
Heat conduction casting glue that heat radiation is characterized is it is also proposed that heat conduction and the requirement of lower proportion higher.Because silicon rubber does not have in itself
Have such heat conductivility, generally needed to be added the filler of high-termal conductivity, and need filler carry out it is substantial amounts of filling to reach
High-termal conductivity (patent US8796190, EP 0745643, JP 107003), such filling will damage the operable of silicon rubber
Property, rubber is become low mechanical property, low adhesion power, high rigidity.
The content of the invention
It is an object of the invention to provide a kind of new energy high heat conduction low-gravity organic silicon potting adhesive, organic silicon potting adhesive tool
There is good operability and mobility, high-termal conductivity and low-gravity.
Above-mentioned technical purpose of the invention technical scheme is that：
A kind of new energy high heat conduction low-gravity organic silicon potting adhesive, including component A and B component, according to weight ratio, component A: B groups
Divide=1: 1,
Described component A, including the component of following weight portion is mixed：
100 parts of vinyl polysiloxanes
130~190 parts of heat fillings
1~5 part of catalyst
Described B component, including the component of following weight portion is mixed：
Further technical scheme is, new energy high heat conduction low-gravity organic silicon potting adhesive be molded using cold curing or
Heating cure is molded.
Further technical scheme is, described vinyl polysiloxane, comprising at least two second being connected with silicon atom
Alkenyl, it can be direct-connected side chain or their mixture.Can be selected from：All use dimethyl second in molecule two ends
The dimethyl polysiloxane of alkenyl siloxy end-blocking；The first that molecule two ends are all blocked with dimethylvinylsiloxy
The copolymer of base phenyl siloxane and dimethyl siloxane；The first that molecule two ends are all blocked with dimethylvinylsiloxy
The copolymer of base vinylsiloxane and dimethyl siloxane；Molecule two ends are all with the ethylene methacrylic of trimethyl first siloxane blocking
The copolymer of radical siloxane and dimethyl siloxane；The methyl that molecule two ends are all blocked with dimethylvinylsiloxy
(trifluoro propyl) polysiloxanes；The silicone copolymers being made up of following siloxane unit formula：(CH3)3SiO1/2, CH3SiO3/2,
CH3ViSiO1/2, (CH3)2SiO2/2, or above two or more kinds of mixtures.For above-mentioned organosiloxane 25
DEG C viscosity have no particular limits, 50~5000cs can be selected, if viscosity be less than lower limit, for the power of entire combination thing
It will be harmful to learn performance, if viscosity will be unfavorable higher than reaching the standard grade for the mobility of entire combination thing, preferably 100~
3000cs, more preferably 100~1000cs, the more preferably two kinds interworking compositions of viscosity, for the knot of above-mentioned organosiloxane
Structure also has no particular limits, but the preferably straight chain type interworking of straight chain and part side chain, is conducive to being uniformly distributed for crosslinking points, and
Tensile strength and elongation are turned round and look at, and has possessed good tear resistance.It is preferred that straight chain type polysiloxanes and the poly- silica of branched chain type
Alkane in mass ratio 100: 0~50 is used in mixed way.
Further technical scheme is：The hydrogen containing siloxane is allyl glycidyl ether, vinyl trimethoxy
Silane, silicon oil of low hydrogen content 3~10: 3~10: 5~30 addition reaction product under rhodium catalyst in proportion.
Further technical scheme is：Described hydrogen containing siloxane is connected hydrogen atom comprising at least two with silicon atom
Organopolysiloxane, in order to ensure good mechanical property preferred molar ratio：Si-H/Si-Vi=1.1~1.3, preferably silicon hydrogen contains
Amount≤0.5wt%.
Further technical scheme is：Described catalyst is platinum catalyst.Such as chloroplatinic acid-Isopropanol catalysis agent,
Chloroplatinic acid-divinyl tetramethyl disiloxane catalyst, chloroplatinic acid-tetravinyl tetramethyl-ring tetrasiloxane catalyst, plus
Catalyst charge into reaction is generally the 0.1~10ppm of component A and component B.
Further technical scheme is：Described heat conduction inorganic filler, for assigning Si―H addition reaction curing molding silicon rubber
Thermal conductivity.The heat filling example is as follows：Aluminum oxide, magnesia, silicon powder, boron nitride, zinc oxide, aluminium nitride, carborundum,
Titanium oxide, Graphene, chopped carbon fiber.The shape of heat filling, can have spherical, cylindrical, irregular shape particle.
Being not particularly limited for the average grain diameter of heat filling can select 0.1-50um, preferably 0.2-45um.And can be equipped with
Length is 0.5-1.2um chopped carbon fibers.In order to the heat-conducting silicon rubber composition for obtaining has more preferable operability, particularly preferably
All of heat filling carries out the dry method coating modification of organic coupling agent, and chopped strand then carries out wet-process modified cladding.In order to
Obtain good thermal conductivity and mobility, preferably Ball-type packing, the average grain diameter of different sizes of irregular and chopped strand
Interworking, to reduce the space between filler, increases " bridge formation " network connection density.More preferably boron nitride and magnesia be 20~
45um Ball-type packings, aluminium hydroxide and silicon powder are 3~12um irregular shape fillers, and Graphene is irregular for 0.1-3um's
Shape filler, the length of chopped carbon fiber is 0.5~1.2um.More preferably use Graphene, chopped carbon fiber, silicon powder, hydrogen-oxygen
Change aluminium, spherical alumina magnesium and spherical boron nitride.It is preferred that above-mentioned filler is 0.5~5: 0~5: 30~120: 30~80 in mass ratio:
5~30: 5~30 mix.
Further technical scheme is：Described delay controlling agent, when assigning A, the mixing of B two-component 1 to 1, there is appropriate
The operating procedure time.It is preferred that many vinyl polysiloxanes, acetylene cyclohexanol, maleic acid ester type compound, BTA.Its addition
It is the 1.2ppm~30ppm of A, B component gross weight to measure.
Further technical scheme is：Described stress conditioning agent, assign organic silicon potting adhesive high-flexibility, low modulus,
Low stress, protection is by mechanical stress and the electronic component of thermal stress.It is preferred that the dimethyl silicone polymer of dimethyl hydrogen-based end-blocking,
Its amount of filling is 0~10 part.
In sum, the invention has the advantages that：
The present invention refers to by selecting low-gravity heat filling, by the filler interworking of different-grain diameter grade of different shapes, heat conduction
Powder carries out surface and is modified, and said composition shows good operability and mobility, high-termal conductivity and low-gravity.
Specific embodiment
This specific embodiment is only explanation of the invention, and it is not limitation of the present invention, people in the art
Member can make the modification without creative contribution to the present embodiment as needed after this specification is read, but as long as at this
All protected by Patent Law in the right of invention.
Hydrogen-containing siloxane synthesis 1：Equipped with thermometer, agitator, condenser pipe, constant pressure funnel four-hole bottle, plus
Enter 5 parts of allyl glycidyl ethers, 3 parts of vinyltrimethoxy silanes, 5ppm rhodium metal catalysts dispersed with stirring uniformly, 90
At DEG C, 10 parts of silicon oil of low hydrogen content are added dropwise, react 4 hours, cooling adds 3 parts of food absorption carbon to stir 15 minutes, and filtering, decompression are steamed
Evaporate de- low.
Hydrogen-containing siloxane synthesis 2：In equipped with thermometer, agitator, condenser pipe, the four-hole bottle of constant pressure funnel,
Add 10 parts of allyl glycidyl ethers, 5 parts of vinyltrimethoxy silanes, 3ppm rhodium metal catalysts dispersed with stirring uniform,
At 40 DEG C, 20 parts of containing hydrogen silicone oils are added dropwise, react 2 hours, be warmed up to 90 DEG C, react 3 hours, cooling adds 3 parts of food-grades to live
Property charcoal stir 15 minutes, filtering, vacuum distillation take off low.
The surface of filler modified 1：It is fast in being preheated 2 hours at 120 DEG C during 300 parts of heat fillings are added into high-speed mixers
Speed adds 8 parts of ethanol solutions of 50wt% dodecyltrimethoxysilanes, is modified 40 minutes at this temperature.Then 130
Precuring 1 hour at DEG C.Obtain the modified heat filling in surface.
The surface of filler modified 2：It is fast in being preheated 2 hours at 130 DEG C during 300 parts of heat fillings are added into high-speed mixers
Speed adds 5 parts of ethanol solutions of 50wt% MTMSs, 1 part of HMDS, 3 parts of 50wt% dodecyls
The ethanol solution of trimethoxy silane, is modified 60 minutes at this temperature.Subsequent precuring 1 hour at 130 DEG C.Obtain surface
Modified heat filling.
Embodiment 1：
100 parts of dimethyl polysiloxanes of dimethylvinylsiloxy end-blocking, 20 parts are added in planetary-type mixer
Modified spherical boron nitride, 10 parts of modified spherical magnesia, 100 parts of modified silicon powders, 50 parts of modified aluminium hydroxides, 3 parts of Graphenes,
At 120 DEG C, dispersed with stirring 60 minutes under the conditions of -0.06Mpa.Add 10ppm platinum catalysts dispersed with stirring uniform, be made A groups
Point.
100 parts of dimethyl polysiloxanes of dimethylvinylsiloxy end-blocking are added in planetary-type mixer,
20 parts of modified spherical boron nitride, 10 parts of modified spherical magnesia, 100 parts of modified silicon powders, 50 parts of modified aluminium hydroxides, 3 parts of stones
Black alkene, at 120 DEG C, stirs 60 minutes under the conditions of -0.06MPa.Add 5 parts of hydrogen containing siloxane synthesis 2,30ppm BTAs
Dispersed with stirring is uniform, is made B component.
By A, B component 1 to 1 mixed-forming in mass ratio, test result such as table 1.
Embodiment 2：
85 parts of dimethyl polysiloxanes of dimethylvinylsiloxy end-blocking, 10 part two are added in planetary-type mixer
The methyl vinyl silicone of methyl ethylene siloxy end-blocking and the copolymer of dimethyl siloxane, 5 parts of modified sphericals
Boron nitride, 20 parts of modified spherical magnesia, 100 parts of modified silicon powders, 60 parts of modified aluminium hydroxides, 1 part of Graphene, 120
DEG C, 40 minutes minutes are stirred under the conditions of -0.08Mpa.Room temperature is cooled to, 10ppm platinum catalysts dispersed with stirring is uniform, is made A
Component.
85 parts of dimethyl polysiloxanes of dimethylvinylsiloxy end-blocking, 10 are added in planetary-type mixer
The methyl vinyl silicone of part dimethylvinylsiloxy end-blocking and the copolymer of dimethyl siloxane, 5 parts are modified
Spherical boron nitride, 20 parts of modified spherical magnesia, 100 parts of modified silicon powders, 60 parts of modified aluminium hydroxides, 1 part of Graphene,
120 DEG C, 40 minutes minutes are stirred under the conditions of -0.08Mpa.2 parts of hydrogen containing siloxanes are added to synthesize 1 and 3 part of silicon oil of low hydrogen content,
10ppm t etram-ethyltetravinylcyclotetrasiloxanes, 10ppm acetylene cyclohexanol, dispersed with stirring is uniform, is made B component.
By A, B component 1 to 1 mixed-forming in mass ratio, test result such as table 1.
Embodiment 3：
95 parts of dimethyl polysiloxanes of dimethylvinylsiloxy end-blocking, 15 parts of ends are added in planetary-type mixer
Trimethyl polyvinyl methyl-dimethyl siloxanes, 15 parts of 5 parts of modified graphenes, 10 parts of modified spherical magnesia, 10 parts are modified
Boron nitride, 100 parts of modified silicon powders, 60 parts of modified aluminium hydroxides, at 120 DEG C, stir 40 minutes minutes under the conditions of -0.08Mpa.
Room temperature is cooled to, 10ppm platinum catalysts dispersed with stirring is uniform, is made component A.
100 parts of dimethyl polysiloxanes of dimethylvinylsiloxy end-blocking are added in planetary-type mixer,
10 parts of 15 parts of end trimethyl polyvinyl methyl-dimethyl siloxanes, 5 parts of modified graphenes, 10 parts of modified spherical magnesia, 10
The modified boron nitride of part, 100 parts of modified silicon powders, 60 parts of modified aluminium hydroxides, at 120 DEG C, stir minute under the conditions of -0.08Mpa
40 minutes.2 parts of hydrogen containing siloxanes 1 and 3 part of silicon oil of low hydrogen content of synthesis of addition, 10ppm t etram-ethyltetravinylcyclotetrasiloxanes,
10ppm BTAs, dispersed with stirring is uniform, is made B component.
By A, B component 1 to 1 mixed-forming in mass ratio, test result such as table 1.
Embodiment 4：
100 parts of poly- methyl trifluoro propyl-dimethyl siloxanes of end-vinyl, 0.5 part of modified stone are added in planetary-type mixer
Black alkene, 0.2 part of chopped carbon fiber, 10 parts of modified spherical magnesia, 10 parts of modified boron nitride, 100 parts of modified silicon powders, 60 parts change
Property aluminium hydroxide, at 120 DEG C, under the conditions of -0.08Mpa stir 40 minutes minutes.Room temperature is cooled to, 10ppm platinum catalysts are stirred
Mix and be uniformly dispersed, be made component A.
100 parts of poly- methyl trifluoro propyl-dimethyl siloxanes of end-vinyl are added in planetary-type mixer, 0.5 part changes
Property Graphene, 0.2 part of chopped carbon fiber, 10 parts of modified spherical magnesia, 10 parts of modified boron nitride, 100 parts of modified silicon powders, 60
Part modified aluminium hydroxide, at 120 DEG C, stirs 40 minutes minutes under the conditions of -0.08Mpa.Add 2 parts of hydrogen containing siloxane synthesis 2
With 3 parts of silicon oil of low hydrogen content, 10ppm acetylene cyclohexanol, 10ppm BTAs, dispersed with stirring is uniform, is made B component.
By A, B component 1 to 1 mixed-forming in mass ratio, test result such as table 1.
Comparative example 1：
100 parts of dimethyl polysiloxanes of dimethylvinylsiloxy end-blocking, 150 parts are added in planetary-type mixer
Modified aluminas, 50 parts of modified aluminium hydroxides, at 120 DEG C, disperse 60 minutes under the conditions of -0.06Mpa.10ppm platinums are added to urge
Agent dispersed with stirring is uniform, is made component A.
100 parts of dimethyl polysiloxanes of dimethylvinylsiloxy end-blocking are added in planetary-type mixer,
150 parts of modified aluminas, 50 parts of modified aluminium hydroxides, at 120 DEG C, disperse 60 minutes under the conditions of -0.06Mpa.1 part of addition is hydrogeneous
Polysiloxanes synthesis Isosorbide-5-Nitrae part silicon oil of low hydrogen content, 30ppm BTAs dispersed with stirring is uniform, is made B component.
By A, B component 1 to 1 mixed-forming in mass ratio, test result such as table 1.
Comparative example 2：
100 parts of dimethyl polysiloxanes of dimethylvinylsiloxy end-blocking, 300 parts are added in planetary-type mixer
Non-modified aluminum oxide, at 120 DEG C, disperses 60 minutes under the conditions of -0.06Mpa.Add 10ppm platinum catalyst dispersed with stirring equal
It is even, it is made component A.
100 parts of dimethyl polysiloxanes of dimethylvinylsiloxy end-blocking are added in planetary-type mixer,
300 parts of non-modified aluminum oxide, at 120 DEG C, disperse 60 minutes under the conditions of -0.06Mpa.Add 1 part of hydrogen containing siloxane synthesis 2,4
Part silicon oil of low hydrogen content, 30ppm BTAs dispersed with stirring is uniform, is made B component.
By A, B component 1 to 1 mixed-forming in mass ratio, test result such as table 1.
Result is as follows：
Claims (9)
1. a kind of new energy high heat conduction low-gravity organic silicon potting adhesive, it is characterised in that：Including component A and B component, according to weight
Than component A：B component=1:1,
Described component A, including the component of following weight portion is mixed：
100 parts of vinyl polysiloxanes
130 ~ 190 parts of heat fillings
1 ~ 5 part of catalyst
Described B component, including the component of following weight portion is mixed：
100 parts of vinyl polysiloxanes
130 ~ 190 parts of heat fillings
3 ~ 10 parts of hydrogen containing siloxanes
1 ~ 5 part of delayed-action activator
0 ~ 10 part of stress conditioning agent.
2. new energy high heat conduction low-gravity organic silicon potting adhesive according to claim 1, it is characterised in that：Can be solid with room temperature
Chemical conversion type or 60 DEG C ~ 120 DEG C heating cure shapings.
3. new energy high heat conduction low-gravity organic silicon potting adhesive according to claim 1, it is characterised in that：The heat conduction is filled out
Material can be selected from：Graphene, chopped carbon fiber, silicon powder, aluminium hydroxide, spherical alumina magnesium and spherical boron nitride, it is preferably above-mentioned
Filler is 0.5 ~ 5 in mass ratio：0~5:30~120：30~80:5~30：5 ~ 30 mix.
4. new energy high heat conduction low-gravity organic silicon potting adhesive according to claim 1, it is characterised in that：The heat conduction is filled out
Material is by particle diameter heat filling, 0.1um ~ 3um fine grain heat filling heaps in 30um ~ 50um coarse grain footpath heat filling, 8um ~ 15um
Product is formed, and more preferably coarse grain footpath heat filling is spherical heat filling, the preferably irregular heat filling of middle particle diameter heat filling, carefully
Particle diameter heat filling preferably has an irregular heat filling of certain draw ratio, the particle size range of described heat filling for 0.1 ~
50um。
5. new energy high heat conduction low-gravity organic silicon potting adhesive according to claim 1, it is characterised in that：The heat conduction is filled out
Material is preferably surface-treated using HMDS, MTMS, dodecyltrimethoxysilane.
6. new energy high heat conduction low-gravity organic silicon potting adhesive according to claim 1, it is characterised in that：It is described hydrogeneous poly-
Siloxanes is allyl glycidyl ether, vinyltrimethoxy silane, silicon oil of low hydrogen content in proportion 3 ~ 10:3~10:5 ~ 30
Addition reaction product under rhodium catalyst.
7. new energy high heat conduction low-gravity organic silicon potting adhesive according to claim 1, it is characterised in that：The vinyl
Polysiloxanes is the straight chain type or branched polysiloxane that at least two vinyl are bonded silicon atom, or their mixture,
It is preferred that straight chain type polysiloxanes and branched polysiloxane in mass ratio 100:0 ~ 50 is used in mixed way.
8. new energy high heat conduction low-gravity organic silicon potting adhesive according to claim 1, it is characterised in that：The catalyst
Chloroplatinic acid-Isopropanol catalysis agent, chloroplatinic acid-divinyl tetramethyl disiloxane catalyst, the ethene of chloroplatinic acid-four can be selected from
One kind in base tetramethyl-ring tetrasiloxane catalyst, preferably platinum metal catalyst account for A, B two-component gross weight 0.1ppm ~
10ppm。
9. new energy high heat conduction low-gravity organic silicon potting adhesive according to claim 1, it is characterised in that：The delayed-action activator
The one kind in many vinyl polysiloxanes, acetylene cyclohexanol, maleic acid ester type compound, BTA can be selected from, be preferably prolonged
Slow agent accounts for A, the 1.2ppm ~ 30ppm of B two-component gross weight.
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| CN108440969A (en) * | 2018-03-30 | 2018-08-24 | 肇庆皓明有机硅材料有限公司 | Power battery pack low-density heat conductive flame-retarding organosilicon material |
| CN108795055A (en) * | 2018-05-15 | 2018-11-13 | 苏州市贝特利高分子材料股份有限公司 | A kind of curable silicon composition |
| CN108822807A (en) * | 2018-05-10 | 2018-11-16 | 郑州赛尔微粉有限公司 | A kind of novel heat-conducting material and its production technology |
| CN109777345A (en) * | 2018-12-30 | 2019-05-21 | 苏州桐力光电股份有限公司 | One kind can the thermally conductive Silica hydrogel of self-healing dual composition addition type and preparation method thereof |
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| CN116285875A (en) * | 2023-03-27 | 2023-06-23 | 湖北兴瑞硅材料有限公司 | Low-density heat-conducting organic silicon pouring sealant and preparation method thereof |
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