CN106701012A - Light-weight heat-conducting organosilicon pouring sealant base sizing material as well as composition and preparation methods thereof - Google Patents
Light-weight heat-conducting organosilicon pouring sealant base sizing material as well as composition and preparation methods thereof Download PDFInfo
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- CN106701012A CN106701012A CN201710019287.6A CN201710019287A CN106701012A CN 106701012 A CN106701012 A CN 106701012A CN 201710019287 A CN201710019287 A CN 201710019287A CN 106701012 A CN106701012 A CN 106701012A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/22—Expanded, porous or hollow particles
- C08K7/24—Expanded, porous or hollow particles inorganic
- C08K7/28—Glass
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
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- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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- C—CHEMISTRY; METALLURGY
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Abstract
The invention discloses a light-weight heat-conducting organosilicon pouring sealant base sizing material which comprises unsaturated hydrocarbon terminated polydiorgnosiloxane and light-weight heat-conducting filler with density of 0.1-2.0g/cm<3>. The invention aims at providing a light-weight heat-conducting organosilicon pouring sealant base sizing material and also provides a preparation method of the base sizing material, as well as a composition prepared by using the base sizing material and a preparation method thereof. A pouring sealant prepared by the base sizing material has the advantages of light weight, and good heat-conducting property.
Description
Technical field
The present invention relates to organosilicon material technical field, more particularly to a kind of lightweight heat conduction organosilicon filling and sealing gum basis glue
Material, composition and preparation method thereof.
Background technology
The conventional Embedding Material of in the market mainly has the materials such as polyurethane, epoxy resin and silicon rubber.Wherein polyurethane material
Material has preferable lower temperature resistance, weatherability, and viscosity is small, good fluidity, process equipment and process is simple, it is easy to accomplish automation
Operation.Have the disadvantage that polyurethane material is poisonous, to human health；No coupling product, shrinkage factor are small during epoxy resin cure, have
Excellent heat resistance, electrical insulating property and dielectricity.Have the disadvantage that fragility is big, toughness is not enough, has certain internal stress during solidification, after solidification
It is also easy to produce crackle；Silicon rubber does not absorb heat when solidifying, not heat release, is not shunk after solidification, and has excellent electrical property and chemistry steady
Qualitative, it will not produce corrosion to metal, and nontoxic.Particularly additional organosilicon potting material cure when, surface and deep layer
Vulcanize simultaneously, the intensity of silastic material is high after vulcanization, shrinkage factor is low, with good protection against the tide, anticorrosion, shockproof, dust-proof etc.
Effect.
In recent years, with high energy quantization, miniaturization, the height of the products such as all kinds of electric vehicle batterys, compact power, LED
Performance-based, is also proposed higher to performances such as embedding product stability, high and low temperature resistance, insulating radiation, anti-flammabilitys
It is required that.And organosilicon electronic encapsulation material with good stability, excellent insulating properties, resistant of high or low temperature, hyperoxia due to referring to
The performances such as number, the focus paid close attention to as academia all the time.Japan Patent JP5140456 [P] has found, if dosing metal in silicon rubber
Powder (such as aluminium powder, aluminum nitride powder) and through the aluminium-hydroxide powder of stearic acid treatment, can be obtained with high-termal conductivity and good fire-retardant
The silicon rubber of performance.Patent JP06234920 [P] is disclosed and silver powder, boron nitride and platinum-based combustion promoters is filled with silicon rubber,
The silastic material with fire resistance can be prepared, flame retardant rating reaches UL94-V1.Patent US6448329 is pointed out, organic
The aluminium powder filler processed through silane coupler of mass fraction 60%~90%, the thermal conductivity of elastomer silicone are added in siloxanes
Rate is at least 0.8W/m.K, it might even be possible to reach 1.5W/m.K.Patent CN103102689A [P] uses 100 parts of vinyl silicone oil,
The ratio of 400~1000 parts of the alumina powder of silicone covering is coordinated to prepare high heat conduction organosilicon Embedding Material.
At this stage with the fast development of electric automobile, the safety problem on electric automobile emerges in an endless stream.How to avoid
Or mitigate electric automobile power battery group overcharging, short circuit, immersion, the hidden danger, guarantor such as the burning, the blast that produce during collision etc.
Barrier personal safety turns into the new focus of electric automobile industry.The proportion 1.5-1.6 or so of traditional casting glue, there is particular/special requirement
Can be to 1.2 --- between 2.0, also there is the casting glue without heat conductivility, proportion can arrive 1.0-1.2；But typically not
1.0 can be less than.Therefore, in the correlation technique of this area, data is not had temporarily to disclose well unify proportion and heat conductivility
Scheme.
The content of the invention
For above-mentioned deficiency, it is an object of the invention to provide a kind of lightweight heat conduction organosilicon filling and sealing gum sizing,
The present invention also provides preparation method and the composition using the sizing of the sizing and preparation method thereof simultaneously, this
The casting glue that the sizing of invention is prepared has lightweight, good heat conductivity advantage, can be electric vehicle battery, just
Take formula power supply and light-weighted embedding protection is provided.
Previous technical scheme of the invention is such：A kind of lightweight heat conduction organosilicon filling and sealing gum sizing, including
The polydiorganosiloxanewith of unsaturated alkyl end-blocking, is 0.1~2.0g/cm also including density3Lightweight heat filling.
In above-mentioned lightweight heat conduction organosilicon filling and sealing gum sizing, relative to the unsaturated alkyl of 100 weight portions
The polydiorganosiloxanewith of end-blocking, the consumption of lightweight heat filling is 1-180 mass parts.
In above-mentioned lightweight heat conduction organosilicon filling and sealing gum sizing, described lightweight heat filling is hollow glass
One kind or several in glass microballoon, hollow ceramic microspheres, hollow alumina microballoon, hollow aluminium nitride microballoon, hollow aluminium carbide microballoon
Plant combination.
In above-mentioned lightweight heat conduction organosilicon filling and sealing gum sizing, the density of described lightweight heat filling is
0.1-1.5g/cm3, the particle diameter of lightweight heat filling is 1um-100um.
In above-mentioned lightweight heat conduction organosilicon filling and sealing gum sizing, also including alkoxy end-capped polydimethylsiloxanes
Alkane, relative to the polydiorganosiloxanewith that the unsaturated alkyl of 100 weight portions is blocked, alkoxy end-capped dimethyl silicone polymer
It is 5-18 weight portions.
In above-mentioned lightweight heat conduction organosilicon filling and sealing gum sizing, described alkoxy end-capped polydimethylsiloxanes
The structural formula of alkane such as following formula 1：
Wherein, w=5-60；
R is C1-C3 alkyl, such as methyl, ethyl, propyl group.
In actual application, alkoxy end-capped dimethyl silicone polymer can use hydroxy-end capped poly dimethyl silicon
Oxygen alkane and corresponding end-blocking auxiliary agent carry out addition reaction and can obtain, and the addition reaction is in the art more conventional anti-
Should, do not do excessive limitation to this present invention.
In above-mentioned lightweight heat conduction organosilicon filling and sealing gum sizing, w=10-30.
In above-mentioned lightweight heat conduction organosilicon filling and sealing gum sizing, poly- the two of described unsaturated alkyl end-blocking has
The structure of machine radical siloxane such as following formula 2：
Wherein, x=10-500, y=0-50；It is preferred that x=20-400, y=0-30；More preferably x=20-400, y=0-10.
R1、R3It is C2-C3 unsaturated aliphatic hydrocarbon bases；E.g. any one of vinyl, pi-allyl, optimal ethylene
Base.
R2It is any one of C1-C3 alkyl.Such as methyl, ethyl, propyl group, C2-C3 alkenyls such as vinyl, alkene
Any one of propyl group；
In above-mentioned lightweight heat conduction organosilicon filling and sealing gum sizing, poly- two also including saturated hydrocarbyl end-blocking are organic
Radical siloxane, relative to the polydiorganosiloxanewith that the unsaturated alkyl of 100 weight portions is blocked, poly- the two of saturated hydrocarbyl end-blocking
The consumption of organopolysiloxane is 20-80 mass parts.
In above-mentioned lightweight heat conduction organosilicon filling and sealing gum sizing, the poly- two organic groups silica of saturated hydrocarbyl end-blocking
Alkane has such as following formula 3：
In formula, z=10-100, preferably z=10-50；R4、R5It is C1-C2 alkyl such as methyl, ethyl.
In above-mentioned lightweight heat conduction organosilicon filling and sealing gum sizing, also including fire-retardant filler, relative to 100 weight
The polydiorganosiloxanewith of the unsaturated alkyl end-blocking of part, the consumption of fire-retardant filler is 5-180 mass parts.
In above-mentioned lightweight heat conduction organosilicon filling and sealing gum sizing, described fire-retardant filler is aluminium hydroxide, hydrogen
One kind or their mixture in magnesia, zinc carbonate and Firebrake ZB.
In above-mentioned lightweight heat conduction organosilicon filling and sealing gum sizing, the particle diameter of described fire-retardant filler is 0.1-
50um。
In above-mentioned lightweight heat conduction organosilicon filling and sealing gum sizing, also including filler treatment agent, relative to 100 weights
The polydiorganosiloxanewith of the unsaturated alkyl end-blocking of part is measured, the consumption of filler treatment agent is 5-18 mass parts.
In above-mentioned lightweight heat conduction organosilicon filling and sealing gum sizing, described filler treatment agent is epoxy radicals silicon
Any one of alkane, vinyl silanes, acyl silanes or their mixture.
Specifically, filler treatment agent can be epoxy radicals silicone hydride, such as 3- glycidyl ether oxygen propyl trimethoxy silicanes,
3- glycidoxypropyltrietandysilane andysilanes, 3- glycidyl ether oxygen propyls methyl dimethoxysilane, 3- glycidols
Ether oxygen propyl methyldiethoxysilane；Can also be vinyl silanes, such as VTES, vinyl methyl two
Ethoxysilane, vinyltrimethoxy silane, vinyl methyl dimethoxysilane；Can also be acyl silanes, such as 3- (first
Base acryloxy) propyl trimethoxy silicane, 3- (methacryloxy) propyl-triethoxysilicane, 3- (metering systems
Acyloxy) hydroxypropyl methyl dimethoxysilane, 3- (methacryloxy) hydroxypropyl methyls diethoxy silane, 3- (methyl-props
Alkene acyloxy) any one of the isopropoxy silane of propyl group three or their mixture.
Meanwhile, the present invention also provides the preparation method of lightweight heat conduction organosilicon filling and sealing gum sizing as described above,
Comprise the following steps：
Step 1：The polydiorganosiloxanewith that unsaturated alkyl is blocked is added in vacuum kneader, then is added several times
Enter lightweight heat filling, stirring mixing 0.5-2.0 hours；
Step 2：120-160 DEG C of heating is warming up to knead 2.0-6.0 hours；
Step 3：By the vacuum removal lower-molecular substance of 1.0-4.0 hours；
Step 4：Lightweight heat conduction organosilicon filling and sealing gum sizing is made after cooling, filtering.
In the preparation method of above-mentioned lightweight heat conduction organosilicon filling and sealing gum sizing, in step 1, by insatiable hunger
What the polydiorganosiloxanewith blocked with alkyl was additionally added saturated hydrocarbyl end-blocking when being added in vacuum kneader poly- two has
Machine radical siloxane.
In the preparation method of above-mentioned lightweight heat conduction organosilicon filling and sealing gum sizing, in step 1, several times
While adding lightweight heat filling, fire-retardant filler and filler treatment agent have been additionally added.
In the preparation method of above-mentioned lightweight heat conduction organosilicon filling and sealing gum sizing, between step 1 and step 2
Also include step 1-1；
Described step 1-1 is：Alkoxy end-capped dimethyl silicone polymer is added, continues to stir mixing 0.5-2.0 hours
Then step 2 is carried out.
Step 1-1, adds alkoxy end-capped dimethyl silicone polymer, continues to stir mixing 0.5-2.0 hours, can be in heat conduction
Crystallinity is formed between filler and polydiorganosiloxanewith, the toughness of product is lifted.Stirring incorporation time is small less than 0.5
When, then react insufficient.
Additionally, the present invention also provides a kind of lightweight heat conduction organosilicon filling and sealing gum composition, it is pressed by component A and component B
According to 1:1 weight is constituted than proportioning；
Wherein, component A includes：100 mass parts such as weigh above-mentioned lightweight heat conduction organosilicon filling and sealing gum sizing and
The addition reaction catalyst of 0.02-0.4 mass parts；
Component B includes：100 mass parts lightweight heat conduction organosilicon filling and sealing gum sizing described above, 1-10 mass parts
Crosslinking agent, the addition reaction inhibitor of 0.01-0.1 mass parts.
Above-mentioned addition reaction catalyst is any one of palladium class catalyst, platinum-type catalyst or rhodium class catalyst；
Described platinum-type catalyst is the complex compound and diacetyl platinum acetate of chloroplatinic acid, platinum tetrachloride or platinum and vinyl compound
Any one of；
Above-mentioned crosslinking agent is organic hydrogen-based polysiloxanes, and its general molecular formula is following formula 4：
In formula：M=0-100, n=2-30；
R6, R7 be independently in methyl or hydrogen-based, but each molecule at least containing two hydrogen-baseds, preferably comprise three or
More than three hydrogen-baseds.
Addition reaction inhibitor is the compound containing vinyl, and the described compound containing vinyl preferably is selected from：Tetramethyl
Tetravinyl cyclotetrasiloxane, hexamethyl divinyl cyclotetrasiloxane, tetramethyl divinyl silane, trimethyl trivinyl
Silane, dimethyl tetravinyl silane, dimethyl divinyl silane, methyl trivinyl silane, dimethyl ethenyl methoxy
Base silane, Vinyldimethylethoxysilane.
Meanwhile, the preparation method that above-mentioned lightweight heat conduction organosilicon filling and sealing gum composition is also provided of the invention, including with
Lower step：
Step 1：Lightweight heat conduction organosilicon filling and sealing gum sizing is added into addition reaction catalyst, after stirring,
De-bubbled, filtering, obtains final product component A；
Step 2：Lightweight heat conduction organosilicon filling and sealing gum sizing is added into crosslinking agent, addition reaction inhibitor, stirring
After uniform, de-bubbled, filtering obtains final product component B；
Step 3：Component A and component B is according to 1：1 quality proportioning is well mixed, and pours into mould, is placed at 25 DEG C
48h is obtained final product.
Compared with conventional method, the present invention has the advantage that：
(1) present invention can effectively improve heat conductivility using lightweight heat filling, reduce product density, realize producing
Product lightweight；
(2) present invention use alkoxy end-capped dimethyl silicone polymer, can effectively improve product tensile strength and
Tensile elongation；
(3) present invention uses fire-retardant filler and filler treatment agent, can realize that product is light-weighted simultaneously, improves product
Fire resistance.It is right by the comprehensive function of filler treatment agent and alkoxy end-capped dimethyl silicone polymer for specifically
Heat filling, fire-retardant filler are surface-treated, and improve compatibility of the filler in sizing material, improve the mobility of sizing material.And alkane
The introducing of epoxide end-blocking dimethyl silicone polymer can effectively improve the mechanical strength of casting glue, improve pliability.
Lightweight heat conduction organosilicon filling and sealing gum composition good fluidity of the invention, solidifies under ambient temperature curable or high temperature,
Shaping speed is fast, and solidification process no coupling product, material loss is few, and is easy to implement the operation of serialization encapsulating；The casting glue is consolidated
There is the features such as thermal conductivity is good, flame retarding efficiency is high, proportion is low, permanent compression set is small, electrical property is protruded after change,
From lightweight heat conduction organosilicon filling and sealing gum composition of the invention typically Shao's A hardness with 10-60, preferably 15-
35 Shao's A hardness, the tensile strength with 0.5-5.0MPa, the elongation with 20-150%, with 1.0-12.0kN/m
Tearing strength.In addition, also typically having insulaion resistance 1012-1015Ω·cm。
Specific embodiment
With reference to specific embodiment, claim of the invention is described in further detail, but do not constitute it is right
Any limitation of the invention, the modification of any limited number of time for being made within the scope of the invention as claimed, still in power of the invention
In the claimed scope of profit.
Embodiment 1
Polydiorganosiloxanewith (a), the saturated hydrocarbyl envelope of 0 mass parts that the unsaturated alkyl of 100 mass parts is blocked
The polydiorganosiloxanewith (b) at end is added in vacuum kneader, then adds 50 mass parts particle diameters several times for 1um, density
It is 0.4g/cm3Hollow glass micro-ball heat filling (c), 30 mass parts particle diameters for 5um aluminium hydroxide flame-retardant filler (d) and
3- glycidyl ether oxygen propyl trimethoxy silicanes inorganic agent (e) of 10 mass parts, stirring mixing 1.0 hours, adds 0 mass
The alkoxy end-capped dimethyl silicone polymer (f) of part, continues to stir mixing 0.5 hour；It is warming up to 120 DEG C of heating mixings 2.0 small
When；Vacuum removal low molecule 1.0 hours；Lightweight heat conduction, flame-proof organosilicon casting glue sizing are made after cooling, filtering.
The above-mentioned organic silicon potting adhesive sizing of 100 mass parts is added the chloroplatinic acid catalyst (g) of 0.02 mass parts,
After stirring, de-bubbled, filtering obtains final product component (A)；
The above-mentioned organic silicon potting adhesive sizing of 100 mass parts is added crosslinking agent (h), 0.01 mass of 10 mass parts
T etram-ethyltetravinylcyclotetrasiloxane inhibitor (i) of part, after stirring, de-bubbled, filtering obtains final product component (B)；
Component (A) is with component (B) according to 1：1 quality proportioning is well mixed, and pours into the deep moulds of 2mm, at 25 DEG C
Place 48h and obtain a kind of lightweight heat conduction, flame-proof organosilicon casting glue film, and test performance.
The structural formula of the polydiorganosiloxanewith (a) of above-mentioned unsaturated alkyl end-blocking is as follows：
Vi is the abbreviation of vinyl.
The structural formula of the polydiorganosiloxanewith (b) of above-mentioned saturated hydrocarbyl end-blocking is as follows：
Above-mentioned alkoxy end-capped dimethyl silicone polymer (f) structural formula is as follows：
Above-mentioned crosslinking agent (h) is organic hydrogen-based polysiloxanes, and its general molecular formula is：
Embodiment 2
Polydiorganosiloxanewith (a), the saturated hydrocarbyl envelope of 20 mass parts that the unsaturated alkyl of 100 mass parts is blocked
The polydiorganosiloxanewith (b) at end is added in vacuum kneader, then adds 1 mass parts particle diameter for 5um several times, and density is
2.0g/cm3Hollow ceramic microspheres heat filling (c), 90 mass parts particle diameters for 2um magnesium hydroxide flame retardant filler (d) and 5 matter
3- glycidyl ether oxygen propyls methyldiethoxysilane inorganic agent (e) of part is measured, stirring mixing 2.0 hours adds 8 mass
The alkoxy end-capped dimethyl silicone polymer (f) of part, continues to stir mixing 0.8 hour；It is warming up to 130 DEG C of heating mixings 3.0 small
When；Vacuum removal low molecule 2.0 hours；Lightweight heat conduction, flame-proof organosilicon casting glue sizing are made after cooling, filtering.
The above-mentioned organic silicon potting adhesive sizing of 100 mass parts is added the platinum tetrachloride catalyst of 0.04 mass parts
G (), after stirring, de-bubbled, filtering obtains final product component (A)；
The above-mentioned organic silicon potting adhesive sizing of 100 mass parts is added crosslinking agent (h), 0.02 mass of 8 mass parts
Hexamethyl divinyl cyclotetrasiloxane inhibitor (i) of part, after stirring, de-bubbled, filtering obtains final product component (B)；
Component (A) is with component (B) according to 1：1 quality proportioning is well mixed, and pours into the deep moulds of 2mm, at 25 DEG C
Place 48h and obtain a kind of lightweight heat conduction, flame-proof organosilicon casting glue film, and test performance.
The structural formula of the polydiorganosiloxanewith (a) of above-mentioned unsaturated alkyl end-blocking is as follows：
The structural formula of the polydiorganosiloxanewith (b) of above-mentioned saturated hydrocarbyl end-blocking is as follows：
Above-mentioned alkoxy end-capped dimethyl silicone polymer (f) structural formula is as follows：
Above-mentioned crosslinking agent (h) is organic hydrogen-based polysiloxanes, and its general molecular formula is：
Embodiment 3
Polydiorganosiloxanewith (a), the saturated hydrocarbyl envelope of 40 mass parts that the unsaturated alkyl of 100 mass parts is blocked
The polydiorganosiloxanewith (b) at end is added in vacuum kneader, then adds 25 mass parts particle diameters several times for 20um, density
It is 0.1g/cm3Hollow alumina microballoon heat filling (c), 5 mass parts particle diameters for 2um aluminium hydroxide flame-retardant filler (d) and
3- glycidyl ether oxygen propyl trimethoxy silicanes inorganic agent (e) of 7 mass parts, stirring mixing 0.8 hour, adds 5 mass
The alkoxy end-capped dimethyl silicone polymer (f) of part, continues to stir mixing 0.8 hour；It is warming up to 140 DEG C of heating mixings 4.0 small
When；Vacuum removal low molecule 3.0 hours；Lightweight heat conduction, flame-proof organosilicon casting glue sizing are made after cooling, filtering.
The above-mentioned organic silicon potting adhesive sizing of 100 mass parts is added the diacetyl acetic acid platinum catalysis of 0.06 mass parts
Agent (g), after stirring, de-bubbled, filtering obtains final product component (A)；
The above-mentioned organic silicon potting adhesive sizing of 100 mass parts is added crosslinking agent (h), 0.03 mass of 6 mass parts
Tetramethyl divinyl silane inhibitor (i) of part, after stirring, de-bubbled, filtering obtains final product component (B)；
Component (A) is with component (B) according to 1：1 quality proportioning is well mixed, and pours into the deep moulds of 2mm, at 25 DEG C
Place 48h and obtain a kind of lightweight heat conduction, flame-proof organosilicon casting glue film, and test performance.
The structural formula of the polydiorganosiloxanewith (a) of above-mentioned unsaturated alkyl end-blocking is as follows：
The structural formula of the polydiorganosiloxanewith (b) of above-mentioned saturated hydrocarbyl end-blocking is as follows：
Above-mentioned alkoxy end-capped dimethyl silicone polymer (f) structural formula is as follows：
Above-mentioned crosslinking agent (h) is organic hydrogen-based polysiloxanes, and its general molecular formula is：
Embodiment 4
Polydiorganosiloxanewith (a), the saturated hydrocarbyl envelope of 80 mass parts that the unsaturated alkyl of 100 mass parts is blocked
The polydiorganosiloxanewith (b) at end is added in vacuum kneader, then adds 180 mass parts particle diameters several times for 100um, close
It is 1.0g/cm to spend3Hollow glass micro-ball heat filling (c), the fire-retardant filler (d) of 0 mass parts and 18 mass parts vinyl
Triethoxysilane inorganic agent (e), stirring mixing 0.5 hour, adds the alkoxy end-capped dimethyl silicone polymer of 5 mass parts
F (), continues to stir mixing 1.0 hours；150 DEG C of heating are warming up to knead 5.0 hours；Vacuum removal low molecule 4.0 hours；It is cold
But lightweight heat conduction, flame-proof organosilicon casting glue sizing are made after, filtering.
The above-mentioned organic silicon potting adhesive sizing of 100 mass parts is added the platinum tetrachloride catalyst of 0.1 mass parts
G (), after stirring, de-bubbled, filtering obtains final product component (A)；
The above-mentioned organic silicon potting adhesive sizing of 100 mass parts is added crosslinking agent (h), 0.04 mass of 2 mass parts
T etram-ethyltetravinylcyclotetrasiloxane inhibitor (i) of part, after stirring, de-bubbled, filtering obtains final product component (B)；
Component (A) is with component (B) according to 1：1 quality proportioning is well mixed, and pours into the deep moulds of 2mm, at 25 DEG C
Place 48h and obtain a kind of lightweight heat conduction, flame-proof organosilicon casting glue film, and test performance.
The structural formula of the polydiorganosiloxanewith (a) of above-mentioned unsaturated alkyl end-blocking is as follows：
The structural formula of the polydiorganosiloxanewith (b) of above-mentioned saturated hydrocarbyl end-blocking is as follows：
Above-mentioned alkoxy end-capped dimethyl silicone polymer (f) structural formula is as follows：
Above-mentioned crosslinking agent (h) is organic hydrogen-based polysiloxanes, and its general molecular formula is：
Embodiment 5
Polydiorganosiloxanewith (a), the saturated hydrocarbyl envelope of 20 mass parts that the unsaturated alkyl of 100 mass parts is blocked
The polydiorganosiloxanewith (b) at end is added in vacuum kneader, then adds 30 mass parts particle diameters several times for 20um, density
It is 0.5g/cm3Hollow aluminium nitride microballoon heat filling (c), 120 mass parts particle diameters for 0.1um zinc carbonate fire-retardant filler
D () and VTES inorganic agent (e) of 10 mass parts, stirring mixing 1.0 hours, adds the alkane of 10 mass parts
Epoxide blocks dimethyl silicone polymer (f), continues to stir mixing 1.5 hours；160 DEG C of heating are warming up to knead 6.0 hours；Vacuum
Removing low molecule 3.0 hours；Lightweight heat conduction, flame-proof organosilicon casting glue sizing are made after cooling, filtering.
The above-mentioned organic silicon potting adhesive sizing of 100 mass parts is added the platinum and vinyl compound of 0.2 mass parts
Complex compound catalyst (g), after stirring, de-bubbled, filtering, obtain final product component (A)；
The above-mentioned organic silicon potting adhesive sizing of 100 mass parts is added crosslinking agent (h), 0.05 mass of 8 mass parts
Dimethyl tetravinyl silane inhibitor (i) of part, after stirring, de-bubbled, filtering obtains final product component (B)；
Component (A) is with component (B) according to 1：1 quality proportioning is well mixed, and pours into the deep moulds of 2mm, at 25 DEG C
Place 48h and obtain a kind of lightweight heat conduction, flame-proof organosilicon casting glue film, and test performance.
The structural formula of the polydiorganosiloxanewith (a) of above-mentioned unsaturated alkyl end-blocking is as follows：
The structural formula of the polydiorganosiloxanewith (b) of above-mentioned saturated hydrocarbyl end-blocking is as follows：
Above-mentioned alkoxy end-capped dimethyl silicone polymer (f) structural formula is as follows：
Above-mentioned crosslinking agent (h) is organic hydrogen-based polysiloxanes, and its general molecular formula is：
Embodiment 6
Polydiorganosiloxanewith (a), the saturated hydrocarbyl envelope of 60 mass parts that the unsaturated alkyl of 100 mass parts is blocked
The polydiorganosiloxanewith (b) at end is added in vacuum kneader, then adds 120 mass parts particle diameters several times for 20um, close
It is 0.4g/cm to spend3Hollow glass micro-ball heat filling (c), 10 mass parts particle diameters for 5um aluminium hydroxide flame-retardant filler (d)
And 10 mass parts vinyl methyl dimethoxysilane inorganic agent (e), stirring mixing 1.2 hours, add the alkane of 8 mass parts
Epoxide blocks dimethyl silicone polymer (f), continues to stir mixing 1.8 hours；120 DEG C of heating are warming up to knead 5.0 hours；Vacuum
Removing low molecule 2.0 hours；Lightweight heat conduction, flame-proof organosilicon casting glue sizing are made after cooling, filtering.
The above-mentioned organic silicon potting adhesive sizing of 100 mass parts is added the chloroplatinic acid catalyst (g) of 0.3 mass parts,
After stirring, de-bubbled, filtering obtains final product component (A)；
The above-mentioned organic silicon potting adhesive sizing of 100 mass parts is added crosslinking agent (h), 0.07 mass of 3 mass parts
T etram-ethyltetravinylcyclotetrasiloxane inhibitor (i) of part, after stirring, de-bubbled, filtering obtains final product component (B)；
Component (A) is with component (B) according to 1：1 quality proportioning is well mixed, and pours into the deep moulds of 2mm, at 25 DEG C
Place 48h and obtain a kind of lightweight heat conduction, flame-proof organosilicon casting glue film, and test performance.
The structural formula of the polydiorganosiloxanewith (a) of above-mentioned unsaturated alkyl end-blocking is as follows：
The structural formula of the polydiorganosiloxanewith (b) of above-mentioned saturated hydrocarbyl end-blocking is as follows：
Above-mentioned alkoxy end-capped dimethyl silicone polymer (f) structural formula is as follows：
Above-mentioned crosslinking agent (h) is organic hydrogen-based polysiloxanes, and its general molecular formula is：
Embodiment 7
Polydiorganosiloxanewith (a), the saturated hydrocarbyl envelope of 40 mass parts that the unsaturated alkyl of 100 mass parts is blocked
The polydiorganosiloxanewith (b) at end is added in vacuum kneader, then adds 20 mass parts particle diameters several times for 5um, density
It is 0.8g/cm3Hollow ceramic microspheres heat filling (c), 20 mass parts particle diameters for 50um magnesium hydroxide flame retardant filler (d) and
3- (methacryloxy) propyl trimethoxy silicane inorganic agent (e) of 0 mass parts, stirring mixing 1.0 hours, adds 18
The alkoxy end-capped dimethyl silicone polymer (f) of mass parts, continues to stir mixing 1.5 hours；It is warming up to 140 DEG C of heating mixings
4.0 hours；Vacuum removal low molecule 1.0 hours；Lightweight heat conduction, flame-proof organosilicon casting glue basis are made after cooling, filtering
Sizing material.
The above-mentioned organic silicon potting adhesive sizing of 100 mass parts is added the platinum tetrachloride catalyst of 0.4 mass parts
G (), after stirring, de-bubbled, filtering obtains final product component (A)；
The above-mentioned organic silicon potting adhesive sizing of 100 mass parts is added crosslinking agent (h), 0.1 mass parts of 5 mass parts
Dimethyl divinyl silane inhibitor (i), after stirring, de-bubbled, filtering, obtain final product component (B)；
Component (A) is with component (B) according to 1：1 quality proportioning is well mixed, and pours into the deep moulds of 2mm, at 25 DEG C
Place 48h and obtain a kind of lightweight heat conduction, flame-proof organosilicon casting glue film, and test performance.
The structural formula of the polydiorganosiloxanewith (a) of above-mentioned unsaturated alkyl end-blocking is as follows：
The structural formula of the polydiorganosiloxanewith (b) of above-mentioned saturated hydrocarbyl end-blocking is as follows：
Above-mentioned alkoxy end-capped dimethyl silicone polymer (f) structural formula is as follows：
Above-mentioned crosslinking agent (h) is organic hydrogen-based polysiloxanes, and its general molecular formula is：
Embodiment 8
Polydiorganosiloxanewith (a), the saturated hydrocarbyl envelope of 80 mass parts that the unsaturated alkyl of 100 mass parts is blocked
The polydiorganosiloxanewith (b) at end is added in vacuum kneader, then adds 5 mass parts particle diameters several times for 10um, density
It is 0.5g/cm3Hollow aluminium carbide microballoon heat filling (c), 180 mass parts particle diameters for 10um Firebrake ZB fire-retardant filler (d)
And 5 mass parts 3- (methacryloxy) propyl-triethoxysilicane inorganic agent (e), stirring mixing 0.5 hour, add
The alkoxy end-capped dimethyl silicone polymer (f) of 15 mass parts, continues to stir mixing 2.0 hours；It is warming up to 150 DEG C of heating mixings
3.0 hours；Vacuum removal low molecule 4.0 hours；Lightweight heat conduction, flame-proof organosilicon casting glue basis are made after cooling, filtering
Sizing material.
The above-mentioned organic silicon potting adhesive sizing of 100 mass parts is added the chloroplatinic acid catalyst (g) of 0.25 mass parts,
After stirring, de-bubbled, filtering obtains final product component (A)；
The above-mentioned organic silicon potting adhesive sizing of 100 mass parts is added crosslinking agent (h), 0.06 mass of 1 mass parts
Vinyldimethylethoxysilane inhibitor (i) of part, after stirring, de-bubbled, filtering obtains final product component (B)；
Component (A) is with component (B) according to 1：1 quality proportioning is well mixed, and pours into the deep moulds of 2mm, at 25 DEG C
Place 48h and obtain a kind of lightweight heat conduction, flame-proof organosilicon casting glue film, and test performance.
The structural formula of the polydiorganosiloxanewith (a) of above-mentioned unsaturated alkyl end-blocking is as follows：
The structural formula of the polydiorganosiloxanewith (b) of above-mentioned saturated hydrocarbyl end-blocking is as follows：
Above-mentioned alkoxy end-capped dimethyl silicone polymer (f) structural formula is as follows：
Above-mentioned crosslinking agent (h) is organic hydrogen-based polysiloxanes, and its general molecular formula is：
Embodiment 9
Polydiorganosiloxanewith (a), the saturated hydrocarbyl envelope of 20 mass parts that the unsaturated alkyl of 100 mass parts is blocked
The polydiorganosiloxanewith (b) at end is added in vacuum kneader, then adds 30 mass parts particle diameters several times for 20um, density
It is 0.5g/cm3Hollow aluminium nitride microballoon heat filling (c), 120 mass parts particle diameters for 0.1um zinc carbonate fire-retardant filler
D () and VTES inorganic agent (e) of 10 mass parts, stirring mixing 1.0 hours, adds the alkane of 0 mass parts
Epoxide blocks dimethyl silicone polymer (f), continues to stir mixing 1.5 hours；160 DEG C of heating are warming up to knead 6.0 hours；Vacuum
Removing low molecule 3.0 hours；Lightweight heat conduction, flame-proof organosilicon casting glue sizing are made after cooling, filtering.
The above-mentioned organic silicon potting adhesive sizing of 100 mass parts is added the platinum and vinyl compound of 0.2 mass parts
Complex compound catalyst (g), after stirring, de-bubbled, filtering, obtain final product component (A)；
The above-mentioned organic silicon potting adhesive sizing of 100 mass parts is added crosslinking agent (h), 0.05 mass of 8 mass parts
Dimethyl tetravinyl silane inhibitor (i) of part, after stirring, de-bubbled, filtering obtains final product component (B)；
Component (A) is with component (B) according to 1：1 quality proportioning is well mixed, and pours into the deep moulds of 2mm, at 25 DEG C
Place 48h and obtain a kind of lightweight heat conduction, flame-proof organosilicon casting glue film, and test performance.
The structural formula of the polydiorganosiloxanewith (a) of above-mentioned unsaturated alkyl end-blocking is as follows：
The structural formula of the polydiorganosiloxanewith (b) of above-mentioned saturated hydrocarbyl end-blocking is as follows：
Above-mentioned alkoxy end-capped dimethyl silicone polymer (f) structural formula is as follows：
Above-mentioned crosslinking agent (h) is organic hydrogen-based polysiloxanes, and its general molecular formula is：
The thick films of 2mm in the various embodiments described above are used for measuring physical property, wherein hardness (Shao A) is according to standard
GB/T 531-1999 are tested；Tensile strength, elongation at break are tested according to standard GB/T 528-1998；Tearing strength is root
Tested according to standard GB/T 529-1999；According to GB/T 533-2008《The measure of vulcanized rubber or thermoplastic elastomer density》Carry out
Density of material is detected；According to standard GB/T 1410-2006《Material volume resistivity and surface resistivity test method》Carry out body
Product Resistivity testing, result of the test is shown in Table 1.
The physical and mechanical properties and dielectric properties result of the test of the film of table 1
According to upper table it can be seen that：
1st, when the addition of heat filling is more, density is smaller, and film density is smaller；By upper table as can be seen that heat conduction
The proportion of filler is bigger, addition is more, and its thermal conductivity factor will be higher, additionally, hydroxide or carbonate fire retardant pair
Thermal conductivity factor is improved has certain contribution, and both cooperate with, and improves the heat-conducting effect of casting glue.
2nd, f being increased in the case of amount of filler identical can lift intensity；If amount of filler changes, heat conduction is filled out
The increase of material and fire-retardant filler can all cause the decline of intensity, the two comprehensive function to cause the change of intensity, be not only by f
The influence of consumption.For specifically, alkoxy end-capped dimethyl silicone polymer can effectively improve the intensity of casting glue
Reason is, it can as the introducing of another surface conditioning agent of filler-alkoxy end-capped dimethyl silicone polymer
The mechanical strength of casting glue is effectively improved, pliability is improved.
3rd, specific insulation as one of casting glue it is important consider aspect, it is the important ginseng of casting glue insulating properties
Examine foundation, existing casting glue its specific insulation is generally 1013-1014Ω CM, but in the present embodiment 3, its volume
Resistivity has reached 1015Rank, with very excellent insulation effect.
It is above-described be only presently preferred embodiments of the present invention, it is all made in the range of the spirit and principles in the present invention appoint
What modification, equivalent and improvement etc., should be included within the scope of the present invention.
Claims (21)
1. a kind of poly- two organic groups silica of lightweight heat conduction organosilicon filling and sealing gum sizing, including unsaturated alkyl end-blocking
Alkane, it is characterised in that also including density be 0.1~2.0g/cm3Lightweight heat filling.
2. lightweight heat conduction organosilicon filling and sealing gum sizing according to claim 1, it is characterised in that relative to 100
The polydiorganosiloxanewith of the unsaturated alkyl end-blocking of weight portion, the consumption of lightweight heat filling is 1-180 mass parts.
3. lightweight heat conduction organosilicon filling and sealing gum sizing according to claim 1, it is characterised in that described light weight
Change heat filling is hollow glass micro-ball, hollow ceramic microspheres, hollow alumina microballoon, hollow aluminium nitride microballoon, hollow carbonization
One or more combination in aluminium microballoon.
4. lightweight heat conduction organosilicon filling and sealing gum sizing according to claim 3, it is characterised in that described light weight
The density for changing heat filling is 0.1-1.5g/cm3, the particle diameter of lightweight heat filling is 1um-100um.
5. according to any described lightweight heat conduction organosilicon filling and sealing gum sizing of Claims 1-4, it is characterised in that also
Including alkoxy end-capped dimethyl silicone polymer, relative to the poly- two organic groups silica that the unsaturated alkyl of 100 weight portions is blocked
Alkane, alkoxy end-capped dimethyl silicone polymer is 5-18 weight portions.
6. lightweight heat conduction organosilicon filling and sealing gum sizing according to claim 1, it is characterised in that described alcoxyl
Base blocks the structural formula such as following formula 1 of dimethyl silicone polymer：
Wherein, w=5-60；
R is C1-C3 alkyl.
7. lightweight heat conduction organosilicon filling and sealing gum according to claim 6, it is characterised in that w=10-30.
8. according to any described lightweight heat conduction organosilicon filling and sealing gum sizing of Claims 1-4, it is characterised in that institute
The structure such as following formula 2 of the polydiorganosiloxanewith of the unsaturated alkyl end-blocking stated：
Wherein, x=10-500, y=0-50；
R1、R3It is C2-C3 unsaturated aliphatic hydrocarbon bases；
R2It is any one of C1-C3 alkyl.
9. according to any described lightweight heat conduction organosilicon filling and sealing gum sizing of Claims 1-4, it is characterised in that also
Polydiorganosiloxanewith including saturated hydrocarbyl end-blocking, poly- two relative to the unsaturated alkyl end-blocking of 100 weight portions are organic
Radical siloxane, the consumption of the polydiorganosiloxanewith of saturated hydrocarbyl end-blocking is 20-80 mass parts.
10. lightweight heat conduction organosilicon filling and sealing gum sizing according to claim 9, it is characterised in that saturated hydrocarbyl
The polydiorganosiloxanewith of end-blocking has such as following formula 3：
In formula, z=10-100；R4、R5It is C1-C2 alkyl.
11. according to any described lightweight heat conduction organosilicon filling and sealing gum sizing of Claims 1-4, it is characterised in that also
Including fire-retardant filler, relative to the polydiorganosiloxanewith that the unsaturated alkyl of 100 weight portions is blocked, the consumption of fire-retardant filler
It is 5-180 mass parts.
12. lightweight heat conduction organosilicon filling and sealing gum sizings according to claim 11, it is characterised in that described resistance
Combustion filler is one kind or their mixture in aluminium hydroxide, magnesium hydroxide, zinc carbonate and Firebrake ZB.
13. lightweight heat conduction organosilicon filling and sealing gum sizings according to claim 12, it is characterised in that described resistance
The particle diameter for firing filler is 0.1-50um.
14. lightweight heat conduction organosilicon filling and sealing gum sizings according to claim 11, it is characterised in that also including filling out
Material inorganic agent, relative to the polydiorganosiloxanewith that the unsaturated alkyl of 100 weight portions is blocked, the consumption of filler treatment agent is
5-18 mass parts.
15. lightweight heat conduction organosilicon filling and sealing gum sizings according to claim 14, it is characterised in that described fills out
Material inorganic agent is any one of epoxy radicals silicone hydride, vinyl silanes, acyl silanes or their mixture.
16. according to the preparation method of any described lightweight heat conduction organosilicon filling and sealing gum sizings of claim 1-15, its
It is characterised by, comprises the following steps：
Step 1：The polydiorganosiloxanewith that unsaturated alkyl is blocked is added in vacuum kneader, then is added several times light
Quantify heat filling, stirring mixing 0.5-2.0 hours；
Step 2：120-160 DEG C of heating is warming up to knead 2.0-6.0 hours；
Step 3：By the vacuum removal lower-molecular substance of 1.0-4.0 hours；
Step 4：Lightweight heat conduction organosilicon filling and sealing gum sizing is made after cooling, filtering.
The preparation method of 17. lightweight heat conduction organosilicon filling and sealing gum sizings according to claim 16, its feature exists
In in step 1, being additionally added when the polydiorganosiloxanewith for blocking unsaturated alkyl is added in vacuum kneader
The polydiorganosiloxanewith of saturated hydrocarbyl end-blocking.
The preparation method of 18. lightweight heat conduction organosilicon filling and sealing gum sizings according to claim 16, its feature exists
In, in step 1, several times add lightweight heat filling while, be additionally added fire-retardant filler and filler treatment agent.
The preparation method of 19. lightweight heat conduction organosilicon filling and sealing gum sizings according to claim 16, its feature exists
In also including step 1-1 between step 1 and step 2；
Described step 1-1 is：Alkoxy end-capped dimethyl silicone polymer is added, continues to stir mixing 0.5-2.0 hours then
Carry out step 2.
20. a kind of lightweight heat conduction organosilicon filling and sealing gum compositions, it is characterised in that it is by component A and component B according to 1:1
Weight is constituted than proportioning；
Wherein, component A includes：Lightweight heat conduction organosilicon filling and sealing gum base of 100 mass parts as described in claim 1-15 is any
The addition reaction catalyst of plinth sizing material and 0.02-0.4 mass parts；
Component B includes：Lightweight heat conduction organosilicon filling and sealing gum basis glue of 100 mass parts as described in claim 1-15 is any
Material, the crosslinking agent of 1-10 mass parts, the addition reaction inhibitor of 0.01-0.1 mass parts.
A kind of 21. preparation methods of lightweight heat conduction organosilicon filling and sealing gum composition as claimed in claim 20, its feature exists
In comprising the following steps：
Step 1：Lightweight heat conduction organosilicon filling and sealing gum sizing is added into addition reaction catalyst, after stirring, degassing
Bubble, filtering, obtains final product component A；
Step 2：Lightweight heat conduction organosilicon filling and sealing gum sizing is added into crosslinking agent, addition reaction inhibitor, is stirred
Afterwards, de-bubbled, filtering, obtains final product component B；
Step 3：Component A and component B is according to 1：1 quality proportioning is well mixed, and pours into mould, when placing one section at 25 DEG C
Between obtain final product.
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| CN108130039A (en) * | 2017-12-22 | 2018-06-08 | 上海康达化工新材料股份有限公司 | A kind of low-gravity low viscosity heat conduction casting glue and preparation method thereof |
| CN108441165A (en) * | 2017-12-30 | 2018-08-24 | 深圳市安品有机硅材料有限公司 | Low-gravity organic silicon potting adhesive and preparation method thereof |
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| CN111117558A (en) * | 2019-05-15 | 2020-05-08 | 浙江天易新材料有限公司 | Low-density heat-conducting organic silicon electronic pouring sealant and preparation method thereof |
| CN114736649A (en) * | 2022-05-07 | 2022-07-12 | 韦尔通(厦门)科技股份有限公司 | Organic silicon pouring sealant composition and preparation method thereof |
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Effective date of registration: 20220112 Address after: 510760, Guangzhou, Guangdong province Whampoa District Po Po Industrial Zone, East Road, Tat Tat Road, No. 8 Patentee after: GUANGZHOU TINCI MATERIALS TECHNOLOGY Co.,Ltd. Address before: 510760 No. 8, Kangda Road, Dongcheng Pian, YUNPU Industrial Zone, Huangpu District, Guangzhou City, Guangdong Province Patentee before: GUANGZHOU TIANCI ORGANIC SILICON TECHNOLOGY CO.,LTD. |