CN104788968B - Organosilicon heat-conducting insulating sheet and preparation method thereof - Google Patents
Organosilicon heat-conducting insulating sheet and preparation method thereof Download PDFInfo
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- CN104788968B CN104788968B CN201510191264.4A CN201510191264A CN104788968B CN 104788968 B CN104788968 B CN 104788968B CN 201510191264 A CN201510191264 A CN 201510191264A CN 104788968 B CN104788968 B CN 104788968B
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- heat conductive
- organosilicon heat
- organosilicon
- hydrogen
- isolation sheet
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- 238000002360 preparation method Methods 0.000 title claims abstract description 18
- 239000000203 mixture Substances 0.000 claims abstract description 72
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 50
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 50
- 239000010703 silicon Substances 0.000 claims abstract description 48
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 42
- 239000000463 material Substances 0.000 claims abstract description 39
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 35
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 28
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 24
- 125000003342 alkenyl group Chemical group 0.000 claims abstract description 23
- 239000003054 catalyst Substances 0.000 claims abstract description 20
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 20
- 238000007652 sheet-forming process Methods 0.000 claims abstract description 6
- -1 Polysiloxanes Polymers 0.000 claims description 60
- 239000001257 hydrogen Substances 0.000 claims description 53
- 229910052739 hydrogen Inorganic materials 0.000 claims description 53
- 238000002955 isolation Methods 0.000 claims description 43
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 41
- 229920005601 base polymer Polymers 0.000 claims description 32
- 238000011049 filling Methods 0.000 claims description 29
- 239000004970 Chain extender Substances 0.000 claims description 23
- 238000007711 solidification Methods 0.000 claims description 12
- 230000008023 solidification Effects 0.000 claims description 12
- 239000004744 fabric Substances 0.000 claims description 8
- 238000004073 vulcanization Methods 0.000 claims description 7
- 150000001875 compounds Chemical class 0.000 claims description 6
- 238000011017 operating method Methods 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 5
- 150000001451 organic peroxides Chemical class 0.000 claims description 5
- 239000007767 bonding agent Substances 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 239000005030 aluminium foil Substances 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- UFWIBTONFRDIAS-UHFFFAOYSA-N naphthalene-acid Natural products C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 claims description 3
- 238000010792 warming Methods 0.000 claims description 3
- 239000004952 Polyamide Substances 0.000 claims 1
- 150000002466 imines Chemical class 0.000 claims 1
- 229920002647 polyamide Polymers 0.000 claims 1
- 239000000945 filler Substances 0.000 abstract description 5
- 238000007789 sealing Methods 0.000 description 25
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 20
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 15
- 125000000217 alkyl group Chemical group 0.000 description 15
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 11
- 229920001577 copolymer Polymers 0.000 description 11
- 229920005573 silicon-containing polymer Polymers 0.000 description 11
- 229920002554 vinyl polymer Polymers 0.000 description 11
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 9
- 229920001843 polymethylhydrosiloxane Polymers 0.000 description 8
- 125000003944 tolyl group Chemical group 0.000 description 8
- 125000003118 aryl group Chemical group 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 238000000465 moulding Methods 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 6
- 125000005388 dimethylhydrogensiloxy group Chemical group 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 125000003710 aryl alkyl group Chemical group 0.000 description 5
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 5
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- 239000000741 silica gel Substances 0.000 description 5
- 229910002027 silica gel Inorganic materials 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 229920002799 BoPET Polymers 0.000 description 4
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 4
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 4
- 238000003490 calendering Methods 0.000 description 4
- 238000007766 curtain coating Methods 0.000 description 4
- 238000001125 extrusion Methods 0.000 description 4
- 238000001746 injection moulding Methods 0.000 description 4
- 229920001921 poly-methyl-phenyl-siloxane Polymers 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 3
- 229910017083 AlN Inorganic materials 0.000 description 3
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 3
- 229910052582 BN Inorganic materials 0.000 description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 3
- 239000005864 Sulphur Substances 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 125000003545 alkoxy group Chemical group 0.000 description 3
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 3
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- 239000003063 flame retardant Substances 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 3
- 125000005023 xylyl group Chemical group 0.000 description 3
- NALFRYPTRXKZPN-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane Chemical class CC1CC(C)(C)CC(OOC(C)(C)C)(OOC(C)(C)C)C1 NALFRYPTRXKZPN-UHFFFAOYSA-N 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 2
- 239000000292 calcium oxide Substances 0.000 description 2
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 2
- 238000006555 catalytic reaction Methods 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 2
- 229920002521 macromolecule Polymers 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- LAQFLZHBVPULPL-UHFFFAOYSA-N methyl(phenyl)silicon Chemical compound C[Si]C1=CC=CC=C1 LAQFLZHBVPULPL-UHFFFAOYSA-N 0.000 description 2
- NCWQJOGVLLNWEO-UHFFFAOYSA-N methylsilicon Chemical compound [Si]C NCWQJOGVLLNWEO-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical compound CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 description 1
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 description 1
- 229910052580 B4C Inorganic materials 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 125000002252 acyl group Chemical group 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 229910021502 aluminium hydroxide Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- WURBFLDFSFBTLW-UHFFFAOYSA-N benzil Chemical group C=1C=CC=CC=1C(=O)C(=O)C1=CC=CC=C1 WURBFLDFSFBTLW-UHFFFAOYSA-N 0.000 description 1
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 1
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000000536 complexating effect Effects 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 125000001047 cyclobutenyl group Chemical group C1(=CCC1)* 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 125000002255 pentenyl group Chemical group C(=CCCC)* 0.000 description 1
- 125000000864 peroxy group Chemical group O(O*)* 0.000 description 1
- VWSUVZVPDQDVRT-UHFFFAOYSA-N phenylperoxybenzene Chemical compound C=1C=CC=CC=1OOC1=CC=CC=C1 VWSUVZVPDQDVRT-UHFFFAOYSA-N 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 125000004469 siloxy group Chemical group [SiH3]O* 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005486 sulfidation Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- FBEIPJNQGITEBL-UHFFFAOYSA-J tetrachloroplatinum Chemical compound Cl[Pt](Cl)(Cl)Cl FBEIPJNQGITEBL-UHFFFAOYSA-J 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
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- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses an organosilicon heat-conducting insulating sheet and a preparation method thereof, wherein the organosilicon heat-conducting insulating sheet at least comprises a heat-conducting insulating layer, the heat-conducting insulating layer is prepared from an organosilicon heat-conducting insulating composition by a sheet forming process, the organosilicon heat-conducting insulating sheet can comprise a base material, and the organosilicon heat-conducting insulating composition is prepared from linear organopolysiloxane containing alkenyl, heat-conducting filler, a cross-linking agent, a platinum catalyst, a vulcanizing agent and the like. The organic silicon heat-conducting insulating sheet has high heat-conducting property, good insulating property, puncture resistance and tear resistance, the product performance can be flexibly adjusted, the preparation method is simple, and the adaptability is wide.
Description
Technical field
The invention belongs to organosilicon material technical field, it is related to a kind of organosilicon heat conductive isolation sheet and preparation method thereof.
Technical background
In the design of device miniaturization and ultrathin, the heat between heating position and heat dissipation position is transmitted, sealing, insulate
It is one of key factor needed to be considered, currently, heat conductive insulating packing material is to solve the problems, such as this main means.Heat conductive insulating
Packing material has stronger stretching resistance under the conditions of requiring good heat conduction, insulation performance and low thickness, can resist thorn
It wears, tear-proof, including heat-conducting silica gel sheet.
Heat-conducting silica gel sheet be using glass fibre etc. as base material, based on silica gel material organosilicon macromolecule polymer
Elastomer, and there is heat conduction, flame retardant property by heat conduction, the fillers such as fire-retardant are added in silica gel, in the prior art usually with
Amount of filler and most can be improved under the premise of meeting manufacturing technique requirent in material preparation silica gel piece based on low viscosity silicone rubber
The heat conductivility of whole sheet material, but the sheet material tear resistance prepared is poor, using rear poor reliability, or with macromolecule silicon raw rubber
Based on material, obtain the good sheet material of tear resistance, but the media-filling rate of product is low, can not further increase thermal conductivity
Energy.
Invention content
In view of the above shortcomings of the prior art, a kind of organosilicon heat conductive isolation sheet of present invention offer and preparation method thereof, this
Insulating trip prepared by invention can have the mechanical properties such as high thermal conductivity coefficient, good insulation performance and anti-puncture, tear-proof simultaneously.
The purpose of the present invention is achieved through the following technical solutions：
The present invention provides a kind of organosilicon heat conductive isolation sheet, includes at least thermally conductive insulating layer, the thermally conductive insulating layer by
Organosilicon heat conductive insulating composition is prepared through sheet forming process, and the organosilicon heat conductive insulating composition includes with the following group
Point：
Base polymer：For the line style organopolysiloxane containing two or more and the alkenyl of silicon bonding, 25
DEG C viscosity be 50~50000mpas；
Heat filling；
Crosslinking agent：Organopolysiloxane for the hydrogen-based being connect with silicon containing three or three or more is in 25 DEG C of viscositys
10-50000mpa·s；
Platinum catalyst and vulcanizing agent, the vulcanizing agent are organic peroxide；
It rubs with the hydrogen-based that is connect with silicon in the mole of the alkenyl of silicon bonding and crosslinking agent in the base polymer
The ratio between your amount is more than 1.
The sheet forming process includes calendering, molding, curtain coating, injection moulding, extrusion molding etc..Preferably, described to have
Machine silicon heat conductive isolation sheet further includes base material, the thermally conductive insulating layer and the compound obtained organosilicon heat conductive isolation sheet of the base material, this
Shi Jicai forms the substrate layer in heat conductive isolation sheet, and thermally conductive insulating layer is made by organosilicon heat conductive insulating composition.Including base material
Heat conductive isolation sheet in can contain multiple thermally conductive insulating layer being arranged alternately and substrate layer.
Preferably, the base material is glass fabric, polyimide film, aluminium foil, poly- naphthalene ester film or carbon cloth.
Preferably, in the organosilicon heat conductive insulating composition, in base polymer with mole of the alkenyl of silicon bonding
It measures and is more than 1 less than or equal to 3.5 with the ratio between the mole of hydrogen-based being connect with silicon in crosslinking agent.
Preferably, in the organosilicon heat conductive insulating composition, organic peroxide is chosen in particular from 2,5- dimethyl -2,5-
Bis(t-butylperoxy) hexane, peroxidating pair-(2,4 dichloro benzene formyl), peroxidating bis- (4- toluyls), peroxidating
Dibenzoyl, peroxidized t-butyl perbenzoate, 1,1- bis(t-butylperoxy) -3,3,5- trimethyl-cyclohexanes, the bis- (uncles of 1,1-
Butyl peroxy) one or several kinds in hexamethylene.
In organosilicon heat conductive insulating composition, base polymer is containing two or more and the alkenyl of silicon bonding
Line style organopolysiloxane, with the position of the alkenyl of silicon bonding can be on molecule both ends or strand or molecule both ends with
Contain the alkenyl being connect with silicon atom on strand simultaneously.Preferably, the base polymer is selected from α, and ω-divinyl is poly-
Dimethyl siloxane, the dimethyl silicone polymer of methyl phenyl vinyl siloxy sealing end, dimethylvinyl siloxy sealing end
Polymethylphenylsiloxane, dimethylvinyl siloxy sealing end methyl phenyl siloxane and dimethyl siloxane copolymerization
Condensation polymer, the dimethylvinyl siloxy sealing end for the dimethyl silicone polymer that object, methyl methoxy base vinyl siloxy block
Poly- methyl (3,3,3- trifluoro propyl) siloxanes, and the organopolysiloxane that is expressed from the next：(CH3)2(CH2=CH) SiO
[(CH3)2SiO]n[(CH3)PhSiO]m[(CH3)(CH2=CH) SiO]pSi (CH=CH2)(CH3)2One or more of.
Preferably, heat filling be magnesia, aluminium oxide, iron oxide, calcium oxide, titanium oxide, silica, aluminium nitride,
One or more of boron nitride and silicon nitride.
Crosslinking agent is the organopolysiloxane for the hydrogen-based being connect with silicon containing three or three or more, and the hydrogen-based being connect with silicon
Position can be located in molecular end and side chain on side chain or simultaneously.Preferably, the hydrogen content of crosslinking agent is 0.01-
3% (quality).
Preferably, crosslinking agent is 10-1000mpas in 25 DEG C of viscosity.
Preferably, crosslinking agent is selected from the polymethyl hydrogen siloxane of trimethylsiloxy group sealing end, trimethylsiloxy group blocks
The methyl hydrogen siloxane and aminomethyl phenyl of the copolymer of methyl hydrogen siloxane and dimethyl siloxane, dimethyl hydrogen siloxy sealing end
Copolymer, the trimethyl of the copolymer of siloxanes, the methyl hydrogen siloxane and dimethyl siloxane of dimethyl hydrogen siloxy sealing end
The methyl hydrogen silica of the methyl hydrogen siloxane of siloxy sealing end and the copolymer of methyl phenyl siloxane, trimethylsiloxy group sealing end
Copolymer, cyclic methyl hydrogen polysiloxane or four (the dimethyl hydrogen silane oxygen of alkane and methyl (3,3,3- trifluoro propyl) siloxanes
One or more of base) silane.
Preferably, the organosilicon heat conductive insulating composition includes chain extender, contains the hydrogen-based being connect with silicon for both ends
Line style organopolysiloxane, i.e. its molecule both ends and the end of silicon bonding position group include hydrogen-based, remaining position is free of and silicon original
The hydrogen-based of son connection.
Preferably, the hydrogen content of the chain extender is 0.01%-0.5% (quality), and organosilicon heat conductive insulating combines at this time
It rubs with the mole of the alkenyl of silicon bonding and the hydrogen-based that is connect with silicon in crosslinking agent and chain extender in the base polymer of object
The ratio of the sum of your amount is more than 1.
Preferably, the chain extender is 100-50000mpas in 25 DEG C of viscosity.
Preferably, the chain extender is selected from α, and ω-two hydrogen-baseds dimethyl silicone polymer, aminomethyl phenyl hydrogen siloxy block
The poly- first of dimethyl silicone polymer, the polymethylphenylsiloxane of dimethyl hydrogen siloxy sealing end and dimethyl hydrogen siloxy sealing end
One or more of base (3,3,3- trifluoro propyl) siloxanes.
Preferably, contain silicones in organosilicon heat conductive insulating composition, selected from methyl phenyl silicone resin, methyl silicon tree
One or more of fat, vinyl polysiloxane or hydrogeneous silicones.
Preferably, the platinum catalyst is platinum catalyst or chloroplatinic acid.
Preferably, the organosilicon heat conductive insulating composition includes following components by weight：
It is highly preferred that the organosilicon heat conductive insulating composition includes following components by weight：
The preparation method of above-mentioned organosilicon heat conductive isolation sheet, including following operating procedure：
A, the component for being included by organosilicon heat conductive insulating composition is uniformly mixed according to proportioning, obtains mixture；
B, type is made in mixture, is cured at 40~90 DEG C, obtain one-step solidification sheet material；
C, 110~250 DEG C are warming up to vulcanize one-step solidification sheet material, obtains organosilicon heat conductive isolation sheet.
Preferably, the cured time, which is cured for mixture to crosslink density, reaches maximum value required time.
It is described that type is made in mixture is that will be mixed using calendering, curtain coating, molding, injection moulding, the techniques such as extrusion molding
Object is closed to be made with certain thickness sheet material.
Preferably, the temperature of the vulcanization is 50-180 DEG C higher than the cured temperature.
Preferably, the cured time is 5-30min.
Preferably, the time of the vulcanization is 3-120min.
The beneficial effects of the invention are as follows：The organosilicon heat conductive isolation sheet of the present invention is passed through by organosilicon heat conductive insulating composition
The method of secondary curing is prepared, while having high thermal conductivity coefficient, good insulation performance and anti-puncture, tear resistance,
And properties of product can flexible modulation, wide adaptability, and preparation method is simple, application prospect is good.
Specific implementation mode
The present invention provides a kind of organosilicon heat conductive isolation sheet, includes at least thermally conductive insulating layer, the thermally conductive insulating layer by
Organosilicon heat conductive insulating composition is prepared through sheet forming process, and the organosilicon heat conductive insulating composition includes with the following group
Point：
Base polymer：For the line style organopolysiloxane containing two or more and the alkenyl of silicon bonding, 25
DEG C viscosity be 50~50000mpas；
Heat filling；
Crosslinking agent：Organopolysiloxane for the hydrogen-based being connect with silicon containing three or three or more is in 25 DEG C of viscositys
10-50000mpa·s；
Platinum catalyst and vulcanizing agent, the vulcanizing agent are organic peroxide；
It rubs with the hydrogen-based that is connect with silicon in the mole of the alkenyl of silicon bonding and crosslinking agent in the base polymer
The ratio between your amount is more than 1.
The sheet forming process includes calendering, molding, curtain coating, injection moulding, extrusion molding etc..Preferably, described to have
Machine silicon heat conductive isolation sheet further includes base material, the organosilicon heat conductive insulating composition and the compound obtained organosilicon heat conduction of the base material
Insulating trip, at this time base material formed heat conductive isolation sheet in substrate layer, by organosilicon heat conductive insulating composition be made thermally conductive insulating layer.
Multiple thermally conductive insulating layer being arranged alternately and substrate layer can be contained in heat conductive isolation sheet including base material.
Preferably, the base material is glass fabric, polyimide film, aluminium foil, poly- naphthalene ester film or carbon cloth.
Preferably, in the organosilicon heat conductive insulating composition, in base polymer with mole of the alkenyl of silicon bonding
It measures and is more than 1 less than or equal to 3.5 with the ratio between the mole of hydrogen-based being connect with silicon in crosslinking agent.
In organosilicon heat conductive insulating composition, the organic peroxide is chosen in particular from bis- (the tertiary fourths of 2,5- dimethyl -2,5-
Base peroxy) hexane, peroxidating be double-(2,4 dichloro benzene formyl), peroxidating bis- (4- toluyls), diphenyl peroxide first
Acyl, peroxidized t-butyl perbenzoate, 1,1- bis(t-butylperoxy) -3,3,5- trimethyl-cyclohexanes, bis- (the tertiary butyl mistakes of 1,1-
Oxygroup) one or several kinds in hexamethylene.
In organosilicon heat conductive insulating composition, base polymer is containing two or more and the alkenyl of silicon bonding
Line style organopolysiloxane, with the position of the alkenyl of silicon bonding can be on molecule both ends or strand or molecule both ends with
Contain the alkenyl being connect with silicon atom on strand simultaneously, preferably molecule both ends are contained has with the line style of the alkenyl of silicon bonding
Machine polysiloxanes.Wherein, alkenyl includes vinyl, allyl, cyclobutenyl or pentenyl, preferably vinyl or allyl.
In base polymer besides alkenyl groups with the group of silicon bonding, it may also include alkyl, naphthenic base, aryl, aralkyl, alkoxy
Or halogenated alkyl, alkyl can enumerate methyl, ethyl, propyl or butyl etc., naphthenic base can enumerate cyclohexyl, cyclopenta etc., aryl
Phenyl, tolyl, xylyl etc. can be enumerated, aralkyl can enumerate benzyl, phenethyl etc., and halogenated alkyl can enumerate 3,3,3- tri-
Fluoropropyl, alkoxy can enumerate methoxyl group, ethyoxyl, propoxyl group etc..Preferably methyl and phenyl.Base polymer can be two kinds
Or the mixture of a variety of linear organosilicon polysiloxanes described above.
Base polymer is preferably 50~5000mpas in 25 DEG C of viscosity, ensures the anti-of polymer in base polymer
Operability when answering activity and being mixed with heat filling.
Base polymer can enumerate α, ω-divinyl polydimethylsiloxane, methyl phenyl vinyl siloxy sealing end
Dimethyl silicone polymer, dimethylvinyl siloxy sealing end polymethylphenylsiloxane, dimethylvinyl siloxy
The poly- diformazan of the methyl phenyl siloxane of sealing end and the copolymer of dimethyl siloxane, methyl methoxy base vinyl siloxy sealing end
The condensation polymer of radical siloxane, poly- methyl (3,3,3- trifluoro propyl) siloxanes of dimethylvinyl siloxy sealing end, Yi Jiyou
The organopolysiloxane that following formula indicates：(CH3)2(CH2=CH) SiO [(CH3)2SiO]n[(CH3)PhSiO]m[(CH3)(CH2=
CH)SiO]pSi (CH=CH2)(CH3)2。
Heat filling can enumerate the metal oxides such as aluminium oxide, zinc oxide, titanium oxide, beryllium oxide；Aluminium hydroxide, hydroxide
The metal hydroxides such as magnesium；The nitride such as aluminium nitride, silicon nitride, boron nitride；The carbide such as silicon carbide, boron carbide；And it is above-mentioned
The mixture of substance, preferably silicon carbide, magnesia, aluminium oxide, iron oxide, calcium oxide, titanium oxide, silica, aluminium nitride,
One or more of boron nitride and silicon nitride.
Preferably, it is 1-10 μm of 0.1-1 that heat filling, which is heat filling and average grain diameter that average grain diameter is 20-100 μm,
μm, the mixture of one or more of 0.1 μm of heat filling below.
Preferably, heat filling is the heat conduction that the heat filling that average grain diameter is 20-100 μm is 1-10 μm with average grain diameter
Filler is according to mass ratio (2-4)：(3-1) is mixed to get.
It is preferred that surface modification treatment, the method for surface modification treatment and inorganic agent are carried out without specifically limited to heat filling,
Uniformly spray silane coupling agent on heat filling surface for example, by using spray-on process, silane coupling agent include KH-550, KH-560,
One or more of KH-570, KH-792, A-1160, A-171, processing method is unlimited, and the conductive powder after surface treatment also may be used
Directly buy.It is preferred that heat filling is dried before, drying condition is preferably in 90-150 DEG C of dry 1-8h.
In practice, heat filling can be partly or totally replaced with fire-retardant filler, color stuffing etc., so that material is met corresponding
Performance requirement.
Crosslinking agent is the organopolysiloxane for the hydrogen-based being connect with silicon containing three or three or more, and the hydrogen-based being connect with silicon
Position can be located in molecular end and side chain on side chain or simultaneously.In the molecular structure of crosslinking agent in addition to silicon bonding
Hydrogen-based, may also include alkyl, naphthenic base, aryl, aralkyl or halogenated alkyl, alkyl can enumerate methyl, ethyl, propyl or fourth
Base etc., naphthenic base can enumerate cyclohexyl, cyclopenta etc., and aryl can enumerate phenyl, tolyl, xylyl etc., and aralkyl can arrange
Benzyl, phenethyl etc. are lifted, halogenated alkyl can enumerate 3,3,3- trifluoro propyls.Optimizing alkyl and aryl, more preferable methyl and phenyl.
The molecular structure of crosslinking agent is not particularly limited, and can be the straight chain for having branch, straight chain, part branched, ring-type
Or the molecular structure of branch shape, can be single polymers or mixture with these structures, preferably its hydrogen content is 0.01-
3% (quality), hydrogen content is the mass percent of hydrogen-based being connect with silicon in crosslinking agent in the present invention.Crosslinking agent is glutinous at 25 DEG C
Degree is preferably 10-1000mpas, more preferably 10-500mpas.
Crosslinking agent can enumerate the methyl hydrogen of the polymethyl hydrogen siloxane of trimethylsiloxy group sealing end, trimethylsiloxy group sealing end
The methyl hydrogen siloxane and methyl phenyl siloxane of the copolymer of siloxanes and dimethyl siloxane, dimethyl hydrogen siloxy sealing end
Copolymer, dimethyl hydrogen siloxy sealing end methyl hydrogen siloxane and dimethyl siloxane copolymer, trimethylsiloxy group
The methyl hydrogen siloxane and first of the methyl hydrogen siloxane of sealing end and the copolymer of methyl phenyl siloxane, trimethylsiloxy group sealing end
Copolymer, cyclic methyl hydrogen polysiloxane or four (two methyl hydrogen silicone alkoxy) silicon of base (3,3,3- trifluoro propyl) siloxanes
Alkane.
Preferably, the organosilicon heat conductive insulating composition includes chain extender, contains the hydrogen-based being connect with silicon for both ends
Line style organopolysiloxane, i.e. its molecule both ends and the end of silicon bonding position group include hydrogen-based, remaining position is free of and silicon original
The hydrogen-based of son connection.Alkenyl occurs during the reaction for composition after addition chain extender and the chain growth after si-h bond addition is anti-
It answers, the mechanical properties such as the tensile strength of final piece is adjusted.
It, can also be including alkyl, naphthenic base, aryl, virtue other than hydrogen-based with silicon bonding in the molecular structure of chain extender
Alkyl or halogenated alkyl, alkyl can enumerate methyl, ethyl, propyl or butyl etc., and naphthenic base can enumerate cyclohexyl, cyclopenta etc.,
Aryl can enumerate phenyl, tolyl, xylyl etc., and aralkyl can enumerate benzyl, phenethyl etc., and halogenated alkyl can enumerate 3,3,
3- trifluoro propyls.Optimizing alkyl and aryl, more preferable methyl and phenyl.Chain extender can be two or more straight-chains described above
The mixture of organosilicon polysiloxane.
The hydrogen content of chain extender is 0.01%-0.5% (quality), at this time the base polymer of organosilicon heat conductive insulating composition
In object with the ratio of the mole of the alkenyl of silicon bonding and the sum of the mole of hydrogen-based that is connect with silicon in crosslinking agent and chain extender
Value is more than 1.Chain extender 25 DEG C viscosity be 100-50000mpas, preferably 100-10000mpas, most preferably
100-5000mpa·s。
Chain extender can enumerate α, the poly dimethyl that ω-two hydrogen-baseds dimethyl silicone polymer, aminomethyl phenyl hydrogen siloxy block
Siloxanes, dimethyl hydrogen siloxy sealing end polymethylphenylsiloxane and dimethyl hydrogen siloxy sealing end poly- methyl (3,3,
3- trifluoro propyls) siloxanes etc..
Preferably, contain silicones in organosilicon heat conductive insulating composition, be the poly-organosilicon with cross-linked structure
Hardness and tear resistance after composition solidification can be improved, selected from methyl phenyl silicone resin, methyl silicon resin, ethylene in oxygen alkane
Base silicones, hydrogeneous silicones etc., concrete structure and its dosage are not particularly limited.
Platinum catalyst is not particularly limited, and can enumerate the platinum complexing of platinum micro mist, platinum black, chloroplatinic acid, platinum tetrachloride, alkene
Object, the platinum complex of carbonyl or the thermoplasticity organic resin powder containing the above platinum group catalyst, preferably platinum catalyst or
Chloroplatinic acid.
Above-mentioned organosilicon heat conductive insulating composition, preferably includes following components by weight：
The organosilicon heat conductive insulating composition more preferably includes following components by weight：
The preparation method of above-mentioned organosilicon heat conductive isolation sheet, including following operating procedure：
A, the component for being included by organosilicon heat conductive insulating composition is uniformly mixed according to proportioning, obtains mixture；
B, type is made in mixture, is cured at 40~90 DEG C, obtain one-step solidification sheet material；
C, 110~250 DEG C are warming up to vulcanize one-step solidification sheet material, obtains organosilicon heat conductive isolation sheet.
It is described that type is made in mixture is that will be mixed using calendering, curtain coating, molding, injection moulding, the techniques such as extrusion molding
Object is closed to be made with certain thickness sheet material.
Preferably, it is in stepb, mixture system is molding same when the organosilicon heat conductive isolation sheet further includes base material
When it is compound with base material, then cured.
Preferably, the cured time, which is cured for mixture to crosslink density, reaches maximum value required time.Institute
Stating the cured time can be obtained by being tested on vulcameter after being sampled to mixture, vulcameter model high ferro M-3000A,
Sampling amount is 6g ± 0.5g, at any time by torque (corresponding crosslink density) in measurement mixture at a certain temperature sulfidation
Variation, the time required to obtaining when torque reaches maximum value, as hardening time.
Preferably, the cured time is 5-30min.
Preferably, the time of the vulcanization is 3-120min.
In the preparation method of organosilicon heat conductive isolation sheet, it is preferable that the temperature of the vulcanization is than the cured temperature
It is 50-180 DEG C high.
In the preparation method of organosilicon heat conductive isolation sheet, the mixed time, preferably 3-20min was pinched without specifically limited
It is carried out at normal temperatures in conjunction machine.
In the preparation method of organosilicon heat conductive isolation sheet, mixing preferably carries out under vacuum, and vacuum condition is preferred
It is -0.09Mpa~-0.1Mpa for relative degree of vacuum.
It may be noted that 25 DEG C of viscosity of the present invention is dynamic viscosity value of the substance at 25 DEG C.
The specific embodiment of organosilicon heat conductive insulating composition and organosilicon heat conductive isolation sheet of the present invention is given below.
The organosilicon heat conductive insulating composition proportioning that organosilicon heat conductive isolation sheet is used to prepare in Examples 1 to 3 is shown in Table 1,
Unit is mass fraction.
Table 1
Embodiment 1
In organosilicon heat conductive insulating composition, base polymer is the α that 25 DEG C of viscositys are 100mpas, ω-divinyl
Dimethyl silicone polymer (mass percentage of vinyl is 2.5%)；Heat filling is the aluminium oxide that average grain diameter is 30 μm；
Crosslinking agent is Methyl Hydrogen Polysiloxane Fluid, and 25 DEG C of viscositys are 100mpas, and hydrogen content is 0.2% (quality)；Chain extender is 25 DEG C of viscositys
For the α of 100mpas, ω-two hydrogen-baseds dimethyl silicone polymer (hydrogen content is 0.18% (quality)).Ethylene in base polymer
Base (- CH=CH2) mole and crosslinking agent and chain extender in the ratio of the sum of mole of hydrogen-based be 2.87.
In organosilicon heat conductive insulating composition, silicones DY-MQ102, Shandong Dayi Chemical Industry Co., Ltd.Meanwhile platinum
Catalyst is platinum catalyst, and vulcanizing agent is that peroxidating is bis- (2,4- dichloro-benzoyl).
The preparation method of organosilicon heat conductive isolation sheet, including following operating procedure：
Test hardening time：Heat filling is placed in 100 DEG C of dry 3h, then according to the number take base polymer,
Heat filling, crosslinking agent, chain extender, silicones, vulcanizing agent and platinum catalyst, in room temperature and -0.09MPa relative degree of vacuum conditions
Lower mixing 3min, obtains mixture, take 6g mixtures high ferro M-3000A sulphur become instrument on tested, set reaction temperature as
80 DEG C, record torque changes with time, and it is hardening time to take torque to reach the maximum value corresponding time, and measuring hardening time is
5min。
Base polymer, heat filling, crosslinking agent, chain extender, silicones, vulcanizing agent and platinum catalysis are taken according to the number
Agent mixing is added in kneader, mediates 10min under the conditions of room temperature and -0.09MPa relative degree of vacuum, obtains mixture, will mix
Close object and with glass fabric roll compound, be carried out at the same time two sides coated with PET film, after molding at 80 DEG C progress curing reaction
5min removes PET film, obtains the one-step solidification sheet material that thickness is 0.3mm, and one-step solidification sheet material is vulcanized then at 120 DEG C
40min obtains organosilicon heat conductive isolation sheet.
Embodiment 2
In organosilicon heat conductive insulating composition, base polymer is the α that 25 DEG C of viscositys are 4000mpas, ω-divinyl
Base dimethyl silicone polymer (mass percentage of vinyl is 0.50%)；Heat filling is the nitridation that average grain diameter is 20 μm
Aluminium；Crosslinking agent is Methyl Hydrogen Polysiloxane Fluid, and 25 DEG C of viscositys are 1000mpas, and hydrogen content is 0.08% (quality)；Chain extender is 25
DEG C viscosity is the α of 1000mpas, ω-two hydrogen-baseds dimethyl silicone polymer (hydrogen content is 0.05% (quality)).Base polymer
Object medium vinyl (- CH=CH2) mole and crosslinking agent and chain extender in the ratio of the sum of mole of hydrogen-based be 1.27.
In organosilicon heat conductive insulating composition, silicones DY-MQ102, Shandong Dayi Chemical Industry Co., Ltd.Meanwhile platinum
Catalyst is platinum catalyst, and vulcanizing agent is that peroxidating is bis- (2,4- dichloro-benzoyl).
The preparation method of organosilicon heat conductive isolation sheet, including following operating procedure：
Test hardening time：Heat filling is placed in 100 DEG C of dry 3h, then according to the number take base polymer,
Heat filling, crosslinking agent, chain extender, silicones, vulcanizing agent and platinum catalyst, in room temperature and -0.09MPa relative degree of vacuum conditions
Lower mixing 3min, obtains mixture, take 6g mixtures high ferro M-3000A sulphur become instrument on tested, set reaction temperature as
70 DEG C, record torque changes with time, and it is hardening time to take torque to reach the maximum value corresponding time, and measuring hardening time is
12min。
Base polymer, heat filling, crosslinking agent, chain extender, silicones, vulcanizing agent and platinum catalysis are taken according to the number
Agent mixing is added in kneader, mediates 10min under the conditions of room temperature and -0.09MPa relative degree of vacuum, obtains mixture, will mix
Close object and with glass fabric roll compound, be carried out at the same time two sides coated with PET film, after molding at 70 DEG C progress curing reaction
12min removes PET film, obtains the one-step solidification sheet material that thickness is 0.3mm, and one-step solidification sheet material is vulcanized then at 120 DEG C
30min obtains organosilicon heat conductive isolation sheet.
Embodiment 3
In organosilicon heat conductive insulating composition, base polymer is the α that 25 DEG C of viscositys are 40000mpas, ω-divinyl
Base dimethyl silicone polymer (mass percentage of vinyl is 0.20%), heat filling is the oxidation that average grain diameter is 3 μm
The aluminium oxide in mass ratio 2 that aluminium and average grain diameter are 50 μm：3 are mixed to get；Crosslinking agent is Methyl Hydrogen Polysiloxane Fluid, and 25 DEG C of viscositys are
10000mpas, hydrogen content are 0.03% (quality).Base polymer medium vinyl (- CH=CH2) mole and crosslinking agent
The ratio between mole of middle hydrogen-based is 1.54.
In organosilicon heat conductive insulating composition, silicones DY-MQ102, Shandong Dayi Chemical Industry Co., Ltd.Meanwhile platinum
Catalyst is platinum catalyst, vulcanizing agent 2, bis- (tert-butyl peroxide) hexanes of 5- dimethyl -2,5-.
The preparation method of organosilicon heat conductive isolation sheet, including following operating procedure：
Test hardening time：Heat filling is placed in 100 DEG C of dry 3h, then according to the number take base polymer,
Heat filling, crosslinking agent, silicones, vulcanizing agent and platinum catalyst mix under the conditions of room temperature and -0.09MPa relative degree of vacuum
10min obtains mixture, takes 6g mixtures to become on instrument in high ferro M-3000A sulphur and is tested, sets reaction temperature as 50 DEG C,
Record torque changes with time, and it is hardening time to take torque to reach the maximum value corresponding time, and measuring hardening time is
25min。
Base polymer, heat filling, crosslinking agent, silicones, vulcanizing agent and platinum catalyst mixing are taken according to the number
It is added in kneader, mediates 10min under the conditions of room temperature and -0.09MPa relative degree of vacuum, obtain mixture, mixture is noted
The die cavity for entering 0.3mm thickness cures 25min at 50 DEG C after compression molding, the one-step solidification sheet material that thickness is 0.3mm is obtained, by one
Secondary cured sheet obtains organosilicon heat conductive isolation sheet then at 170 DEG C of vulcanization 30min.
Testing example
The organosilicon heat conductive isolation sheet prepared to Examples 1 to 3 is tested for the property, including thermal coefficient, hardness, stretching
Intensity, tearing strength, volume resistivity and breakdown voltage, test and performance data are shown in Table 2.
2 organosilicon heat conductive isolation sheet performance data of table
From the data in table 2, it can be seen that the present invention is to contain vinyl polysiloxane, heat filling, crosslinking agent, platinum catalyst and vulcanization
Agent is that raw material prepares organosilicon heat conductive isolation sheet, and by the special process of secondary curing, final insulating trip is made to be provided simultaneously with
High heat conduction, high rigidity and good tear resistance meet in practical application to the thermal conductivity and usability of the heat dissipation interface that generates heat
Requirement, comprehensive performance protrudes, and preparation method is simple, and application prospect is wide.
Finally it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention rather than is protected to the present invention
The limitation of range.It will be understood by those of skill in the art that several deductions can be carried out to technical scheme of the present invention or waited
With replacing, without departing from the spirit and scope of technical solution of the present invention.
Claims (7)
1. a kind of organosilicon heat conductive isolation sheet, includes at least thermally conductive insulating layer, the thermally conductive insulating layer is exhausted by organosilicon heat conduction
Edge composition is made through sheet forming process, and the organosilicon heat conductive insulating composition includes following components：
Base polymer：For the line style organopolysiloxane containing two or more and the alkenyl of silicon bonding, at 25 DEG C
Viscosity is 50~50000mP as；The base polymer contains organic with the line style of the alkenyl of silicon bonding for molecule both ends
Polysiloxanes；
Heat filling；
Crosslinking agent：Organopolysiloxane for the hydrogen-based being connect with silicon containing three or three or more is 10- in 25 DEG C of viscositys
50000mP a·s；
Platinum catalyst and vulcanizing agent, the vulcanizing agent are organic peroxide；
In the base polymer with the mole for the hydrogen-based being connect with silicon in the mole of the alkenyl of silicon bonding and crosslinking agent
The ratio between be more than 1；
The preparation method of the organosilicon heat conductive isolation sheet includes following operating procedure：
A, the component for being included by organosilicon heat conductive insulating composition is uniformly mixed according to proportioning, obtains mixture；
B, type is made in mixture, is cured at 40~90 DEG C, obtain one-step solidification sheet material；
C, 110~250 DEG C are warming up to vulcanize one-step solidification sheet material, obtains organosilicon heat conductive isolation sheet；
The temperature of the vulcanization is 50-180 DEG C higher than the cured temperature.
2. organosilicon heat conductive isolation sheet as described in claim 1, which is characterized in that the organosilicon heat conductive isolation sheet further includes
Base material, the thermally conductive insulating layer and the compound obtained organosilicon heat conductive isolation sheet of the base material.
3. organosilicon heat conductive isolation sheet as claimed in claim 2, which is characterized in that the base material is glass fabric, polyamides
Imines film, aluminium foil, poly- naphthalene ester film or carbon cloth.
4. organosilicon heat conductive isolation sheet as claimed in claim 1,2 or 3, which is characterized in that the organosilicon heat conductive insulating group
Close object in, in base polymer with the mole for the hydrogen-based being connect with silicon in the mole of the alkenyl of silicon bonding and crosslinking agent it
It is less than or equal to 3.5 than being more than 1.
5. organosilicon heat conductive isolation sheet as claimed in claim 1,2 or 3, which is characterized in that the organosilicon heat conductive insulating group
It includes chain extender to close object, and chain extender is the line style organopolysiloxane that the hydrogen-based being connect with silicon is contained at both ends.
6. organosilicon heat conductive isolation sheet as claimed in claim 1,2 or 3, which is characterized in that the organosilicon heat conductive insulating group
It includes following components by weight to close object：
7. organosilicon heat conductive isolation sheet as claimed in claim 5, which is characterized in that the organosilicon heat conductive insulating composition packet
Include following components by weight：
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| CN105086464B (en) * | 2015-07-28 | 2017-11-28 | 惠州市安品新材料有限公司 | A kind of organosilicon heat-conducting composite sheet |
| CN105349113A (en) * | 2015-10-14 | 2016-02-24 | 文雪烽 | Heat-conductive interface material |
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| CN106833545A (en) * | 2016-12-01 | 2017-06-13 | 昆山裕凌电子科技有限公司 | A kind of high heat conduction Composition spacer material and preparation method |
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| CN110257022B (en) * | 2019-07-18 | 2022-05-10 | 深圳前海量子翼纳米碳科技有限公司 | Insulated electromagnetic shielding heat-conducting silica gel pad and preparation method thereof |
| CN111041845B (en) * | 2019-12-26 | 2022-06-17 | 深圳德邦界面材料有限公司 | Organic silicon heat-conducting insulating sheet and preparation method thereof |
| CN112724685B (en) * | 2020-12-28 | 2023-01-17 | 深圳市安品有机硅材料有限公司 | Organic silicon heat-conducting sheet and preparation method thereof |
| CN112778932A (en) * | 2021-01-12 | 2021-05-11 | 深圳德邦界面材料有限公司 | Self-adhesive organic silicon heat-conducting insulating sheet and preparation method thereof |
| CN113122181A (en) * | 2021-04-17 | 2021-07-16 | 深圳市益达兴科技股份有限公司 | Production process of high-thermal-conductivity insulating material and insulating sheet |
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