CN105271101B - MEMS fine vacuum encapsulating structures based on getter - Google Patents
MEMS fine vacuum encapsulating structures based on getter Download PDFInfo
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- CN105271101B CN105271101B CN201510787784.1A CN201510787784A CN105271101B CN 105271101 B CN105271101 B CN 105271101B CN 201510787784 A CN201510787784 A CN 201510787784A CN 105271101 B CN105271101 B CN 105271101B
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Abstract
The present invention provides a kind of MEMS fine vacuum encapsulating structures based on getter, including encapsulating cavity, the MEMS being arranged in cavity and getter, the encapsulation cavity includes package substrates and encapsulation cover plate, it is provided with the package substrates or encapsulation cover plate for supporting the support meanss of getter, make getter be suspended inside cavity, do not contact with encapsulation cavity inner surface.There is the encapsulation cavity of above-mentioned support meanss, just be effectively reduced when heat activation is carried out to getter under vacuum conditions its heat transfer, the heat for avoiding which from producing is transferred on IC/MEMS devices in a large number by package substrates or encapsulation cover plate, IC/MEMS devices are adversely affected, activation efficiency and the success rate of getter can be more importantly improved, scrapping for the encapsulating structure that getter activation unsuccessfully causes is reduced.
Description
Technical field
The present invention relates to the fine vacuum encapsulation of MEMS, more particularly to a kind of MEMS fine vacuum encapsulation based on getter
Structure.
Background technology
MEMS Vacuum Packages are the encapsulation technologies that a kind of employing seal cavity provides high gas-tight vacuum environment, and Vacuum Package makes
The moving part of MEMS is worked under vacuum environment, has ensured the quality factor of MEMS.MEMS package is in MEMS devices
Occupy very important status in part production process, be one step of key that device is capable of practical application.
The Vacuum Package of MEMS can be divided into device level and wafer scale.The Vacuum Package of wafer scale is referred to silicon wafer
Cut into slices after operation is packaged for unit again, it is possible to increase packaging efficiency, but do not examined due to chip to be packaged before packaging
Survey, therefore qualification rate is relatively low, and what is more important can be wasted in the making in optical pickocffs such as infrared thermal imaging sensors
Expensive optical window, such as germanium window.Therefore, in the optical MEMS sensors such as production infrared thermal imaging, we are still
Using traditional device level Vacuum Package, first one single chip out, is utilized gold from slice separation on silicon original piece after detection is qualified
The shells such as category, pottery or silicon base are sequentially completed packaging process.
In the encapsulating structure of MEMS, the gas that encapsulation inside cavity slowly discharges generally is absorbed using getter
The pollutant such as body, moisture, for maintaining MEMS to be operated in 10-1~10-2Under the high vacuum environment of pa.Under the premise of here, inhale
The activation efficiency of gas agent and life-span just become one of key of prolongation MEMS service life.In the prior art, generally adopt
With nonevaporable getter, obtain active surface realizing GAS ABSORPTION by heat activation is carried out to getter, and getter
Form then mainly have banding and film like.In existing encapsulating structure, for example publication No. be CN104022046A,
In the application for a patent for invention of CN104003352A and CN102351141A etc., either banding getter or thin film getter
All it is set directly on substrate or cover plate, getter surface is that close face contacts with cavity inner surface.This set side
The problem that formula is present is to carry out heat activation to getter（About 350 ~ 550 °C of temperature）During, the heat of generation leads to
Cross cover plate or substrate is conducted to IC chip or MEMS in a large number, not only packaging is had undesirable effect, is also resulted in
Getter activation efficiency lowly even fails, and causes whole MEMS package structure to be scrapped.
Content of the invention
In order to solve the above problems, the present invention is from structure, there is provided a kind of MEMS fine vacuum based on getter is encapsulated
Structure, can substantially reduce heat transfer.
The technical solution used in the present invention is：A kind of MEMS fine vacuum encapsulating structures based on getter, including package cavity
Body, the MEMS being arranged in cavity and getter, the encapsulation cavity include package substrates and encapsulation cover plate, in the envelope
Be provided with dress substrate or encapsulation cover plate for supporting the support meanss of getter, make getter be suspended inside cavity, not with
Encapsulation cavity inner surface contact.
Preferably, the support meanss are arranged in package substrates, are the ribs for keeping linear contact lay with getter.
Preferably, the support meanss are arranged in package substrates, are the salient points contacted with getter holding point.
Preferably, the support meanss are arranged in package substrates, are the combinations of rib and salient point, wherein, the rib
With getter linear contact lay, the salient point contacted with getter point.
Preferably, the support meanss are arranged on encapsulation cover plate, be from encapsulation cover plate to cavity in extend U-shaped extension
Hook.
Preferably, the package substrates are square box shapes, with bottom surface and side, combine to form one cube with encapsulation cover plate
Encapsulation cavity；The getter is the surrounding circulating type structure of leaving certain gaps uncovered by the economic plan, its shape and package cavity mates, along MEMS
Device routing area periphery is positioned in support meanss for one week, the heat activation that draws on the two ends that getter is formed by breach
On pad in welded wire to package substrates.
Preferably, the support meanss are integrally-formed with package substrates or encapsulation cover plate.
Preferably, the getter is that banding or film like, the banding getter refer to that mid portion is heat activation
Square banding getter wiry, the film like getter refer to the getter of sputtering sedimentation on heat activation metallic plate
Thin film.
Preferably, the MEMS fine vacuum encapsulating structure is infrared thermal imaging sensor, and the MEMS is infrared Jiao
Planar array, the encapsulation cover plate is by can cut down metal and optical window is constituted.
Compared with prior art, there is following technique effect in the present invention：
1）Novelty of the present invention arranges support meanss in the package cavity body, makes getter be suspended inside cavity, not with
Encapsulation cavity inner surface contact.Using the encapsulation cavity of said structure, when carrying out heat activation to getter under vacuum conditions
Its heat transfer is just effectively reduced, and the heat which on the one hand can be avoided to produce is transmitted in a large number by package substrates or encapsulation cover plate
To MEMS, MEMS is adversely affected；Activation efficiency and the success of getter can more importantly be improved
Rate, effectively reduces scrapping for the encapsulating structure that getter activation unsuccessfully causes, and further improves yield rate；
2）The getter adopted in the fine vacuum encapsulating structure of the present invention is the surrounding circulating type structure of leaving certain gaps uncovered by the economic plan, compares
Place in traditional getters side, getter surface product is significantly increased on the premise of encapsulation volume is reduced, vacuum in cavity is made
Degree keeps more longlasting, so as to extend the service life of MEMS fine vacuum encapsulating structures.
Description of the drawings
Fig. 1 is dimensional structure diagram of the present invention；
Fig. 2 is the dimensional structure diagram that the embodiment of the present invention 1 is not added with encapsulation cover plate；
Fig. 3 is the top view that the embodiment of the present invention 1 is not added with encapsulation cover plate；
Fig. 4 is the dimensional structure diagram of 1 package substrates of the embodiment of the present invention；
Fig. 5 is the dimensional structure diagram that the embodiment of the present invention 2 is not added with encapsulation cover plate；
Fig. 6 is the top view that the embodiment of the present invention 2 is not added with encapsulation cover plate；
Fig. 7 is the dimensional structure diagram of 2 package substrates of the embodiment of the present invention；
Fig. 8 is 3 package substrates dimensional structure diagram of the embodiment of the present invention；
Fig. 9 is 4 package substrates dimensional structure diagram of the embodiment of the present invention；
Figure 10 is the side view of Fig. 1；
Figure 11 is the cross-sectional schematic in Figure 10 along A-A directions；
Figure 12 is the dimensional structure diagram of the embodiment of the present invention 6；
Figure 13 is the side view of the embodiment of the present invention 6；
Figure 14 is the cross-sectional schematic in Figure 13 along A-A directions；
Figure 15 is the cross-sectional schematic of the embodiment of the present invention 7.
Specific embodiment
Below in conjunction with accompanying drawing, the invention will be further described.
Diagram provided in the embodiment of the present invention is only illustrated in a schematic way, so only showing the group relevant with the present invention
Part rather than draw according to component count during actual enforcement, shape and size.
Referring to Fig. 1, it is a kind of MEMS fine vacuum encapsulating structure 100, including encapsulating cavity, the getter being arranged in cavity
And MEMS, the encapsulation cavity is made up of package substrates 10 and encapsulation cover plate 40.
The present invention it is critical only that：Also having in the package substrates 10 or encapsulation cover plate 40 is used for supporting getter
Support meanss, make getter be suspended inside cavity, not directly with encapsulation cavity inner surface contact.
Embodiment 1：Referring to Fig. 2 to Fig. 4, in the present embodiment, the package substrates 10 are the square box shapes of upper opening, tool
Have bottom surface and side, combine to form a cube of encapsulation cavity with encapsulation cover plate 40, the support meanss be with triangle or
The number of the rib 11a of square cross section, rib 11a is 4, is arranged on 4 drift angles of square box shape package substrates bottom surface, is formed
1 rib extended to bottom surface and incline both direction, the cross section of the rib for wherein extending to incline are square, and to bottom surface
The cross section of the rib of extension is triangle.The getter is the surrounding circulating type structure of leaving certain gaps uncovered by the economic plan, along MEMS
30 routing area peripheries one week are positioned on 4 ribs, the heat activation that draws on the two ends that getter 20 is formed by breach
Tinsel 21 is soldered on the pad 12 in package substrates 10, then is drawn from side or below by the inner lead below pad
Go out, lead-out mode can be PGA, CLCC and plant ball.
Further, the shape of the rib can with according to encapsulation cavity inner surface pattern carry out changing for treatment in accordance with local conditions
Become, such as the rib with square cross section can be adopted when rib is set on incline, and is arranged in the planes such as side, bottom surface
The rib with triangular cross section is may be selected by during rib so as to keep linear contact lay with getter.
Embodiment 2：Referring to Fig. 5 to 7, with differring primarily in that for embodiment 1：The number of the rib 11a is 8, respectively
The both sides that square box shape encapsulates 4 drift angles in cavity bottom surface are arranged on, are extended to bottom surface and side per rib respectively；The getter
It is the surrounding circulating type structure of leaving certain gaps uncovered by the economic plan, is positioned within one week on 8 ribs along MEMS routing area periphery, getter
On the pad in heat activation welded wire to package substrates that draws on the two ends formed by breach.
Embodiment 3：Referring to Fig. 8, with differring primarily in that for embodiment 2：8 rib 11a described in embodiment 2 are used
Multiple salient point 11b are substituted so as to contacted with getter holding point.The salient point can also be arranged on bottom surface or bottom surface and side
On face.In the present embodiment, the bottom surface of package substrates is smooth, and therefore the height of the salient point is consistent, for ensureing
The steady placement of getter.
Embodiment 4：Referring to Fig. 9, with differring primarily in that for embodiment 2：The support meanss can also be rib and convex
The combination of point, such as on bottom surface arrange rib, select one or more salient points, for the steady of assisted inhalation agent on side
Place or be on bottom surface setting salient point, and on side select arrange rib., it is clear that relative to rib, salient point
The area occupied on encapsulation cavity inner surface is less, and the heat transfer which produces can be less.
From above-described embodiment as can be seen that in production application, the number and set-up mode of the rib and salient point
There can also be other several modes, this specification embodiment can not be exhaustive.It should be noted that ensureing stablizing for getter
On the premise of placement, area that the rib or salient point are occupied on cavity inner surface more at least heat transfer can reduce more.
Embodiment 5：Referring to Figure 10 and 11, the support meanss are arranged on encapsulation cover plate 40, be from encapsulation cover plate 40 to
The U-shaped hook 41 extended in cavity.Described U-shaped link up with for supporting getter, its shape and size is engaged with getter, individual
Number can be set as needed.
Further, the support meanss, such as rib or salient point can be integrally-formed with package substrates, and U-shaped hook can
Integrally-formed with encapsulation cover plate, the manufacture method of integration can effectively reduce the complexity of production technology, make support meanss
Very little is become to the increase of production cost.The rib, salient point and package substrates are preferably made using pottery or silicon materials
Form.
The setting support meanss in package substrates or encapsulation cover plate of novelty of the present invention, make getter be suspended at package cavity
Portion, is not contacted with encapsulation cavity inner surface in vivo.There is the encapsulation cavity of above-mentioned support meanss, under vacuum conditions to getter
Its heat transfer is just effectively reduced when carrying out heat activation, and the heat which on the one hand can be avoided to produce is by package substrates or envelope
Capping plate is transferred on IC/MEMS devices in a large number, and IC/MEMS devices are adversely affected；On the other hand air-breathing can be improved
The activation efficiency of agent and success rate, reduce and activate scrapping for the MEMS package structure for unsuccessfully causing due to getter, further carry
High finished product rate.
In addition, the getter for adopting in the present invention is the surrounding circulating type structure of leaving certain gaps uncovered by the economic plan, compared to traditional air-breathing
Agent side is placed, and significantly increases getter surface product on the premise of encapsulation volume is reduced, and makes vacuum in cavity keep more holding
Long, extend the service life of MEMS fine vacuum encapsulating structures.
Embodiment 6：Referring to Figure 12 and Figure 13, the MEMS fine vacuum encapsulating structure is infrared thermal imaging sensor, wherein
MEMS be infrared focal plane array, encapsulation cover plate is by can cut down metal 41 and optical window 42 is constituted.The optical window
Can be germanium window, for projecting infrared signal.In such sensor, arrange preferably in package substrates and support dress
Put.
Embodiment 7：Referring to Figure 14, getter in the above-described embodiments is banding getter 20a, that is, pars intermedia
It is divided into square banding getter 20a of heat activation tinsel 21a, therefore activator metal silk 21a can be drawn welding directly
To pad 12.But the getter of the present invention can also be film like getter 20b, it is on heat activation metallic plate 21b
Fe Getter Films Prepared 20b of sputtering sedimentation, referring to Figure 15.The heat activation of Fe Getter Films Prepared can pass through in heat activation metallic plate
One section of heat activation tinsel is drawn at two ends, is soldered on pad to realize.The heat activation tinsel is preferably molybdenum
Silk, molybdenum filament have excellent heat-conductive characteristic and preferable hardness, getter can be helped preferably to be fixed on rib.Described
Getter is preferably zirconium, vanadium and iron, the alloy of titanium.
The package substrates that we adopt in the above-described embodiments are the package substrates of square box shape, but the present invention can also apply
In the package substrates of other shapes, such as triangular cross section can be set only on bottom surface when package substrates are plane
Rib or salient point realizing, when the bottom surface of package substrates is not plane, such as can be with concave surface or during convex surface
The stable placement of getter is guaranteed by the height and size of adjustment rib or salient point.
In order to ensure the stable placement of surrounding circulating type getter, the rib number that we select is 4 or 8, salient point
It is arranged near each drift angle of square box shape package substrates.But can be by rib when we select the getter of other shapes
Adaptive adjustment is carried out with the position of salient point and number.Therefore, the invention is not limited in surrounding around the getter that places.
In a word, preferred embodiments of the present invention are these are only, is not intended to limit protection scope of the present invention, in the present invention
Scope within, the equivalents made of the present invention or modification should be included within the scope of the present invention.
Claims (5)
1. a kind of MEMS fine vacuum encapsulating structures based on getter, including encapsulating cavity, the MEMS being arranged in cavity
And getter, the encapsulation cavity includes package substrates and encapsulation cover plate, it is characterised in that：It is provided with the package substrates
For supporting the support meanss of getter, the support meanss are rib and/or salient point, wherein, the rib and getter line
Contact, the salient point are contacted with getter point, make getter be suspended inside cavity, are not contacted with encapsulation cavity inner surface.
2. a kind of MEMS fine vacuum encapsulating structures based on getter according to claim 1, it is characterised in that：The envelope
Dress substrate is square box shape, with bottom surface and side, combines to form a cuboidal encapsulation cavity with encapsulation cover plate；The air-breathing
Agent is the surrounding circulating type structure of leaving certain gaps uncovered by the economic plan, its shape and package cavity mates, along MEMS routing area periphery
It is positioned in support meanss within one week, the heat activation welded wire that draws on the two ends that getter is formed by breach is to encapsulation
On suprabasil pad.
3. a kind of MEMS fine vacuum encapsulating structures based on getter according to claim 1, it is characterised in that：Described
Support arrangement is integrally-formed with package substrates.
4. a kind of MEMS fine vacuum encapsulating structures based on getter according to claim 1, it is characterised in that：The suction
Gas agent is that banding or film like, the banding getter refer to that mid portion is heat activation square banding air-breathing wiry
Agent, the film like getter refer to the Fe Getter Films Prepared of sputtering sedimentation on heat activation metallic plate.
5. a kind of MEMS fine vacuum encapsulating structures based on getter according to claim 1, it is characterised in that：Described
MEMS fine vacuum encapsulating structures are infrared thermal imaging sensors, and the MEMS is infrared focal plane array, the cap
Plate is by can cut down metal and optical window is constituted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201510787784.1A CN105271101B (en) | 2015-11-17 | 2015-11-17 | MEMS fine vacuum encapsulating structures based on getter |
Applications Claiming Priority (1)
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| CN201510787784.1A CN105271101B (en) | 2015-11-17 | 2015-11-17 | MEMS fine vacuum encapsulating structures based on getter |
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| CN105271101A CN105271101A (en) | 2016-01-27 |
| CN105271101B true CN105271101B (en) | 2017-03-15 |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105692545B (en) * | 2016-04-06 | 2017-08-25 | 合肥芯福传感器技术有限公司 | A kind of getter electrical heating activates device |
| CN105731357B (en) * | 2016-04-29 | 2017-09-05 | 合肥芯福传感器技术有限公司 | Integrated attraction type ceramic package shell |
| CN105731355B (en) * | 2016-04-29 | 2017-05-31 | 合肥芯福传感器技术有限公司 | Integrated multi-functional ceramic package shell |
| CN107316844B (en) * | 2017-06-22 | 2019-05-31 | 江苏物联网研究发展中心 | Electrical activation sealing cap structure for wafer-level vacuum packaged getter |
| CN107228736A (en) * | 2017-07-20 | 2017-10-03 | 中国电子科技集团公司第四十九研究所 | A kind of miniaturized capacitance formula vacuum pressure sensor encapsulating structure |
| CN115196081B (en) * | 2022-07-14 | 2024-03-22 | 宁波齐云新材料技术有限公司 | High vacuum packaging equipment |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3563985B2 (en) * | 1998-12-28 | 2004-09-08 | キヤノン株式会社 | Getter device and flat panel image display device using the same |
| US20060250086A1 (en) * | 2004-07-16 | 2006-11-09 | Frank Yang | Vacuum Getter Chamber |
| CN102951594B (en) * | 2011-08-26 | 2015-06-10 | 昆山光微电子有限公司 | Tube shell for vacuum package of micro-optical-electronic-mechanic system and manufacture method thereof |
| CN102610619B (en) * | 2012-03-29 | 2014-04-16 | 江苏物联网研究发展中心 | Wafer-level vacuum encapsulated infrared focal plane array (IRFPA) device and method for producing same |
| CN102997999A (en) * | 2012-11-26 | 2013-03-27 | 烟台睿创微纳技术有限公司 | Infrared focal plane array detector |
| CN104340952A (en) * | 2013-08-09 | 2015-02-11 | 比亚迪股份有限公司 | MEMS (Micro Electro-Mechanical System) wafer level vacuum packaging method and structure |
| CN104022046B (en) * | 2014-06-13 | 2017-07-11 | 中国科学院上海微系统与信息技术研究所 | Mixing wafer-level vacuum encapsulating method and structure based on banding getter |
| CN205133146U (en) * | 2015-11-17 | 2016-04-06 | 合肥芯福传感器技术有限公司 | High vacuum packaging structure of MEMS based on getter |
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