CN105731355B - Integrated multi-functional ceramic package shell - Google Patents
Integrated multi-functional ceramic package shell Download PDFInfo
- Publication number
- CN105731355B CN105731355B CN201610276064.3A CN201610276064A CN105731355B CN 105731355 B CN105731355 B CN 105731355B CN 201610276064 A CN201610276064 A CN 201610276064A CN 105731355 B CN105731355 B CN 105731355B
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- ceramic package
- package shell
- tec
- module
- getter
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0035—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS
- B81B7/0038—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0083—Temperature control
- B81B7/0087—On-device systems and sensors for controlling, regulating or monitoring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0083—Temperature control
- B81B7/009—Maintaining a constant temperature by heating or cooling
Abstract
The present invention provides a kind of integrated multi-functional ceramic package shell, including ceramic package shell, getter module, temperature measurement module, temperature control module, and the getter module, temperature measurement module and temperature control module and ceramic package shell are the integrated design.The achievable ceramic package shell of the present invention carries air-breathing, temperature control and temp sensing function, and the follow-up encapsulation step of simplification, improve production efficiency is reduced because modules fixing link causes the risk of component failure；In addition, getter module, temperature control module and temperature measurement module are integrated in ceramic package shell, ceramic package shell integrated level can be improved, be conducive to the diminution of packaging volume.
Description
Technical field
Ceramic package shell the present invention relates to be used for package of MEMS device, more particularly to a kind of integrated multi-functional ceramics
Encapsulating package.
Background technology
At present, the MEMS sensor such as infrared thermal imaging, Thz generally realized using ceramic package shell high vacuum, constant temperature,
The encapsulation of small size.In order to realize that high vacuum, constant temperature, small size and long-life working environment and encapsulation are required, generally need
To be realized using the encapsulation components and parts assembling of various standalone features combination assembling mode together.
In the prior art, referring to Fig. 1 and Fig. 2, in order to realize the high vacuum environment inside encapsulating structure, it is necessary to will be independent
Getter element 20 in electrical heating wire 21 the reserved metal of ceramic package shell 10 is fixed on by modes such as spot welding
On electrode 12, to its electrified regulation to more than 300 DEG C and keep 10-15 minutes come realize getter activation discharge, Zhi Houzai
Completely enclosed shell, whole encapsulation process needs to be completed under high vacuum environment.
In order to realize the constant of temperature in encapsulating structure, it usually needs assemble temp-controlling element, such as semiconductor in shell
Refrigerator（TEC）Element 30 realizes the precise control of encapsulating structure internal temperature.Referring to Fig. 2, TEC elements are usually by first
Potsherd 31, TEC circuits 32, multiple TEC semiconductor pieces 33 and the second potsherd 34 are constituted, TEC circuits connection TEC semiconductors
Block, realizes TEC functions.The assembling mode of TEC elements is that the outer surface of the first potsherd 31 is gold-plated, then is protected by high temperature nitrogen
Soldering is protected by it together with the fixed bonding of shell 10, and reserved coherent signal or power supply connection pin leads.
Referring to Fig. 2, in order to realize temperature in measurement device, it is necessary to fix a thermoelectricity by the mode such as welding or bonding
Even component 40 is in shell, and reserved coherent signal connection pin leads.
The problem that traditional assembling mode is present is that the assembly technology of every kind of independent component is different, has plenty of spot welding,
Some solderings, some requirement bonding welding etc., technological temperature, time and equipment are also different, the repulsion between process conditions
With incompatible conventional package process complexity can be caused high, operating technology difficulty is big, and production yield is poor, inefficiency, finally leads
Cause production cost too high；In addition, the packaging final volume that conventional package technique makes is larger, does not meet industry development and become
Gesture.
The content of the invention
In order to solve the above problems, the present invention provides a kind of integrated multi-functional ceramic package shell, can significantly reduce
Packaging technology complexity, reduces small product size.
The technical solution adopted by the present invention is：A kind of integrated multi-functional ceramic package shell, including ceramic package shell,
Also include getter module, temperature measurement module, temperature control module, the getter module, temperature measurement module and temperature control module are sealed with ceramics
Tubulature shell is the integrated design.
Preferably, the getter module includes metal area and getter material layer, and the metal area is grown directly upon pottery
On porcelain encapsulating package inner surface, the getter material layer is grown on metal area, is reserved with the ceramic package shell
The lead frame of metal area is connected to, the activation that the metal area is communicated to outside shell by lead frame discharges pin.
Preferably, the temperature control module is semiconductor cooler, and the semiconductor cooler is by TEC circuits, multiple TEC half
Conductor block and the potsherd scope of operation are constituted, and the TEC circuits are directly printed on ceramic package shell inner surface, the multiple
TEC semiconductor pieces are arranged on TEC circuits, and the potsherd scope of operation is arranged on multiple TEC semiconductor pieces, in the ceramics
The lead frame for being connected to TEC circuits is reserved with encapsulating package, the TEC circuits are communicated to outside shell by lead frame
Controlling switch.
Preferably, the temperature measurement module is thermoelectricity occasionally resistance and temperature sensing unit, the thermoelectricity occasionally resistance and temperature
Sensing unit is that thermistor material is printed on ceramic package shell by metal paste typography, in the ceramic package
The lead frame for being connected to thermoelectricity occasionally resistance and temperature sensing unit is reserved with shell, the thermoelectricity occasionally resistance and temperature is passed
Sensillary area is communicated to the signal pins outside shell by lead frame.
Preferably, the metal area is plane or convex-concave wall shape.
Preferably, the metal area is made of tungsten or Molybdenum metal materials industry, by metal paste print process, galvanoplastic or
Chemical deposition is grown on ceramic package shell inner surface.
Preferably, the getter material layer is to be grown in gold by sputtering, coating, sintering or nano coating processing technology
In category area.
Preferably, the multiple TEC semiconductor pieces are made of bismuth telluride material.
Preferably, the controlling switch has signal transmission and function of supplying power.
Preferably, the thermoelectricity occasionally resistance and temperature sensing unit is made of using NTC thermistor material.
Compared with prior art, there is following technique effect in the present invention：
1）The integrated design of getter module, temperature control module and temperature measurement module and ceramic package shell can realize ceramic envelope
Tubulature shell carries air-breathing, temperature control and temp sensing function, and the follow-up encapsulation step of simplification, improve production efficiency is reduced because of modules peace
Dress link causes the risk of component failure；In addition, getter module, temperature control module and temperature measurement module are integrated in into ceramic package pipe
In shell, ceramic package shell integrated level can be improved, be conducive to the diminution of packaging volume；
2）Getter module can strengthen getter reliability with the integrated design of encapsulating package, possess it excellent
Resistance to mechanical impact capacity, prevents dry linting, the phenomenon of the particle that comes off, and significantly improves production yield, extends the use longevity of MEMS
Life；From the point of view of heat activation effect, the metal paste typography that metal area is used ensure that the controllability of metal area resistance, can
Larger metal area resistance is realized, getter active circuit line resistance is reduced to doing that getter material layer release process is caused
Disturb；In addition, using metal material temperature resistance characteristic variations curve, metal area is calculated by measurement metal area resistance in real time
Real time temperature, can accurately control temperature of the metal area during getter material layer release, the design of metal area to cause again
The radiating condition convergence of getter material layer is consistent in each encapsulating package, it is ensured that getter material layer is abundant in each device
Activation and release, it is ensured that the uniformity of getter performance, improve production yield, extend the service life of MEMS.
3）Using ceramic package shell as lower floor's ceramic plane of TEC elements, the volume of packaging can be reduced, reduce life
Produce cost；The integrated design of TEC elements and ceramic package shell, it is not necessary to which TEC elements are protected into big face by high temperature nitrogen
The gold-plated soldering of product is fixed on ceramic package shell, avoids the bubble in the yield issues and weld layer of soldering gentle completely
The deflation problems such as hole, solder impurity, significantly improve production yield, extend the service life of packaging；
4）Electric thermo-couple temperature sensing unit is that thermistor material is directly printed on into ceramics by metal paste typography
On encapsulating package inner surface, thermistor material directly reaches maximization with shell exposure level, can accurately and real time reaction
Temperature inside shell, to realize that encapsulating structure internal temperature control provides extraordinary monitor control index.
5）Relative to plane metal area, the metal area of convex-concave wall shape can significantly increase getter material layer contact surface
Product, strengthens inspiratory effects, extends packaging service life.
Brief description of the drawings
Fig. 1 is prior art overlooking the structure diagram；
Fig. 2 is prior art cross section structure diagram；
Fig. 3 is the cross section structure diagram of the embodiment of the present invention 1；
Fig. 4 is the overlooking the structure diagram of the embodiment of the present invention 1；
Fig. 5 is the cross section structure diagram of the embodiment of the present invention 2；
Fig. 6 is the overlooking the structure diagram of the embodiment of the present invention 2.
Specific embodiment
Below in conjunction with accompanying drawing, the invention will be further described.
Diagram provided in the embodiment of the present invention is only illustrated in a schematic way, so only showing the group relevant with the present invention
Part rather than component count during according to actual implementation, shape and size are drawn.
Embodiment 1：Referring to Fig. 3 and Fig. 4, a kind of integrated multi-functional ceramic package shell, including ceramic package shell 10,
Getter module 20, temperature control module 30 and temperature measurement module 40, the getter module 20, temperature measurement module 40 and temperature control module 30 with
Ceramic package shell 10 is the integrated design.
Specifically, the getter module 20 includes metal area 21 and getter material layer 22, and the metal area 21 is
It is plane, can be printed by including but is not limited to metal paste using the resistance heating metal material such as tungsten or molybdenum, plating or
The processing modes such as person's chemical deposition are grown directly upon on ceramic package shell inner surface, it is preferred to use metal paste typography
It is made；The getter material layer 22 can be given birth to by including but is not limited to the processing modes such as sputtering, coating, sintering, nano coating
Length is reserved with the lead frame 23 for being connected to metal area 21, the metal on metal area 21 in the ceramic package shell
The activation that area 21 is communicated to outside shell by lead frame 23 discharges pin 24.In follow-up encapsulation process, supplied by outside
Be electrically connected activation release pin 24 and metal area 21, and electrified regulation is carried out to metal area 21, is realized to getter material layer 22
High-temperature heating is activated and release reduction.
In the present invention, getter module can also strengthen getter reliability with the integrated design of encapsulating package, make
It possesses excellent resistance to mechanical impact capacity, prevents dry linting, the phenomenon of the particle that comes off, and significantly improves production yield, extends MEMS
The service life of device.
From the point of view of heat activation effect, the metal paste typography that metal area is used ensure that the controllable of metal area resistance
Property, larger metal area resistance is capable of achieving, generally>1 Ω, reduces getter active circuit line resistance and getter material layer is released
Let off the interference of Cheng Zaocheng；In addition, using metal material temperature resistance characteristic variations curve, by measurement metal area resistance in real time
To calculate the real time temperature of metal area, temperature of the metal area during getter material layer release, metal can be accurately controlled
The design in area causes that the radiating condition convergence of getter material layer in each encapsulating package is consistent again, it is ensured that air-breathing in each device
The abundant activation and release of agent material layer, it is ensured that the uniformity of getter performance, improve production yield, extend making for MEMS
Use the life-span.
Specifically, the temperature control module 30 is semiconductor cooler 30, the semiconductor cooler 30 by TEC circuits 32,
Multiple TEC semiconductor pieces 33 and potsherd 34 are constituted, and the TEC circuits 32 are directly printed on by ceramic printing smithcraft
On the inner surface of ceramic package shell 10, the multiple TEC semiconductor pieces 33 are arranged on TEC circuits 32, and TEC semiconductor pieces can be with
It is made of the N-type of heavy doping and the bismuth telluride of p-type or other TEC semi-conducting materials, the potsherd 34 is arranged on multiple
On TEC semiconductor pieces 33, potsherd can have good heat-conductive characteristic again as the existing insulating properties of the scope of operation, in the ceramics
The lead frame 35 for being connected to TEC circuits is reserved with encapsulating package 10, the TEC circuits 32 are communicated to by lead frame 35
Controlling switch 36 outside shell, the controlling switch 36 has signal transmission and function of supplying power.
In the course of the work, electric current is passed through to multiple TEC semiconductor pieces by TEC controlling switch and TEC circuits, electric current is produced
Raw heat passes to opposite side from the side of TEC semiconductor pieces, and " heat " side and " cold " side are produced on TEC semiconductor pieces, realizes
TEC is heated and refrigerating function, is the working temperature environment that packaging creates stabilization, so as to realize device in dynamic temperature wide
Interval, such as in -40 DEG C~80 DEG C of working environment, can continue to keep optimal working condition.
Ceramic cartridge as lower floor's ceramic plane of TEC elements can be reduced the volume of packaging by the present invention, reduce life
Produce cost.Importantly, TEC elements and the integrated design of encapsulating package, are protected without by TEC components by high temperature nitrogen
The shield gold-plated soldering of large area is fixed on shell, avoid completely bubble and stomata in the yield issues and weld layer of soldering,
The deflation problem such as solder impurity, significantly improves production yield, extends the service life of MEMS.
Specifically, the temperature measurement module is thermoelectricity occasionally resistance and temperature sensing unit 40, the thermoelectricity occasionally thermal resistance temperature
Degree sensing unit 40 is that thermistor material is directly printed on ceramic package shell inner surface by metal paste typography,
It is preferred that using NTC thermistor material, it is reserved with the ceramic package shell 10 and is connected to thermoelectricity occasionally resistance and temperature
The lead frame 41 of sensing unit 40, the thermoelectricity occasionally resistance and temperature sensing unit is communicated to outside shell by lead frame 41
Signal pins 42.
From the point of view of thermometric effect, thermoelectricity occasionally resistance and temperature sensing unit is that thermistor material is printed by metal paste
Dataller's skill is directly printed on ceramic package shell inner surface, and thermistor material reaches maximization, energy with shell exposure level
Temperature inside enough accurate and real time reaction shells, refers to realize that encapsulating structure internal temperature control provides extraordinary monitoring
Mark.
Embodiment 2：Referring to Fig. 5 and Fig. 6, other parts are same as Example 1, and difference is：The metal area 21 is convex
Recessed wall shape, getter material layer 22 is grown on the metal area of convex-concave wall shape.Relative to plane metal area, convex-concave wall shape
The metal area of shape can increase getter material layer contact area, strengthen inspiratory effects, extend packaging service life.
In the present invention, the integrated design of getter module, temperature control module and temperature measurement module and ceramic package shell, can
Realize that encapsulating package carries air-breathing, temperature control, temp sensing function, with this understanding, follow-up encapsulation is only needed to MEMS or chip
Die bond binding weldering is completed on 50 potsherds for affixing to TEC temp-controlling elements, by being connected on wire peg 11 by IC wires 51
Wiring technology, is effectively simplified packaging processing step, improve production efficiency, reduce independent getter component, temp-controlling element,
Temperature element fixing link causes the risk that air suction function fails；In addition, by getter module, temperature control module and temperature measurement module collection
Into ceramic package shell integrated level in ceramic package shell, can be improved, be conducive to the diminution of packaging volume.
In above-described embodiment and accompanying drawing, the metal area, getter material layer and thermoelectricity occasionally resistance and temperature are passed
Being shaped as sensillary area is square, and it is also possible to be other shapes, the present invention is not limited.
In a word, preferred embodiments of the present invention are these are only, is not intended to limit the scope of the present invention, in the present invention
Scope within, the equivalents made of the present invention or modification should be included within the scope of the present invention.
Claims (9)
1. a kind of integrated multi-functional ceramic package shell, including ceramic package shell, it is characterised in that：Also include getter mould
Block, temperature measurement module, temperature control module, the getter module, temperature measurement module and ceramic package shell are the integrated design；The control
Warm module is semiconductor cooler, and the semiconductor cooler is by TEC circuits, multiple TEC semiconductor pieces and the potsherd scope of operation
Composition, the TEC circuits are directly printed on ceramic package shell inner surface, and the multiple TEC semiconductor pieces are arranged on TEC electricity
Lu Shang, the potsherd scope of operation is arranged on multiple TEC semiconductor pieces, is reserved with the ceramic package shell and is connected to
The lead frame of TEC circuits, the TEC circuits are communicated to the controlling switch outside shell by lead frame.
2. a kind of integrated multi-functional ceramic package shell according to claim 1, it is characterised in that：The getter mould
Block includes metal area and getter material layer, and the metal area is grown directly upon on ceramic package shell inner surface, the air-breathing
Agent material layer is grown on metal area, and the lead frame for being connected to metal area is reserved with the ceramic package shell, described
The activation that metal area is communicated to outside shell by lead frame discharges pin.
3. a kind of integrated multi-functional ceramic package shell according to claim 1 and 2, it is characterised in that：The thermometric
Module is thermoelectricity occasionally resistance and temperature sensing unit, and the thermoelectricity occasionally resistance and temperature sensing unit is to lead to thermistor material
Cross metal paste typography to be printed on ceramic package shell, be reserved with the ceramic package shell and be connected to thermocouple
Or the lead frame of resistance and temperature sensing unit, the thermoelectricity occasionally resistance and temperature sensing unit is communicated to pipe by lead frame
Signal pins outside shell.
4. a kind of integrated multi-functional ceramic package shell according to claim 1, it is characterised in that：The multiple TEC
Semiconductor piece is made of bismuth telluride material.
5. a kind of integrated multi-functional ceramic package shell according to claim 1, it is characterised in that：The controlling switch
With signal transmission and function of supplying power.
6. a kind of integrated multi-functional ceramic package shell according to claim 2, it is characterised in that：The metal area is
Plane or convex-concave wall shape.
7. a kind of integrated multi-functional ceramic package shell according to claim 2, it is characterised in that：The metal area is adopted
It is made of tungsten or Molybdenum metal materials industry, ceramic package pipe is grown in by metal paste print process, galvanoplastic or chemical deposition
On shell inner surface.
8. a kind of integrated multi-functional ceramic package shell according to claim 2, it is characterised in that：The getter material
The bed of material is grown on metal area by sputtering, coating, sintering or nano coating processing technology.
9. a kind of integrated multi-functional ceramic package shell according to claim 3, it is characterised in that：The thermoelectricity is occasionally
Resistance and temperature sensing unit is made of using NTC thermistor material.
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| US20210139314A1 (en) * | 2019-11-07 | 2021-05-13 | Innovative Interface Laboratory Corp. | Linear actuator |
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| CN113301782B (en) * | 2021-06-02 | 2022-04-19 | 苏州鸿凌达电子科技有限公司 | Preparation device and manufacturing method of intelligent ultra-micro TEC (thermoelectric cooler) refrigeration module |
| CN115635765B (en) * | 2022-12-26 | 2023-03-07 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Ceramic packaging tube shell pore wall metallization die and screen printing equipment |
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