CN105269916A - 一种高导热cem-3覆铜板制作工艺 - Google Patents

一种高导热cem-3覆铜板制作工艺 Download PDF

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CN105269916A
CN105269916A CN201510655448.1A CN201510655448A CN105269916A CN 105269916 A CN105269916 A CN 105269916A CN 201510655448 A CN201510655448 A CN 201510655448A CN 105269916 A CN105269916 A CN 105269916A
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parts
cem
curing agent
join
clad plate
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钱笑雄
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Tongling Composite Base Plate Co Ltd Of Great High Honour Section
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Tongling Composite Base Plate Co Ltd Of Great High Honour Section
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

本发明公开了一种高导热CEM-3覆铜板制作工艺，步骤包括表料胶液配置、里料胶液配置、叠配和压制，使用该制作方法制作的导热CEM-3覆铜板导热系数达到1.0-1.5W/K，符合PCB中LED生产的导热系数要求，同时板材耐热性：100-120s，满足PCB的浸焊要求。

Description

一种高导热CEM-3覆铜板制作工艺
技术领域
本发明涉及一种高导热CEM-3覆铜板制作工艺。
背景技术
LED（半导体发光二极管）节能灯是用高亮度白色发光二极管发光源，光效高、耗电少，寿命长，安全环保，是新一代固体冷光源，适用家庭，商场，医院等各种公共场所长时间照明。随着LED应用技术发展的日益进步，应用的越来越广泛，其功率消耗量与发热量亦随之提高，尤其是大幅提高的发热量更是严苛的挑战。因为LED元件的基本特性是，如果温度上升，发光效率就会下降，所以基板如何有效的释放大量产生热量的放热技术，即具备高导热性就成为了关键。
同时随着PCB无铅制程时代的到来，无铅焊料熔点将由原先的183℃提高至217℃，焊料温度大大提高，就要求作为LED用的基板要有更好的耐热性来满足无铅制程的需要，常规LED用板材是用导热铝基板生产，铝基板的加工难，对PCB加工工艺有严格要求，同时成本较高。
发明内容
本发明的目的是提供一种高导热CEM-3覆铜板制作工艺。
本发明采用的技术方案是：一种高导热CEM-3覆铜板制作工艺，步骤如下
（1）、表料胶液配置：将基础环氧树脂A1000份、增韧剂B110份、多官能树脂C330份、固化剂A295份、促进剂A13份、偶联剂110份和乙二醇甲醚2900份充分混合溶解，再加入氧化铝4640份，搅拌10小时；将制得的混合物涂覆在铜箔的毛面上，经过卧式上胶机进行烘烤；
（2）、里料胶液配置：将基础环氧树脂A300份、环氧树脂D1000份、固化剂B33份、促进剂B1.1份、2-甲基甲酰胺790份充分混合溶解4小时后，再加入氧化铝A1200份、氧化铝100份和偶联剂10份，再充分混合搅拌3小时；将制得的胶水涂覆在玻璃毡上过立式上胶机烘烤；
（3）、叠配：将两层铜板内叠配两层铜箔，在两层铜箔内叠配两层表料胶液半固化片，最后在两层表料胶液半固化片内叠配若干层里料胶液半固化片；
（4）、压制：将叠配完成的组料放入热压机中热压140min，再放入冷压机中冷压60min；取出清理后即制得产品。
作为本发明的进一步改进，所述的固化剂A是苯胺类固化剂，促进剂A是硬脂酸，固化剂B是双氰胺，促进剂B是叔胺类促进剂，偶联剂是KH560型硅烷类偶联剂。
本发明的有益效果是：使用该制作方法制作的导热CEM-3覆铜板导热系数达到1.0-1.5W/K，符合PCB中LED生产的导热系数要求，同时板材耐热性：100-120s，满足PCB的浸焊要求。
具体实施方式
一种高导热CEM-3覆铜板制作工艺，步骤如下
（1）、表料胶液配置：将基础环氧树脂A1000份、增韧剂B110份、多官能树脂C330份、苯胺类固化剂295份、硬脂酸13份、KH560型硅烷类偶联剂110份和乙二醇甲醚2900份充分混合溶解，再加入氧化铝4640份，搅拌10小时；将制得的混合物涂覆在铜箔的毛面上，经过卧式上胶机进行烘烤；
（2）、里料胶液配置：将基础环氧树脂A300份、环氧树脂D1000份、双氰胺33份、叔胺类促进剂1.1份、2-甲基甲酰胺790份充分混合溶解4小时后，再加入氧化铝A1200份、氧化铝100份和偶联剂10份，再充分混合搅拌3小时；将制得的胶水涂覆在玻璃毡上过立式上胶机烘烤；
（3）、叠配：将两层铜板内叠配两层铜箔，在两层铜箔内叠配两层表料胶液半固化片，最后在两层表料胶液半固化片内叠配2-5层里料胶液半固化片；
（4）、压制：将叠配完成的组料放入热压机中热压140min，再放入冷压机中冷压60min；
热压工艺：
区间号码 设定面压（MPa） 设定时间（min） 板面温度（℃） 设定时间（min）
1 0.7 15 140 10
2 1.2 2 140 10
3 1.2 15 160 10
4 1.6 2 160 10
5 1.6 14 210 10
6 2.8 2 210 10
7 2.8 10 210 10
8 2.8 40 210 40
9 2.8 10 210 10
10 2.8 40 210 40
11 2.8 20 210 10
12 2.8 10 210 10
13 2.8 10 210 10
14 2.0 4 180 4
15 1.5 3 160 3
16 0.8 3 140 3
冷压压制工艺：
取出清理后即制得产品。
以上对本发明的实施方式作了说明，但是本发明不限于上述实施方式，在所属技术领域普通技术人员所具备的知识范围内，还可以在不脱离本发明宗旨的前提下做出各种变化。

Claims (2)

1.一种高导热CEM-3覆铜板制作工艺，其特征是：步骤如下
（1）、表料胶液配置：将基础环氧树脂A1000份、增韧剂B110份、多官能树脂C330份、固化剂A295份、促进剂A13份、偶联剂110份和乙二醇甲醚2900份充分混合溶解，再加入氧化铝4640份，搅拌10小时；将制得的混合物涂覆在铜箔的毛面上，经过卧式上胶机进行烘烤；
（2）、里料胶液配置：将基础环氧树脂A300份、环氧树脂D1000份、固化剂B33份、促进剂B1.1份、2-甲基甲酰胺790份充分混合溶解4小时后，再加入氧化铝A1200份、氧化铝100份和偶联剂10份，再充分混合搅拌3小时；将制得的胶水涂覆在玻璃毡上过立式上胶机烘烤；
（3）、叠配：将两层铜板内叠配两层铜箔，在两层铜箔内叠配两层表料胶液半固化片，最后在两层表料胶液半固化片内叠配2-5层里料胶液半固化片；
（4）、压制：将叠配完成的组料放入热压机中热压140min，再放入冷压机中冷压60min；取出清理后即制得产品。
2.根据权利要求1所述的一种高导热CEM-3覆铜板制作工艺，其特征是所述的固化剂A是苯胺类固化剂，促进剂A是硬脂酸，固化剂B是双氰胺，促进剂B是叔胺类促进剂，偶联剂是KH560型硅烷类偶联剂。
CN201510655448.1A 2015-10-12 2015-10-12 一种高导热cem-3覆铜板制作工艺 Pending CN105269916A (zh)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102205675A (zh) * 2011-03-29 2011-10-05 浙江华正新材料股份有限公司 Led用高导热高耐热cem-3覆铜板
TW201436659A (zh) * 2013-03-13 2014-09-16 Yun-Chao Yeh 多層印刷電路板結構

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102205675A (zh) * 2011-03-29 2011-10-05 浙江华正新材料股份有限公司 Led用高导热高耐热cem-3覆铜板
TW201436659A (zh) * 2013-03-13 2014-09-16 Yun-Chao Yeh 多層印刷電路板結構

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Application publication date: 20160127