CN105261598A - 具有基于管道的散热器的半导体器件 - Google Patents
具有基于管道的散热器的半导体器件 Download PDFInfo
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Abstract
本发明涉及具有基于管道的散热器的半导体器件。一种封装半导体器件具有集成电路(IC)管芯、柔性管道和金属段塞。在组装期间,管道的第一端部安装于IC管芯的表面上,而管道的第二端部远离管芯表面而延伸。IC管芯表面的露出部分被包封于模制化合物内,该模制化合物同样包封管道的外周。在模制之后,管道可以用金属来填充,以提高热量远离管芯顶部的传导。如果管道由像橡胶一样的软材料形成,则管道在与管芯顶部的贴附过程中将不会破坏管芯。
Description
技术领域
本发明一般地涉及半导体封装,并且更特别地涉及具有基于管道的(tube-based)散热器的半导体封装。
背景技术
随着集成电路的小型化,排热已经变得愈发重要。如果热量没有充分地从集成电路管芯中散逸出去,则集成电路可能会过热,从而导致性能降低并且甚至可能失效。为了帮助热量散逸,某些常规的封装半导体器件配置有散热器。一般地,散热器使从集成电路中散发出的热量散布到远离集成电路的封装区域。
由于金属良好的热特性,散热器通常由金属(例如,铜)制成。典型地,散热器的一端或一侧贴附于管芯的表面,而散热器的另一端或另一侧是露出的。但是,由于散热器含有金属,因而当它贴附于管芯顶部时,它可能会破坏管芯以及下垫的集成电路。因而,有利的是拥有在贴附于管芯时不太可能会破坏管芯顶部的散热器。
附图说明
本发明的实施例通过举例的方式来说明,并且不受附图所限定,在附图中,相似的附图标记指示相似的元件。在附图中的元件是出于简单和清晰起见而示出的,而并不一定按比例来绘制。例如,层和区域的厚度可以为了清晰起见而放大。
图1A和1B分别示出了根据本发明的一种实施例的部分组装的半导体封装的顶视图和截面侧视图;以及
图2A和2B分别示出了根据本发明的一种实施例的完全组装的半导体封装的顶视图和截面侧视图。
具体实施方式
本文公开了本发明的详细说明性实施例。但是,本文所公开的具体的结构及功能细节仅仅是用于描述本发明的示例实施例的代表。本发明的实施例可以用许多可替换的形式来实现,并且不应被理解为仅限定于本文所阐明的实施例。此外,本文所使用的术语只是为了描述特定的实施例,而并非意指对本发明的示例实施例的限定。
如同本文所使用的,单数形式的“一”、“一个”和“该”意指同样包括复数形式,除非上下文另有明确指出。还应当理解,术语“包括”、“包含”、“具有”、“拥有”、“含有”和/或“囊括”指定存在着规定的特征、步骤或构件,但是不排除存在或添加一个或多个其他特征、步骤或元件。还应当注意,在某些可替换的实现方式中,所指出的功能/动作可以按照除附图所指出的顺序之外的顺序出现。例如,连续示出的两个图实际上可以基本上同时执行,或者有时可以按照相反的顺序来执行,取决于所涉及的功能/动作。
在下面的描述中,应当理解,本发明的某些实施例涉及在封装半导体器件内使用金属填充的管道来散热。为了便于讨论,下面将讨论一种示例性的封装半导体器件的组装。但是,应当理解,本发明的实施例并不限定于管道的特定配置或者特定的封装类型(丝线键合或倒装芯片)。
本发明的一种实施例是包含集成电路(IC)管芯、柔性的软管道和金属填充物的封装半导体器件。该器件包含安装于IC管芯的表面上的管道的第一端部以及远离IC管芯的表面而延伸的管道的第二端部。金属填充物被布置于管道之内。本发明的另一种实施例是用于组装封装半导体器件的方法。
现在参照图1A和1B,图中分别示出了根据本发明的一种实施例的部分组装的半导体封装的顶视图和截面侧视图。在本实施例中,封装半导体器件被实现四方扁平封装(QFP)。部分组装的半导体封装包含金属引线框100和集成电路(IC)管芯102。用于制作引线框100和IC管芯102的方法是熟知的,并且因此在此不进行描述。
引线框100包含具有接地棒106的管芯座(paddle)104(有时称为管芯基岛(flag)或焊盘),该接地棒106形成于管芯座104的外围附近,并且与管芯座104物理隔离且电隔离。引线框100还包含沿着引线框100的外围包围着接地棒106的多个引线指108。本发明的实施例不一定要包含接地棒106。
尽管未示出,但是引线框100可以包含用于使引线指108的远端相互连接的金属连接元件(有时称为引线框滑条(runner))。这些金属滑条还可以将引线框100连接至引线框100的一个或多个其他实例(未示出),使得引线框的实例形成的一维或二维阵列互连的引线框。
在封装半导体器件的组装期间,IC管芯102使用管芯贴附粘合剂110来安装于管芯座104上,如同图1B的截面图所示的且如同本技术领域所已知的。然后,多个管道112被安装于IC管芯102的有源表面(activesurface)上,不过是按照它们不会干涉形成于IC管芯102的有源表面上的键合焊盘114的方式来安装。键合丝线118连接(string)于IC管芯102上的键合焊盘114与多个引线指108之间。如图1A所示(但不在图1B中示出),其他键合丝线118将其他管芯键合焊盘114连接至接地棒106,并且还有其他键合丝线将接地棒106连接至引线指108中的某些引线指。
每个管道112都可以通过将诸如(不限于)环氧树脂之类的粘合剂116施加于管道112的一端并且将具有粘合剂116的管道端部按压到IC管芯102的有源表面上而安装于管芯102的表面上。管道112可以按照例如阵列的形式安置于管芯102的表面上的各个位置。在本发明的至少某些实施例中,管道112所安置的具体位置可以使用例如用于在管芯正在工作时识别出IC管芯102上的一个或多个最热区域的热模拟来确定。此外,粘合剂116的施加可以受到控制,以防止粘合剂116渗流到IC管芯102的不直接位于管道112的管壁下方的区域之上。
在本发明的至少某些实施例中,管道112由柔性的且优选为软的材料(例如(不限于),橡胶或硅酮)制成,尽管诸如聚四氟乙烯之类的其他材料也能够使用。可以选择该柔性材料,使得当管道112被安装于IC管芯102之上时,管道112的柔性或软度降低损坏IC管芯102的表面的可能性。另外,在本发明的至少某些实施例中,管道112由能够耐高温的材料制成。管道112可以是圆形的(即,圆柱形)或方形的。管道112的直径可以是例如2~4mm,但是该尺寸的范围能够是1~20mm,取决于管芯102的尺寸。
图2A和2B分别示出了根据本发明的一种实施例的完全组装的半导体封装120的顶视图和截面侧视图。为了完成封装半导体器件120,模制化合物122被施加于图1A和1B的部分组装的半导体封装。可以通过常规的散布机(dispensingmachine)(未示出)的喷嘴来施加的模制化合物122覆盖着键合丝线118、引线指108的近端(即,引线指108的接近于管芯座104的端部)、接地棒106、IC管芯102的露出部分以及管芯座104的露出部分。此外,模制化合物122覆盖着每个管道112的弯曲周界,没有填充管道112内的空腔或者没有覆盖与管芯102间隔开的在管道112的末端处的开口。注意,每个管道112都可以被设计(例如,通过选择管道112的材料和尺寸),使得在散布模制化合物的同时,管道112基本上保留形成于其内的空腔。换言之,管道112在模制化合物122的压力之下基本上不会坍塌。
在散布模制化合物122时,模具(未示出)可以被按压到管道112的顶端上以密封管道112的空腔。然后,当模制化合物122被散布时,模制化合物122被防止进入管道112的空腔。将模具朝管道112按压会产生对管道112的向下的作用力,这进而对IC管芯102的顶部施加向下的作用力。在管道112使用柔性材料来制造的实施例中,柔性材料可以收缩,使得施加于IC管芯102的顶部上的作用力大小减小。这种收缩可以降低破坏IC管芯102的可能性。
在模制之后,管道112以例如固态的金属段塞(slug)124或金属材料(例如,与粘合剂混合的金属粒子)的热传导材料填充。在一种实施例中,金属段塞124通过使用拾放机器(pickandplacemachine)将金属段塞124向下朝管道112的顶端按压而安装于每个管道112之内。金属段塞124使用粘合剂126来保持于原位,该粘合剂126可以散布于相应管道112的空腔内的金属段塞124以及IC管芯102的上表面之一或两者之上。在至少某些实施例中,粘合剂126是适用于固定金属段塞124并将IC管芯102所放射出的热量传导到金属段塞124的热粘合剂。
在以金属段塞124填充管道112并且以模制化合物122覆盖管芯102、键合丝线118等之后,可以执行激光或锯切单体化和/或修边以去除任何金属连接元件(未示出),从而(i)使引线指108彼此电解耦且机械解耦并且(ii)使封装半导体器件120与组装于互连的相邻引线框(未示出)上的其他封装半导体器件分离。
尽管本发明的一种实施例是关于它在具有特定配置的QFP中使用来描述的,但是本发明的实施例并不限定于此。根据可替换的实施例,本发明可以实现于具有除了所示出的配置之外的配置的QFP中以及实现于其他类型的封装中,包括(不限于):其中管芯座的底面为露出(即,未以模制化合物覆盖)的封装,具有焊球或引脚的封装,不具有金属引线框的封装,以及在不使用键合丝线的情况下将IC管芯电连接至引线的封装(例如,使用位于IC管芯下方的再分布层)。
此外,尽管在此示出了其中6个尺寸相等的圆柱形管道被安装于IC管芯之上的本发明的一种实施例,但是本发明的实施例并不限定于此。例如,本发明的可替换实施例可以采用少至1个的管道或者多于6个的管道。
作为另一实例,本发明的可替换实施例可以采用具有非圆形截面的管道,包括(不限于):方形、三角形、椭圆形(ovular)以及其他闭合形状的截面。
作为又一个实例,本发明的可替换实施例可以采用具有除了所示尺寸之外的尺寸的管道。例如,本发明的封装半导体器件可以用具有占据IC管芯表面的主要部分的截面的单个大管道或者具有彼此不同的尺寸和/或形状的多个管道来实现。
作为再一个实例,本发明的可替换实施例可以采用没有间隔开的管道。
尽管在此描述了其中封装半导体器件通过将固态的金属段塞按压到管道内来组装的一种实施例,但是本发明的实施例并不限定于此。根据本发明的可替换实施例,封装半导体器件能够通过将粉末金属、液态金属或金属浆体散布到管道内来组装。粉末金属、液态金属或金属浆体然后可以根据需要通过加热或者不加热来固化。
根据另外一种实施例,固态的金属段塞能够在不使用粘合剂的情况下或者除了使用粘合剂之外也能够固定于管道内(例如,通过将固态的金属段塞压装到管道之内)。
在包含任意权利要求的本说明书中,可以使用术语“每个”来指代多个前面所述的元件或步骤的一个或多个指定特性。在与开放式的术语“包含”一起使用时,术语“每个”的叙述并不排除另加的未述及的元件或步骤。因而,应当理解,装置可以具有另加的未述及的元件,并且方法可以具有另加的未述及的步骤,其中这些另加的未述及的元件或步骤并不具有该一个或多个指定特性。
本文对“一种实施例”或“实施例”的引用意指,结合该实施例所描述的特定特征、结构或特性能够包含于本发明的至少一种实施例中。短语“在一种实施例中”出现于本说明书中的不同位置并不一定全都指的是同一种实施例,也并不一定是必须与其他实施例相互排斥的单独的或可替换的实施例。对于术语“实现方式”同样如此。
诸如“下部”、“上部”、“水平”、“垂直”、“上”、“下”、“向上”、“向下”、“顶部”、“底部”、“右侧”和“左侧”以及它们的派生词(例如,“水平地”、“垂直地”等)之类的方位术语应当被理解为指的是在所讨论的附图中所示出的方位。这些方位术语是为了便于描述,而并不要求装置要按照特定的方位来构造或操作。
除非另有明确说明,否则每个数字值和范围应当被解释为近似的,如同单词“大约”或“近似”位于该值或范围的数值之前。
还应当理解,在不脱离下面的权利要求所表示的本发明的范围的情况下,本领域技术人员可以进行关于已经为了解释本发明的性质而描述及说明的部分的细节、材料和布局的各种改变。
应当理解,本文所阐明的示例性方法的步骤并不一定需要按照所描述的顺序来执行,并且关于此类方法的步骤的顺序应当被理解为只是示例性的。例如,管道112能够在丝线键合之后安装,和/或金属段塞124能够在模制之前安装。同样地,在此类方法中可以包括另加的步骤,并且在与本发明的各种实施例一致的方法中可以省略或组合某些步骤。
尽管在下面的方法的权利要求中的要件(若存在)是按照具有相应标签的特定顺序来叙述的,但是除非这些权利要求的叙述另外暗示着用于实现那些要件中的一些或全部要件的特定顺序,否则那些要件并不一定意指限定于按照该特定顺序来实现。
Claims (18)
1.一种封装半导体器件,包含:
集成电路IC管芯;
具有安装于所述IC管芯的表面上的第一端部以及远离所述IC管芯的所述表面而延伸的第二端部的管道;以及
填充所述管道的传导材料,其中所述传导材料将来自所述IC管芯的热量移到所述封装半导体器件的外部。
2.根据权利要求1所述的封装半导体器件,其中所述管道由柔性的软材料制成。
3.根据权利要求2所述的封装半导体器件,所述管道包含橡胶和硅酮中的一种或多种。
4.根据权利要求1所述的封装半导体器件,其中所述管道是基本上圆柱形的。
5.根据权利要求1所述的封装半导体器件,其中所述管道基本上垂直于所述IC管芯的所述表面。
6.根据权利要求1所述的封装半导体器件,还包含用于将所述传导材料固定于所述IC管芯的所述表面的粘合剂。
7.根据权利要求6所述的封装半导体器件,其中所述传导材料包含金属粒子,并且所述粘合剂与所述金属粒子混合。
8.根据权利要求1所述的封装半导体器件,还包含:
一个或多个附加管道,每个附加管道都包含安装于所述IC管芯的表面上的第一端部以及远离所述IC管芯的所述表面而延伸的第二端部;以及
用于填充所述附加管道的附加传导材料。
9.根据权利要求1所述的封装半导体器件,还包含模制化合物,所述模制化合物包封:(i)所述管道的外周,而不覆盖所述管道的所述第二端部;以及(ii)所述IC管芯的所述表面的至少一部分。
10.一种封装半导体器件,包含:
集成电路IC管芯;
具有安装于所述IC管芯的表面上的第一端部以及远离所述IC管芯的所述表面而延伸的第二端部的柔性软管;
填充所述管道的热传导材料,其中所述传导材料将来自所述IC管芯的热量移到所述封装半导体器件的外部;
将所述传导材料固定于所述IC管芯的所述表面的粘合剂;以及
模制化合物,所述模制化合物包封:(i)所述管道的外周,而不覆盖所述管道的所述第二端部;以及(ii)所述IC管芯的所述表面的至少一部分。
11.根据权利要求10所述的封装半导体器件,其中所述传导材料包含金属粒子,并且所述粘合剂与所述金属粒子混合。
12.一种用于组装封装的半导体器件的方法,所述方法包括:
(a)将管道的第一端部安装到IC管芯的表面上,使得所述管道的第二端部远离所述表面而延伸;以及
(b)以热传导材料填充所述管道,其中所述热传导材料将来自所述管芯的热量移到所述封装的半导体器件的外部。
13.根据权利要求12所述的方法,其中所述管道由柔性的软材料制成。
14.根据权利要求13所述的方法,所述管道包含橡胶和硅酮中的一种或多种。
15.根据权利要求12所述的方法,其中:
步骤(a)还包括将附加管道的第一端部安装于所述IC管芯的所述表面上,使得所述附加管道的第二端部远离所述表面而延伸;以及
步骤(b)还包括以附加的热传导材料来填充所述附加管道。
16.根据权利要求12所述的方法,其中所述管道是基本上圆柱形的并且垂直于所述管芯表面。
17.根据权利要求12所述的方法,其中步骤(b)包括:
将所述热传导材料与粘合剂结合,使得所述热传导材料贴附于所述IC管芯的所述表面。
18.根据权利要求12所述的方法,还包含以模制化合物来包封:(i)所述管道的外周,而不覆盖所述管道的所述第二端部;以及(ii)所述IC管芯的所述表面的至少一部分。
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US7280572B2 (en) | 2002-03-25 | 2007-10-09 | Sanyo Electric Co., Ltd. | Semiconductor laser beam device |
US6654248B1 (en) | 2002-10-25 | 2003-11-25 | Lsi Logic Corporation | Top gated heat dissipation |
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US20090059537A1 (en) * | 2007-08-30 | 2009-03-05 | International Business Machines Corporation | Optimization of electronic package geometry for thermal dissipation |
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