CN105257994A - Method for improving luminous efficacy of optical engine - Google Patents
Method for improving luminous efficacy of optical engine Download PDFInfo
- Publication number
- CN105257994A CN105257994A CN201510784903.8A CN201510784903A CN105257994A CN 105257994 A CN105257994 A CN 105257994A CN 201510784903 A CN201510784903 A CN 201510784903A CN 105257994 A CN105257994 A CN 105257994A
- Authority
- CN
- China
- Prior art keywords
- led
- silica gel
- led chip
- aluminium base
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
- F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a method for improving luminous efficacy of an optical engine. The optical engine comprises an aluminum substrate, wherein a plurality of LED (Light-Emitting Diode) chips, an AC (Alternating Current) input N bonding pad and an AC input L bonding pad are arranged on the aluminum substrate; the optical engine further comprises an LED current control chip and an SMD component, and the SMD (Surface Mount Device) component 5 is arranged on the aluminum substrate through SMT (Surface Mounted Technology); the integrity of the LED chips and a driver is realized; a plurality of copper tubes are embedded in the aluminum substrate; the copper tubes are filled with heat-conduction silica gel; and heat generated by the LED chips is rapidly transferred to the aluminum substrate through the heat-conduction silica gel. After the LED chips are subjected to a die bonding process on a silica gel surface, a layer of large-particle and high-gloss fluorescent powder is sprayed on the surface of each LED chip; and lens-shaped high-transparency packaging silica gel is dispensed on the surface of each layer of fluorescent powder. By adopting the method, an effect of fast heat dissipation is realized; and the reliability of the LED chips is improved. The emergent light angle is enlarged, so that the luminous efficacy of the optical engine is further improved. The LED chips and the driver are integrated, so that an assembly technological step is omitted, and the production efficiency is improved.
Description
Technical field
The present invention relates to photo engine, specifically relate to the method improving LED light engine light efficiency.
Background technology
Namely LED light engine comprises the entire combination of LED element or LED array module, LED driver and other luminosity, calorifics, machinery and electrical equipment, and this is combined through an ordinary connector mated with LED lamp and is directly connected on branch circuit.Therefore LED light engine is a device between LED lamp and LED, although the present stage development of LED light engine product is not synchronous with the explosive growth of LED illumination, but its normalized design and application in the industry cycle obtains accreditation and is constantly deep ploughing, the modularization thinking that LED light engine is brought simultaneously is constantly propagated between each producer, will obtain general accreditation in LED illumination industry.
Luminous intensity distribution and the heat sinking function can with setting with the identical point of LED lamp.This product effectively can improve the stability of LED indoor light fixture, improves each performance parameter (as colour rendering, system light efficiency etc.)
The ratio of the total light flux that light source sends and the electrical power (watt) that this light source consumes, is called the light efficiency of this light source.Luminous efficiency value is higher, and show that electric energy conversion is that the ability of luminous energy is stronger by illuminating equipment, namely when providing equivalent brightness, the energy saving of this illuminating equipment is stronger; Under Same Efficieney, the illumination of this illuminating equipment is stronger, and namely brightness is larger.
Improve overall light efficiency, this refers to the overall light efficiency comprising power-efficient, certainly for the light transmittance that yet should comprise lampshade whole lamp.And for example colour temperature, colour rendering index, and also may reduce power consumption when same luminous flux, energy-conservation further.
At present, the light efficiency of LED light engine is unsatisfactory.
In order to reduce parts number, the simplest method uses linear power supply instead, and usual linear power supply only has 5-6 element, so just can greatly reduce shared area.Current photo engine great majority are on the market all the Linear CCSs adopting no electrolytic capacitor, and the shortcoming of this scheme is the same with all common linear power supplies, and its efficiency only has 84%-93%, and line voltage more high efficiency is lower.But also only allowing line voltage change to be less than in 20% scope, total forward voltage of LED strip also must in 10% scope of design load, otherwise efficiency can become very low.In addition the light efficiency utilization rate of LED also only has 70-90%.
When power supply and lamp plate are put together time, the power that power supply consumes also can become heat and be added on lamp plate, although the heat of power supply itself also will be gone out by heat sink radiates, but power supply is put into more than lamp plate and will increases the heat left needed for lamp plate, and lamp plate has to pass through the insulating barrier of aluminium base itself and the insulating barrier between aluminium base and radiator to radiator, the thermal resistance of this dielectric layers increases the heat radiation difficulty of aluminium base, this part heat will increase the junction temperature of LED, reduces its life-span.
Summary of the invention
The technical problem that the present invention solves: the present invention seeks to a kind of method improving LED light engine light efficiency.
Technical scheme: a kind of method improving photo engine light efficiency, this photo engine comprise some LED chip aluminium base are equipped with, AC inputs N pad, AC inputs L pad, also comprise LED current control chip, SMD components 5SMT paster on aluminium base, realize LED chip integrated with driver, the embedded some copper pipes of described aluminium base, fill heat conductive silica gel in copper pipe, the heat that LED chip produces is delivered to rapidly on aluminium base by heat conductive silica gel, realizes quick heat radiating effect.
LED chip completes after the die bond technique of silica gel face, is coated with the fluorescent material of one deck bulky grain, high briliancy on LED chip surface, to improve LED light effect; And the packaging silicon rubber of high transmission rate at phosphor surface point lens-shape, increase rising angle, improve light efficiency.
Encapsulated reflecting cup in described LED chip, reflector inside is silver-plated.
Beneficial effect of the present invention:
1, the embedded copper pipe of aluminium base of the present invention, and fill heat conductive silica gel to copper pipe inside, LED chip die bond technique is carried out at heat conductive silica gel and aluminium base flush, the heat that LED chip produces is delivered to rapidly on aluminium base by heat conductive silica gel, thus realize the effect of quick heat radiating, improve the reliability of LED chip.
2, LED chip of the present invention completes after the die bond technique of silica gel face, will be coated with the fluorescent material of one deck bulky grain, high briliancy, to improve LED light effect on LED chip surface; And the packaging silicon rubber of high transmission rate at phosphor surface point lens-shape, increase rising angle, improve light efficiency further.
3, the components and parts of the LED driver part such as LED current control chip of the present invention, resistance, electric capacity all SMT paster on aluminium base, realize LED chip integrated with driver, save assembly technology link, enhance productivity.
4, the reflector of microcosmic of the present invention is encapsulated in LED chip place, and reflector inside is silver-plated, and silvered reflective layer reflection efficiency, up to 95%, can improve photo engine light efficiency to a great extent.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
Fig. 2 is that one of them LED chip of the present invention and reflector are loaded in aluminium base and analyse and observe key diagram.
Label represents: 1LED chip, 2 silica gel and phosphor powder layer, 3 aluminium bases, 4LED Current Control chip, 5 SMD components, and 6AC inputs N pad, the silver-plated rete of 7 high reverse--bias, 8 reflectors, 9 copper pipes, and 10AC inputs L pad.
Detailed description of the invention
Below in conjunction with accompanying drawing, the present invention is further described.
A kind of method improving photo engine light efficiency, this photo engine comprise some LED chip 1 aluminium base 3 are equipped with, AC inputs N pad 6, AC inputs L pad 10, also comprise LED current control chip 4, SMD components 5SMT paster on aluminium base 3, realize LED chip integrated with driver.The embedded some copper pipes 9 of described aluminium base 3, fill heat conductive silica gel in copper pipe 9, and the heat that LED chip produces is delivered to rapidly on aluminium base by heat conductive silica gel, realizes quick heat radiating effect.
SMT refers to and adopts surface mounting technology LED current control chip 4, SMD components 5 to be loaded on aluminium base 3.
LED chip completes after the die bond technique of silica gel face, is coated with the fluorescent material of one deck bulky grain, high briliancy on LED chip 1 surface, to improve LED light effect; And the packaging silicon rubber of high transmission rate at phosphor surface point lens-shape, increase rising angle, improve light efficiency.
Encapsulated reflecting cup 8 in described LED chip 1, reflector inside is silver-plated.
Product of the present invention each LED light source part comprises: aluminium base flaggy, circuit layer, white oil layer, packaging silicon rubber layer, phosphor powder layer, copper pipe layer, thermal grease layer.The embedded copper pipe of aluminium base of the present invention, and fill heat conductive silica gel to copper pipe inside, LED chip die bond technique is carried out at heat conductive silica gel and aluminium base flush, the heat that LED chip produces is delivered to rapidly on aluminium base by heat conductive silica gel, thus realize the effect of quick heat radiating, improve the reliability of LED chip.LED chip completes after the die bond technique of silica gel face, encapsulates the reflector of a microcosmic at LED chip place, and this reflector inside is silver-plated, and reflector efficiency, up to 95%, can improve photo engine light efficiency to a great extent.Finally to be coated with the fluorescent material of one deck bulky grain, high briliancy on LED chip surface, to improve LED light effect; And the packaging silicon rubber of high transmission rate at phosphor surface point lens-shape, increase rising angle, improve light efficiency further.
The present invention is only limitted to absolutely not these examples.The foregoing is only the good embodiment of the present invention, only for describing the present invention, the restriction to scope of the present invention can not be interpreted as.It should be pointed out that all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (2)
1. one kind is improved the method for photo engine light efficiency, this photo engine comprise some LED chip aluminium base are equipped with, AC inputs N pad, AC inputs L pad, also comprise LED current control chip, SMD components SMT paster on aluminium base, realize LED chip integrated with driver, it is characterized in that: the embedded some copper pipes of described aluminium base, fill heat conductive silica gel in copper pipe, the heat that LED chip produces is delivered to rapidly on aluminium base by heat conductive silica gel, realizes quick heat radiating effect;
LED chip completes after the die bond technique of silica gel face, is coated with the fluorescent material of one deck bulky grain, high briliancy on LED chip surface, to improve LED light effect; And the packaging silicon rubber of high transmission rate at phosphor surface point lens-shape, increase rising angle, improve light efficiency.
2. a kind of method improving photo engine light efficiency according to claim 1, it is characterized in that: encapsulated reflecting cup in described LED chip, reflector inside is silver-plated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510784903.8A CN105257994A (en) | 2015-11-16 | 2015-11-16 | Method for improving luminous efficacy of optical engine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510784903.8A CN105257994A (en) | 2015-11-16 | 2015-11-16 | Method for improving luminous efficacy of optical engine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105257994A true CN105257994A (en) | 2016-01-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510784903.8A Pending CN105257994A (en) | 2015-11-16 | 2015-11-16 | Method for improving luminous efficacy of optical engine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105257994A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106641764A (en) * | 2017-02-27 | 2017-05-10 | 宁波亚茂光电股份有限公司 | LED equipment |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201757305U (en) * | 2010-07-22 | 2011-03-09 | 宁波升谱光电半导体有限公司 | LED lamp |
| CN102135248A (en) * | 2011-01-23 | 2011-07-27 | 符建 | Liquid metal heat dissipation-based high-power LED (Light Emitting Diode) light source with threaded connection structure |
| CN102980090A (en) * | 2011-09-07 | 2013-03-20 | 王元成 | Light-emitting diode (LED) street lamp |
| CN103247743A (en) * | 2013-05-24 | 2013-08-14 | 安徽三安光电有限公司 | Veneering type lighting device and manufacturing method thereof |
| CN103311410A (en) * | 2013-06-13 | 2013-09-18 | 苏州金科信汇光电科技有限公司 | Integrated LED with high thermal conductivity and high breakdown voltage |
| CN204141395U (en) * | 2014-09-28 | 2015-02-04 | 绵阳弘业照明电器有限公司 | A kind of LED wall wash lamp |
| CN204611421U (en) * | 2015-04-17 | 2015-09-02 | 重庆新天阳照明科技股份有限公司 | A kind of LED lamp tube based on AC-SMT encapsulation |
-
2015
- 2015-11-16 CN CN201510784903.8A patent/CN105257994A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201757305U (en) * | 2010-07-22 | 2011-03-09 | 宁波升谱光电半导体有限公司 | LED lamp |
| CN102135248A (en) * | 2011-01-23 | 2011-07-27 | 符建 | Liquid metal heat dissipation-based high-power LED (Light Emitting Diode) light source with threaded connection structure |
| CN102980090A (en) * | 2011-09-07 | 2013-03-20 | 王元成 | Light-emitting diode (LED) street lamp |
| CN103247743A (en) * | 2013-05-24 | 2013-08-14 | 安徽三安光电有限公司 | Veneering type lighting device and manufacturing method thereof |
| CN103311410A (en) * | 2013-06-13 | 2013-09-18 | 苏州金科信汇光电科技有限公司 | Integrated LED with high thermal conductivity and high breakdown voltage |
| CN204141395U (en) * | 2014-09-28 | 2015-02-04 | 绵阳弘业照明电器有限公司 | A kind of LED wall wash lamp |
| CN204611421U (en) * | 2015-04-17 | 2015-09-02 | 重庆新天阳照明科技股份有限公司 | A kind of LED lamp tube based on AC-SMT encapsulation |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106641764A (en) * | 2017-02-27 | 2017-05-10 | 宁波亚茂光电股份有限公司 | LED equipment |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160120 |