CN105246019A - Welding process for flexible circuit board and loudspeaker module - Google Patents
Welding process for flexible circuit board and loudspeaker module Download PDFInfo
- Publication number
- CN105246019A CN105246019A CN201510724804.0A CN201510724804A CN105246019A CN 105246019 A CN105246019 A CN 105246019A CN 201510724804 A CN201510724804 A CN 201510724804A CN 105246019 A CN105246019 A CN 105246019A
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- circuit board
- welding
- flexible circuit
- loud speaker
- speaker module
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Abstract
The invention discloses a welding process for a flexible circuit board and a loudspeaker module. An external bonding pad for being connected to an external circuit is arranged on the loudspeaker module; a circuit board bonding pad connected with the external bonding pad is arranged on the flexible circuit board; and the external bonding pad and the circuit board bonding pad are welded and fixed through laser. The welding process comprises the following steps: pre-supplying tin to the circuit board bonding pad; fixing the flexible circuit board with the loudspeaker module, such that the external bonding pad and the circuit board bonding pad are aligned accurately; laminating the flexible circuit board with the loudspeaker module through a laminating tooling; and adjusting a welding spot parameter, and completing welding and fixing between the external bonding pad and the circuit board bonding pad through a laser welding machine. By means of the welding process for the flexible circuit board and the loudspeaker module disclosed by the invention, on one hand, the welding effect and the welding stability can be increased; the welding yield can be ensured; on the other hand, manpower and time costs can be reduced; and furthermore, automatic batch welding production can be facilitated.
Description
Technical field
The present invention relates to electroacoustic field, be specifically related to the welding procedure of a kind of flexible circuit board and loud speaker module.
Background technology
Loud speaker is a kind of can be the device of acoustic energy by electric energy conversion, and be the most basic phonation unit, it is widely used in the terminal installation such as mobile phone, computer, PDA, MP3.Under normal circumstances, loudspeaker monomer collecting is fixed in external shell, jointly forms loud speaker module with external shell, and is positioned within the reserved assembly space of terminal equipment, completes the assembly with terminal installation, is convenient to miniaturized loudspeaker box structure.Under this group mode, loud speaker module is often provided with the external pad for connecting external circuit, and be electrically connected with external circuit due to flexible circuit board (FPCB), therefore, external pad on loud speaker module needs to complete with the pad in flexible circuit board to be electrically connected, the current signal of such guarantee external circuit is passed to loud speaker module internal smoothly, makes it normally work.
Under normal circumstances, pad solder in loud speaker module and flexible circuit board is fixed, along with electron trade and scientific and technical development and progress, requirement for the two welding is also more and more higher, welding process in existing technique generally comprises three steps, namely flexible circuit board and module fix-are coated with solder(ing) paste-tin soldering machine and solidify, and this kind of technological process easily exists following problem in actual production: the first, and welding stability is poor; Existing technique is adopted to weld, the application place of tin cream with highly all cannot ensure good consistency, simultaneously, be manual operation when using tin soldering machine to weld, high requirement is had with the consummate degree of operation to the gimmick of operator, the operant level of operator can directly affect welding yield, not easily management and control; The second, operating efficiency is low; Adopt existing technique to need applying solder paste, and the cycle of this operation is longer, uses tin soldering machine also longer for manual man-hour, if solder joint is more, then also need to carry out flip horizontal adjustment to the welding direction of different solder joint, directly cause welding efficiency low.
Summary of the invention
Technical problem to be solved by this invention is: by the adjustment of existing welding procedure and improvement, optimize flexible circuit board and the welding process of loud speaker module, improve welding effect, improve and weld yield, enhance productivity simultaneously.
To achieve these goals, the present invention by the following technical solutions: the welding procedure of a kind of flexible circuit board and loud speaker module, described loud speaker module is provided with the external pad for connecting external circuit; Described flexible circuit board is provided with the circuit pads be connected with described external pad, wherein, described external pad and described circuit pads are fixed by laser welding, comprising:
(1) tin process is mended in advance to described circuit pads;
(2) described flexible circuit board and described loud speaker module are fixed, make described external pad and described circuit pads accurate contraposition;
(3) by press against frock by described flexible circuit board and the pressing of described loud speaker module;
(4) adjust solder joint parameter, complete being welded and fixed of described external pad and described circuit pads by laser-beam welding machine.
Improve as one, described flexible circuit board and described loud speaker module bond fixing by colloid.
Improve as one, described flexible circuit board and described loud speaker module are respectively arranged with location hole and the reference column matched; Described flexible circuit board coordinates fixing with described loud speaker module by described location hole in described reference column.
Improve as one, described in press against frock described external pad and described circuit pads fitted tightly.
Improve as one, described solder joint is one or more.
Improve as one, when described solder joint is multiple, need regulate one by one the parameter of described multiple solder joint, utilize laser-beam welding machine spot welding respectively.
Compared to existing technique, the invention provides a kind of technological process of laser welding, in conjunction with press against frock pressing, and increase the pre-benefit tin process of flexible circuit board, some optimization following can be realized: one, increases the pre-benefit tin process of flexible circuit board, be equivalent to preposition for existing applying solder paste operation, as the first step in welding process, the stability of flexible circuit board pad tin layers height can be improved, thus improve stability and the welding yield of welding; Its two, use the method welding flexible circuit board and loud speaker module of laser welding in the present invention, because compole during laser welding itself is short, the time of manual welding in existing technique can be saved, thus enhance productivity, save time and human cost; Its three, laser welding stability is higher, in conjunction with the use that press against frock, can realize the effective management and control to welding yield, improve further the stability of welding.
Accompanying drawing explanation
Fig. 1 is the FB(flow block) of flexible circuit board of the present invention and loud speaker module welding procedure;
Fig. 2 is the schematic diagram of step I in Fig. 1;
Fig. 3 is the schematic diagram of Step II in Fig. 1;
Fig. 4 is the schematic diagram of Step II I in Fig. 1;
Fig. 5 is the schematic diagram of step IV in Fig. 1;
Reference numeral wherein comprises: 1, flexible circuit board, and 11, tin point, 2, loud speaker module, 21, reference column, 3, module fixing tool, 4, dispensing needle head, 5, press against frock, 6, laser head.
Embodiment
Below in conjunction with accompanying drawing, describe content of the present invention in detail:
Embodiment:
Typically, in order to complete the transmission of current signal to loud speaker module internal of external circuit, loud speaker module is provided with the external pad connecting external circuit, and correspondence, flexible circuit board is then provided with the circuit pads be electrically connected with above-mentioned external pad, flexible circuit board is connected with external circuit simultaneously, can realize current signal transmission from outside to inside by the electrical connection of circuit pads and external pad.Consult shown in Fig. 1, in the present invention, flexible circuit board 1 and the welding procedure of loud speaker module 2, add the pre-benefit tin treatment process of flexible circuit board, and combine the use that press against frock, fetched eventually through Laser Welding, it specifically comprises following four steps:
First, tin process is mended in advance to circuit pads;
Secondly, flexible circuit board and loud speaker module are fixed, makes external pad and circuit pads accurate contraposition;
Again, by press against frock by flexible circuit board and the pressing of loud speaker module;
Finally, adjustment solder joint parameter, completes being welded and fixed of external pad and circuit pads by laser-beam welding machine.
As can be seen from above-mentioned technique, the present invention adds the pre-benefit tin process of flexible circuit board in the welding procedure of flexible circuit board and loud speaker module, be equivalent to preposition for existing applying solder paste operation, as the first step in welding process, the stability of flexible circuit board pad tin layers height can be improved, thus improve stability and the welding yield of welding; In addition, method welding flexible circuit board and the loud speaker module of laser welding is used in the present invention, because compole during laser welding itself is short, the time of manual welding in existing technique can be saved, thus enhance productivity, save time and human cost, and laser welding stability is higher, in conjunction with the use that press against frock, the effective management and control to welding yield can be realized.Elaborate below in conjunction with accompanying drawing each step to welding procedure of the present invention:
Particularly, consult shown in Fig. 2, need in this operation to mend tin process in advance to the circuit pads in flexible circuit board 1 emphatically, that is, first to the circuit pads applying solder paste in flexible circuit board 1.Solder(ing) paste described herein, be a kind of Novel welding material arisen at the historic moment along with SMT, the paste mixture normally mixed by solder powder, scaling powder and other surfactant, thixotropic agent etc., can be used for the welding of electronic devices and components.During enforcement, can directly at the hollowed-out board surface brush tin corresponding with circuit pads, then through hot blast solidification, in Fig. 2 label be 11 structure be the signal of the tin point that said process is formed.Certainly, the number of solder joint can be one or more, is preferably at least two.It should be noted that, carry out in the processing procedure of applying solder paste in this operation to circuit pads, the clean of circuit pads should be kept as far as possible, circuit pads also will be prevented to be oxidized simultaneously, prevent the situation causing solder(ing) paste application difficulties because it is dirty from occurring.
Consult shown in Fig. 3, this operation is mainly fixed flexible circuit board 1 and loud speaker module 2, specifically comprises two kinds of fixed forms, and these two kinds of fixed forms exist simultaneously.Specifically, first loud speaker module 2 can be positioned on module fixing tool 3, make loud speaker module 2 can be relatively fixing, be convenient to carry out a glue operation to it, then point gum machine is utilized to carry out a glue process to loud speaker module 2, particular by dispensing needle head 4 pairs of loud speaker modules 2 of point gum machine and the location point glue contacted of flexible circuit board 1, on the one hand, flexible circuit board 1 is fixed by colloid and loud speaker module 2, simultaneously, owing to loud speaker module 2 being provided with usually the reference column 21 for locating, and flexible circuit board 1 can be mated be provided with location hole, the two can be coordinated with location hole by reference column 21 locates, certainly, in this course, should guarantee that the circuit pads in flexible circuit board 1 and the external pad on loud speaker module 2 can accurate contrapositions, to improve the yield of welding, prevent from causing the situation of failure welding to occur because of the skew of two pad locations.
Consult shown in Fig. 4, the main purpose of this operation is the flexible circuit board 1 and loud speaker module 2 pressing further that fix having bondd in foregoing sequence, particularly, first the flexible circuit board 1 bondd being positioned over loud speaker module 2 press against in frock 5, specifically should be placed in position immediately below the pressure head that press against frock 5, pressing effect can be ensured like this.When the pressure head that press against frock 5 starts to apply downward pressure, flexible circuit board 1 and loud speaker module 2 can press together closely under above-mentioned pressure, the main purpose done like this ensures that circuit pads can directly contact with external pad, for follow-up spot welding process is ready.In the process, in order to ensure the laminating degree of circuit pads and external pad, after carrying out one step press operation, can verify, if pressing degree is not high, can continue to repeat stitching operation, till the two can fit tightly.
After completing above-mentioned stitching operation, flexible circuit board 1 and loud speaker module 2 are not taken off from press against frock 5, but keep the fixing and assembled state after above-mentioned pressing, whole frock 5 entirety that press against is positioned on the base of laser-beam welding machine, prepares to carry out laser welding process.Certainly, in order to ensure welding effect, should guarantee to press against the smooth of frock 5 placement as far as possible, deflection not occurring.
Consult shown in Fig. 5, this operation is laser welding operation, after aforementioned all process steps completes, just needs to carry out laser welding process to circuit pads and external pad.Because product comprises two even multiple solder joints, therefore need to carry out one by one for the design parameter of each solder joint on laser-beam welding machine, independent adjustment, after often adjusting the parameter of a complete solder joint, the laser head 6 of laser-beam welding machine can be utilized to aim at bond pad locations and to carry out spot welding; Point postwelding, can carry out judgement according to the effect of welding and revise further, just can carry out the soldering of batch when obtaining good welding effect in this condition.It should be noted that, operation cycle of laser welding operation itself is shorter, and stability is higher, can save time and human cost while guarantee welding effect, but, need the contraposition of circuit pads and external pad very accurate in this process, be preferably within the focusing range of laser beam, that is, in foregoing sequence, the operations such as the contraposition of the two and the smooth placement be even included on laser welder base of fitting should be more careful, to guarantee final effect and the quality of welding.
It should be noted that, relate in accompanying drawing of the present invention pressing tool, module fixing tool, dispensing needle head, the first-class equipment of laser structure be only used to illustrate the technical program and the schematic structure that illustrates, the not entire infrastructure of its entirety, but the concrete shape of the said equipment, structure and size etc. do not form restriction of the present invention.
These are only the invention process case, be not limited to the present invention, as long as those of ordinary skill in the art modify or change according to the equivalence that disclosed content is done, all should include in the protection range recorded in claims.
Claims (6)
1. a welding procedure for flexible circuit board and loud speaker module, described loud speaker module is provided with the external pad for connecting external circuit; Described flexible circuit board is provided with the circuit pads be connected with described external pad, it is characterized in that: described external pad and described circuit pads are fixed by laser welding, comprising:
(1) tin process is mended in advance to described circuit pads;
(2) described flexible circuit board and described loud speaker module are fixed, make described external pad and described circuit pads accurate contraposition;
(3) by press against frock by described flexible circuit board and the pressing of described loud speaker module;
(4) adjust solder joint parameter, complete being welded and fixed of described external pad and described circuit pads by laser-beam welding machine.
2. welding procedure according to claim 1, is characterized in that: described flexible circuit board and described loud speaker module bond fixing by colloid.
3. welding procedure according to claim 1, is characterized in that: described flexible circuit board and described loud speaker module are respectively arranged with location hole and the reference column matched; Described flexible circuit board coordinates fixing with described loud speaker module by described location hole in described reference column.
4. welding procedure according to claim 1, is characterized in that: described in press against frock described external pad and described circuit pads fitted tightly.
5. welding procedure according to claim 1, is characterized in that: described solder joint is one or more.
6. welding procedure according to claim 5, is characterized in that: when described solder joint is multiple, need regulate one by one the parameter of described multiple solder joint, utilizes laser-beam welding machine spot welding respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510724804.0A CN105246019A (en) | 2015-10-29 | 2015-10-29 | Welding process for flexible circuit board and loudspeaker module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510724804.0A CN105246019A (en) | 2015-10-29 | 2015-10-29 | Welding process for flexible circuit board and loudspeaker module |
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| Publication Number | Publication Date |
|---|---|
| CN105246019A true CN105246019A (en) | 2016-01-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510724804.0A Pending CN105246019A (en) | 2015-10-29 | 2015-10-29 | Welding process for flexible circuit board and loudspeaker module |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113056114A (en) * | 2019-12-26 | 2021-06-29 | 东莞新能德科技有限公司 | Electronic circuit board and battery |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080023214A1 (en) * | 2006-07-28 | 2008-01-31 | Hon Hai Precision Ind. Co., Ltd. | Flexible printed circuit cable and method of soldering the same to a printed circuit board |
| CN101118992A (en) * | 2007-07-26 | 2008-02-06 | 友达光电股份有限公司 | Electric connection device, electronic device and electric product including the same |
| CN102581488A (en) * | 2012-02-27 | 2012-07-18 | 武汉凌云光电科技有限责任公司 | Laser soldering method and precise fast fixture of multi-core shielding cable and PCB (Printed Circuit Board) |
| CN104439587A (en) * | 2014-07-25 | 2015-03-25 | 乐辉 | Laser welding method |
-
2015
- 2015-10-29 CN CN201510724804.0A patent/CN105246019A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080023214A1 (en) * | 2006-07-28 | 2008-01-31 | Hon Hai Precision Ind. Co., Ltd. | Flexible printed circuit cable and method of soldering the same to a printed circuit board |
| CN101118992A (en) * | 2007-07-26 | 2008-02-06 | 友达光电股份有限公司 | Electric connection device, electronic device and electric product including the same |
| CN102581488A (en) * | 2012-02-27 | 2012-07-18 | 武汉凌云光电科技有限责任公司 | Laser soldering method and precise fast fixture of multi-core shielding cable and PCB (Printed Circuit Board) |
| CN104439587A (en) * | 2014-07-25 | 2015-03-25 | 乐辉 | Laser welding method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113056114A (en) * | 2019-12-26 | 2021-06-29 | 东莞新能德科技有限公司 | Electronic circuit board and battery |
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| C06 | Publication | ||
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| CB02 | Change of applicant information |
Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Applicant after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Applicant before: Goertek Inc. |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160113 |
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| RJ01 | Rejection of invention patent application after publication |