CN209857841U - Strain detection sensing module, deformation detection device and electronic equipment - Google Patents
Strain detection sensing module, deformation detection device and electronic equipment Download PDFInfo
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- CN209857841U CN209857841U CN201920819008.9U CN201920819008U CN209857841U CN 209857841 U CN209857841 U CN 209857841U CN 201920819008 U CN201920819008 U CN 201920819008U CN 209857841 U CN209857841 U CN 209857841U
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Abstract
The utility model provides a strain detection sensing module, a deformation detection device and electronic equipment, wherein the module comprises a substrate, a strain detection sensor, a connecting piece, a transmission piece and a welding layer; the substrate comprises a first side and a second side; the strain detection sensor is arranged on the first side and used for generating a detection signal according to a strain signal conducted to the strain detection sensor from the outside; the transmission piece is arranged on the first side, is connected with the strain detection sensor through the connecting piece and is used for leading out the detection signal; the welding layer is attached to the second side and coupled with the transmission piece, and is used for outputting the detection signal derived by the transmission piece. Therefore, the problem that deformation detection equipment in the prior art is complex in structure and difficult to popularize can be effectively solved; meanwhile, due to the structural improvement, non-professionals can conveniently finish the installation and the application of the deformation detection equipment, and the application efficiency of the deformation detection equipment is greatly improved.
Description
Technical Field
The utility model relates to a pressure sensing detection area indicates a strain detection sensing module, deformation detection device and electronic equipment especially.
Background
At present, the main operation of electronic equipment such as portable mobile phones and tablet computers existing in the market is completed through a touch screen. Touch screens are becoming more and more popular because of their ease of operation and lower cost, and they have the unique advantage of helping users achieve the same operational objectives without having to frequently move a mouse and tap a keyboard. The touch screen generally includes a touch panel, a touch response component, a touch control system, a driver, and the like. The touch response assembly mainly adopts technical schemes including resistive type, capacitive type, infrared type, surface acoustic wave type and the like, and the technical schemes have a common disadvantage except the limitation of self-generated technology, namely that the technical schemes are generally in a plane structure or a plane-like structure, and simultaneously have limitation on materials, for example, the capacitive technology cannot be compatible with metal materials, and the resistive technology cannot be compatible with harder materials.
With the development and progress of technologies, touch devices and touch screens that can determine a deformation position have appeared, such as a commonly used capacitive screen; the deformation condition of the contact is mainly determined by the capacitance or resistance change value of the contact, and the contact has the advantages of more complex structure, higher cost, more complex manufacture and more thickness limitation; however, the requirements of space, cost, manufacture and the like are very strict when the current portable equipment is designed, so that the equipment has strong limitation and higher cost when being applied; meanwhile, the installation and application of related sensors are complicated, the requirement on workers is high, and the efficiency is low in the large-scale production process.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a strain detection sensing module, deformation detection device and electronic equipment to this problem that deformation detection equipment structure is complicated to be difficult to promote among the solution prior art.
In order to achieve the above object, the strain detection sensing module provided by the present invention specifically comprises a substrate, a strain detection sensor, a connecting member, a transmission member, and an output end; the substrate comprises a first side and a second side; the strain detection sensor is arranged on the first side and used for generating a detection signal according to a strain signal conducted to the strain detection sensor from the outside; the transmission piece is arranged on the first side, is connected with the strain detection sensor through the connecting piece and is used for leading out the detection signal; the output end is attached to the second side and coupled with the transmission piece, and is used for outputting the detection signal led out by the transmission piece.
In the above strain detection sensor module, preferably, the strain detection sensor is attached to the first side of the substrate through a glue.
In the strain detection sensing module, preferably, the transmission member is a solder paste and/or a solder joint.
In the strain detection sensing module, preferably, the substrate is a strain conductive carrier; the substrate comprises an FR4 board, an FPC board with a back reinforcing board and a ceramic substrate.
In the strain detection sensing module, preferably, the connecting member includes a copper wire, a silver-plated wire, an aluminum wire, a resistor, and a pad.
In the above strain detection sensor module, preferably, the output end is further configured to conduct an externally generated strain signal to the substrate.
The utility model also provides a deformation detection device suitable for above-mentioned strain detection sensing module, deformation detection device still contains control circuit board, control circuit board with the output meets, be used for with the detected signal conversion is the signal of telecommunication.
In the above deformation detecting device, preferably, the control circuit board is further configured to generate a strain signal according to external deformation.
The utility model also provides an electronic equipment suitable for the deformation detection device, which comprises a substrate, a processing module and one or more deformation detection devices; the substrate comprises a third side and a fourth side, wherein the third side is used for generating a strain signal according to external deformation; the other side, opposite to the output end, of the control circuit board of the deformation detection device is attached to the fourth side of the substrate and used for generating the electric signal according to the strain signal; and the processing module is coupled with the control circuit board and used for obtaining corresponding external deformation data according to the electric signals.
In the above electronic device, preferably, when the electronic device includes a plurality of deformation detection devices, the deformation detection devices form a diagonal half-bridge array or a full-bridge array.
Through the strain detection sensing module, the deformation detection device and the electronic equipment provided by the utility model, the problem that the deformation detection equipment in the prior art is complex in structure and difficult to popularize can be effectively solved; meanwhile, due to the structural improvement, non-professionals can conveniently finish the installation and the application of the deformation detection equipment, and the application efficiency of the deformation detection equipment is greatly improved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the principles of the invention. In the drawings:
fig. 1 is a schematic structural diagram of a strain detection sensing module according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a substrate according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a strain detection sensor according to an embodiment of the present invention;
fig. 4A to 4D are schematic views of a strain detection sensor package structure according to an embodiment of the present invention;
fig. 5A to 5C are schematic views of a strain detection sensor package structure according to an embodiment of the present invention;
fig. 6 is a schematic view of a strain detection sensor package structure according to an embodiment of the present invention;
fig. 7 is a schematic view of a strain detection sensor package structure according to an embodiment of the present invention;
fig. 8 is a schematic structural diagram of a deformation detection apparatus according to an embodiment of the present invention;
fig. 9 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.
Detailed Description
The following detailed description will be made with reference to the accompanying drawings and examples, so as to solve the technical problems by applying technical means to the present invention, and to fully understand and implement the technical effects of the present invention. It should be noted that, as long as no conflict is formed, the embodiments and the features in the embodiments of the present invention may be combined with each other, and the technical solutions formed are all within the scope of the present invention.
Additionally, the steps illustrated in the flow charts of the figures may be performed in a computer system such as a set of computer-executable instructions and, although a logical order is illustrated in the flow charts, in some cases, the steps illustrated or described may be performed in an order different than here.
Referring to fig. 1, the strain detection sensing module provided in the present invention specifically includes a substrate 101, a strain detection sensor 102, a connecting member 103, a transmission member 104, and an output end 105; the substrate 101 comprises a first side and a second side; the strain detection sensor 102 is disposed on the first side, and configured to generate a detection signal according to a strain signal conducted to the strain detection sensor 102 from the outside; the transmission piece 104 is arranged on the first side and connected with the strain detection sensor 102 through the connecting piece 103, and is used for exporting the detection signal; the output terminal 105 is attached to the second side and coupled to the transmission element 104, and is configured to output a detection signal derived by the transmission element 104. The strain signal may be an elastic wave signal or a signal generated by other deformations, which is not limited herein; the strain detection sensor can be a commonly used strain gauge; the first side and the second side are only used for convenience of illustration of the positions of the elements mounted on the substrate, and do not limit the substrate in any way, and one skilled in the art can select any surface of the substrate as the first side or the second side according to actual needs.
Referring to fig. 2 again, the first side of the substrate 201 specifically includes a top pad 201 of the control circuit board, and the transmission element is soldered to the top pad 201; a second side that specifically includes a control circuit board bottom pad 202; wherein the top layer bonding pad 201 is used for receiving a detection signal obtained by the detection of the strain detection sensor through a connecting piece and a transmission piece; it is worth to explain that the top layer pad 201 and the bottom layer pad 202 are conducted inside the substrate, so that the top layer pad 201 can be handed over to the bottom layer pad 202 after obtaining the detection signal, at the moment, the bottom layer pad 202 can be used as a signal output end of the strain detection sensor, and therefore through the structure, a worker can simply attach the strain detection sensor, and in actual work, the strain signal collection can be realized only by welding the bottom layer pad 202 of the substrate to a target control circuit board without performing traditional complicated operations such as wire alignment and the like. In this embodiment, the transport may be solder paste and/or solder joints; the substrate is a strain conduction carrier and can be a material structure with strain signal conduction property, such as FR4 board, FPC board with a back reinforcing board, ceramic substrate and the like; the transmission piece can comprise a signal transmission medium such as a copper wire, a silver-plated wire, an aluminum wire, a resistor, a bonding pad and the like.
Referring to fig. 3, in the above embodiment, the strain detecting sensor 301 may be attached to the first side of the substrate by using glue, but the strain detecting sensor may also be attached to the substrate by using other methods in actual work, which is not limited herein; referring to fig. 3 again, in practical operation, the signal output end of the strain detection sensor may be connected to the transmission element on the substrate through the top layer bonding pad 302 via a connection element to realize signal derivation of the strain detection sensor 301, of course, the signal output end of the strain detection sensor in fig. 3 is only for illustration purpose, and the specific position of the strain detection sensor in practical operation may be adjusted as appropriate, which is not limited herein.
The utility model discloses an in the embodiment, work as the basement passes through behind a control circuit board is located in the output subsides, when control circuit board pastes again and establishes external structure, the signal of meeting an emergency can be conducted extremely through external structure control circuit board passes again for the basement, consequently the output still can be used to with the signal of meeting an emergency conduction extremely that the outside generated the basement.
In the above embodiment, the strain detection sensing module may further include a protection medium, where the protection medium is used to encapsulate and protect each element on the first side of the substrate; the protective medium can be made of colloid, injection molding body and the like.
The following embodiments will further introduce the manufacturing method of the strain detection sensing module, so as to further overcome the defect that the conventional strain gauge can only be bonded by a colloid and cannot be produced in a welding manner, and greatly meet the requirement of consumer electronics mass production; the mode that the foil gage passes through the colloid and bonds, in consumer electronics batch production, has the low in production efficiency, problem with high costs, utilizes the utility model provides a structure and following packaging method can realize carrying out batch paster welding like paster electric capacity among the conventional electronic product, have greatly improved production efficiency, and reduce cost.
In practical operation, the packaging method of the strain detection sensing module mainly includes the following four steps: through screen printing, welding, spot welding and alignment and attachment; specifically, the method comprises the following steps:
firstly, by screen printing
The substrate includes a top layer pad and a bottom layer pad. The top layer bonding pads are used for connecting the strain gauge, the bottom layer bonding pads are used for SMT welding, and the specific structure can be referred to as that shown in FIG. 2; the strain detection sensor comprises a strain gauge body and a connecting lead; referring to fig. 4A to 4D, the two are packaged, and the first step of steel mesh alignment is performed, and the windowed steel mesh is aligned with the pad position, as shown in fig. 4A, wherein the strain gauge attaching area 401 and the pad 402 can be selectively disposed on the substrate 403 according to actual situations, and the specific positions thereof are not further limited herein; a second step of steel mesh printing solder paste, specifically as shown in fig. 4B, printing solder paste 404 on the bonding pad 402; third, dispensing, please refer to fig. 4C, i.e., dispensing the adhesive layer 405 on the strain gauge pasting region 401; then, the fourth step of pasting the strain gauge, namely pasting the strain gauge on the adhesive layer 405, and connecting the strain gauge with the solder paste 404 through a lead of the strain gauge; then, a fifth step of baking and reflow soldering is carried out, which is a common process and will not be described in detail; performing a sixth injection molding and a post-baking after the baking and reflow soldering are completed, specifically referring to fig. 4D, in the process, an injection molding housing 406 is mainly covered on a strain gauge 407 side of the substrate 403, wherein the strain gauge 407 is connected to the solder paste 404 disposed on the solder pad 402 through a connecting member 408; and finally, performing large-piece cutting and small-piece operation to obtain the strain detection sensing module.
Two, welding mode
The substrate includes a top layer pad and a bottom layer pad. The top layer bonding pads are used for connecting the strain gauge, the bottom layer bonding pads are used for SMT welding, and the specific structure can be referred to as that shown in FIG. 2; the strain detection sensor comprises a strain gauge body and a bonding pad; referring to fig. 5A to 5C, in the process of packaging the two, as shown in fig. 5A, the first step of dispensing the substrate is to dispense the adhesive layer 503 on the strain gauge pasting region of the substrate 501, and the setting of the top pad 510 of the substrate is the same as the above-mentioned form; a second step of attaching a strain gauge, specifically referring to fig. 5B, that is, attaching the strain gauge 504 to the adhesive layer 503; and then, the third step of baking is to perform a fourth step after the adhesive is cured, please refer to fig. 5C, which adopts a welding mode, that is, welding points 511 are respectively arranged on the bonding pads of the strain gauge and the bonding pads of the substrate, and data similarity is realized by means of communicating the welding points 511, of course, in actual work, the connection mode includes, but is not limited to, wedge welding, ball welding, and connecting the bonding pads on the top layer of the substrate 506 and the bonding pads 507 of the strain gauge through connecting members 505, and the connecting members 505 include, but are not limited to, aluminum wires and silver-plated wires. And finally, performing injection molding, post-baking, large-piece cutting and small-piece cutting operations to obtain the strain detection sensing module.
Three, spot welding
This is similar to the second method, except that in the fourth step, a spot welding method is used, and specifically, referring to fig. 6, the leads 602 of the strain gauge 603 are connected to the pads 601 of the top pad on the substrate by using a connecting member.
Four, alignment and lamination mode
The method is similar to the first method, and is different in that in the third step of dispensing, the thickness of the glue body 702 is consistent with that of the solder paste 704 of the top pad 703 of the substrate 701, and after the strain gauge is attached to the attaching area 705, data acquired by the strain gauge is directly led out to the solder paste 704 through the pad of the strain gauge, so that the pad of the strain gauge is the connecting piece; reference is made in particular to fig. 7.
The utility model also provides a deformation detection device suitable for above-mentioned strain detection sensing module, deformation detection device still contains control circuit board, control circuit board with the output meets through the SMT welding, be used for with detected signal conversion is the signal of telecommunication. Referring to fig. 8, in practical applications, the structure of the deformation detecting apparatus may include a strain detecting sensor 801, an adhesive layer 802, a connecting body 803, a solder paste 804, a base 805, a solder layer 806 and a control circuit board PCB807, and the specific structure is shown in fig. 8 and will not be described in detail herein.
In an embodiment of the present invention, the control circuit board may further be configured to generate a strain signal according to external deformation; that is, when the user deforms the control circuit board, a strain detection sensor coupled to the control circuit board generates a detection signal.
Referring to fig. 8 and 9, the present invention further provides an electronic device suitable for the above deformation detecting device, where the electronic device includes a substrate 901, a processing module 902, and one or more deformation detecting devices 903; the substrate 901 includes a third side for generating a strain signal according to an external deformation and a fourth side; the other side, opposite to the output end, of the control circuit board 807 of the deformation detection device 903 is attached to the fourth side of the substrate, and is used for generating the electrical signal according to the strain signal; the processing module 902 is coupled to the control circuit board 807 for obtaining corresponding external deformation data according to the electrical signal. When the electronic device comprises a plurality of deformation detection devices 903, the deformation detection devices 903 form a diagonal half-bridge array or a full-bridge array.
Through the strain detection sensing module, the deformation detection device and the electronic equipment provided by the utility model, the problem that the deformation detection equipment in the prior art is complex in structure and difficult to popularize can be effectively solved; meanwhile, due to the structural improvement, non-professionals can conveniently finish the installation and the application of the deformation detection equipment, and the application efficiency of the deformation detection equipment is greatly improved.
As will be appreciated by one skilled in the art, embodiments of the present invention may be provided as a method, system, or computer program product. Accordingly, the present invention may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present invention may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein.
The present invention has been described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems) and computer program products according to embodiments of the invention. It will be understood that each flow and/or block of the flow diagrams and/or block diagrams, and combinations of flows and/or blocks in the flow diagrams and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
The above-mentioned embodiments, further detailed description of the objects, technical solutions and advantages of the present invention, it should be understood that the above-mentioned embodiments are only specific embodiments of the present invention, and are not intended to limit the scope of the present invention, and any modifications, equivalent substitutions, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (10)
1. A strain detection sensing module is characterized by comprising a substrate, a strain detection sensor, a connecting piece, a transmission piece and an output end;
the substrate comprises a first side and a second side;
the strain detection sensor is arranged on the first side and used for generating a detection signal according to a strain signal conducted to the strain detection sensor from the outside;
the transmission piece is arranged on the first side, is connected with the strain detection sensor through the connecting piece and is used for leading out the detection signal;
the output end is attached to the second side and coupled with the transmission piece, and is used for outputting the detection signal led out by the transmission piece.
2. The strain sensing module of claim 1, wherein the strain sensing transducer is attached to the first side of the substrate by glue.
3. The strain gage sensing module of claim 1, wherein the transmission member is a solder paste and/or a solder joint.
4. The strain sensing module of claim 1, wherein the substrate is a strain conductive carrier; the substrate comprises an FR4 board, an FPC board with a back reinforcing board and a ceramic substrate.
5. The strain gage sensing module of claim 1, wherein the connector comprises copper wire, silver plated wire, aluminum wire, resistor, solder pad.
6. The strain sensing module of claim 1, wherein the output is further configured to conduct an externally generated strain signal to the substrate.
7. The strain sensing module of claim 1, further comprising a protective dielectric for encapsulating and protecting the components on the first side of the substrate.
8. A deformation detection device suitable for the strain detection sensing module set of any one of claims 1 to 7, further comprising a control circuit board, wherein the control circuit board is connected to the output end for converting the detection signal into an electrical signal.
9. The deformation sensing device of claim 8, wherein the control circuit board is further configured to generate a strain signal based on the external deformation.
10. An electronic device suitable for use in the deformation detecting apparatus according to claim 8, wherein the electronic device comprises a substrate, a processing module, and one or more deformation detecting apparatuses;
the substrate comprises a third side and a fourth side, wherein the third side is used for generating a strain signal according to external deformation;
the other side, opposite to the output end, of the control circuit board of the deformation detection device is attached to the fourth side of the substrate and used for generating the electric signal according to the strain signal;
and the processing module is coupled with the control circuit board and used for obtaining corresponding external deformation data according to the electric signals.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201920819008.9U CN209857841U (en) | 2019-05-31 | 2019-05-31 | Strain detection sensing module, deformation detection device and electronic equipment |
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| CN201920819008.9U CN209857841U (en) | 2019-05-31 | 2019-05-31 | Strain detection sensing module, deformation detection device and electronic equipment |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112160859A (en) * | 2020-09-28 | 2021-01-01 | 国家电网有限公司 | Deformation detection mechanism and water turbine |
| CN113227737A (en) * | 2019-12-30 | 2021-08-06 | 歌尔科技有限公司 | Electronic device and input method for electronic device |
| CN114441943A (en) * | 2022-01-28 | 2022-05-06 | 苏州浪潮智能科技有限公司 | Strain detection method and device, computer equipment and storage medium |
-
2019
- 2019-05-31 CN CN201920819008.9U patent/CN209857841U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113227737A (en) * | 2019-12-30 | 2021-08-06 | 歌尔科技有限公司 | Electronic device and input method for electronic device |
| US11836322B2 (en) | 2019-12-30 | 2023-12-05 | Goertek Technology Co. Ltd. | Electronic device and input method for the same |
| CN112160859A (en) * | 2020-09-28 | 2021-01-01 | 国家电网有限公司 | Deformation detection mechanism and water turbine |
| CN112160859B (en) * | 2020-09-28 | 2022-05-27 | 国家电网有限公司 | Deformation detection mechanism and water turbine |
| CN114441943A (en) * | 2022-01-28 | 2022-05-06 | 苏州浪潮智能科技有限公司 | Strain detection method and device, computer equipment and storage medium |
| CN114441943B (en) * | 2022-01-28 | 2024-01-30 | 苏州浪潮智能科技有限公司 | Strain detection method, strain detection device, computer equipment and storage medium |
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